ES2045013T3 - Ba\o acido, acuoso, para la deposicion galvanica de revestimientos de cobre brillantes y nivelados. - Google Patents

Ba\o acido, acuoso, para la deposicion galvanica de revestimientos de cobre brillantes y nivelados.

Info

Publication number
ES2045013T3
ES2045013T3 ES88108876T ES88108876T ES2045013T3 ES 2045013 T3 ES2045013 T3 ES 2045013T3 ES 88108876 T ES88108876 T ES 88108876T ES 88108876 T ES88108876 T ES 88108876T ES 2045013 T3 ES2045013 T3 ES 2045013T3
Authority
ES
Spain
Prior art keywords
bright
acid
aqueous
galvanic deposition
copper coatings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88108876T
Other languages
English (en)
Inventor
Wolfgang Dahms
Hubert-Matthias Seidenspinner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Application granted granted Critical
Publication of ES2045013T3 publication Critical patent/ES2045013T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

LA INVENCION SE REFIERE A UN BAÑO ACIDO ACUOSO PARA DEPOSICION GALVANICA DE RECUBRIMIENTOS SW COBRE BRILLANTES Y NIVELADOS, CARACTERIZADO PORQUE PRESENTA UN CONTENIDO CON AL MENOS UN COMPUESTO DE BENZOTIAZONIO E LA FORMULA GENERAL (I) EN LA QUE R1 ES C1-C5 ALQUILO, SI ES CASO ARILO O ARALQUILO SUSTITUIDO; R1 ES HIDROGENO, C1-C5 ALQUILO O C1-C5 ALCOXI, R3 Y R4 ES C1-C4 ALQUILO Y X ES UN RESTO ACIDO.
ES88108876T 1987-06-30 1988-06-03 Ba\o acido, acuoso, para la deposicion galvanica de revestimientos de cobre brillantes y nivelados. Expired - Lifetime ES2045013T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873721985 DE3721985A1 (de) 1987-06-30 1987-06-30 Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

Publications (1)

Publication Number Publication Date
ES2045013T3 true ES2045013T3 (es) 1994-01-16

Family

ID=6330825

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88108876T Expired - Lifetime ES2045013T3 (es) 1987-06-30 1988-06-03 Ba\o acido, acuoso, para la deposicion galvanica de revestimientos de cobre brillantes y nivelados.

Country Status (5)

Country Link
EP (1) EP0297306B1 (es)
JP (1) JPH01100292A (es)
AT (1) AT396946B (es)
DE (2) DE3721985A1 (es)
ES (1) ES2045013T3 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
JPH04120692A (ja) * 1990-09-11 1992-04-21 Koatsu Gas Kogyo Kk 感知器試験装置
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4133299A1 (de) * 1991-10-08 1993-04-15 Basf Lacke & Farben Kathodisch anscheidbarer elektrotauchlack
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
DE10000090A1 (de) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Verfahren zum Herstellen einer mehrlagigen Planarspule
EP1348320A1 (de) * 2001-01-04 2003-10-01 Elmicron AG Verfahren zum herstellen von elektrisch leitenden strukturen
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817272A (ja) * 1981-07-20 1983-02-01 Yamatake Honeywell Co Ltd 調節弁用アクチユエ−タ
JPS59501829A (ja) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド 電気銅メッキ液
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions

Also Published As

Publication number Publication date
DE3721985A1 (de) 1989-01-12
ATA166488A (de) 1993-05-15
AT396946B (de) 1993-12-27
DE3877633D1 (de) 1993-03-04
EP0297306B1 (de) 1993-01-20
EP0297306A1 (de) 1989-01-04
JPH01100292A (ja) 1989-04-18

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