ATA166488A - Waesseriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege - Google Patents

Waesseriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

Info

Publication number
ATA166488A
ATA166488A AT881664A AT166488A ATA166488A AT A166488 A ATA166488 A AT A166488A AT 881664 A AT881664 A AT 881664A AT 166488 A AT166488 A AT 166488A AT A166488 A ATA166488 A AT A166488A
Authority
AT
Austria
Prior art keywords
glossy
aqueous acid
acid bath
galvanic deposition
copper coatings
Prior art date
Application number
AT881664A
Other languages
English (en)
Other versions
AT396946B (de
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of ATA166488A publication Critical patent/ATA166488A/de
Application granted granted Critical
Publication of AT396946B publication Critical patent/AT396946B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electroplating Methods And Accessories (AREA)
AT0166488A 1987-06-30 1988-06-27 Wässeriges saures bad zur galvanischen abscheidung glänzender und eingeebneter kupferüberzüge AT396946B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873721985 DE3721985A1 (de) 1987-06-30 1987-06-30 Waessriges saures bad zur galvanischen abscheidung glaenzender und eingeebneter kupferueberzuege

Publications (2)

Publication Number Publication Date
ATA166488A true ATA166488A (de) 1993-05-15
AT396946B AT396946B (de) 1993-12-27

Family

ID=6330825

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0166488A AT396946B (de) 1987-06-30 1988-06-27 Wässeriges saures bad zur galvanischen abscheidung glänzender und eingeebneter kupferüberzüge

Country Status (5)

Country Link
EP (1) EP0297306B1 (de)
JP (1) JPH01100292A (de)
AT (1) AT396946B (de)
DE (2) DE3721985A1 (de)
ES (1) ES2045013T3 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
JPH04120692A (ja) * 1990-09-11 1992-04-21 Koatsu Gas Kogyo Kk 感知器試験装置
DE4032864A1 (de) * 1990-10-13 1992-04-16 Schering Ag Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination
DE4133299A1 (de) * 1991-10-08 1993-04-15 Basf Lacke & Farben Kathodisch anscheidbarer elektrotauchlack
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
DE10000090A1 (de) * 2000-01-04 2001-08-30 Elfo Ag Sachseln Sachseln Verfahren zum Herstellen einer mehrlagigen Planarspule
WO2002054840A1 (de) * 2001-01-04 2002-07-11 Elmicron Ag Verfahren zum herstellen von elektrisch leitenden strukturen
US6736954B2 (en) * 2001-10-02 2004-05-18 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US7153408B1 (en) * 2006-04-13 2006-12-26 Herdman Roderick D Copper electroplating of printing cylinders
EP2568063A1 (de) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Kupfer-Elektroplattierverfahren mit geringer innerer Spannung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5817272A (ja) * 1981-07-20 1983-02-01 Yamatake Honeywell Co Ltd 調節弁用アクチユエ−タ
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
JPS59501829A (ja) * 1982-09-30 1984-11-01 リ−ロ−ナル　インコ−ポレ−テツド 電気銅メッキ液

Also Published As

Publication number Publication date
JPH01100292A (ja) 1989-04-18
EP0297306B1 (de) 1993-01-20
AT396946B (de) 1993-12-27
DE3877633D1 (de) 1993-03-04
DE3721985A1 (de) 1989-01-12
ES2045013T3 (es) 1994-01-16
EP0297306A1 (de) 1989-01-04

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties
ELA Expired due to lapse of time