EP3576491B1 - Vitre dotée d'un élément de raccordement électrique - Google Patents

Vitre dotée d'un élément de raccordement électrique Download PDF

Info

Publication number
EP3576491B1
EP3576491B1 EP19186394.3A EP19186394A EP3576491B1 EP 3576491 B1 EP3576491 B1 EP 3576491B1 EP 19186394 A EP19186394 A EP 19186394A EP 3576491 B1 EP3576491 B1 EP 3576491B1
Authority
EP
European Patent Office
Prior art keywords
connection element
electrically conductive
conductive structure
contact
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP19186394.3A
Other languages
German (de)
English (en)
Other versions
EP3576491A1 (fr
Inventor
Christoph Degen
Bernhard Reul
Mitja Rateiczak
Andreas Schlarb
Lothar Lesmeister
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Original Assignee
Saint Gobain Glass France SAS
Compagnie de Saint Gobain SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Glass France SAS, Compagnie de Saint Gobain SA filed Critical Saint Gobain Glass France SAS
Publication of EP3576491A1 publication Critical patent/EP3576491A1/fr
Application granted granted Critical
Publication of EP3576491B1 publication Critical patent/EP3576491B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/016—Heaters using particular connecting means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Definitions

  • the invention relates to a disk with an electrical connection element and an economical and environmentally friendly method for producing it.
  • the invention further relates to a pane with an electrical connection element for vehicles with electrically conductive structures such as heating conductors or antenna conductors.
  • the electrically conductive structures are usually connected to the on-board electrical system via soldered electrical connection elements. Due to different thermal expansion coefficients of the materials used, mechanical stresses occur during production and operation, which can put strain on the panes and cause the pane to break.
  • Lead-containing solders have high ductility, which can compensate for mechanical stresses that occur between the electrical connection element and the pane through plastic deformation.
  • lead-containing solders must be replaced by lead-free solders within the EC.
  • the directive is collectively referred to by the abbreviation ELV (End of life vehicles).
  • ELV End of life vehicles
  • the goal is to banish extremely problematic components from the products as a result of the massive expansion of disposable electronics.
  • the substances affected are lead, mercury and cadmium. This concerns, among other things, the implementation of lead-free solders in electrical applications on glass and the introduction of corresponding replacement products.
  • EP 1 942 703 A2 discloses an electrical connection element on vehicle windows, wherein the difference in the thermal expansion coefficients of the window and electrical connection element is ⁇ 5 ⁇ 10 -6 /°C, the connection element predominantly contains titanium and the contact surface between the connection element and the electrically conductive structure is rectangular.
  • the connection element predominantly contains titanium and the contact surface between the connection element and the electrically conductive structure is rectangular.
  • it is suggested to use an excess of solder mass.
  • the excess solder mass emerges from the space between the connection element and the electrically conductive structure.
  • the excess of solder causes high mechanical stresses in the glass pane. These mechanical stresses ultimately lead to the disc breaking.
  • US 2644066 and GB 751536 A each show a connection element that does not contain any chromium-containing steel and is soldered to an electrically conductive layer using a lead-containing solder.
  • the object of the present invention is to provide a disk with an electrical connection element and an economical and environmentally friendly method for its production, whereby critical mechanical stresses in the disk are avoided.
  • the central angle of the segment is from 90° to 360°, preferably from 140° to 360°, for example from 180° to 330° or from 200° to 330°.
  • the shape of the contact surface between the connection element and the electrically conductive structure has at least two semi-ellipses, particularly preferably two semicircles.
  • the contact surface is shaped as a rectangle with two semicircles arranged on opposite sides.
  • the shape of the contact surface has two circular segments with center angles of 210° to 360°.
  • the shape of the contact surface can also include, for example, two segments of an oval, an ellipse or a circle, the center angle being from 180° to 350°, preferably from 210° to 310°.
  • the soldering points form two separate contact surfaces between the connection element and the electrically conductive structure.
  • Each contact surface is arranged on the surface of one of two foot regions of the connection element facing the substrate.
  • the foot areas are connected to each other via a bridge.
  • the two contact surfaces are connected to one another via the surface of the bridge facing the substrate.
  • the shape of each of the two contact surfaces has at least one segment of an oval, an ellipse or a circle with a center angle of 90° to 360°, preferably 140° to 360°.
  • Each contact surface can have an oval, preferably an elliptical structure.
  • Each contact surface is particularly preferably shaped as a circle.
  • each contact surface is preferably shaped as a circular segment with a center angle of at least 180°, particularly preferably at least 200°, very particularly preferably at least 220°, and in particular at least 230°.
  • the circle segment can, for example, have a center angle of 180° to 350°, preferably of 200° to 330°, particularly preferably of 210° to 310°.
  • each contact surface is designed as a rectangle with two semi-ovals, preferably semi-ellipses, particularly preferably semicircles, arranged on opposite sides.
  • the electrical connection element is electrically connected to the electrically conductive structure in some areas using a solder mass.
  • connection element is connected to the electrically conductive structure by soldering, for example resistance soldering, via the contact surface or contact surfaces.
  • soldering for example resistance soldering
  • two soldering electrodes are used, with each soldering electrode being brought into contact with a soldering point on the connection element.
  • a current flows from one soldering electrode via the connection element to the second soldering electrode.
  • the contact between the soldering electrode and the connection element preferably takes place over the smallest possible area.
  • the soldering electrodes are designed as tips.
  • the small contact area results in a high current density in the area of contact between the soldering electrode and the connection element. The high current density leads to heating of the contact area between the soldering electrode and the connection element.
  • connection element is, for example, preferably connected to the electrically conductive structure via a rectangular contact surface. Temperature differences occur along the edges of a rectangular contact surface during the soldering process due to the heat distribution spreading from the solder joints. This means that there may be areas of the contact surface in which the solder mass is not completely melted. These areas lead to poor adhesion of the connecting element and mechanical stress in the disc.
  • the advantage of the invention lies in the shape of the contact surface or surfaces between the connection element and the electrically conductive structure.
  • the shape of the contact surfaces is rounded at least in a predominant area of the edges and preferably has circles or circle segments.
  • the shape of the contact surfaces approximates the shape of the heat distribution around the soldering points during the soldering process. Therefore, no or only small temperature differences occur along the edges of the contact surfaces during the soldering process. This leads to a uniform melting of the solder mass in the entire area of the contact surfaces between the connection element and the electrically conductive structure.
  • This is particularly advantageous with regard to the adhesion of the connection element, shortening the duration of the soldering process and avoiding mechanical stress in the disk.
  • There is a particular advantage in particular when using a lead-free solder which is less able to compensate for mechanical stresses due to its lower ductility compared to lead-containing solder.
  • connection elements are, for example, preferably 1 mm to 50 mm long and wide and particularly preferably 2 mm to 30 mm long and wide and very particularly preferably 2 mm to 8 mm wide and 10 mm to 24 mm long.
  • Two contact surfaces connected to one another by a bridge are, for example, preferably 1 mm to 15 mm long and wide and particularly preferably 2 mm to 8 mm long and wide.
  • the solder mass emerges from the space between the connection element and the electrically conductive structure with an exit width of ⁇ 1 mm.
  • the maximum exit width is preferably less than 0.5 mm and in particular approximately 0 mm. This is particularly advantageous with regard to the reduction of mechanical stresses in the disk, the adhesion of the connection element and the saving of solder.
  • the maximum exit width is defined as the distance between the outer edges of the connection element and the point of the solder transfer where the solder layer thickness is less than 50 ⁇ m. The maximum exit width is measured on the solidified solder mass after the soldering process.
  • a desired maximum exit width is achieved through a suitable choice of solder mass volume and vertical distance between the connection element and the electrically conductive structure, which can be determined through simple experiments.
  • the vertical distance between the connection element and the electrically conductive structure can be specified by a corresponding process tool, for example a tool with an integrated spacer.
  • the maximum exit width can also be negative, i.e. retracted into the space formed by the electrical connection element and the electrically conductive structure.
  • the maximum exit width is retracted into a concave meniscus in the space formed by the electrical connection element and the electrically conductive structure.
  • a concave meniscus is created by increasing the vertical distance between the spacer and the conductive structure during the soldering process while the solder is still liquid.
  • the bridge between two foot areas of the connection element according to the invention is preferably flat in sections.
  • the bridge particularly preferably consists of three flat sections.
  • Plan means that the underside of the connection element forms a plane.
  • the angle between the surface of the substrate and the underside of each flat section of the bridge directly adjacent to a foot area is preferably ⁇ 90°, particularly preferably between 1° and 85°, very particularly preferably between 2° and 75° and in particular between 3° and 60°.
  • the bridge is shaped in such a way that each flat section adjacent to a foot area is inclined in the direction facing away from the immediately adjacent foot area.
  • the advantage lies in the effect of the capillary effect between the electrically conductive structure and the sections of the bridge adjacent to the contact surfaces.
  • the capillary effect is a consequence of the small distance between the electrically conductive structure and the sections of the bridge adjacent to the contact surfaces. The small distance results from the angle ⁇ 90° between the surface of the substrate and the underside of each flat section of the bridge directly adjacent to a foot area.
  • the desired distance between the connection element and the electrically conductive structure is set after the solder mass has melted. Excess solder mass is sucked into the volume limited by the bridge and the electrically conductive structure in a controlled manner using the capillary effect. This reduces the amount of solder mass transfer to the outer edges of the connection element and thus the maximum exit width. This results in a reduction in the mechanical stresses in the disc.
  • edges of the contact surfaces to which the bridge is connected are not outer edges of the connection element.
  • the cavity which is delimited by the electrically conductive structure and the bridge, can be completely filled with solder mass.
  • the cavity is preferably not completely filled with solder mass.
  • the bridge is curved.
  • the bridge can have a single direction of curvature.
  • the bridge preferably has the profile of an oval arch, particularly preferably the profile of an elliptical arch and very particularly preferably the profile of a circular arc.
  • the radius of curvature of the circular arc is, for example, preferably from 5 mm to 15 mm with a length of the connecting element of 24 mm.
  • the direction of curvature of the bridge can also change.
  • the bridge can also consist of at least two sub-elements that are in direct contact with each other.
  • the projection of the bridge into the plane of the substrate surface can also be curved.
  • the direction of curvature preferably changes in the middle of the bridge.
  • the bridge does not have to have a constant width.
  • each of the two soldering points is arranged on a contact elevation.
  • the contact elevations are arranged on the surface of the connection element facing away from the substrate.
  • the contact elevations preferably contain the same alloy as the connection element.
  • Each contact elevation is preferably convexly curved at least in the area facing away from the surface of the substrate.
  • Each contact elevation is formed, for example, as a segment of an ellipsoid of revolution or as a spherical segment.
  • the contact elevation can be shaped as a cuboid, with the surface facing away from the substrate being shaped to be convexly curved.
  • the contact elevations preferably have a height of 0.1 mm to 2 mm, particularly preferably 0.2 mm to 1 mm.
  • the length and width of the contact elevations is preferably between 0.1 and 5 mm, very particularly preferably between 0.4 mm and 3 mm.
  • the contact surveys can be designed as embossings.
  • the contact elevations can be formed in one piece with the connection element.
  • the contact elevations can be formed on the surface, for example, by forming a connection element with a flat surface in the initial state, for example by embossing or deep drawing. A corresponding depression can be created on the surface of the connection element opposite the contact elevation.
  • Electrodes whose contact side is flat can be used for soldering.
  • the electrode surface is brought into contact with the contact bump.
  • the electrode surface is arranged parallel to the surface of the substrate.
  • the point on the convex surface of the contact bump that has the greatest perpendicular distance to the surface of the substrate is located between the electrode surface and the surface of the substrate.
  • the contact area between the electrode surface and the contact bump forms the soldering point.
  • the position of the soldering point is preferred determines the point on the convex surface of the contact bump that has the greatest perpendicular distance to the surface of the substrate.
  • the position of the soldering point is independent of the position of the soldering electrode on the connection element. This is particularly advantageous with regard to reproducible, even heat distribution during the soldering process.
  • the heat distribution during the soldering process is determined by the position, size, arrangement and geometry of the contact bump.
  • At least two spacers are arranged on each of the contact surfaces of the connection element.
  • the spacers preferably contain the same alloy as the connecting element.
  • Each spacer is shaped, for example, as a cube, as a pyramid, as a segment of an ellipsoid of revolution or as a spherical segment.
  • the spacers preferably have a width of 0.5 ⁇ 10 -4 m to 10 ⁇ 10 -4 m and a height of 0.5 ⁇ 10 -4 m to 5 ⁇ 10 -4 m, particularly preferably 1x 10 -4 m up to 3 ⁇ 10 -4 m.
  • the spacers promote the formation of a uniform layer of solder mass.
  • the spacers can be formed in one piece with the connection element.
  • the spacers can be formed on the contact surface, for example, by forming a connection element with flat contact surfaces in the initial state, for example by embossing or deep drawing. A corresponding depression can be created on the surface of the connection element opposite the contact surface.
  • the contact elevations and the spacers create a homogeneous, evenly thick and evenly melted layer of solder mass. This allows mechanical stresses between the connecting element and the disc to be reduced. This is particularly advantageous when using lead-free soldering materials, which are less able to compensate for mechanical stresses due to their lower ductility compared to lead-containing soldering materials.
  • the substrate preferably contains glass, particularly preferably flat glass, float glass, quartz glass, borosilicate glass, soda-lime glass.
  • the substrate contains polymers, particularly preferably polyethylene, polypropylene, polycarbonate, polymethyl methacrylate and/or mixtures thereof.
  • the substrate has a first coefficient of thermal expansion.
  • the connection element has a second thermal expansion coefficient.
  • the first coefficient of thermal expansion is preferably from 8 ⁇ 10 -6 /°C to 9 ⁇ 10 -6 /°C.
  • the substrate preferably contains glass, which preferably has a thermal expansion coefficient of 8.3 ⁇ 10 -6 /°C to 9 ⁇ 10 -6 /°C in a temperature range of 0 °C to 300 °C.
  • the difference between the first and second expansion coefficients is also ⁇ 5 ⁇ 10 -6 /°C.
  • the second coefficient of thermal expansion is preferably from 9 ⁇ 10 -6 /°C to 13 ⁇ 10 -6 /°C, particularly preferably from 10 ⁇ 10 -6 /°C to 11.5 ⁇ 10 -6 /°C in one Temperature range from 0°C to 300°C.
  • connection element according to the invention contains a chromium-containing steel with a chromium content of greater than or equal to 10.5% by weight and a thermal expansion coefficient of 9 ⁇ 10 -6 /°C to 13 ⁇ 10 -6 /°C.
  • Other alloy components such as molybdenum, manganese or niobium lead to improved corrosion resistance or changed mechanical properties such as tensile strength or cold formability.
  • connecting elements made of chromium-containing steel compared to prior art connecting elements made of titanium is their better solderability. It results from the higher thermal conductivity of 25 W/mK to 30 W/mK compared to titanium's thermal conductivity of 22 W/mK. The higher thermal conductivity leads to a more even heating of the connection element during the soldering process, which prevents the formation of particularly hot spots. These points are starting points for later damage to the window. This results in improved adhesion of the connecting element to the pane. Steel containing chromium is also easy to weld. This enables a better connection of the connection element to the on-board electrical system via an electrically conductive material, for example copper, by welding. Due to the better cold formability, the connection element can also be better crimped with the electrically conductive material. Steel containing chromium is also more available.
  • the electrically conductive structure according to the invention preferably has a layer thickness of 5 ⁇ m to 40 ⁇ m, particularly preferably of 5 ⁇ m to 20 ⁇ m, very particularly preferably of 8 ⁇ m to 15 ⁇ m and in particular of 10 ⁇ m to 12 ⁇ m.
  • the electrically conductive structure according to the invention preferably contains silver, particularly preferably silver particles and glass frits.
  • the layer thickness of the solder according to the invention is preferably ⁇ 3.0 ⁇ 10 -4 m.
  • the solder is lead-free, so it does not contain any lead. This is particularly advantageous with regard to the environmental compatibility of the pane according to the invention with an electrical connection element.
  • Lead-free solder materials typically have lower ductility than lead-containing solder materials, so that mechanical stresses between the connection element and the disk cannot be compensated as well. However, it has been shown that critical mechanical stresses are significantly reduced by the connection element according to the invention.
  • the soldering material according to the invention preferably contains tin and bismuth, indium, zinc, copper, silver or compositions thereof.
  • the proportion of tin in the solder composition according to the invention is from 3% by weight to 99.5% by weight, preferably from 10% by weight to 95.5% by weight, particularly preferably from 15% by weight to 60 % by weight.
  • the proportion of bismuth, indium, zinc, copper, silver or compositions thereof in the solder composition according to the invention is from 0.5% by weight to 97% by weight, preferably 10% by weight to 67% by weight, whereby the Proportion of bismuth, indium, zinc, copper or silver can be 0% by weight.
  • the solder composition according to the invention can contain nickel, germanium, aluminum or phosphorus in a proportion of 0% by weight to 5% by weight.
  • the solder composition according to the invention particularly preferably contains Bi40Sn57Ag3, Sn40Bi57Ag3, Bi59Sn40Ag1, Bi57Sn42Ag1, In97Ag3, Sn95.5Ag3.8Cu0.7, Bi67In33, Bi33ln50Sn17, Sn77.2In20Ag2.8, Sn95Ag4Cu1, S n99Cu1, Sn96.5Ag3.5 or mixtures thereof.
  • connection element according to the invention is preferably coated with nickel, tin, copper and/or silver.
  • the connection element according to the invention is particularly preferably provided with an adhesion-promoting layer, preferably made of nickel and/or copper, and additionally with a solderable layer, preferably made of silver.
  • the connection element according to the invention is particularly preferably coated with 0.1 ⁇ m to 0.3 ⁇ m nickel and/or 3 ⁇ m to 20 ⁇ m silver.
  • the connection element can be nickel-plated, tin-plated, copper-plated and/or silver plated. Nickel and silver improve the current carrying capacity and corrosion stability of the connection element and the wetting with the solder mass.
  • the iron-nickel alloy, the iron-nickel-cobalt alloy or the iron-chromium alloy can also be welded, crimped or glued as a compensating plate to a connection element made of, for example, steel, aluminum, titanium, copper.
  • a connection element made of, for example, steel, aluminum, titanium, copper.
  • the compensation plate is preferably hat-shaped.
  • the electrical connection element contains, on the surface aligned with the solder mass, a coating which contains copper, zinc, tin, silver, gold or alloys or layers thereof, preferably silver. This prevents the solder mass from spreading across the coating and limits the exit width.
  • the shape of the electrical connection element can form solder deposits in the space between the connection element and the electrically conductive structure.
  • the solder deposits and wetting properties of the solder on the connection element prevent the solder mass from escaping from the gap.
  • Solder depots can be rectangular, rounded or polygonal.
  • connection element The distribution of the solder heat and thus the distribution of the solder mass in the soldering process can be defined by the shape of the connection element. Solder flows to the warmest point.
  • connection element can have a single or double hat shape in order to advantageously distribute the heat in the connection element during the soldering process.
  • the introduction of energy when electrically connecting the electrical connection element and the electrically conductive structure is preferably carried out using stamps, thermodes, iron soldering, preferably laser soldering, hot air soldering, induction soldering, resistance soldering and/or ultrasound.
  • connection elements The solder mass is preferably applied to the connection elements beforehand, preferably as a plate with a fixed layer thickness, volume, shape and arrangement on the connection element.
  • connection element can, for example, be welded or crimped with a sheet metal, a stranded wire or a braid made of, for example, copper and connected to the on-board electrical system.
  • connection element is preferably used in heating panes or in panes with antennas in buildings, in particular in automobiles, railways, aircraft or sea vessels.
  • the connection element serves to connect the conductive structures of the pane with electrical systems which are arranged outside the pane.
  • the electrical systems are amplifiers, control units or voltage sources.
  • Fig.1 , Fig. 2a , Fig. 2b and Fig. 2c each show a detail of a heatable pane 1 according to the invention in the area of the electrical connection element 3.
  • the pane 1 is a 3 mm thick thermally toughened single-pane safety glass made of soda-lime glass.
  • the disk 1 has a width of 150 cm and a height of 80 cm.
  • An electrically conductive structure 2 in the form of a heating conductor structure 2 is printed on the pane 1.
  • the electrically conductive structure 2 contains silver particles and glass frits.
  • the electrically conductive structure 2 is widened to a width of 10 mm and forms a contact surface for the electrical connection element 3.
  • the Connection element 3 consists of two foot areas 7 and 7 ', which are connected to one another via the bridge 9. Two contact surfaces 8' and 8" are arranged on the surfaces of the foot regions 7 and 7' facing the substrate. In the area of the contact surfaces 8' and 8", the solder mass 4 brings about a permanent electrical and mechanical connection between the connection element 3 and the electrically conductive structure 2.
  • the solder mass 4 contains 57% by weight of bismuth, 40% by weight of tin and 3% by weight of silver.
  • the solder mass 4 is arranged completely between the electrical connection element 3 and the electrically conductive structure 2 by a predetermined volume and shape.
  • the solder mass 4 has a thickness of 250 ⁇ m.
  • the electrical connection element 3 consists of steel with material number 1.4509 according to EN 10 088-2 (ThyssenKrupp Nirosta ® 4509) with a thermal expansion coefficient of 10.0 ⁇ 10 -6 /°C.
  • Each of the contact surfaces 8' and 8" has the shape of a circular segment with a radius of 3 mm and a center angle ⁇ of 276°.
  • the bridge 9 consists of three flat sections 10, 11 and 12. The surface of each of the two sections facing the substrate 10 and 12 form an angle of 40° with the surface of the substrate 1.
  • the section 11 is arranged parallel to the surface of the substrate 1.
  • the electrical connection element 3 has a length of 24 mm.
  • a contact elevation 14 is arranged on each of the surfaces 13 and 13 'of the foot regions 7 and 7' facing away from the substrate.
  • the contact elevations 14 are shaped as hemispheres and have a height of 2.5 ⁇ 10 -4 m and a width of 5 ⁇ 10 -4 m.
  • the centers of the contact elevations 14 are perpendicular to the surface of the substrate above the circle centers of the contact surfaces 8 'and 8".
  • the soldering points 15 and 15' are arranged at the points on the convex surface of the contact elevations 14 which have the greatest perpendicular distance to the surface of the substrate.
  • the spacers 19 are arranged on each of the contact surfaces 8' and 8".
  • the spacers 19 are shaped as hemispheres and have a height of 2.5 ⁇ 10 -4 m and a width of 5 ⁇ 10 -4 m.
  • Steel with material number 1.4509 according to EN 10 088-2 is easy to cold form and can be welded using all processes except gas welding.
  • the steel is used for the construction of silencers and exhaust gas detoxification systems and is particularly suitable for this due to its scale resistance up to over 950 °C and corrosion resistance to the stresses that occur in the exhaust system.
  • Fig. 1a shows schematically a simplified representation of the heat distribution around the soldering points 15 and 15 'during the soldering process.
  • the circular lines are isotherms.
  • the shape of the contact surfaces 8' and 8" of the connection element 3 Fig. 1 is adapted to the heat distribution. As a result, the solder mass 4 is melted evenly and completely in the area of the contact surfaces 8' and 8".
  • Fig. 3 shows in continuation of the exemplary embodiment Figures 1 and 2c an alternative embodiment of the connection element 3 according to the invention.
  • the electrical connection element 3 is provided with a silver-containing coating 5 on the surface facing the solder mass 4. This prevents the solder mass from spreading over the coating 5 and limits the exit width b.
  • an adhesion-promoting layer for example made of nickel and/or copper, can be located between the connection element 3 and the silver-containing layer 5.
  • the exit width b of the solder mass 4 is below 1 mm. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the pane 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • Fig. 4 shows in continuation of the exemplary embodiment Figures 1 and 2c a further alternative embodiment of the connection element 3 according to the invention.
  • the electrical connection element 3 contains a recess with a depth of 250 ⁇ m on the surface facing the solder mass 4, which forms a solder depot for the solder mass 4. Leakage of the solder mass 4 from the gap can be completely prevented.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2.
  • Fig. 5 shows in continuation of the exemplary embodiment Figures 1 and 2c a further alternative embodiment of the connection element 3 according to the invention.
  • the foot areas 7 and 7 'of the electrical connection element 3 are bent up at the edge areas.
  • the height of the bending of the edge areas of the glass pane 1 is a maximum of 400 ⁇ m. This creates a space for the solder mass 4.
  • the predetermined solder mass 4 forms a concave meniscus between the electrical connection element 3 and the electrically conductive structure 2. Leakage of solder mass 4 from the gap can be completely prevented.
  • the exit width b is approximately 0, largely due to the formed meniscus below zero.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2.
  • Fig. 6 shows a further alternative embodiment of the connection element 3 according to the invention with contact surfaces 8 'and 8" in the form of circle segments and a bridge 9 that is flat in sections.
  • the connection element 3 contains an iron-containing alloy with a thermal expansion coefficient of 8 ⁇ 10 -6 / ° C.
  • the material thickness is 2 mm.
  • hat-shaped compensating bodies 6 with chromium-containing steel of material number 1.4509 according to EN 10 088-2 (ThyssenKrupp Nirosta ® 4509) are applied.
  • the maximum layer thickness of the hat-shaped compensating body 6 is 4 mm.
  • the compensating bodies allow the thermal expansion coefficients of the connecting element 3 to be adapted to the requirements of the disk 1 and the solder mass 4.
  • the hat-shaped compensating bodies 6 lead to an improved heat flow during the production of the solder connection 4.
  • the heating takes place primarily in the center of the contact surfaces 8 'and 8".
  • the exit width b of the solder mass 4 can be further reduced. Due to the small exit width b of ⁇ 1 mm and the adapted expansion coefficient, the thermal stresses in the disk 1 can be further reduced.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2 .
  • Fig. 7 shows in continuation of the exemplary embodiment Figures 1 and 2a an alternative embodiment of the connection element 3 according to the invention.
  • the bridge 9 is curved and has the profile of a circular arc with a radius of curvature of 12 mm.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2.
  • Fig. 8 shows in continuation of the exemplary embodiment Figures 1 and 2a a further alternative embodiment of the connection element 3 according to the invention.
  • the bridge 9 is curved and changes its direction of curvature twice. Adjacent to the foot areas 7 and 7 ', the direction of curvature points away from the substrate 1. As a result, there are connections 16 and 16' between the contact surfaces 8' and 8" and the underside of the Bridge 9 no edges.
  • the underside of the connection element 3 has a continuous course.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2.
  • Fig. 8a shows in continuation of the exemplary embodiment Figures 1 and 2a a further alternative embodiment of the connection element 3 according to the invention.
  • the bridge 9 consists of two flat sections 22 and 23.
  • the surface of each of the two sections 22 and 23 facing the substrate forms an angle of 20 ° with the surface of the substrate 1.
  • the surfaces of the two sections 22 and 23 facing the substrate form an angle of 140° with one another.
  • the thermal stresses in the disk 1 are not critical and a permanent electrical and mechanical connection between the connection element 3 and the disk 1 is provided via the electrically conductive structure 2.
  • Fig. 9 and Fig. 9a each show a detail of a further embodiment of the disc 1 according to the invention in the area of the electrical connection element 3.
  • the connection element 3 contains steel with material number 1.4509 according to EN 10 088-2 (ThyssenKrupp Nirosta ® 4509).
  • the foot areas 7 and 7 ' are connected to each other via the bridge 9.
  • the bridge 9 consists of three flat sections 10, 11 and 12.
  • Each of the contact surfaces 8 'and 8" is shaped as a rectangle with semicircles arranged on opposite sides.
  • the connecting element 3 has a length of 24 mm.
  • the bridge 9 has a width of 4 mm.
  • the contact surfaces 8' and 8" are 4 mm long and 8 mm wide.
  • a contact elevation 14 is arranged on each of the surfaces 13 and 13 'of the foot regions 7 and 7' facing away from the substrate 1.
  • Each contact elevation 14 is shaped as a cuboid with a length of 3 mm and a width of 1 mm, with the surfaces facing away from the substrate 1 being shaped to be convexly curved.
  • the height of the contact elevations is 0.6 mm.
  • the soldering points 15 and 15' are arranged at the points on the convex surface of the contact bumps 14 which have the greatest perpendicular distance to the surface of the substrate.
  • Two spacers 19 are arranged on each of the contact surfaces 8' and 8", which are shaped as hemispheres with a radius of 2.5 ⁇ 10 -4 m. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the disk 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • Fig. 10 shows a top view of an alternative embodiment of the connection element 3 according to the invention.
  • the foot areas 7 and 7 ' are connected to one another via the bridge 9.
  • the contact surfaces 8 and 8' are shaped as circle segments with a radius of 2.5 mm and a center angle ⁇ of 280°.
  • the bridge 9 is curved.
  • the width of the bridge becomes smaller starting from the connections 16 and 16' to the contact surfaces 8 and 8' towards the center of the bridge.
  • the minimum width of the bridge is 3 mm. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the pane 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • the connecting element 3 has the contour Figure 10 not designed in the form of a bridge.
  • the connection element 3 is connected over the entire surface to the electrically conductive structure via a contact surface 8.
  • Fig. 11 and Fig. 11a each show a detail of a further alternative embodiment of the connection element 3 according to the invention.
  • the two foot areas 7 and 7 ' are connected to one another via the bridge 9.
  • Each contact surface 8' and 8" is shaped as a circular segment with a radius of 2.5 mm and a center angle ⁇ of 286°.
  • the bridge 9 consists of two sub-elements. The sub-elements each have a curved sub-area 17 and 17' and a flat sub-area 18 and 18'.
  • the bridge 9 is connected to the foot area 7 through the sub-area 17 and to the foot area 7' through the sub-area 17'.
  • the directions of curvature of the sub-areas 17 and 17' point away from the substrate 1.
  • the flat sub-areas 18 and 18 ' are arranged perpendicular to the surface of the substrate and are in direct contact with one another.
  • the contact elevations 14 are shaped as hemispheres with a radius of 5 ⁇ 10 -4 m.
  • the spacers 19 are shaped as hemispheres with a radius of 2.5 ⁇ 10 - 4 m.
  • the connection element 3 has a length of 10 mm.
  • the foot areas 7 and 7 ' have a width of 5 mm
  • the bridge 9 has a width of 3 mm.
  • the height of the bridge 9 from the surface of the substrate 1 is 3 mm.
  • the height of the bridge 9 can preferably be between 1 mm and 5 mm. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the pane 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • Fig. 12 shows a top view of a further alternative embodiment of the connection element 3 according to the invention.
  • the two foot areas 7 and 7 ' are over one curved bridge 9 connected to each other.
  • Each contact surface 8' and 8" is shaped as a circle with a radius of 2.5 mm.
  • the two connections 16 and 16' between the foot areas 7 and 7' and the bridge 9 are completely on different sides of the direct connecting line between the circle centers Contact surfaces 8' and 8" are arranged.
  • the projection of the bridge into the plane of the substrate surface is curved.
  • the direction of curvature changes in the middle of the bridge.
  • two opposite bulges are arranged on the sides in the form of circular segments with radii of 2 mm.
  • the radii of the bulges can preferably be between 1 mm and 3 mm.
  • the bulges can, for example, also have a rectangular shape with a preferred length and width of 1 mm to 6 mm.
  • an electrically conductive material can be attached to the area of the bridge 9, which is delimited by the edges of the bulges, for connection to the on-board electrical system, for example by welding or crimping. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the pane 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • Fig. 13 and Fig. 13a each show a detail of a further alternative embodiment of the connection element 3 according to the invention.
  • the connection element 3 is connected over the entire surface to the electrically conductive structure 2 via a contact surface 8.
  • the contact surface 8 is shaped as a rectangle with semicircles arranged on opposite sides.
  • the contact surface has a length of 14 mm and a width of 5 mm.
  • the connecting element 3 is bent all around in the edge region 20.
  • the height of the edge area 20 of the glass pane 1 is 2.5 mm.
  • the height of the edge region 20 can preferably be between 1 mm and 3 mm in alternative embodiments of the invention.
  • an extension element 21 is arranged on the bent edge.
  • the extension element 21 consists of a curved portion and a flat portion.
  • the extension element 21 is connected to the edge region 20 of the connection element 3 through the curved portion and the direction of curvature faces the opposite side of the connection element 3.
  • the extension element 21 has a length of 11 mm and a width of 6 mm in plan view.
  • the extension element 21 can preferably have a length of between 5 mm and 20 mm, particularly preferably between 7 mm and 15 mm, and a width of 2 mm to 10 mm, particularly preferably of 4 mm to 8 mm.
  • an electrically conductive material can be attached to the extension element 21 for connection to the on-board electrical system be attached, for example by welding, crimping or in the form of a plug connection. Due to the arrangement of the solder mass 4, no critical mechanical stresses are observed in the disk 1.
  • the connection of the pane 1 to the electrical connection element 3 is permanently stable via the electrically conductive structure 2.
  • Fig. 14 shows in detail a method according to the invention for producing a disk 1 with an electrical connection element 3.
  • An example of the method according to the invention for producing a disk with an electrical connection element 3 is shown there.
  • As a first step it is necessary to portion the solder mass 4 according to shape and volume.
  • the portioned solder mass 4 is arranged on the contact surface 8 or the contact surfaces 8 'and 8" of the electrical connection element 3.
  • the electrical connection element 3 is arranged with the solder mass 4 on the electrically conductive structure 2.
  • the electrical connection element 3 is permanently connected to the electrically conductive structure 2 and thereby with the disk 1 with energy input at the soldering points 15 and 15 '.
  • Test samples were made with the pane 1 (thickness 3 mm, width 150 cm and height 80 cm), the electrically conductive structure 2 in the form of a heating conductor structure, the electrical connection element 3 according to Figure 1 , the silver layer 5 on the contact surfaces 8 'and 8" of the connection element 3 and the solder mass 4.
  • the material thickness of the connection element 3 was 0.8 mm.
  • the connection element 3 contained steel with material number 1.4509 according to EN 10 088-2 (ThyssenKrupp Nirosta ® 4509). Three spacers 19 were arranged on each of the contact surfaces 8' and 8". Each soldering point 15 and 15' was arranged on a contact bump 14.
  • the solder mass 4 was previously applied as a plate with a defined layer thickness, volume and shape on the contact surfaces 8 'and 8" of the connection element 3.
  • the connection element 3 was attached with the attached solder mass 4 to the electrically conductive structure 2.
  • the connection element 3 was at a Temperature of 200 ° C and a treatment time of 2 seconds on the electrically conductive structure 2.
  • the dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 'and 8" of the connection element 3 and the solder mass 4 can be seen from Table 1. Due to the arrangement of the solder mass 4, specified by the connection element 3 and the electrically conductive structure 2, no critical mechanical stresses were observed in the disk 1. The connection of the pane 1 to the electrical connection element 3 was permanently stable via the electrically conductive structure 2.
  • connection element 3 contained an iron-nickel-cobalt alloy.
  • the dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 'and 8" of the connection element 3 and the solder mass 4 can be seen from Table 2.
  • an average exit width b 0.4 mm was obtained.
  • connection element 3 contained an iron-nickel alloy.
  • the dimensions and compositions of the electrical connection element 3, the silver layer 5 on the contact surfaces 8 'and 8" of the connection element 3 and the solder mass 4 can be seen from Table 3.
  • an average exit width b 0.4 mm was obtained.
  • the comparative example was carried out in the same way as the example.
  • the shape of the contact surface was not adapted to the heat distribution profile. No spacers were arranged on the contact surface.
  • the solder joints 15 and 15' were not arranged on contact bumps.
  • the dimensions and components of the electrical connection element 3, the metal layer on the contact surface of the connection element 3 and the solder mass 4 can be seen from Table 4.
  • panes according to the invention with glass substrates 1 and electrical connection elements 3 according to the invention had better stability against sudden temperature differences.

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Resistance Heating (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Surface Heating Bodies (AREA)
  • Liquid Crystal (AREA)

Claims (12)

  1. Vitre comprenant
    - un substrat (1),
    - une structure conductrice d'électricité (2) sur une zone du substrat (1),
    - une couche d'un matériau de soudure sans plomb (4) sur une zone de la structure conductrice d'électricité (2),
    - au moins un élément de connexion électrique (3), qui contient un acier contenant du chrome avec une proportion de chrome supérieure ou égale à 10,5 % en poids,
    - au moins deux points de soudure (15,15') de l'élément de connexion (3) sur le matériau de soudure (4), dans lesquels
    - les points de soudure (15,15') forment au moins une surface de contact (8) entre l'élément de connexion (3) et la structure électriquement conductrice (2), et
    - la forme de la surface de contact (8) présente au moins un segment d'ovale, d'ellipse ou de cercle avec un angle central α d'au moins 90°.
  2. Vitre selon la revendication 1, dans lequel
    - les points de soudure (15,15') forment deux surfaces de contact (8',8"), séparées l'une de l'autre, entre l'élément de connexion (3) et la structure électriquement conductrice (2),
    - les deux surfaces de contact (8',8") sont reliées l'une à l'autre par la surface d'un pont (9) faisant face au substrat (1), et
    - la forme de chacune des deux surfaces de contact (8',8") présente au moins un segment d'ovale, d'ellipse ou de cercle avec un angle central α d'au moins 90°.
  3. Vitre selon la revendication 1 ou 2, dans laquelle la surface de contact (8) ou les surfaces de contact (8',8") ont la forme d'un rectangle avec deux demi-cercles disposés sur les côtés opposés.
  4. Vitre selon la revendication 2, dans laquelle chaque surface de contact (8',8") est formée en forme de cercle ou de segment circulaire avec un angle central α d'au moins 180°, de préférence d'au moins 220°.
  5. Vitre selon l'une des revendications 1 à 4, dans lequel le substrat (1) contient du verre, de préférence du verre plat, du verre flotté, du verre de quartz, du verre borosilicaté, du verre sodocalcique, ou des polymères, de préférence du polyéthylène, du polypropylène, du polycarbonate, du polyméthacrylate de méthyle, et / ou des mélanges de ceux-ci.
  6. Vitre selon l'une des revendications 1 à 5, dans laquelle des entretoises (19) sont disposées sur la surface de contact (8) ou les surfaces de contact (8',8").
  7. Vitre selon l'une des revendications 1 à 6, dans laquelle chacun des deux points de soudure (15, 15') est disposé sur une bosse de contact (14).
  8. Vitre selon l'une des revendications 1 à 7, dans laquelle le matériau de soudure (4) contient de l'étain et du bismuth, de l'indium, du zinc, du cuivre, de l'argent ou des compositions de ceux-ci.
  9. Vitre selon la revendication 8, dans laquelle la proportion d'étain dans la composition de soudure (4) est de 3 % en poids à 99,5 % en poids et la proportion de bismuth, d'indium, de zinc, de cuivre, d'argent ou de leurs compositions est de 0,5 % en poids à 97 % en poids.
  10. Vitre selon l'une des revendications 1 à 9, dans lequel l'élément de connexion (3) est revêtu de nickel, d'étain, de cuivre et/ou d'argent, de préférence de 0,1 µm à 0,3 µm de nickel et/ou de 3 µm à 20 µm d'argent.
  11. Procédé de production d'une vitre selon l'une des revendications 1 à 10, dans lequel
    a) un matériau de soudure sans plomb (4) est appliqué sur la surface de contact (8) ou les surfaces de contact (8',8") de l'élément de connexion (3) sous la forme d'une plaquette dont l'épaisseur, le volume et la forme sont fixes,
    b) une structure conductrice d'électricité (2) est appliquée sur une zone du substrat (1),
    c) l'élément de connexion (3) avec le matériau de soudure (4) est disposé sur la structure électriquement conductrice (2),
    d) de l'énergie est introduite aux points de soudure (15,15'), et
    e) l'élément de connexion (3) est soudé à la structure électriquement conductrice (2).
  12. Utilisation d'une vitre selon l'une des revendications 1 à 10, pour des véhicules ayant des structures conductrices d'électricité, de préférence avec des conducteurs de chauffage et/ou des conducteurs d'antenne.
EP19186394.3A 2011-05-10 2012-04-17 Vitre dotée d'un élément de raccordement électrique Active EP3576491B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11165506 2011-05-10
EP12715095.1A EP2708092B1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique
PCT/EP2012/056963 WO2012152542A1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP12715095.1A Division-Into EP2708092B1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique
EP12715095.1A Division EP2708092B1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique

Publications (2)

Publication Number Publication Date
EP3576491A1 EP3576491A1 (fr) 2019-12-04
EP3576491B1 true EP3576491B1 (fr) 2023-10-25

Family

ID=45976395

Family Applications (2)

Application Number Title Priority Date Filing Date
EP12715095.1A Active EP2708092B1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique
EP19186394.3A Active EP3576491B1 (fr) 2011-05-10 2012-04-17 Vitre dotée d'un élément de raccordement électrique

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP12715095.1A Active EP2708092B1 (fr) 2011-05-10 2012-04-17 Vitre pourvue d'un élément de connexion électrique

Country Status (23)

Country Link
US (1) US10355378B2 (fr)
EP (2) EP2708092B1 (fr)
JP (1) JP5886419B2 (fr)
KR (1) KR101553762B1 (fr)
CN (1) CN103270809B (fr)
AR (1) AR086303A1 (fr)
AU (1) AU2012252670B2 (fr)
BR (1) BR112013028115B1 (fr)
CA (1) CA2835553C (fr)
DE (2) DE202012013543U1 (fr)
DK (2) DK3576491T3 (fr)
EA (1) EA026423B1 (fr)
ES (2) ES2769640T3 (fr)
FI (1) FI3576491T3 (fr)
HU (2) HUE064312T2 (fr)
MA (1) MA35103B1 (fr)
MX (1) MX2013013016A (fr)
MY (1) MY171777A (fr)
PL (2) PL2708092T3 (fr)
PT (2) PT3576491T (fr)
TW (1) TWI556515B (fr)
WO (1) WO2012152542A1 (fr)
ZA (1) ZA201308341B (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2708091T5 (pl) 2011-05-10 2021-09-27 Saint-Gobain Glass France Szyba z elektrycznym elementem przyłączeniowym
WO2012152544A1 (fr) 2011-05-10 2012-11-15 Saint-Gobain Glass France Vitre pourvue d'un élément de connexion électrique
AU2013314647B2 (en) 2012-09-14 2016-12-15 Saint-Gobain Glass France Pane having an electrical connection element
PT3182795T (pt) 2012-09-14 2022-05-18 Saint Gobain Placa de vidro com um elemento de conexão elétrica
EP2923528B1 (fr) 2012-11-21 2017-01-04 Saint-Gobain Glass France Disque avec élément de raccordement électrique et barrette de liaison
JP2016503568A (ja) * 2012-11-21 2016-02-04 サン−ゴバン グラス フランスＳａｉｎｔ−Ｇｏｂａｉｎ Ｇｌａｓｓ Ｆｒａｎｃｅ 電気的接続部材及び補償プレートを備えた板ガラス
EP3066718B1 (fr) * 2013-11-08 2021-03-10 Pilkington Group Limited Connecteur électrique pour vitrage
DE202014004267U1 (de) * 2014-05-23 2014-07-04 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Elektrisches Anschlusselement zum Befestigen, insbesondere Auflöten auf eine Glasscheibe sowie Bandlitzenmischgeflecht
DE102015003086A1 (de) * 2014-09-12 2016-03-17 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Verfahren zur Prozesszeitverkürzung beim Löten elektrischer oder elektronischer Bauteile mittels elektromagnetischer Induktionserwärmung
JP6566811B2 (ja) * 2014-09-25 2019-08-28 株式会社旭製作所 半田チップ、半田チップを用いた端子付きガラス基板の製造方法
JP2016081589A (ja) * 2014-10-10 2016-05-16 日本板硝子株式会社 車両用の窓ガラス構造体
USD815042S1 (en) 2015-03-26 2018-04-10 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Mounting device
DE102015210458A1 (de) * 2015-06-08 2016-12-08 Te Connectivity Germany Gmbh Verfahren zum Verbinden eines ein unedles Metall aufweisenden Leiters mit einem Kupfer aufweisenden Anschlusselement mittels Verschweißen sowie eine dadurch hergestellte Anschlussanordnung
GB201514397D0 (en) 2015-08-13 2015-09-30 Pilkington Group Ltd Electrical Connector
GB201515010D0 (en) * 2015-08-24 2015-10-07 Pilkington Group Ltd Electrical connector
FR3044962B1 (fr) * 2015-12-10 2017-12-22 Saint Gobain Vitrage muni d'un dispositif conducteur electrique et possedant une resistance amelioree aux tests cycliques de temperature.
GB201607398D0 (en) * 2016-04-28 2016-06-15 Strip Tinning Ltd Connector
FR3054771B1 (fr) * 2016-07-27 2020-11-06 Saint Gobain Vitrage muni d'un dispositif conducteur electrique avec zones de soudure ameliorees
USD857420S1 (en) 2016-12-23 2019-08-27 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Mounting device
DE202016008092U1 (de) 2016-12-28 2017-03-03 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Elektrisches Anschlusselement
EP3721681B1 (fr) * 2017-12-04 2024-07-17 AGC Glass Europe Connecteur de sertissage électrique comportant un élément de blindage
WO2019110564A1 (fr) * 2017-12-04 2019-06-13 Agc Glass Europe Connecteur électrique à sertir comportant une partie formant queue
JP7100980B2 (ja) * 2018-01-22 2022-07-14 ローム株式会社 Ｌｅｄパッケージ
CN108493629A (zh) * 2018-03-12 2018-09-04 福耀集团（上海）汽车玻璃有限公司 一种电气联接元件和汽车玻璃
GB201804622D0 (en) * 2018-03-22 2018-05-09 Central Glass Co Ltd Method of producing a vehicle glass assembly
GB201804624D0 (en) * 2018-03-22 2018-05-09 Central Glass Co Ltd Method of producing a vehicle glass assembly
GB201817357D0 (en) 2018-10-25 2018-12-12 Strip Tinning Ltd Flexible connector
CN111169056B (zh) * 2018-11-12 2022-08-05 苏州维业达触控科技有限公司 一种防眩光扩散膜的制作方法
JP7373931B2 (ja) * 2019-07-01 2023-11-06 日本板硝子株式会社 接続端子
CN110695565B (zh) * 2019-09-12 2021-08-03 中国航发北京航空材料研究院 一种石英与可伐合金钎焊用铟基活性钎料及钎焊工艺
DE102020131622A1 (de) * 2020-11-30 2022-06-02 Bayerische Motoren Werke Aktiengesellschaft Verfahren zum stoffschlüssigen Kontaktieren von Komponenten in elektrischen Systemen, Energiespeichereinheit sowie Verwendung der Energie einer Energiespeichereinheit

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2062335A (en) 1929-07-05 1936-12-01 Westinghouse Electric & Mfg Co Glass metal seal
US2481385A (en) 1944-03-31 1949-09-06 Armco Steel Corp Weld and weld rod
US2672414A (en) 1950-01-27 1954-03-16 United States Steel Corp Chromium-titanium steel adapted for sealing to glass
US2644066A (en) 1951-07-05 1953-06-30 Blue Ridge Glass Corp Electrical connector for resistance elements on glass plates
FR1104595A (fr) 1953-05-27 1955-11-22 Saint Gobain Raccords électriques pour éléments de résistance sur des plaques de verre
US2709211A (en) 1953-05-27 1955-05-24 Blue Ridge Glass Corp Electrical connectors for resistance elements on glass plates
US2736649A (en) 1953-12-04 1956-02-28 United States Steel Corp Ferritic stainless steel
US3088833A (en) 1960-06-06 1963-05-07 Owens Illinois Glass Co Sealing glass
US3204326A (en) 1960-12-19 1965-09-07 American Optical Corp Multi-element energy-conducting structures and method of making the same
FR1527738A (fr) 1966-09-13 1968-06-07 Saint Gobain Raccord électrique pour vitrages chauffants, notamment de véhicules
DE1936780A1 (de) 1968-07-23 1970-02-26 Ppg Industries Inc Heizvorrichtung in Kombination mit einer Antennenvorrichtung
US3484584A (en) 1968-07-23 1969-12-16 Ppg Industries Inc Combination of electrically heated transparent window and antenna
US3534148A (en) 1969-02-11 1970-10-13 Sybron Corp Encapsulated electrical circuit and terminals and method of making the same
US3746536A (en) 1970-08-07 1973-07-17 Tokyo Shibaura Electric Co Sealing alloy
US4023008A (en) 1972-12-28 1977-05-10 Saint-Gobain Industries Terminal connection for electric heaters for vehicle windows
US3880369A (en) 1973-09-21 1975-04-29 Boehler & Co Ag Geb Impact strip for impact pulverizers
FR2430847A1 (fr) * 1978-07-13 1980-02-08 Saint Gobain Vitrage chauffant et/ou d'alarme
US4179285A (en) 1978-07-27 1979-12-18 Armco Inc. Ferritic stainless steel
US4246467A (en) 1979-07-20 1981-01-20 Ford Motor Company Electric terminal for connecting a heating grid on a thermal window
JPS5929155B2 (ja) 1979-11-12 1984-07-18 富士通株式会社 半導体記憶装置
US4498096A (en) 1981-01-30 1985-02-05 Motorola, Inc. Button rectifier package for non-planar die
JPS60208076A (ja) 1984-04-02 1985-10-19 松下電器産業株式会社 シ−ズヒ−タ
JPS60212987A (ja) 1984-04-09 1985-10-25 松下電器産業株式会社 シ−ズヒ−タ
JPS61130453A (ja) 1984-11-28 1986-06-18 Sumitomo Special Metals Co Ltd 耐食性のすぐれた永久磁石の製造方法
KR930003957B1 (ko) 1987-05-09 1993-05-17 후다바 덴시 고오교오 가부시끼가이샤 형광표시관
DE9013380U1 (de) 1990-09-21 1990-11-29 SEKURIT SAINT-GOBAIN Deutschland GmbH & Co. KG, 52066 Aachen Stromanschlußelement für eine heizbare Autoglasscheibe
FR2670070B1 (fr) 1990-11-30 1996-09-20 Saint Gobain Vitrage Int Pieces de connexion pour vitrages electrifies.
JP2908922B2 (ja) 1991-11-29 1999-06-23 株式会社日立製作所 半導体装置およびその製造方法
JPH0696847A (ja) 1992-09-11 1994-04-08 Matsushita Electric Ind Co Ltd 面状発熱体およびその製造法
JPH0658557U (ja) 1993-01-14 1994-08-12 旭硝子株式会社 導電端子
US5596335A (en) 1994-12-27 1997-01-21 Ppg Industries, Inc. Electrical connector
JP3439866B2 (ja) 1995-03-08 2003-08-25 日本冶金工業株式会社 耐食性および溶接性に優れるフェライト系ステンレス鋼
JPH09139565A (ja) 1995-11-15 1997-05-27 Dainippon Printing Co Ltd 電極パターン形成方法
JPH09226522A (ja) 1996-02-29 1997-09-02 Central Glass Co Ltd 導電端子
JP3390617B2 (ja) 1996-11-29 2003-03-24 京セラ株式会社 半導体素子収納用パッケージ
US5961737A (en) 1996-12-12 1999-10-05 Hughes Electronics Corporation Welded wire termination device and method for constructing a solar array
GB9707368D0 (en) 1997-04-11 1997-05-28 Splifar S A Electrical connection stud
JP3498893B2 (ja) 1998-04-23 2004-02-23 セントラル硝子株式会社 導電体ペースト
JPH11347785A (ja) 1998-06-04 1999-12-21 Hitachi Ltd 半導体ダイボンディング用半田とそのテープ及び半導体装置
US6475043B2 (en) 1998-11-25 2002-11-05 Antaya Technologies Corporation Circular electrical connector
JP4334054B2 (ja) 1999-03-26 2009-09-16 株式会社東芝 セラミックス回路基板
JP2001126648A (ja) 1999-10-22 2001-05-11 Futaba Corp 蛍光表示装置
BR0107834A (pt) 2000-01-25 2003-01-14 It Vetro Siv S P A Soc Envidraçamento provido com um circuito elétrico e método para sua produção
US6638120B2 (en) 2000-02-21 2003-10-28 Larry J. Costa Snap electrical terminal
DE10018276A1 (de) 2000-04-13 2001-10-25 Saint Gobain Sekurit D Gmbh Verbundscheibe
DE10046489C1 (de) 2000-06-02 2001-12-20 Saint Gobain Sekurit D Gmbh Lötbares elektrisches Anschlußelement mit Lotdepot und dessen Verwendung
ES2276754T3 (es) 2000-06-02 2007-07-01 Saint-Gobain Glass France Elemento de conexion electrica soldable mediante deposito de soldadura.
TWI248842B (en) 2000-06-12 2006-02-11 Hitachi Ltd Semiconductor device and semiconductor module
US6406337B1 (en) 2000-09-27 2002-06-18 Antaya Technologies Corporation Glass mounted electrical terminal
US6774310B1 (en) * 2000-10-27 2004-08-10 Intel Corporation Surface mount connector lead
US6816385B1 (en) 2000-11-16 2004-11-09 International Business Machines Corporation Compliant laminate connector
JP2003050341A (ja) 2001-08-06 2003-02-21 Yamaha Corp 光学部品複合体およびその製造方法
JPWO2003021664A1 (ja) 2001-08-31 2005-07-07 株式会社日立製作所 半導体装置、構造体及び電子装置
JP2003124416A (ja) 2001-10-16 2003-04-25 Yazaki Corp チップ部品のバスバーへの接合構造
DE20203202U1 (de) 2001-12-31 2002-06-06 Gilliam Jakob Elektrischer Anschluß
ATE400481T1 (de) * 2002-03-11 2008-07-15 Nippon Sheet Glass Co Ltd Durch eine metallbefestigung verbundener glasartikel und diesen verwendende verbindungskonstruktion
US6685514B2 (en) 2002-04-05 2004-02-03 Larry J. Costa Folding blade electrical terminal
US6790104B2 (en) 2002-07-26 2004-09-14 Antaya Technologies Corporation Electrical terminal
US6840780B1 (en) 2002-07-26 2005-01-11 Antaya Technologies Corporation Non-solder adhesive terminal
GB0302230D0 (en) * 2003-01-30 2003-03-05 Pilkington Plc Vehicular glazing panel
DE602005023276D1 (de) * 2004-03-12 2010-10-14 Panasonic Corp Heizelement und herstellungsverfahren dafür
DE102004050158B3 (de) 2004-10-15 2006-04-06 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Transparente Scheibe mit einer beheizbaren Beschichtung
US20070224842A1 (en) 2004-11-12 2007-09-27 Agc Automotive Americas R&D, Inc. Electrical Connector For A Window Pane Of A Vehicle
US20070105412A1 (en) 2004-11-12 2007-05-10 Agc Automotive Americas R&D, Inc. Electrical Connector For A Window Pane Of A Vehicle
US7134201B2 (en) 2004-11-12 2006-11-14 Agc Automotive Americas R&D, Inc. Window pane and a method of bonding a connector to the window pane
DE102004057630B3 (de) 2004-11-30 2006-03-30 Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg Verfahren und Vorrichtung zum Löten von Anschlüssen mit Induktionswärme
WO2006098160A1 (fr) 2005-03-14 2006-09-21 Murata Manufacturing Co., Ltd. Pate conductrice et structure de verre
WO2006132319A1 (fr) 2005-06-08 2006-12-14 Nippon Sheet Glass Co., Ltd. Objet en verre comportant un film conducteur formé sur celui-ci et procédé pour le fabriquer
US7281806B2 (en) 2005-06-08 2007-10-16 Tte Technology, Inc. System and method for projecting a video image with a temporal LED combiner
US20070030064A1 (en) 2005-08-03 2007-02-08 Yinglei Yu Integrated laterally diffused metal oxide semiconductor power detector
JP4550791B2 (ja) 2005-11-24 2010-09-22 古河電気工業株式会社 アルミ撚線用圧着端子および前記圧着端子が接続されたアルミ撚線の端末構造
JP4934325B2 (ja) 2006-02-17 2012-05-16 株式会社フジクラ プリント配線板の接続構造及びプリント配線板の接続方法
GB0605884D0 (en) * 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
GB0605883D0 (en) * 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
DE102006017675A1 (de) 2006-04-12 2007-10-18 Pilkington Automotive Deutschland Gmbh Glasscheibe mit elektrischem Funktionselement mit durch Lötverbindung befestigten Anschlußdrähten und Verfahren zum Herstellen elektrischer Anschlüsse
JP2007335260A (ja) 2006-06-15 2007-12-27 Epson Imaging Devices Corp 基板の接続端子と被覆導体線との接続構造
JP2008041518A (ja) 2006-08-09 2008-02-21 Noritake Itron Corp 蛍光表示管の製造方法および蛍光表示管
JP4907734B2 (ja) 2007-05-07 2012-04-04 エクスアテック、エル．エル．シー． 導電性グリッドを有するプラスチックパネルの電気接続
JP2009064579A (ja) 2007-09-04 2009-03-26 Nippon Sheet Glass Co Ltd 導電機能付板状体の端子構造体及び導電機能付板状体
FR2921520B1 (fr) 2007-09-20 2014-03-14 Saint Gobain Element de connexion electrique et vitrage pourvu d'un tel element
CN101933139B (zh) 2007-12-20 2012-11-07 爱信艾达株式会社 半导体装置及其制造方法
EP2279274B1 (fr) 2008-05-08 2012-02-08 ThyssenKrupp VDM GmbH Alliage fer-nickel
JP2010020918A (ja) 2008-07-08 2010-01-28 Nippon Sheet Glass Co Ltd 端子構造及び車両用端子付ガラス板
JP5156580B2 (ja) 2008-10-31 2013-03-06 株式会社オートネットワーク技術研究所 コネクタ
DE202008015441U1 (de) 2008-11-20 2010-04-08 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Lötanschluss
DE102009016353B4 (de) 2009-04-07 2022-06-30 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Anschlusskontakt für an Scheiben von Fahrzeugen vorgesehene elektrische Einrichtungen
TWI404972B (zh) 2009-06-19 2013-08-11 Largan Precision Co 成像光學鏡組
EP2365730A1 (fr) 2010-03-02 2011-09-14 Saint-Gobain Glass France Disque doté d'un élément de raccordement électrique
DE102010018860B4 (de) 2010-04-30 2014-10-09 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Kontaktierungsanordnung für auf flächigen Gebilden, insbesondere Glasscheiben, vorhandene Leiter
EP2408260A1 (fr) 2010-07-13 2012-01-18 Saint-Gobain Glass France palque de verre dotée d'un élément de raccordement électrique
US20120060559A1 (en) 2010-09-14 2012-03-15 E. I. Du Pont De Nemours And Company Process for coating glass onto a flexible stainless steel substrate
DE202011100906U1 (de) 2011-05-03 2011-06-09 FEW Fahrzeugelektrikwerk GmbH & Co. KG, 04442 Elektrisches Anschlusselement
PL2708091T5 (pl) 2011-05-10 2021-09-27 Saint-Gobain Glass France Szyba z elektrycznym elementem przyłączeniowym
WO2012152544A1 (fr) 2011-05-10 2012-11-15 Saint-Gobain Glass France Vitre pourvue d'un élément de connexion électrique
BR112013030696B1 (pt) 2011-07-04 2019-06-18 Saint-Gobain Glass France Elemento de conexão elétrica, uso de um elemento de conexão elétrica e método de produzir uma vidraça com pelo menos um elemento de conexão elétrica
WO2013073068A1 (fr) 2011-11-16 2013-05-23 エム・テクニック株式会社 Procédé pour produire des particules d'alliage argent-cuivre
PT3182795T (pt) 2012-09-14 2022-05-18 Saint Gobain Placa de vidro com um elemento de conexão elétrica
JP2015119072A (ja) 2013-12-19 2015-06-25 富士電機株式会社 レーザ溶接方法、レーザ溶接治具、半導体装置
USD815042S1 (en) 2015-03-26 2018-04-10 Few Fahrzeugelektrikwerk Gmbh & Co. Kg Mounting device

Also Published As

Publication number Publication date
US10355378B2 (en) 2019-07-16
AU2012252670A1 (en) 2013-11-28
ES2966732T3 (es) 2024-04-24
JP5886419B2 (ja) 2016-03-16
ES2769640T3 (es) 2020-06-26
EA201391659A1 (ru) 2014-03-31
MY171777A (en) 2019-10-29
TW201304294A (zh) 2013-01-16
JP2014520355A (ja) 2014-08-21
HUE047517T2 (hu) 2020-04-28
ZA201308341B (en) 2014-07-30
FI3576491T3 (en) 2023-12-11
MX2013013016A (es) 2014-01-31
KR101553762B1 (ko) 2015-09-16
CA2835553C (fr) 2019-06-11
EP2708092B1 (fr) 2019-11-13
EA026423B1 (ru) 2017-04-28
CN103270809A (zh) 2013-08-28
DE202012013540U1 (de) 2017-08-10
PT3576491T (pt) 2023-12-22
CN103270809B (zh) 2016-02-03
MA35103B1 (fr) 2014-05-02
AU2012252670B2 (en) 2015-05-21
AR086303A1 (es) 2013-12-04
DE202012013543U1 (de) 2017-08-10
CA2835553A1 (fr) 2012-11-15
PL3576491T3 (pl) 2024-03-18
US20140110166A1 (en) 2014-04-24
KR20140024420A (ko) 2014-02-28
BR112013028115A2 (pt) 2017-06-27
DK3576491T3 (da) 2023-11-20
PL2708092T3 (pl) 2020-05-18
WO2012152542A1 (fr) 2012-11-15
TWI556515B (zh) 2016-11-01
DK2708092T3 (da) 2020-02-24
BR112013028115B1 (pt) 2020-11-17
HUE064312T2 (hu) 2024-03-28
EP2708092A1 (fr) 2014-03-19
EP3576491A1 (fr) 2019-12-04
PT2708092T (pt) 2020-02-21

Similar Documents

Publication Publication Date Title
EP3576491B1 (fr) Vitre dotée d'un élément de raccordement électrique
EP3751960B1 (fr) Vitre dotée d'un élément de raccordement électrique
EP2708091B1 (fr) Vitre munie d'un élément de raccordement électrique
EP2729277B1 (fr) Procédé de fabrication dýun disque doté d'un élément de raccordement électrique
EP2896269B1 (fr) Disque doté d'un élément de raccordement électrique
EP2896270B2 (fr) Disque doté d'un élément de raccordement électrique
EP2923529B1 (fr) Disque avec élément de raccordement électrique et plaques de compensateur
EP2859620B1 (fr) Vitre dotée d'un élément de raccordement électrique
EP2543229B1 (fr) Disque doté d'un élément de raccordement électrique
EP2594109B1 (fr) Plaque de verre dotée d'un élément de raccordement électrique
WO2015165632A1 (fr) Élément de connexion électrique servant à connecter une structure électriquement conductrice à un substrat

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AC Divisional application: reference to earlier application

Ref document number: 2708092

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: SAINT-GOBAIN GLASS FRANCE

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20200713

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210329

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20230508

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230619

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AC Divisional application: reference to earlier application

Ref document number: 2708092

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502012017224

Country of ref document: DE

REG Reference to a national code

Ref country code: DK

Ref legal event code: T3

Effective date: 20231116

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: PT

Ref legal event code: SC4A

Ref document number: 3576491

Country of ref document: PT

Date of ref document: 20231222

Kind code of ref document: T

Free format text: AVAILABILITY OF NATIONAL TRANSLATION

Effective date: 20231218

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: SK

Ref legal event code: T3

Ref document number: E 42969

Country of ref document: SK

REG Reference to a national code

Ref country code: HU

Ref legal event code: AG4A

Ref document number: E064312

Country of ref document: HU

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240126

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240225

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231025

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240315

Year of fee payment: 13

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2966732

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20240424

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231025

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240225

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240126

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: RO

Payment date: 20240327

Year of fee payment: 13

Ref country code: BG

Payment date: 20240318

Year of fee payment: 13

Ref country code: GB

Payment date: 20240229

Year of fee payment: 13

Ref country code: SK

Payment date: 20240312

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: LU

Payment date: 20240411

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231025

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20240125

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231025

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20231025

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: TR

Payment date: 20240320

Year of fee payment: 13

Ref country code: SE

Payment date: 20240312

Year of fee payment: 13

Ref country code: PL

Payment date: 20240303

Year of fee payment: 13

Ref country code: IT

Payment date: 20240313

Year of fee payment: 13

Ref country code: FR

Payment date: 20240308

Year of fee payment: 13

Ref country code: BE

Payment date: 20240319

Year of fee payment: 13