Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
  • H05K7/20136—Forced ventilation, e.g. by fans
  • H05K7/20172—Fan mounting or fan specifications
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
  • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/02—Details
  • H05K5/0212—Condensation eliminators
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
  • H05K7/20136—Forced ventilation, e.g. by fans
  • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20309—Evaporators
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20318—Condensers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
  • H05K7/20354—Refrigerating circuit comprising a compressor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
  • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components

Definitions

• This application relates generally to a system for cooling enclosures that contain electronics.
• Refrigeration systems are used in a variety of settings such as for residential, commercial, and industrial air conditioning systems. These systems may include various components such as motors, compressors, valves, etc. Some or all of these components may be controlled with electronics. Electronics control the flow of electrical energy and signals using electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog to digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits.
• electronic components such as resistors, transistors, digital signal processors, programmable logic controllers, analog to digital converters, inductors, transformers, IGBTs, diodes, and integrated circuits.
• an electronics cooling system with an electronics enclosure that is hermetically sealed.
• the system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system.
• a fan circulates the first cooling fluid within the electronics enclosure.
• the electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid in a controlled manner over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.
• a system with an electronics cooling system includes an electronics enclosure that is hermetically sealed.
• the system includes a heat exchanger that exchanges heat between a first cooling fluid within the electronics enclosure and a second cooling fluid of a vapor compression system.
• a fan circulates the first cooling fluid within the electronics enclosure.
• the electronics cooling system may also include a baffle system within the electronics enclosure that directs the first cooling fluid over one or more electronic components disposed within the electronics enclosure to cool the one or more electronic components.
• the system includes a vapor compression system that generates a second cooling fluid. The heat exchanger exchanges heat between the first cooling fluid and the second cooling fluid.
• the second cooling fluid is augmented by a third cooling fluid.
• an electronics cooling system that includes an electronics enclosure that stores one or more electronic components used to control a vapor compression system (e.g., an electric motor).
• the electronics enclosure is hermetically sealed.
• the electronics cooling system includes a baffle system within the electronics enclosure. The baffle system directs a first cooling fluid over the one or more electronic components to cool the one or more electronic components.
• FIG. 1 is a perspective view of a building that may utilize a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system, in accordance with an aspect of the present disclosure;
• HVAC&R heating, ventilation, air conditioning, and refrigeration
• FIG. 2 is a perspective view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure
• FIG. 3 is a schematic view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure
• FIG. 4 is a schematic view of a vapor compression system coupled to an electronics cooling system, in accordance with an aspect of the present disclosure
• FIG. 5 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure
• FIG. 6 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure.
• FIG. 7 is a partial cross-sectional view of an electronics cooling system within line 7-7 of FIG. 6, in accordance with an aspect of the present disclosure
• FIG. 8 is a partial cross-sectional view of an electronics cooling system within line 7-7 of FIG. 6, in accordance with an aspect of the present disclosure
• FIG. 9 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure.
• FIG. 10 is a cross-sectional view of an electronics cooling system, in accordance with an aspect of the present disclosure.
• FIG. 11 is a front view of a baffle system of the electronics cooling system, in accordance with an aspect of the present disclosure.
• FIG. 12 is a front view of a baffle system of the electronics cooling system, in accordance with an aspect of the present disclosure.
• Embodiments of the present disclosure include an electronics cooling system that cools electronics as well as protects them from moisture, industrial gases/fumes and dirt.
• the electronics cooling system includes an electronics enclosure that is hermetically sealed (or near hermetically sealed) to seal in a first cooling fluid, circulating within the electronics enclosure, from interacting with fluids surrounding the enclosure.
• the first cooling fluid may be air, and the electronics enclosure seals in this air and eliminates or reduces interaction of the air inside of the electronics enclosure from interacting with humid or dirty air outside of the electronics enclosure.
• the first cooling fluid circulates within the electronics enclosure, the first cooling fluid cools the electronics by removing heat by forced convection.
• the first cooling fluid releases this energy in a heat exchanger to a second cooling fluid (e.g., water, refrigerant).
• the second cooling fluid may come from a vapor compression system, such as a chiller that forms part of a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system.
• HVAC&R heating, ventilation, air conditioning, and refrigeration
• the second cooling fluid may be driven through the heat exchanger by a pressure differential and/or it may be driven by a pump.
• the pressure difference may be created by fluidly coupling the electronics cooling system between opposite ends of an evaporator tube bundle. In this way, a small portion of the higher pressure second cooling fluid flowing through the evaporator is diverted to the electronics cooling system.
• the second cooling fluid then flows through the electronics cooling system heat exchanger to cool the first cooling fluid before being drawn out of the electronics cooling system by the lower pressure second cooling fluid exiting the evaporator tube bundle.
• the supply and return lines of the electronics cooling system may couple to other locations in the HVAC&R system to create a pressure differential that drives the second cooling fluid through the electronics cooling system without a pump.
• the electronics cooling system may therefore not use a pump to drive the second cooling fluid through the heat exchanger, thus reducing potential manufacturing and/or operating costs while simultaneously increasing reliability of the electronics cooling system.
• the second cooling fluid may be driven through the electronics cooling system with a pump.
• the pump may be assisted by a pressure differential in the HVAC&R system.
• FIG. 1 is a perspective view of an embodiment of an environment for a heating, ventilation, air conditioning, and refrigeration (HVAC&R) system 10 in a building 12.
• HVAC&R heating, ventilation, air conditioning, and refrigeration
• the HVAC&R system 10 may include a vapor compression system 14 (e.g., chiller) that supplies a chilled liquid, which may be used to cool the building 12.
• the HVAC&R system 10 may also include a boiler 16 to supply warm liquid to heat the building 12 and an air distribution system 18 which circulates air through the building 12.
• the air distribution system 18 can also include an air return duct 20, an air supply duct 22, and/or an air handler 24.
• the air handler 24 may include a heat exchanger that is connected to the boiler 16 and the vapor compression system 14 by conduits 26.
• the heat exchanger in the air handler 24 may receive either heated liquid from the boiler 16 or chilled liquid from the vapor compression system 14, depending on the mode of operation of the HVAC&R system 10.
• the HVAC&R system 10 is shown with a separate air handler 24 on each floor 28 of the building 12, but in other embodiments, the HVAC&R system 10 may include air handlers 24 and/or other components that may be shared between or among floors 28.
• FIGS. 2 and 3 illustrate embodiments of the vapor compression system 14 that can be used in the HVAC&R system 10.
• FIG. 2 is a perspective view of the vapor compression system 14
• FIG. 3 is a schematic view of the vapor compression system 14.
• the vapor compression system 14 may circulate a refrigerant through a circuit starting with a compressor 32.
• the circuit may also include a condenser 34, an expansion valve(s) or device(s) 36, and an evaporator 38.
• the vapor compression system 14 may further include an electronics enclosure 40 that stores various electronics to operate the vapor compression system 14.
• the electronics enclosure 40 includes a digital (A/D) converter(s), a microprocessor(s), a non-volatile memory/memories, interface board(s), etc.
• the electronics enclosure 40 forms part of an electronics cooling system 42 that cools the electronics discussed above.
• the electronics enclosure 40 is a hermetically sealed container that reduces and/or blocks exposure of the electronics to a humid and dirty environment.
• electronics enclosure 40 may be the same as the enclosure that contains the motor variable speed drive (VSD) 52 or the enclosure which contains the components which control the motor magnetic bearing.
• VSD motor variable speed drive
• HFC hydrofluorocarbon
• R-410A R-407, R-134a
• HFO hydrofluoro olefin
• R1233zd R1234ze
• "natural" refrigerants like ammonia (NH3) R-717, carbon dioxide (CO2), R-744, or hydrocarbon based refrigerants, water vapor, or any other suitable refrigerant.
• NH3 ammonia
• CO2 carbon dioxide
• R-744 hydrocarbon based refrigerants
• the vapor compression system 14 may be configured to efficiently utilize refrigerants having a normal boiling point of about 19 degrees Celsius (86 degrees Fahrenheit) at one atmosphere of pressure, also referred to as low pressure refrigerants, versus a medium pressure refrigerant, such as R-134a.
• refrigerants having a normal boiling point of about 19 degrees Celsius (86 degrees Fahrenheit) at one atmosphere of pressure also referred to as low pressure refrigerants
• medium pressure refrigerant such as R-134a.
• "normal boiling point” may refer to a boiling point temperature measured at one atmosphere of pressure.
• the vapor compression system 14 may use one or more of the following components: a variable speed drive(s) 52, a motor 50, the compressor 32, the condenser 34, the expansion valve or device 36, and/or the evaporator 38.
• the motor 50 drives the compressor 32 and may be powered by a variable speed drive (VSD) 52.
• VSD 52 receives alternating current (AC) power having a particular fixed line voltage and fixed line frequency from an AC power source and provides power having a variable voltage and frequency to the motor 50.
• AC alternating current
• the motor 50 may be powered directly from an AC or direct current (DC) power source.
• the motor 50 may include any type of electric motor that can be powered by a VSD 52 or directly from an AC or DC power source, such as a switched reluctance motor, an induction motor, an electronically commutated permanent magnet motor, or another suitable motor.
• the compressor 32 and/or motor 50 may use magnetic bearings 54 to reduce friction and/or noise during operation and increase the compressor/motor reliability.
• the magnetic bearings 54 may be controlled with electronics that are housed within the electronics enclosure 40. As explained above, the electronics enclosure 40 may protect the electronics from dirt and moisture, while the electronics cooling system 42 cools the electronics using a cooling fluid (e.g., water, refrigerant) supplied by the vapor compression system 14.
• a cooling fluid e.g., water, refrigerant
• the compressor may be a positive displacement device 32 which compresses a refrigerant vapor and delivers the vapor to the condenser 34 through a discharge passage.
• the compressor 32 may be a centrifugal compressor.
• the refrigerant vapor delivered by the compressor 32 to the condenser 34 may transfer heat to a cooling fluid (e.g., water or air) in the condenser 34.
• the refrigerant vapor may condense to a refrigerant liquid in the condenser 34 as a result of thermal heat transfer with the cooling fluid.
• the liquid refrigerant from the condenser 34 may flow through the expansion device 36 to the evaporator 38.
• the condenser 34 is water cooled and includes a tube bundle 55 connected to a cooling tower 56 (or water body surrounding a vessel), which supplies the cooling fluid to the condenser 34.
• the liquid refrigerant delivered to the evaporator 38 may absorb heat from another cooling fluid, which may or may not be the same cooling fluid used in the condenser 34.
• the liquid refrigerant in the evaporator 38 may undergo a phase change from the liquid refrigerant to a refrigerant vapor.
• the evaporator 38 may include a tube bundle 58 that couples to a chilled fluid supply line 60S and a return line 60R.
• the supply line 60S and the return line 60R connect the chiller 14 to a cooling load 62.
• the cooling fluid of the evaporator 38 enters the evaporator 38 via return line 60R and exits the evaporator 38 via supply line 60S.
• the evaporator 38 may reduce the temperature of the cooling fluid in the tube bundle 58 via thermal heat transfer with the refrigerant.
• the tube bundle 58 in the evaporator 38 can include a plurality of tubes and/or a plurality of tube bundles. In any case, the vapor refrigerant exits the evaporator 38 and returns to the compressor 32 by a suction line to complete the cycle.
• the electronics cooling system 42 may couple to the tube bundle 58 in the evaporator 38 to receive a flow of cooling fluid from the HVAC&R system 10.
• the electronics cooling system 42 uses the cooling fluid (e.g., water) from the HVAC&R system 10 to cool electronics within the electronics enclosure 40.
• the electronics cooling system 42 may not include a pump and may instead use differences in pressure in the HVAC&R system 10 to drive the flow of the cooling fluid through the electronics cooling system 42.
• a supply line 64 of the electronics cooling system 42 may tap into an end of the tube bundle 58 that receives the cooling fluid flowing through the return line 60R. After passing through the electronics cooling system 42, the temperature and pressure of the cooling fluid increases as it absorbs energy from the electronics disposed within the electronics enclosure 40.
• the cooling fluid is then returned to the supply line side of the tube bundle 58 through a return line 66.
• the pressure of the cooling fluid in the evaporator 38 will be lower than the pressure of the cooling fluid diverted from the evaporator 38 through supply line 64. This difference in pressure drives the flow of the cooling fluid through the electronics cooling system 42 without a pump.
• the supply and return lines 64, 66 of the electronics cooling system 42 may couple to other locations in the vapor compression system 14 to form a pressure differential that drives the cooling fluid through the electronics cooling system 42.
• a supply line 64 i.e., dashed supply line 64
• the supply line 64 directs the cooling fluid through the electronics cooling system 42 where it cools the first fluid or electronics through a chill/cold plates before exiting through the return line 66 (i.e., dashed return line 66).
• the return line 66 may then return the cooling fluid (i.e., refrigerant) to the evaporator 38 because the cooling fluid exiting the expansion valve 68 is at a higher pressure than the cooling fluid in the evaporator 38, the pressure difference drives the flow of the cooling fluid through the electronics cooling system 42 without a pump.
• the cooling fluid i.e., refrigerant
• the cooling fluid may be driven through the electronics cooling system 42 with one or more pumps 72.
• the cooling fluid may be driven through the electronics cooling system 42 with one or more pumps 72.
• the pump(s) 72 may be assisted by a pressure differential in the HVAC&R system 10.
• FIG. 4 is a schematic of the vapor compression system 14 with an intermediate circuit 84 incorporated between condenser 34 and the evaporator 38.
• the intermediate circuit 84 may have an inlet line 88 that is directly fluidly connected to the condenser 34.
• the inlet line 88 may be indirectly fluidly coupled to the condenser 34.
• the inlet line 88 includes a first expansion device 86 positioned upstream of an intermediate vessel 90.
• the intermediate vessel 90 may be a flash tank (e.g., a flash intercooler).
• the intermediate vessel 90 may be configured as a direct expansion heat exchanger or economizer. In the illustrated embodiment of FIG.
• the intermediate vessel 90 is used as a flash tank, and the first expansion device 86 is configured to lower the pressure of (e.g., expand) the liquid refrigerant received from the condenser 34. During the expansion process, a portion of the liquid may vaporize, and thus, the intermediate vessel 90 may be used to separate the vapor from the liquid received from the first expansion device 86. Additionally, the intermediate vessel 90 may provide for further expansion of the liquid refrigerant because of a pressure drop experienced by the liquid refrigerant when entering the intermediate vessel 90 (e.g., due to a rapid increase in volume experienced when entering the intermediate vessel 90). The vapor in the intermediate vessel 90 may be drawn by the compressor 32 through an inlet line 94 to an intermediate pressure port of the compressor 32.
• the vapor in the intermediate vessel 90 may be drawn to an intermediate stage of the compressor 32.
• the liquid that collects in the intermediate vessel 90 may be at a lower enthalpy than the liquid refrigerant exiting the condenser 34 because of the expansion in the expansion device 86 and/or the intermediate vessel 90.
• the liquid from intermediate vessel 90 may then flow in line 92 through a second expansion device 36 to the evaporator 38.
• the electronics cooling system 42 receives a cooling fluid from the vapor compression system 14.
• the electronics cooling system 42 uses the cooling fluid to cool electronics within the electronics enclosure 40 using a heat exchanger.
• the electronics cooling system 42 may not include a pump and instead may use differences in pressure in the vapor compression system 14 to drive the flow of the cooling fluid through the electronics cooling system 42.
• the supply line 96 to the electronics cooling system 42 may tap into the line 92 carrying liquid cooling fluid (i.e., refrigerant) from the intermediate vessel 90 to the evaporator 38.
• the temperature of the cooling fluid increases.
• the cooling fluid is returned through line 98 to the evaporator 38 which is at a lower pressure than the cooling fluid flowing through line 92.
• the return line 98 couples to the evaporator 38. Because the cooling fluid exiting line 92 is at a higher pressure than the pressure in the evaporator 38 the difference in pressure drives the flow of the cooling fluid through the electronics cooling system 42 without a pump. However, in some embodiments a pump 72 may assist and/or drive cooling fluid (i.e., liquid refrigerant from the evaporator 38) through the supply line 95 to the electronics cooling system 42 and return the cooling fluid to the evaporator 38 through return line 97.
• cooling fluid i.e., liquid refrigerant from the evaporator 38
• FIG. 5 is a cross-sectional view of an embodiment of the electronics cooling system 42.
• the electronics enclosure 40 forms part of the electronics cooling system 42.
• Electronics enclosure 40 is a hermetically sealed container that reduces and/or blocks exposure of the electronics to moisture, industrial fumes/gases and dirt in the environment.
• the electronics enclosure 40 includes a first enclosure 100 coupled to a second enclosure 102.
• the first and second enclosures 100, 102 are fluidly coupled together with an outlet 104 and an inlet 106.
• there may be multiple inlets 106 and outlets 104 e.g., 2, 3, 4, 5, or more).
• the outlet 104 the inlet 106 enable a cooling fluid 108 (e.g., air) to circulate between a first cavity 110 in the first enclosure 100 and a second cavity 1 12 in the second enclosure 102 to cool electronics 1 14.
• the electronics 1 14 may include microchips, integrated circuits, power supplies, transistors, resistors, inductors, transformers, IGBTs, etc.
• the electronics cooling system 42 limits and/or blocks direct interaction between the cooling fluid 108 and fluids outside of the electronics enclosure 40. In this way, electronics enclosure 40 is able to block and/or reduce exposure of the electronics 114 to moisture, industrial fumes/gases and/or dirt in the environment.
• the cooling fluid 108 e.g., air
• the cooling fluid 108 may not be exposed to moist/humid air circulating around outside the electronics enclosure 40.
• electronics cooling system 42 includes a heat exchanger 1 16 (e.g., gas to liquid heat exchanger).
• the heat exchanger 116 receives a second cooling fluid 1 18 through a supply line 120.
• the second cooling fluid 1 18 comes from the vapor compression system 14 and may be a refrigerant, water, etc.
• the second cooling fluid 1 18 exchanges energy with the first cooling fluid 108 circulating in the electronics enclosure 40.
• the second cooling fluid 118 exits the heat exchanger 1 16 at a higher temperature.
• the second cooling fluid 118 is then carried away from the electronics cooling system 42 through return line 122 to the HVAC&R system 10.
• the first cooling fluid 108 is driven into the second enclosure 102 using a fan 124. More specifically, the fan 124 draws the first cooling fluid 108 through the heat exchanger 116, and then blows the first cooling fluid 108 through the outlet 104 and into the inlet plenum 152. After passing through the outlet 104, the first cooling fluid 108 contacts a baffles system 126. As illustrated, the baffle system 126 redirects and controls the flow of the cooling fluid 108 through the second enclosure 102.
• the baffle system 126 includes a baffle plate 128 and a separation plate 130. The separation plate 130 couples to the second enclosure 102 and spaces the baffle plate 128 a distance 132 from the enclosure wall 134.
• the distance 132 may be selected to optimize flow and pressure drop of the cooling fluid 108.
• the separation plate 130 also separates the outlet 104 from the inlet 106 to form inlet and outlet plenums 152, 154. Accordingly, as the cooling fluid 108 exits the first enclosure 100 through the outlet 104, the separation plate 130 blocks the first cooling fluid 108 from flowing directly to the inlet 106 without passing over the baffle plate 128 and the attached electronics 1 14.
• first cooling fluid 108 As the first cooling fluid 108 exits the outlet 104, it contacts a rear face 136 of the baffle plate 128.
• the first cooling fluid 108 is therefore directed upward in axial direction 138 (e.g., vertical) in the inlet plenum 152.
• axial direction 138 e.g., vertical
• the first cooling fluid 108 flows in axial direction 140 (e.g., downward). This creates a cascading cooling effect that cools the electronics 1 14 as the first cooling fluid 108 flows in direction 140.
• the first cooling fluid 108 then flows around the bottom of the baffle plate 128 where it contacts the wall 134 of the second enclosure 102.
• the wall 134 and baffle plate 128 direct the first cooling fluid 108 upward in axial direction 138 through the outlet plenum 154.
• the separation plate 130 blocks direct fluid flow between the outlet 104 and the inlet 106.
• the first cooling fluid 108 is therefore driven through the inlet 106 and into the heat exchanger 116 where it again exchanges energy with the second cooling fluid 118.
• the electronics cooling system 42 includes a condensate breather valve 142.
• the condensate breather valve 142 enables liquid to exit the electronics enclosure 40 while blocking and/or reducing outside (ambient) fluid flow into the electronics enclosure 40.
• the condensate breather valve 142 may be placed in the first enclosure 100 in order to catch liquid that condenses in the first cooling fluid 108 as it exits the heat exchanger 116.
• the heat exchanger 1 16 is placed within the first enclosure 100. As explained above and seen in FIG. 5, the first and second enclosures 100, 102 are separated by the wall 134 which blocks the minimal condensate formed in the first enclosure 100 from flowing into the second enclosure 102.
• the first enclosure 100 and the second enclosure 102 are separate enclosures that couple together.
• the first and second enclosures 100, 102 may be coupled together with fasteners 144.
• the first and second enclosures 100, 102 may form a fluid tight seal that blocks and/or reduces outside (ambient) fluid from entering the electronics enclosure 40.
• Fluid tight seal may be formed using a sealing element 156 such as a gasket, a weld, a polymeric seal (eg. O-ring etc.), a braze, an adhesive, etc.
• the first and second enclosures 100, 102 may be integral (e.g., one-piece) with one another. While the illustrated first and second enclosures 100, 102 have different sizes, in some embodiments they may be the same size.
• the first and second enclosures 100, 102 may have access panels.
• the first enclosure 100 may include a fan access panel 146.
• the fan access panel 146 couples to the first enclosure 100 with one or more fasteners 148 (e.g., threaded fasteners such as bolts, screws).
• the fan access panel 146 enables access for replacement and/or maintenance of the fan 124.
• the fan access panel 146 forms a fluid tight seal using a gasket, a braze, an adhesive etc. with the first enclosure 100 to block and/or reduce contact with fluids around the exterior of the electronics enclosure 40.
• the electronics 114 may also be accessed through an enclosure panel 150 that couples to the second enclosure 102.
• the enclosure panel 150 may likewise couple to the second enclosure 102 with fasteners (e.g., threaded fasteners such as bolts, screws, etc.).
• the enclosure panel 150 may also form a fluid tight seal with the second enclosure 102 to block and/or reduce contact with fluids around the exterior of the electronics enclosure 40 using a gasket, a braze, an adhesive etc.
• FIG. 6 is a cross-sectional view of an embodiment of the electronics cooling system 42.
• the electronics cooling system 42 in FIG. 6 circulates the first cooling fluid 108 through first and second enclosures 100, 102 to cool the electronics 1 14.
• the electronics cooling system 42 may include one or more chill (cold) plates 170.
• the chill (cold) plates 170 may increase heat transfer from one or more electronic components 114.
• some electronics components 1 14 may generate more heat than others. These electronics components 114 may therefore increase the heat transfer requirements of the electronics cooling system 42.
• the electronics cooling system 42 may therefore include the chill (cold) plates 170 to enable a more direct heat transfer from electronics to the second cooling fluid 118.
• the chill (cold) plates 170 may directly receive and circulate the second cooling fluid 1 18 as shown in Fig 6.
• the supply line 120 and the return line 122 may include respective T-joints 172 and 174.
• the T-joints 172, 174 enable the second cooling fluid 118 to flow to and from the heat exchanger 116 and chill (cold) plates 170, as shown in Fig 6.
• the secondary cooling fluid 1 18 may be water or refrigerant.
• the chill (cold) plates 170 may form condensate within the second enclosure 102.
• the chill (cold) plate 170 may be positioned at the bottom of the baffle plate 128 in direction 140. Accordingly, if condensate forms on the chill (cold) plate 170, the condensate may fall in direction 140 to the bottom of the second enclosure 102 without contacting any other electronics 114.
• the second enclosure 102 may include a second breather condensate valves 142, 176.
• the breather condensate valve 176 enables the electronics cooling system 42 to remove liquid from the first and/or second enclosures 100, 102.
• the chill (cold) plate 170 may not form condensate within the second enclosure 102 because the heat exchanger 1 16 and supply line 120 condense moisture out of the cooling fluid 108 before it reaches the second enclosure 102.
• the electronics cooling system 42 may include additional baffle systems 126 to accommodate and cool more electronic components 114.
• the electronics cooling system 42 includes a first baffle system 126 coupled to the wall 134 of the second enclosure 102 and a second baffle system 126 coupled to the enclosure panel 150.
• the baffle plates 128 of the respective first and second baffle systems 126 may be spaced apart a distance 178 to facilitate the flow of the first cooling fluid 108 over the electronics 114.
• the distance 178 may be optimized to facilitate the required heat transfer from the electronics 1 14 to the cooling fluid 108.
• FIG. 7 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of FIG. 6.
• the electronics cooling system 42 in FIG. 7 circulates the first cooling fluid 108 through first and second enclosures 100, 102 to cool the electronics 114.
• the electronics cooling system 42 may include one or more chill (cold) plates 170.
• the chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronics components 114 may generate more heat than others.
• the electronics cooling system 42 may therefore include the chill (cold) plates 170 to enable a more direct heat transfer from the electronics to the second cooling fluid 118. However, instead of splitting the flow of the second cooling fluid 118.
• the electronics cooling system 42 may first direct the second cooling fluid 118 to the chill (cold) plates 170 before redirecting the second cooling fluid 118 to flow through the heat exchanger 116.
• FIG. 8 is a partial cross-sectional view of an embodiment of the electronics cooling system 42 within line 7-7 of FIG. 6.
• the electronics cooling system 42 may include one or more chill (cold) plates 170.
• the chill (cold) plates 170 may increase heat transfer from one or more electronic components 114.
• the electronics cooling system 42 may first direct the second cooling fluid 118 to the heat exchanger 116 after which the second cooling fluid 118 is then directed to the chill (cold) plates 170.
• the electronics cooling system 42 may heat the second cooling fluid 118 and reduce condensation in the second enclosure 102 while cooling one or more electronic components 114.
• FIG. 9 is a cross-sectional view of an embodiment of the electronics cooling system 42.
• the electronics cooling system 42 may include one or more chill (cold) plates 170.
• the chill (cold) plates 170 may increase heat transfer from one or more electronic components 114. For example, some electronics components 114 may generate more heat than others. These electronic components 114 may therefore increase the heat transfer requirements of the electronics cooling system 42.
• the chill (cold) plates 170 may be separately supplied with a third cooling fluid 200.
• the third cooling fluid 200 flows to and from the chill (cold) plates 170 through respective supply and return lines 202 and 204.
• the second cooling fluid 118 and the third cooling fluid 200 may be the same cooling fluid.
• the second and third cooling fluids 118, 200 may be water, refrigerant, etc. In another embodiment, the second and third cooling fluids 118, 200 may be different.
• the second cooling fluid 118 may be water, while the third cooling fluid 200 may be refrigerant, or vice versa.
• FIG. 10 is a cross-sectional view of an embodiment of the electronics cooling system 42.
• the baffle system 126 may include one or more additional guide plates 220.
• the guide plate 220 assists in controlling the flow of the first cooling fluid 108 through the second enclosure 102.
• guide plate 220 couples to an interior surface 222 of the top plate 224 of the second enclosure 102.
• the guide plate 220 extends away from the interior surface 222 in direction 140.
• the guide plate 220 may extend over a portion or over the entire baffle plate 128 to guide the flow of the first cooling fluid 108. As illustrated, the first cooling fluid 108 flows up and over the baffle plate 128.
• the first cooling fluid 108 contacts the surface 226 of the guide plate 220.
• the guide plate 220 directs the first cooling fluid 108 downward in direction 140 and over electronics 114. In this way, the guide plate 220 focuses the flow of the first cooling fluid 108 over the electronics 1 14 to facilitate heat transfer.
• a distance 228 between the surface 226 of the guide plate 220 and the baffle plate 128 may be increased or decreased to control characteristics of the fluid flow over electronics 114.
• An increased flow velocity may increase turbulence leading to greater heat transfer from the electronics 1 14.
• the guide plate 220 may increase the flow velocity of the first cooling fluid 108 over the electronics 1 14.
• the guide plate 220 may decrease the flow velocity of the first cooling fluid 108 over the electronics 114. In this way, the electronics cooling system 42 may use the guide plate 220 to direct and customize heat transfer between the first cooling fluid 108 and the electronics 114.
• the surface 226 of the guide plate 220 is flat; however, in some embodiments, surface 226 may be curved or otherwise shaped to facilitate heat transfer at different positions along the guide plate 220.
• the distance 230 between the guide plate 220 and the baffle plate 128 may increase and/or decrease at different points along the length 230 to customize and/or optimize heat transfer over different electronics 114 (e.g., increase or decrease flow velocity over different electronics 114).
• the guide plate 220 may include protrusions 232 and/or recesses 234. The protrusions 232 and recesses 234 may similarly control the flow velocity and rate of the first cooling fluid 108 over specific electronic components 114, and thus the heat transfer characteristics.
• the guide plate 220 may be removably coupled from the second enclosure 102.
• the guide plate 220 may couple to the second enclosure 102 with a snap fit connection, bayonet connection, etc.
• the guide plate 220 may be removably coupled using fasteners (e.g., threaded fasteners).
• FIG. 1 1 is a front view of an embodiment of the baffle system 126.
• baffle plate 128 may have another shape other than rectangular or square.
• the baffle plate 128 may have an irregular shape to control the flow of the first cooling fluid 108 over the electronics 114.
• the plate 128 includes rectangular cutouts 250 and 252 at respective ends 254 and 256 of the baffle plate 128.
• the cutouts 250, 252 may be at different positions along the length 258 of the baffle plate 128, have different sizes, and/or different shapes (e.g., semicircular, triangular, square, etc.) in order to customize/control the flow of the first cooling fluid 108 over the electronics 114.
• the baffle plate 128 directs more of the first cooling fluid 108 over the electronics 1 14 on or near end 256 of the baffle plate 128. It should be noted that the cutouts 250, 252 may be placed in any position on the baffle plate 128 above and/or below the separation plate 130 to control the flow of the first cooling fluid 108 over the electronics 1 14.
• the baffle plate 128 may also include apertures 260.
• the apertures 260 enable the first cooling fluid 108 to pass through the aperture 260 instead of flowing up and over the baffle plate 128. This enables customized and/or optimized fluid flow of the first cooling fluid 108 over specific electronics 1 14. While two apertures 260 are shown in FIG. 11 , in other embodiments there may be different numbers of apertures 260 such as 1, 3, 4, 5, 6, 7, 8, 9, 10 or more. Furthermore, the apertures 260 may have different shapes and/or sizes in order to customize and/or optimized the flow of the first cooling fluid 108 over electronics 114.
• FIG. 12 is a front view of an embodiment of the baffle system 126.
• baffle system 126 includes the baffle plate 128 and the separation plate 130.
• the baffle system 126 includes adjustable baffles 280.
• the adjustable baffles 280 couple to respective ends 254 and 256 of the baffle plate 128.
• the adjustable baffles 280 may be vertically repositioned in directions 138 and 140 to customize the flow of the first cooling fluid 108 over the electronics 1 14. While FIG.
• the baffle system 126 uses the adjustable baffles 280 to control the flow of the first cooling fluid 108
• the baffle system 126 may include a combination of adjustable baffles 280, apertures 260, and cutouts 250 and 252 to control the flow of the first cooling fluid 108 over the electronics 1 14.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Devices That Are Associated With Refrigeration Equipment (AREA)

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• 2018
  • 2018-07-19 KR KR1020207004108A patent/KR102435795B1/ko active IP Right Grant
  • 2018-07-19 JP JP2020502268A patent/JP2020528217A/ja active Pending
  • 2018-07-19 CN CN201880059353.5A patent/CN111096091A/zh active Pending
  • 2018-07-19 TW TW107124967A patent/TWI826384B/zh active
  • 2018-07-19 CN CN202310356853.8A patent/CN116261308A/zh active Pending
  • 2018-07-19 WO PCT/US2018/042945 patent/WO2019018681A1/en unknown
  • 2018-07-19 EP EP18750068.1A patent/EP3656190A1/de active Pending
• 2022
  • 2022-09-20 JP JP2022148768A patent/JP7412064B2/ja active Active

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