Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
  • H01L21/4857—Multilayer substrates
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
  • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
  • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
  • H05K1/188—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/14—Related to the order of processing steps
  • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
  • H05K2203/1469—Circuit made after mounting or encapsulation of the components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Definitions

• the present invention relates to a method of manufacturing a smart card module, as well as a smart card module obtained by said method. More generally, the invention relates to the manufacture of a smart card module integrating at least one component in the thickness of the printed circuit of said module.
• the module of a card consists of a contact grid on which is connected an integrated circuit (also called a "chip"), said module being inserted into the card so that the integrated circuit is inside said card with the contacts flush with the surface of the card.
• the contact grid is made using a single or double-sided flexible printed circuit manufacturing technique, one engraved side of which corresponds to the contact grid and the other side is used to receive and connect the chip to the contact grid.
• the chip is connected to the printed circuit, according to a technique using a connection by gold wire (better known under the English term "Wire-Bonding") or according to a technique of direct soldering of the chip turned over on the printed circuit (better known under the English term "Flip-Chip").
• the module thus produced corresponds to a rectangular printed circuit pad having a thickness of between 150 and 200 micrometers having a protrusion of the order of 300 to 400 micrometers in the center of the face opposite the contact grid.
• application US 2004/256150 illustrates the production of a printed circuit for a chip card module intended to receive a chip according to the so-called Flip-Chip technique.
• US Patent 6,319,827 discloses a technique for placement of an NFC antenna on a chip intended to be placed in a smart card module according to the so-called Wire-Bonding technique.
• the module In order to place the module in a smart card, the latter must comprise a first cavity having the shape of the rectangular pad and the thickness of the printed circuit and a second cavity placed in the center of the first cavity to receive the protrusion of the module so that the contact grid is flush with the surface of the card.
• first and second cavities can be made by machining or by molding.
• the thickness of a smart card being 800 micrometers, this creates a fragile zone at the level of the module which can also present a perceptible deformation after assembly.
• the production of the double cavity has a non-negligible cost.
• the thickness of the smart card requires a printed circuit having a thickness of less than 200 micrometers in order to make it possible to receive the integrated circuit and its protective layer over a thickness of less than 400 micrometers.
• the realization of such a thin printed circuit requires reducing all the thicknesses of the layers constituting the printed circuit, which makes it very flexible and limits the size of the chip to prevent it from breaking following a bending not supported by the silicon constituting the integrated circuit.
• the invention proposes a method for manufacturing a smart card module which integrates a component, such as for example a silicon chip, in the thickness of its printed circuit. Thanks to such a method, it becomes possible to produce a chip card module of uniform thickness, without protuberance, the thickness of which is less than the thickness of a module of the state of the art. Since the printed circuit is thicker than the printed circuits of the state of the art, the latter can be less flexible and allow the use of chips with a larger surface area. In addition, since the chip is placed and connected during the manufacture of the printed circuit, the manufacturing costs of the module are thereby reduced. [0010] More particularly, the invention proposes a method for manufacturing a smart card module which comprises the steps of: - supply of a first metal sheet comprising at least one registration mark,
• the steps of depositing the first and second conductive layers can be carried out simultaneously and comprise a step of depositing an ignition conductive material on the first layer of dielectric material and in the openings, followed by a step of electro-deposition of copper.
• the step of depositing the first conductive layer can be done by depositing a second metal sheet prior to the hot rolling step and the step of making openings simultaneously creates openings in the first layer of dielectric material and in the second metal sheet.
• the step of making openings can be done by laser.
• the dielectric material can be chosen from one of the following materials: polyester, epoxy resin, polyimide.
• the first layer of dielectric material may be a thermosetting material deposited in the liquid or pasty phase and in which the method comprises a hot rolling step in order to flatten and harden the first layer of dielectric material.
• the hot rolling step can be carried out using a press having a control of the pressing height.
• the step of etching the first metal sheet and the first conductive layer may include the steps of:
• said method may comprise the following steps:
• the step of etching the third conductive layer may include the steps of:
• the invention proposes a smart card module comprising a first metal layer and a second metal layer enclosing a layer of dielectric material, the first metal layer defining a contact grid intended to be flush with the surface of a smart card, the second metal layer being etched with patterns defining metal conductors for connecting contact pads of an integrated circuit to the contact grid through openings made in the layer of dielectric material, characterized in that that the integrated circuit is placed between the first and second metal layers inside the layer of dielectric material.
• the module may comprise a third metal layer separated from the second metal layer by a second dielectric layer, the second metal layer being between the first and third metal layers.
• FIG.1 shows a copper strip serving as the basis for the production of a smart card module strip according to the method according to the invention
• FIG.3a] and [Fig.3b] show a strip of smart card modules produced by the method according to the invention
• [0027] [Fig.4a], [Fig.4b], [Fig.4c], [Fig.4d] and [Fig.4e] illustrate the steps of a second embodiment of the method according to the invention
• smart card module refers to a module intended to be inserted into a cavity of a smart card body and which comprises at least one chip connected to a contact grid intended to be flush with the surface of said smart card.
• the manufacturing method of the invention is particularly advantageous for the production of smart card modules continuously on strips of several meters, or even several tens of meters, the width of which is generally from 35 to 150 millimeters.
• the description mainly refers to the manufacture of a smart card module on 35 millimeter tapes but can be implemented on wider tapes.
• the method according to the invention begins with the supply of a metal foil.
• the metal sheet is for example a copper strip 10 35 millimeters wide, shown in Figure 1.
• the copper strip 10 has perforations 11 and 12 on the edges which are intended to allow a controlled advance on a production line. Some perforations 12 are wider in order to serve as registration marks making it possible to define the position of the modules on the strip metallic.
• the registration marks 12 are used in particular in the method according to the invention to precisely define placement or machining positions.
• all the perforations are registration marks.
• the registration marks can also be distinct from the perforations used to advance the strip. According to the invention, it is important to have at least one registration mark on the metal strip from which the manufacturing process is implemented.
• the metal strip 10 is for example a copper strip whose thickness is for example 35 ⁇ m to produce a smart card module.
• a person skilled in the art may at leisure use a material other than copper, such as steel or aluminum for example, and the thickness of the metal strip 10 may vary depending on the applications for which the module is intended.
• Figures 2a to 2h illustrate the different steps implemented according to a first embodiment of the method.
• the metal strip 10 is positioned under a component placement tool.
• the position of the strip being marked by the placement tool using the registration mark 12, the tool carries out a step of depositing and gluing an electronic component 20 at a location localized with respect to the mark of identification.
• the electronic component 20 is an integrated circuit of the thinned silicon chip type cut directly from a wafer having a thickness for example of the order of 150 ⁇ m.
• the bonding of the electronic component 20 is carried out according to a known technique using a thin layer adhesive 21 commonly used for the manufacture of smart card modules.
• Other bonding techniques can be used provided the thickness of the adhesive layer is of the same order of magnitude.
• Figure 2b illustrates a next step of depositing a layer of a dielectric material 30.
• the dielectric material 30 can be epoxy resin, polyimide, polyester or any other material commonly used as a dielectric material.
• the dielectric material 30 is deposited in the liquid or so-called pasty phase, that is to say that the liquid phase has a sufficient viscosity not to creep without stress, the viscosity depending on the thickness of the material. dielectric deposited.
• the deposition of the dielectric material is carried out during the advance of the strip 10 with a flow rate of liquid material calculated to obtain a desired thickness.
• the flow rate is controlled to obtain a thickness of the order of 200 ⁇ m on the part of the strip which does not include the chip and of the order of 35 ⁇ m on the electronic component.
• the dielectric layer can then be UV cured or heat cured.
• thermosetting type dielectric material In order to obtain better control of the thickness of the dielectric layer 30, it is preferred to use a thermosetting type dielectric material and to carry out hot rolling by controlling the pressing height in order to flatten and to harden said dielectric layer 30. As such, it is possible to deposit a release film on the dielectric layer in pasty phase and then to laminate the whole hot. The release film is removed after hot rolling.
• the hot rolling can be done by moving the strip 10 covered with the dielectric layer 30 and the release film between cylinders separated by a predetermined distance corresponding to the desired distance for the dielectric layer 30.
• the use of cylinders can create stress on a silicon chip which risks damaging it if the thickness of the dielectric material is low.
• a hot rolling technique using a controlled height press such as for example described in the French patent application filed on March 29, 2021 under number 2103188.
• a technique consists in stopping the scrolling of the strip 10 under a press which descends vertically to a predetermined height in order to apply pressure and heat to harden the dielectric material. The press is then opened and the strip 10 advances over a distance allowing the pressing zone to be changed.
• a dielectric layer 30 of controlled thickness which is relatively flat.
• the dielectric layer 30 having been hardened, a step of making openings 40 is then carried out, as illustrated in FIG. 2c.
• the realization of the openings 40 is practiced for example using a YAG type laser which will vaporize the dielectric material at locations corresponding to contact locations.
• the contact locations are located relative to the registration mark so that the openings correspond to the contact pads of the integrated circuit 20 and to locations where it is desired to make contact with the metal strip 10.
• the location of the location of the contact terminals of the integrated circuit 20 can also be done by a position reading by X-rays.
• a deposition of a conductive layer 50 is carried out as illustrated in Figure 2d.
• the conductive layer 50 is deposited to cover the whole of the dielectric layer 30 and to fill the openings 40.
• the conductive layer 50 is deposited in two stages. Initially, a deposit of conductive starter material is deposited over the entire surface then an electro-deposition of more conductive metal, for example copper, is then carried out on the layer of conductive starter material to improve the conductivity of the conductive layer 50.
• the conductive primer material can be of different nature and the deposition method can vary depending on the material.
• the initiating conductive material is for example carbon, graphite or palladium and the deposition is carried out by immersing the strip in a bath containing the initiating conductive material so that the latter is deposited on the dielectric layer 30. Once the dielectric layer 30 is covered with a thin layer of conductive material, the strip is taken into a second bath to carry out the electro-deposition until a copper layer thickness is obtained around 35pm.
• the conductive layer 50 thus produced is connected to the metal strip 10 and to the contact areas of the chip 20.
• the conductive layer 50 can be made by sputtering a metal under vacuum. Cathodic sputtering can be used for the deposition of a conductive seed layer or to completely deposit the conductive layer 50. However, the implementation of a deposition by cathodic sputtering is more expensive to implement, in particular if the amount of metal to be deposited is significant.
• a step of etching the conductive layer 50 and the metal strip 10 is then carried out according to a known technique.
• the etching step is carried out by photolithography and acid etching.
• other etching methods could be used.
• layers 60 of photosensitive material are deposited on the metal layer 50 and on the lower surface of the metal strip 10.
• the parts 70 to be removed from the photosensitive layers 60 are then exposed to the UV using a mask, not shown, then these parts 70 are removed, as shown in FIG. 2f.
• the strip is then passed through an acid bath in order to make openings 80 in the metal strip 10 and in the conductive layer 50.
• the rest of the photosensitive layers 60 is then completely removed, leaving visible on the rear face of the module, shown in FIG. 3a, an antenna 90 and the metal conductors 91 which connect the contact pads of the integrated circuit to the contact grid. 92 of the front of the module, shown in Figure 3b.
• the modules thus produced have a thickness which is for example 270 ⁇ m, which is much less than the thickness of the modules of the state of the art. Those skilled in the art can use greater thicknesses of metal and dielectric material if they wish to have a more rigid module, while being able to obtain a module thickness less than a module of the state of the art. In addition, the module being flat, the machining of the smart card is simplified.
• FIG. 4a illustrates the removal and gluing of an integrated circuit 20 onto the metal strip 10, identically to what is produced in FIG. 2a. Then a layer of a dielectric material 30 is deposited in the liquid phase to cover the metal strip 10 and the integrated circuit 20, as shown in Figure 4b.
• the dielectric material is a thermosetting material whose viscosity is high enough to prevent creep under the effect of its own weight.
• a second metal strip 51 is deposited on the layer of dielectric material 30 before a hot rolling step.
• the second metal strip 51 is for example a copper strip 35 mm thick which makes it possible to avoid the use of a release film.
• the hot rolling is carried out using a press with a controlled pressing height to roll the two metal strips 10 and 51 enclosing the layer of dielectric material 30 and to heat the assembly until the dielectric layer crosslinks.
• a step of making openings is carried out, as illustrated in FIG. 5d.
• the production of openings 40 is carried out for example using a YAG type laser which will vaporize the metal of the second metal strip 51 and the dielectric material at locations corresponding to contact locations.
• the contact locations are located relative to the registration mark so that the openings correspond to the contact pads of the integrated circuit 20 and to locations where it is desired to make contact with the metal strip 10.
• a deposition of a conductive layer 52 is carried out as illustrated in Figure 5e.
• the conductive layer 52 is deposited to fill the openings 40.
• the conductive layer 52 is deposited locally by cathode sputtering of metal or by any other metallization method making it possible to control the location of the metal deposit.
• a step of etching the metal strips 10 and 51 is then carried out according to a known technique.
• the etching step is performed by photolithography and acid etching as illustrated using Figures 2e to 2h.
• the second exemplary embodiment has fewer manufacturing steps, although the production of the metallization of the openings is more complex.
• this second example allows to obtain a better surface finish for the conductors located on the rear part of the module.
• the chip card module produced according to one of the two embodiments comprises a near-field antenna 90 whose size is limited at the center by the metal conductors 91.
• this is connected to contacts C4 and C8 of the contact grid, which is only possible for modules with eight contacts.
• the advantage of obtaining such a thin module also makes it possible to add a third conductive layer while having a thickness less than the thickness of a state-of-the-art module.
• the use of a third conductive layer makes it possible to produce an antenna on the third layer without the latter being limited by the metallic conductors or requiring it to be connected to contact pads.
• FIGs 5a to 5f illustrate an embodiment of a method for adding a third conductive layer to a module according to the invention.
• an etched module obtained from one of the previous examples is provided as a strip.
• Such a module has for example a thickness of 270 ⁇ m.
• a layer of dielectric material 530 is deposited on the metal layer 50 in the liquid phase over a thickness of around 60 ⁇ m.
• the dielectric layer is then hot rolled to be hardened in the same way as described in the first embodiment in relation to FIG. 2b.
• the hot rolling height is set to reduce the layer to 50 ⁇ m in thickness so that the layer of dielectric material fills the openings 80 of the metallic layer 50 well.
• openings 540 are then made in the dielectric layer 530
• the realization of the openings 540 is performed for example using a YAG type laser which will vaporize the dielectric material at locations corresponding to contact locations.
• the contact locations are located relative to the registration mark such that the openings correspond to conductor areas of the metal layer 50 for which electrical contact is desired with the third metal layer.
• a deposition of a conductive layer 550 is performed as illustrated in Figure 5c.
• the conductive layer 550 is deposited to completely cover the dielectric layer 530 and to fill the openings 540.
• the conductive layer 550 is deposited in two stages. Initially, a starting conductive material is deposited over the entire surface then an electro-deposition of metal, for example copper, is then carried out on the carbon layer to improve the conductivity of the conductive layer 550. electro-deposition is carried out until a copper layer thickness of around 35 ⁇ m is obtained.
• the conductive layer 550 thus produced is connected to conductor areas of the metal layer 50 which allow interconnection to the metal strip 10 and/or to the contact areas of the chip 20.
• the conductive layer 550 is then etched, as shown in Figure 5d.
• the step of etching the conductive layer 550 is carried out according to a known technique. As a preferred example, the etching step is carried out by photolithography and acid etching. Layers 560 of photosensitive material are deposited on the metal layer 550 and on the lower surface of the metal strip 10. However, only the photosensitive layer 560 deposited on the metal layer 550 is exposed to UV using a mask, the photosensitive layer 560 deposited on the metal strip serving only as protection for the metal strip 10 during the acid bath. During the passage of the strip in the acid bath, openings 580 are made in the conductive layer 550.
• the photosensitive layers 560 are then completely removed using a solvent, as shown in Figure 5e.
• the rear face of the module can include an antenna 590 connected to metal conductors 91 located on the metal layer 50.
• the module thus produced although having three metal layers, has a thickness of 345 ⁇ m, which is very less than a state-of-the-art module.
• the method of the invention is not limited to the manufacture of smart card module comprising a single chip.
• One or more active or passive components can also be placed in the dielectric layer, it will be appropriate to adapt the thickness of the dielectric layer to the height of the thickest component.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Power Engineering (AREA)
• Ceramic Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Credit Cards Or The Like (AREA)
• Manufacturing Of Printed Circuit Boards (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=77411811

Family Applications (1)

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Family Cites Families (9)

• 2021
  • 2021-06-07 FR FR2105980A patent/FR3123778A1/fr active Pending
• 2022
  • 2022-05-30 WO PCT/EP2022/064651 patent/WO2022258420A1/fr active Application Filing
  • 2022-05-30 CN CN202280055189.7A patent/CN117795523A/zh active Pending
  • 2022-05-30 EP EP22733905.8A patent/EP4352652A1/de active Pending

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