EP3852199A1 - Hermetisches anschlusselement - Google Patents

Hermetisches anschlusselement Download PDF

Info

Publication number
EP3852199A1
EP3852199A1 EP19861121.2A EP19861121A EP3852199A1 EP 3852199 A1 EP3852199 A1 EP 3852199A1 EP 19861121 A EP19861121 A EP 19861121A EP 3852199 A1 EP3852199 A1 EP 3852199A1
Authority
EP
European Patent Office
Prior art keywords
tube body
ceramic substrate
hermetic terminal
terminal according
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP19861121.2A
Other languages
English (en)
French (fr)
Other versions
EP3852199B1 (de
EP3852199A4 (de
Inventor
Haruka OOMURA
Koichi IWAMOTO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of EP3852199A1 publication Critical patent/EP3852199A1/de
Publication of EP3852199A4 publication Critical patent/EP3852199A4/de
Application granted granted Critical
Publication of EP3852199B1 publication Critical patent/EP3852199B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/53Bases or cases for heavy duty; Bases or cases for high voltage with means for preventing corona or arcing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/73Means for mounting coupling parts to apparatus or structures, e.g. to a wall
    • H01R13/74Means for mounting coupling parts in openings of a panel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/504Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together

Definitions

  • the present disclosure relates to a hermetic terminal.
  • hermetic terminals used in a vacuum equipment, a nuclear equipment, or the like a contact pin 21, a heat-resistant insulator 22, and a pipe flange (tube body) 23 are hermetically connected to each other as a hermetic terminal 30 shown in Fig. 5 to obtain a high leakage resistance, and the connecting is performed by brazing or the like, and it is required to have a necessary mechanical strength, and withstand impact and high temperature sufficiently.
  • alumina is used as the heat-resistant insulator 22, its surface is metallized, it is hermetically connected to the contact pin 21 and the pipe flange 23 by brazing, and to reduce difference of thermal expansion coefficients of the contact pin 21 and the pipe flange 23 with respect to the alumina, the contact pin 22 and the pipe flange 23 are normally formed by an iron-nickel alloy or an iron-nickel cobalt alloy.
  • Non-Patent Document 1 a multi-pole terminal is used as a hermetic terminal for extracting signal of a liquid hydrogen tank of a rocket.
  • Patent Document 1 Japanese Patent Publication No. 2519642
  • Non-Patent Document 1 Hajime Ishimaru, Hermetic Seal for Low Temperature, TEION KOGAKU 17(1), pp. 61-62 (1982 )
  • a hermetic terminal of the present disclosure includes a plate-shaped ceramic substrate in a plate shape provided with a through hole for inserting a columnar conductive member in a thickness direction, a first tube body surrounding the ceramic substrate, and a second tube body coaxially connected with the first tube body , and the first tube body includes a fernico-type alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy or an Fe-Co-Cr alloy, and the second tube body includes an austenitic stainless steel with a nickel content of 10.4 mass% or more.
  • FIG. 1(a) is a perspective view at a side of a first tube body
  • FIG. 1(b) is a perspective view at a side of a second tube body, illustrating one embodiment of a hermetic terminal of the present disclosure.
  • FIG. 2(a) is a drawing illustrating one embodiment of a sectional view along an axis direction of the first tube body and the second tube body
  • FIG. 2(b) is a side view of FIG. 2(a)
  • FIG. 2(c) is a sectional view illustrating one embodiment enlarging the part A shown in FIG. 2(a)
  • FIG. 2(d) is a sectional view illustrating another embodiment enlarging the part A shown in FIG. 2(a)
  • FIG. 2(e) is a sectional view illustrating one embodiment enlarging the part B shown in FIG. 2(a) , illustrating the hermetic terminal of FIG. 1 .
  • a hermetic terminal 20 illustrated in FIGs. 1 and 2 includes a plate shape ceramic substrate 3 provided with a through hole 2 for inserting a columnar conductive member 1 in a thickness direction, a first tube body 4 surrounding the ceramic substrate 3, and a second tube body 5 coaxially connected with the first tube body 4.
  • the conductive member 1 includes a columnar base part 1a inserted into the through hole 2, and a collar part 1b opposing to the ceramic substrate 3 on the midway in an axis direction of the columnar base part 1a.
  • the conductive member 1 includes a fernico-type alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Co-Cr alloy or an Fe-Cr-Al alloy
  • the ceramic substrate 3 includes ceramics including aluminum oxide as a main component
  • the conductive member 1 is supported by the ceramic substrate 3 provided with a metallized layer 10 formed on the surface by a brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component.
  • main component in the ceramics denotes a component of 85 mass% or more in 100 mass% of the components constituting the ceramics
  • main component in the brazing material denotes a component of 60 mass% or more in 100 mass% of the components constituting the brazing material.
  • the ceramics may include at least one of silicon, calcium and magnesium as an oxide in addition to aluminum oxide which is a main component.
  • the components constituting the ceramics may be identified by using an X-ray diffractometer (XRD), and then the content of components may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP), and converted it into the content of the identified components.
  • XRD X-ray diffractometer
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the content of the components constituting the brazing material may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP).
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the first tube body 4 includes a shaft part 4a and a head part 4b having an outer diameter larger than the outer diameter of the shaft part 4a.
  • the second tube body 5 includes a shaft part 5a and a head part 5b having an outer diameter larger than the outer diameter of the shaft part 5a.
  • the hermetic terminal 20 includes a flange 6 provided with a plurality of through holes 6a for inserting the second tube body 5, and a plurality of through holes 6b for inserting fastening members such as bolts or the like on the outer peripheral side to fix a storage container for low temperature liquid or the like (not shown).
  • the flange 6, for example, includes an austenitic stainless steel.
  • the flange 6 surrounds the shaft part 4a of the first tube body 4 and the shaft part 5a of the second tube body 5, and separates an environment different on the left and right sides with the flange 6 as a boundary.
  • the side of the head part 4b of the head part 4b and the shaft part 4a of the first tube body 4 located on the left side of the ceramic substrate 3 is used in an environment exposed to the atmosphere
  • the second tube body 5 located on the right side of the ceramic substrate 3 is used in an environment exposed to liquid hydrogen.
  • the shaft part 4a of the first tube body 4 located on the right side of the ceramic substrate 3 is configured not to be directly exposed to the liquid hydrogen by the second tube body 5.
  • the first tube body 4 includes a fernico alloy, an Fe-Ni alloy, an Fe-Ni-Cr-Ti-Al alloy, an Fe-Cr-Al alloy or an Fe-Co-Cr alloy
  • the second tube body 5 includes an austenitic stainless steel with a nickel content of 10.4 mass% or more.
  • the first tube body 4 includes the above-described alloys, even if heating and cooling are repeated, linear expansion coefficients of these alloys have a small difference from a linear expansion coefficient of aluminum oxide, so residual stress is less likely to accumulate in the ceramic substrate 3, and thus cracks are less likely to occur in the ceramic substrate 3. Additionally, if the second tube body 5 includes the austenitic stainless steel with the nickel content of 10.4 mass% or more, it is less likely to be embrittled by hydrogen and can therefore be used for a long period of time.
  • the second tube body 5 includes, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
  • the first tube body 4 and the second tube body 5 are both circular cylindrical bodies, and the ceramic substrate 3 is a disk, but the first tube body 4 and the second tube body 5 may be both square cylindrical bodies, and the ceramic substrate 3 may be a square plate.
  • an end of the second tube body 5 on the side of the first tube body 4 includes a step surface 5c.
  • an end of the first tube body 4 on the side of the second tube body 5 includes a step surface 4c.
  • At least one of the end of the second tube body 5 on the side of the first tube body 4 and the end of the first tube body 4 on the side of the second tube body 5 may include the step surfaces 4c and 5c.
  • the step surface 5c is included on the outer peripheral surface of the second tube body 5, but the step surface may be included on the inner peripheral surface of the second tube body 5.
  • the step surface 4c is included on the outer peripheral surface of the first tube body 4, but the step surface may be included on the inner peripheral surface of the first tube body 4.
  • FIG. 3 is a sectional view illustrating another embodiment enlarging the part A of the hermetic terminal shown in FIG. 2 .
  • the second tube body 5 may include a coating layer 5d composed of nickel, copper or a copper-nickel alloy as a main component at least on a connecting part with the first tube body 4.
  • the first tube body 4 and the second tube body 5 can be connected firmly by a connecting layer 7 including a brazing material, and thus reliability is improved.
  • the second tube body 5 may include the coating layer 5d composed of nickel, copper or a copper-nickel alloy as a main component on at least one of the surfaces exposed to the liquid hydrogen such as the inner peripheral surface, the outer peripheral surface, and the end surface in addition to the connecting part.
  • embrittlement due to hydrogen of the austenitic stainless steel constituting the second tube body 5 can be delayed, so that it can be used for a longer period of time.
  • the second tube body 5 shown in FIG. 3 includes the coating layer 5d on the inner peripheral surface, the outer peripheral surface, and the end surface.
  • the first tube body 4 may include a coating layer 4d composed of nickel, copper or a copper-nickel alloy as a main component at least on a connecting part with the second tube body 5.
  • the first tube body 4 and the second tube body 5 can be connected firmly by a brazing material, and thus reliability is improved.
  • the inner peripheral surface of the first tube body 4 may be located outward rather than the outer peripheral surface of the second tube body 5.
  • the first tube body 4 has a linear expansion coefficient smaller than the second tube body 5, so the gap is less likely to expand even if heating and cooling are repeated, and thus the volatilized hydrogen is less likely to leak to the outside through the internal space of the first tube body 4.
  • the second tube body 5 includes the step surface 5c on the end of the second tube body 5 on the side of the first tube body 4, the outer peripheral surface corresponds to the step surface 5c.
  • the flange 6 connected to the outer peripheral surface of the second tube body 5 and surrounding the second tube body 5 may be further included.
  • the flange 6 includes a second recessed part 6d at the side of the second tube body 5, a collar part 8 having a U-shaped cross section along an axial direction of the second tube body 5 is attached to the second recessed part 6d, and the second tube body 5 and the flange 6 are connected via the collar part 8.
  • the collar part 8 may include a coating layer (not shown) including nickel, copper or a copper-nickel alloy as a main component at least on the connecting part with the second tube body 5, and the coating layer (not shown) may be included on entire surface of the collar part 8.
  • a coating layer including nickel, copper or a copper-nickel alloy as a main component at least on the connecting part with the second tube body 5, and the coating layer (not shown) may be included on entire surface of the collar part 8.
  • main component in the coating layer denotes a component of 88 mass% or more in 100 mass% of the components constituting the coating layer, and may include phosphorus or the like in addition to the main component. If the coating layer including the copper-nickel alloy as a main component, the total content of copper and nickel is the content of the main component.
  • the content of the components in the coating layer may be determined by using an X-ray fluorescent analyzer (XRF) or an ICP emission spectrometer (ICP).
  • XRF X-ray fluorescent analyzer
  • ICP ICP emission spectrometer
  • the collar part 8 and the second tube body 5 are connected by the brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component, and the flange 6 and the collar part 8 are welded by a TIG (Tungsten Inert Gas) welding method, and this welding is performed after each member is connected with the brazing material.
  • the brazing material including silver such as BAg-8, BAg-8A, BAg-8B or the like as a main component
  • the flange 6 includes a first recessed part 6c at the side of the first tube body 4, and it is preferable that the connecting part between the ceramic substrate 3 and the first tube body 4 is located away from the second tube body 5 than a bottom surface 6c1 of the first recessed part 6c (that is, in FIG. 2(a) , it is preferable that the connecting part between the ceramic substrate 3 and the first tube body 4 is located on the left side of the drawing with respect to a virtual plane where the bottom surface 6c1 of the first recessed part 6c is located, and the second tube body 5 is located on the right side of the drawing with respect to the virtual plane).
  • the connecting part between the ceramic substrate 3 and the first tube body 4 is at this position, the heat generated by welding is less likely to be transferred to the ceramic substrate 3, so that residual stress is less likely to be generated in the ceramic substrate 3, and cracks are less likely to occur in the ceramic substrate 3.
  • the first recessed part 6c is a counterbore for facilitating the attachment of the first tube body 4.
  • the collar part 8 may include the austenitic stainless steel with the nickel content of 10.4 mass% or more. If the collar part 8 has such a configuration, it is less likely to be embrittled by hydrogen and can therefore be used for a long period of time.
  • the collar part 8 includes, for example, SUS310S, SUS316L, SUS316LN, SUS316J1L or SUS317L.
  • the nickel content in the second tube body 5 and the collar part 8 can be measured by using an ICP (Inductively Coupled Plasma) emission spectrometer or an X-ray fluorescent analyzer (XRF).
  • ICP Inductively Coupled Plasma
  • XRF X-ray fluorescent analyzer
  • FIG. 4(a) is a drawing illustrating another embodiment of a sectional view along the axis direction of the first tube body and the second tube body
  • FIG. 4(b) is a side view of FIG. 4(a)
  • FIG. 4(c) is a sectional view illustrating one embodiment enlarging the part A shown in FIG. 4(a)
  • FIG. 4(d) is a sectional view illustrating another embodiment enlarging the part A shown in FIG. 4(a)
  • FIG. 4(e) is a sectional view illustrating one embodiment enlarging the part B shown in FIG. 4(a) , illustrating the hermetic terminal of FIG. 1 .
  • a plurality of conductive members 1 are individually inserted into a plurality of through holes 2, and the ceramic substrate 3 includes step parts 9 (9a, 9b) recessed from at least one of the main surfaces 3b, 3c around the through holes 2.
  • the ceramic substrate 3 includes the step parts 9 recessed from both of the main surfaces 3b, 3c around the through holes 2, and one of the step parts 9a further includes a metallized layer 10 on the step surface, and the step part 9a on the side provided with the metallized layer 10 may be deeper than the step part 9b on the side not provided with the metallized layer 10.
  • the metallized layer 10 is for fixing the conductive member 1 to the ceramic substrate 3 by brazing, and the thickness thereof is, for example, 5 ⁇ m or more and 55 ⁇ m or less.
  • the step part 9a on the side provided with the metallized layer 10 is deeper than the step part 9b on the side provided with the metallized layer 10, the creepage distance between the columnar base parts 1a of the conductive members 1 adjacent to each other can be lengthened, so that even if the metallized layer 10 is made thicker, generation of creepage discharge between the conductive members 1 can be suppressed.
  • the depth of the step part 9a is a distance from the main surface to the step surface, and it does not include the thickness of the metallized layer 10.
  • the depth of the step part 9a on the side provided with the metallized layer 10 may be 45% or less of the thickness of the ceramic substrate 3. If the depth of the step part 9a is in this range, mechanical strength of the ceramic substrate 3 around the through holes 2 can be ensured.
  • the thickness of the ceramic substrate 3 is a distance between both main surfaces 3b, 3c of the ceramic substrate 3.
  • the plurality of conductive members 1 are individually inserted into the plurality of through holes 2, and the ceramic substrate 3 includes a protrusion part 3a extending from at least one of the main surfaces (the main surface 3c in the example shown in FIG. 2 ) around the through holes 2.
  • the metallized layer 10 opposing to the conductive member 1 can be lengthened, so that reliability of the connecting of the conductive member 1 to the ceramic substrate 3 can be increased.
  • the ceramic substrate 3 includes a plurality of open pores on the step surface where the metallized layer 10 is included or the tip end surface of the protrusion part 3a, and the value obtained by subtracting an average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores may be 20 ⁇ m or more and 50 ⁇ m or less.
  • the value obtained by subtracting the average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores is 20 ⁇ m or more, it becomes difficult for the open pores to communicate with each other even if used in an environment where heating and cooling are repeated, so that the mechanical strength can be maintained, and cracks are less likely to occur in the metallized layer 10. Further, if the value obtained by subtracting the average value of the equivalent circle diameters of the open pores from the distance between the centers of gravity of the open pores is 50 ⁇ m or less, the density of the open pores is increased, so that an anchor effect of the metallized layer 10 to the ceramic substrate 3 is improved, and adhesion strength of the metallized layer 10 is increased.
  • the mechanical strength of the ceramic substrate 3 can be maintained, cracks can be suppressed in the metallized layer 10, and the adhesion strength of the metallized layer 10 can be improved.
  • the step surface of the ceramic substrate 3 or the tip end surface of the protrusion part 3a is polished with diamond abrasive grains to obtain a mirror surface.
  • an arithmetic mean roughness Ra of the mirror surface is set to 0.2 ⁇ m or less by using a measurement method in accordance with JIS B 0601: 2013.
  • a part where the size and distribution of the open pores are observed on average is selected from the mirror surface, and an optical microscope is used with a magnification of 200 times to measure an area of, for example, 1.5 ⁇ 10 5 ⁇ m 2 as a measurement area.
  • a method called a distance between centers of gravity of an image analysis software "A-ZOKUN (ver 2.52)" (registered trademark, produced by Asahi Kasei Engineering Corporation, and hereinafter, indicated by the image analysis software) is applied, and the distance between the centers of gravity of the open pores adjacent to each other can be obtained.
  • the distance between the centers of gravity of the open pores in the present disclosure is a linear distance connecting the centers of gravity of the open pores.
  • a threshold value should be set in such a way that a marker appearing on the screen matches the shape of the open pore.
  • the threshold value is, for example, 155.
  • a first tube body, a second tube body, and a ceramic substrate in which a conductive member is inserted into a through hole are prepared.
  • the ceramic substrate can be obtained by the following manufacturing method.
  • aluminum oxide powder which is the main component, magnesium hydroxide, silicon oxide, calcium carbonate, and zirconium oxide powders, a dispersant to disperse the aluminum oxide powder as needed, and an organic binder are wet-mixed by a ball mill, a bead mill, or a vibration mill to obtain a slurry.
  • the mean particle size (D 50 ) of the aluminum oxide powder is 3 ⁇ m or less, preferably 1 ⁇ m or less, and in a total of 100 mass% of the above-described powders, the content of the magnesium hydroxide powder is 0.87 mass% to 1.07 mass%, the content of the silicon oxide powder is 6.1 mass% to 7.5 mass%, the content of the calcium carbonate powder is 2.5 mass% to 3.1 mass%, and the content of the zirconium oxide is 1.0 mass% to 1.3 mass%.
  • the time for wet mixing is, for example, 40 to 50 hours.
  • the organic binder include paraffin wax, wax emulsion (wax and emulsifier), PVA (polyvinyl alcohol), PEG (polyethylene glycol), and PEO (polyethylene oxide).
  • the slurry obtained by the above-described method is spray-granulated to obtain granules, and then the granules are molded by a powder press molding method or a cold isostatic pressing method to obtain a molded body in a disk shape.
  • a ceramic substrate can be obtained by forming a through hole and step parts or a protrusion part by a cutting process, and sintering the molded body in which the through holes and the like are formed at a temperature of 1550°C or more and 1750°C or less.
  • a molded body is manufactured by the cold isostatic pressing method with a molding pressure of 98 MPa or more and 147 MPa or less, and sintered at a temperature of 1580°C or more and 1750°C or less.
  • a coating layer composed of nickel, copper, or a copper-nickel alloy as a main component may be formed in advance on at least one of the connecting part of the conductive member with the ceramic substrate, the connecting part of the first tube body with the second tube body, the connecting part of the first tube body with the ceramic substrate, the connecting part of the second tube body with the first tube body, and the connecting part of the ceramic substrate with the first tube body by a plating method.
  • the above-described coating layer may be formed on the entire surface of each of the conductive member, the first tube body, and the second tube body.
  • the above-described coating layer may be formed on the step surface.
  • the metallized layer may be formed in advance by a Mo-Mn method, and then a coating layer composed of nickel, copper or the copper-nickel alloy as a main component by the plating method.
  • the above-described coating layer may be formed on the entire outer peripheral surface of the ceramic substrate.
  • the appropriate temperature is the brazing temperature described in JIS Z 3281: 1998.
  • a hermetic terminal provided with a flange, a first tube body, a ceramic substrate in which a conductive member is inserted into a through hole, and a second tube body to which a collar part is attached are prepared.
  • the flange is attached to the outer peripheral side of the collar part, and the hermetic terminal of the present disclosure can be obtained by welding and fixing by the TIG (Tungsten Inert Gas) welding method.
  • TIG Tungsten Inert Gas
  • the hermetic terminals of the present disclosure obtained by the above-mentioned manufacturing method have high embrittlement to hydrogen, and can therefore be used for a long period of time.
  • the second tube body 5 is connected to the flange 6 via the collar part 8 is shown, but the second tube body 5 may be directly connected to the flange 6.
  • the collar part 8 has a U-shaped cross section is shown, but the collar part 8 may have another shape such as an L-shaped cross section or the like. If the collar part 8 has a U-shape, an L-shape, or the like, the bent part may be curved.

Landscapes

  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Ceramic Products (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
EP19861121.2A 2018-09-11 2019-09-10 Hermetisches anschlusselement Active EP3852199B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018169868 2018-09-11
PCT/JP2019/035503 WO2020054703A1 (ja) 2018-09-11 2019-09-10 気密端子

Publications (3)

Publication Number Publication Date
EP3852199A1 true EP3852199A1 (de) 2021-07-21
EP3852199A4 EP3852199A4 (de) 2022-06-08
EP3852199B1 EP3852199B1 (de) 2023-08-30

Family

ID=69776783

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19861121.2A Active EP3852199B1 (de) 2018-09-11 2019-09-10 Hermetisches anschlusselement

Country Status (3)

Country Link
EP (1) EP3852199B1 (de)
JP (1) JP7037662B2 (de)
WO (1) WO2020054703A1 (de)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6074479U (ja) * 1983-10-28 1985-05-25 京セラ株式会社 真空端子
JPH0212682A (ja) * 1988-06-30 1990-01-17 Canon Inc 記憶媒体
JP2543759Y2 (ja) * 1991-04-10 1997-08-13 京セラ株式会社 真空端子
JP2519642B2 (ja) 1992-11-24 1996-07-31 日立原町電子工業株式会社 気密用コネクタの製造方法
JPH07282621A (ja) * 1994-04-06 1995-10-27 Rohm Co Ltd 電極材料及びこれを用いたチップ状電子部品、並びに電極層の表面処理方法
JP2005235577A (ja) * 2004-02-19 2005-09-02 Kyocera Corp 気密端子
JP2005235576A (ja) * 2004-02-19 2005-09-02 Kyocera Corp 気密端子
JP4439389B2 (ja) * 2004-12-22 2010-03-24 京セラ株式会社 気密端子
JP4614905B2 (ja) * 2005-04-18 2011-01-19 京セラ株式会社 気密端子
JP4684110B2 (ja) * 2006-01-30 2011-05-18 京セラ株式会社 気密端子
WO2011096592A1 (ja) * 2010-02-04 2011-08-11 小田産業株式会社 高強度・高延性で優れた耐食性・耐熱性を有する高窒素ステンレス鋼管及びそれらの製造方法

Also Published As

Publication number Publication date
EP3852199B1 (de) 2023-08-30
JPWO2020054703A1 (ja) 2021-08-30
JP7037662B2 (ja) 2022-03-16
WO2020054703A1 (ja) 2020-03-19
EP3852199A4 (de) 2022-06-08

Similar Documents

Publication Publication Date Title
US7854975B2 (en) Joined body and manufacturing method for the same
US11331738B2 (en) High temperature resistant silicon joint for the joining of ceramics
EP3288914B1 (de) Verfahren zur reparatur eines in der halbleiterverarbeitung verwendeten ausstattungsteils
US20130189022A1 (en) Hermetically Joined Plate And Shaft Devices
US12114402B2 (en) Holding device and method of manufacturing holding device
KR20080025012A (ko) 정전 척 및 그 제조 방법
JP2006128603A (ja) セラミックス部材及びその製造方法
JP2010042967A (ja) セラミックス部材、セラミックス部材の作成方法及び静電チャック
EP4286839A1 (de) Hohlraumfraktionssensor, durchflussmesser damit und transferrohr für kryogene flüssigkeit
KR20210153616A (ko) 정전 척을 위한 고밀도 내식층 배열
EP3852199B1 (de) Hermetisches anschlusselement
JP4703442B2 (ja) 基板加熱装置
JP7203233B2 (ja) 電磁場制御用部材
TWI842402B (zh) 接合構造體
US20230347436A1 (en) Multi-layer ceramic plate device
JP7498015B2 (ja) 保持装置及び保持装置の製造方法
JP7075335B2 (ja) 多層基板及びその製造方法
JP2003139861A (ja) 局所領域環境モニター用検出器
JP2023012878A (ja) 嵌合体および接続機構
JP2023050778A (ja) 接合体、その製造方法、および電極埋設部材
JP5937506B2 (ja) セラミック部材および熱伝導部材
WO2024197211A1 (en) Integral resistance heaters including niobium and processes for making same
JP2001006618A (ja) ランプ用傾斜機能材料製封止部材

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210322

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20220506

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 13/504 20060101ALN20220429BHEP

Ipc: H01R 13/03 20060101ALN20220429BHEP

Ipc: H01R 13/74 20060101ALI20220429BHEP

Ipc: H01R 13/53 20060101ALI20220429BHEP

Ipc: H01R 13/405 20060101AFI20220429BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602019036422

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01R0009160000

Ipc: H01R0013405000

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: H01R0009160000

Ipc: H01R0013405000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 13/504 20060101ALN20230220BHEP

Ipc: H01R 13/03 20060101ALN20230220BHEP

Ipc: H01R 13/74 20060101ALI20230220BHEP

Ipc: H01R 13/53 20060101ALI20230220BHEP

Ipc: H01R 13/405 20060101AFI20230220BHEP

RIC1 Information provided on ipc code assigned before grant

Ipc: H01R 13/504 20060101ALN20230303BHEP

Ipc: H01R 13/03 20060101ALN20230303BHEP

Ipc: H01R 13/74 20060101ALI20230303BHEP

Ipc: H01R 13/53 20060101ALI20230303BHEP

Ipc: H01R 13/405 20060101AFI20230303BHEP

INTG Intention to grant announced

Effective date: 20230320

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230508

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602019036422

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20230830

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1606654

Country of ref document: AT

Kind code of ref document: T

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231130

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231230

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231201

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240102

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230910

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20230930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230910

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602019036422

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230910

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230910

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230930

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20230830

26N No opposition filed

Effective date: 20240603

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230930

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240730

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240801

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240808

Year of fee payment: 6