EP3543287A2 - Composition pour l'impression 3d - Google Patents

Composition pour l'impression 3d Download PDF

Info

Publication number
EP3543287A2
EP3543287A2 EP17871708.8A EP17871708A EP3543287A2 EP 3543287 A2 EP3543287 A2 EP 3543287A2 EP 17871708 A EP17871708 A EP 17871708A EP 3543287 A2 EP3543287 A2 EP 3543287A2
Authority
EP
European Patent Office
Prior art keywords
composition
magnetic
particles
printing
printing according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17871708.8A
Other languages
German (de)
English (en)
Other versions
EP3543287B1 (fr
EP3543287A4 (fr
Inventor
Sai Bom Park
Jin Kyu Lee
Sang Bum Ahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Publication of EP3543287A2 publication Critical patent/EP3543287A2/fr
Publication of EP3543287A4 publication Critical patent/EP3543287A4/fr
Application granted granted Critical
Publication of EP3543287B1 publication Critical patent/EP3543287B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/12—Adsorbed ingredients, e.g. ingredients on carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/23—Magnetisable or magnetic paints or lacquers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
    • H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
    • H01F1/28—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder dispersed or suspended in a bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/10—Formation of a green body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2262—Oxides; Hydroxides of metals of manganese
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the present application relates to a composition for 3D printing, a method of 3D printing using the same, and a three-dimensional shape comprising the same.
  • the present application relates to a magnetic body composite which can be applied to three-dimensional printing and an ink composition comprising the same.
  • the three-dimensional printer has a three-dimensional printing mechanism configured to three-dimensionally form a physical object.
  • thermosetting type is a relatively simple manufacturing process in which polymer filaments are thermally melted, extruded and dropped in drops at the designated point to complete a shape of laminating layer by layer, but there are problems such as an imprecise shape and non-uniform curing due to an equipment supplying heat, phase separation between organic/inorganic composite materials and heat shrinkage due to heating/cooling.
  • photo-curable type can express precisely, but there are problems such as size of equipment, storage and low hardness after curing.
  • the present application relates to a composition used as an ink of a 3D printer, and provides a composition capable of precisely forming a three-dimensional solid shape and implementing uniform curing properties of a three-dimensional shape.
  • the present application relates to a composition for 3D printing.
  • the composition for 3D printing can be applied, for example, to printing three-dimensional physical objects to form a three-dimensional shape.
  • the composition can be applied to sealing electronic devices.
  • the composition can be applied to encapsulating a microelectronic device, for example, a micro-battery.
  • An exemplary composition for 3D printing may comprise magnetic particles and gas-containing particles.
  • the magnetic particles and the gas-containing particles may form a magnetic composite.
  • the magnetic composite may be formed by surrounding the gas-containing particles with the magnetic particles or surrounding the magnetic particles with the gas-containing particles.
  • the present application makes it possible to cure the composition with vibrational heat of the magnetic particles and enables uniform curing by the gas-containing particles, as described below.
  • the magnetic particles may have two or more magnetic domains (multi-magnetic domains).
  • the magnetic particles may have irregularly arranged magnetic domains when an external magnetic field is absent, and be magnetized by an external alternate-current magnetic field.
  • the irregular arrangement of the magnetic domains may mean a state where magnetic directions existing in the magnetic domains are each different and not aligned, and in this case, may be a state without magnetism as the net value of the magnetization at room temperature is zero.
  • the magnetic directions of the magnetic domains are aligned, whereby the magnetic particles can be magnetized.
  • the magnetic particles may be superparamagnetic particles, but are not limited thereto.
  • the composition is applied in three dimensions to form a three-dimensional shape, and vibrational heat is generated from the magnetic particles through the application of a magnetic field, whereby the composition for 3D printing can be uniformly cured.
  • the present application generates vibrational heat by magnetization reversal of magnetic particles through electromagnetic induction heating, whereby the generated heat can cure a thermosetting resin or the like to be described below.
  • heat is generated by eddy current, where heat was generated by hysteresis loss of a metal or a magnetic material.
  • the present application can generate heat due to vibrations between magnetic materials, other than eddy currents.
  • the magnetic material itself vibrates due to the coercive force of the magnetic particles under an external magnetic field, where the resin can be cured using the generated heat, and the curing proceeds from the inside of the composition, so that the cured product can have excellent physical properties. Accordingly, the present application can realize uniform and stable curing.
  • the magnetic particles may comprise two or more magnetic domains.
  • the term "magnetic domain” generally means a region in which magnetization directions are differently divided within a magnetic material.
  • magnetic particles having two or more magnetic domains are strongly magnetized by an external alternate-current magnetic field to generate vibrational heat, and when the magnetic field is eliminated, the magnetic particles return to the original magnetic domains, whereby magnetic particles with low residual magnetization of hysteresis loss can be provided.
  • the material of the magnetic particles is not particularly limited.
  • the magnetic material may include pure iron, iron oxide, ferrite, iron alloy, cobalt alloy, nickel alloy, or manganese alloy.
  • the shape of the magnetic particles may be a sphere, an ellipsoid, a tetrahedron, a hexahedron, a triangular prism, a quadrangular prism, a cylinder, an elliptical column, a polygonal column or an amorphous shape.
  • the magnetic particles may be spherical.
  • the density of the magnetic particles may be appropriately selected in consideration of the object of the present application.
  • the density of the particles may be 1 g/cm 3 to 10 g/cm 3 , 1.5 g/cm 3 to 8.5 g/cm 3 , or 3 g/cm 3 to 7 g/cm 3 .
  • the magnetic particles are combined with the above-described gas-containing particles in the density range and are dispersed in a uniform distribution upon 3D printing, the present application can realize the uniform curing.
  • the magnetic particles may have a coercive force in a range of 1 to 200 kOe, 10 to 150 kOe, 20 to 120 kOe, 30 to 100 kOe, 40 to 95 kOe, or 50 to 95 kOe.
  • the term "coercive force" herein may mean an intensity of the critical magnetic field required to reduce the magnetization of the magnetic material to zero. More specifically, a magnetic material magnetized by an external magnetic field maintains a certain degree of magnetized state even if a magnetic field is removed, where the intensity of a magnetic field capable of making the magnetization degree to zero by applying a reverse magnetic field to the magnetic material thus magnetized is referred to as a coercive force.
  • the coercive force of the magnetic material may be a criterion for distinguishing a soft magnetic material or a hard magnetic material
  • the magnetic particles of the present application may be a soft magnetic material.
  • the measured temperature may be room temperature, for example, 25°C.
  • the magnetic particle has a saturation magnetization value at 25°C in a range of 20 to 150emu/g, 30 to 130emu/g, 40 to 100emu/g, 50 to 90emu/g, or 60 to 85emu/g.
  • the present application can satisfy curing physical properties by uniform curing of the resin.
  • the measurement of physical properties of the magnetic particles can be calculated by the value of VSM (Vibrating Sample Magnetometer).
  • the VSM is a device that measures magnetization values of samples by recording the applied magnetic field applied by a Hall probe and recording the electromotive force obtained on applying vibration to the sample by Faraday's law. According to Faraday's law, it can be seen that if the N pole of a bar magnet is directed and pushed towards the coil, the galvanometer moves and the current flows through the coil. The resultant current is called induction current, which is said to have been made by induced electromotive force.
  • the VSM is a method of detecting the induced electromotive force, which occurs on vibrating a sample by such a basic operation principle, in the search coil, to measure the magnetization value of the sample by this electromotive force.
  • the magnetic characteristics of a material can be measured simply as functions of magnetic field, temperature and time, and quick measurement in a magnetic force of up to 2 Tesla and a temperature range of 2 K to 1273 K is possible.
  • the magnetic particles may have an average particle diameter in a range of 20 nm to 300 nm, 30 nm to 250 nm, 40 nm to 230 nm, or 45 nm to 220 nm.
  • the magnetic domains in the magnetic particles may have an average size in a range of 10 to 50 nm or 20 to 30 nm.
  • the present application can generate heat capable of performing the uniform curing of the composition in the composition by controlling the number of magnetic domains and the magnitude of the coercive force of the magnetic particles to an appropriate range in the particle size range.
  • the present application can generate sufficient vibrational heat on curing through a low coercive force and a large number of magnetic domains by controlling the size of the particles to 20 nm or more, and allow only the saturation magnetization value to be present while reducing hysteresis loss of the magnetic material itself, thereby realizing uniform and stable curing by controlling the particle size to 300 nm or less.
  • the material is not particularly limited.
  • the magnetic particles may satisfy Formula 1 below. [Formula 1] MX a O b
  • M is a metal or a metal oxide
  • X includes Fe, Mn, Co, Ni or Zn
  • M may be Fe, Mn, Mg, Ca, Zn, Cu, Co, Sr, Si, Ni, Ba, Cs, K, Ra, Rb, Be, Li, Y, B, or an oxide thereof.
  • X a O b is Fe 2 O 3
  • c may be +3 and d may be -2.
  • X a O b is Fe 3 O 4
  • it can be expressed as FeOFe 2 O 3
  • c may be +2 and +3, respectively
  • d may be -2.
  • the magnetic particles of the present application are not particularly limited as long as they satisfy Formula 1 above, and may be, for example, MFe 2 O 3 .
  • the 3D printing composition of the present application may comprise, as magnetic particles, a compound of Formula 1 above alone, or a mixture of compounds of Formula 1 or a compound doping a compound of Formula 1 with an inorganic substance.
  • the inorganic substance may comprise a monovalent to trivalent cationic metal or an oxide thereof, and two or more of plural cationic metals may be used.
  • the magnetic particles may comprise those having surface-treated particle surfaces. That is, the composition of the present application may comprise particles surface-treated with a metal, a metal oxide, an organic substance or an inorganic substance on the surface of the magnetic particles.
  • the present application can prevent the magnetic particles from losing the coercive force of the magnetic material by oxidation in air through the surface treatment.
  • the surface treatment can improve compatibility with the filler, the dispersant organic solvent and the like to be described below, and improve dispersibility of the composition.
  • the surface treatment can form a polymer of polymethyl methacrylate (PMMA) on the surface by attaching a methyl methacrylate (MMA) monomer to a magnetic particle having a carboxyl group on its surface.
  • PMMA polymethyl methacrylate
  • MMA methyl methacrylate
  • the surface treatment can be carried out by being subjected to an acid treatment to remove the oxide film on the surface, and the surface treatment can be also carried out through a method of coating silica particles.
  • the gas-containing particles may be hollow particles.
  • the gas-containing particles may have a structure in which one or more voids are contained in the particle and the void is filled with the gas.
  • the gas-containing particles may comprise an inorganic material, an organic material, or an organic-inorganic composite.
  • the inorganic particle as the gas-containing particle may comprise one or more selected from the group consisting of silicate, silica, titanium and iron, but is not limited thereto.
  • the organic particle as the gas-containing particle may include one or more selected from the group consisting of a liposome, a polymer, and a hydrated gel, but is not limited thereto.
  • the gas-containing particle may mean a form in which bubbles are contained in a liquid or a solid, but is not limited thereto, where any form in which a hole exists in the particle may be included.
  • the material containing the gas may be exemplified by glass (e.g., soda-lime-borosilicate glass), a polymer, a surfactant, a lipid, a protein (e.g. albumin), silica, a ceramic or a metal (e.g., titanium oxide), a carbon material (e.g., graphene) or a combination thereof.
  • the bubbles may be micro bubbles or nano bubbles composed of the above materials.
  • the gas in the gas-containing particles may include air, nitrogen, carbon dioxide, methane gas, perfluorocarbon, or the like.
  • the shape of the gas-containing particles may be a sphere, an ellipsoid, a tetrahedron, a hexahedron, a triangular prism, a quadrangular prism, a cylinder, an elliptical column, a polygonal column or an amorphous shape.
  • the gas-containing particles may be spherical.
  • the density of the gas-containing particles can be appropriately selected in consideration of the object of the present application.
  • the density of the gas-containing particles may be in a range of 0.01 g/cm 3 to 1.02 g/cm 3 , 0.1 g/cm 3 to 0.95 g/cm 3 , or 0.2 g/cm 3 to 0.8 g/cm 3 .
  • the density in the present application can be obtained by using a method of dispersing the particles in a solvent having a specific density and deducing it.
  • the gas-containing particles By controlling the density of the gas-containing particles within the above range, they can be bonded to the above-mentioned magnetic particle to lower the density of the composite, and the present application can provide a composition having long-term dispersion stability and simultaneously realize excellent 3D printing performance.
  • the average size of the gas-containing particles can be appropriately selected in consideration of the object of the present application.
  • the average size of the gas-containing particles may be 10 nm to 100 ⁇ m, 50 nm to 90 ⁇ m, 100 nm to 50 ⁇ m, 200 nm to 30
  • the average size of the composite can be suitably selected in consideration of the object of the present application.
  • the average size of the composite may be 10 nm to 1000 ⁇ m, 50 nm to 900 ⁇ m, 100 nm to 500 ⁇ m, 200 nm to 300 ⁇ m, or 500 nm to 250 ⁇ m.
  • the present application can realize adequate dispersibility, uniform cure degree and excellent 3D printing performance.
  • the density of the composite can be suitably selected in consideration of the object of the present application.
  • the density of the composite may be 0.1 g/cm 3 to 10 g/cm 3 , 0.5 g/cm 3 to 8 g/cm 3 , 1.5 g/cm 3 to 7 g/cm 3 , or 3.5 g/cm 3 to 5.5 g/cm 3 .
  • the density of the composite is within the above range, long-term dispersion stability can be ensured in the composition and excellent 3D printing performance can be realized.
  • the magnetic particles and the gas-containing particles may have their surfaces physically or chemically bonded to each other.
  • the magnetic particles and the gas-containing particles may be bonded through a known inter-particle bonding method in the art, and the method is not particularly limited.
  • the magnetic particles and the gas-containing particles may have their surfaces bonded to each other by an acid-base reaction, electrostatic attraction, covalent bonding or hydrophilic to hydrophobic interaction.
  • an acid base reaction can be used, and specifically, the magnetic particles are surface-treated with any one substituent of an acid group and a base, the gas-containing particles are surface-treated with the other substituent, and then they may be bonded through a reaction in an aqueous solution.
  • the gas-containing particles may be included in an amount of 80 to 200 parts by weight, 90 to 180 parts by weight, 100 to 170 parts by weight or 110 to 160 parts by weight, relative to 100 parts by weight of the magnetic particles.
  • the present application makes it possible to have uniform dispersibility in an ink composition within the above content range, and to realize excellent 3D printing performance within the above range.
  • the 3D printing composition may further comprise a dispersant such that the magnetic particles can be uniformly dispersed.
  • a dispersant for example, a surfactant having an affinity with the surface of the magnetic particle and having good compatibility with a resin to be described below, such as a nonionic surfactant, can be used.
  • a dispersant of a type containing an acidic or basic group, a high molecular weight acrylic polymer type having a weight average molecular weight of 10,000 or more, an inorganic soda type, or a metal salt type, and the like can be exemplified, and the composition of the present application may comprise one or more dispersants.
  • the dispersant may be included in an amount of 0.01 to 10 parts by weight, 0.1 to 8 parts by weight, or 0.15 to 5 parts by weight, relative to 100 parts by weight of a thermosetting resin to be described below.
  • the 3D printing composition may further comprise a dispersion medium.
  • a dispersion medium an inorganic solvent or an organic solvent may be used.
  • the inorganic solvent may be exemplified by water or the like.
  • the organic solvent may be exemplified by hexane, ethanol, silicone oil or polydimethylsiloxane, and the like.
  • the content of the composite in the dispersion medium may be suitably selected in consideration of the object of the present application or application fields of the composition.
  • the content of the composite in the dispersion medium may be 0.1 to 90 wt%, 0.5 to 80 wt%, 1 to 70 wt%, 3 to 55 wt%, 4 to 30 wt%, 4.5 to 15 wt%, or 4.8 to 9 wt%.
  • the density of the dispersion medium may be appropriately selected in consideration of the object of the present application.
  • the density of the dispersion medium may be, for example, 0.5 g/cm 3 to 2 g/cm 3 , 0.8 g/cm 3 to 1.8 g/cm 3 , or 1.2 g/cm 3 to 1.5 g/cm 3 .
  • the density of the dispersion medium is within the above range, it may be more advantageous to secure dispersion stability of the composite.
  • the composition for 3D printing may form magnetic clusters.
  • the nanoparticle-sized magnetic material can prevent agglomeration between the magnetic materials and improve dispersibility, thereby effectively curing the resin by vibrational heat.
  • the 3D printing composition of the present application may comprise a curable compound.
  • the curable compound may be a thermosetting resin.
  • thermosetting resin means a resin that can be cured through application of an appropriate heat or an aging process.
  • thermosetting resin in the present application is not particularly limited as long as it has the above-mentioned characteristics.
  • the thermosetting resin may comprise at least one thermosetting functional group.
  • it may comprise one or more of thermosetting functional groups such as an epoxy group, a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group or an amide group, which can be cured to exhibit the adhesive property.
  • thermosetting functional groups such as an epoxy group, a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group or an amide group, which can be cured to exhibit the adhesive property.
  • a specific kind of the resin as above may include an acrylic resin, a polyester resin, an isocyanate resin, an ester resin, an imide resin or an epoxy resin, but is not limited thereto.
  • thermosetting resin in the present application aromatic or aliphatic; or linear or branched epoxy resins may be used.
  • an epoxy resin having an epoxy equivalent of 180 g/eq to 1,000 g/eq, which contains two or more functional groups, may be used.
  • An example of such an epoxy resin may include one or a mixture of two or more of a cresol novolac epoxy resin, a bisphenol A epoxy resin, a bisphenol A novolac epoxy resin, a phenol novolac epoxy resin, a tetrafunctional epoxy resin, a biphenyl type epoxy resin, a triphenol methane type epoxy resin, an alkyl-modified triphenol methane epoxy resin, a naphthalene-type epoxy resin, a dicyclopentadiene type epoxy resin, or a dicyclopentadiene-modified phenol type epoxy resin.
  • an epoxy resin containing a cyclic structure in the molecular structure may be used, and more preferably, an epoxy resin containing an aromatic group (e.g., a phenyl group) may be used.
  • an epoxy resin containing an aromatic group e.g., a phenyl group
  • the epoxy resin comprises an aromatic group
  • the cured product may have excellent thermal and chemical stability.
  • a specific example of the aromatic group-containing epoxy resin that can be used in the present application may be one or a mixture of two or more of a biphenyl type epoxy resin, a dicyclopentadiene type epoxy resin, a naphthalene type epoxy resin, a dicyclopentadiene-modified phenol type epoxy resin, a cresol-based epoxy resin, a bisphenol-based epoxy resin, a xylylol-based epoxy resin, a polyfunctional epoxy resin, a phenol novolac epoxy resin, a triphenol methane type epoxy resin, and an alkyl-modified triphenol methane epoxy resin, and the like, but is not limited thereto.
  • the composite may be included in an amount of 0.01 to 25 parts by weight, 0.1 to 20 parts by weight, 1 to 15 parts by weight, 3 to 13 parts by weight, or 5 to 12 parts by weight, relative to 100 parts by weight of the thermosetting resin.
  • the unit "part by weight” means a weight ratio between the respective components.
  • the composition for 3D printing may further comprise a thermosetting agent.
  • a thermosetting agent for example, it may further comprise a curing agent capable of reacting with the thermosetting resin to form a cross-linked structure or the like.
  • an appropriate type may be selected and used according to the type of the functional group contained in the resin.
  • thermosetting resin is an epoxy resin
  • a curing agent of the epoxy resin known in this field for example, one or two or more of an amine curing agent, an imidazole curing agent, a phenol curing agent, a phosphorus curing agent, or an acid anhydride curing agent may be used, without being limited thereto.
  • an imidazole compound which is solid at room temperature and has a melting point or a decomposition temperature of 80°C or higher may be used.
  • 2-methylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole or 1-cyanoethyl-2-phenylimidazole, and the like can be exemplified, but is not limited thereto.
  • the content of the curing agent may be selected depending on composition of the composition, for example, the kind and ratio of the thermosetting resin.
  • the curing agent may be included in an amount of 1 to 20 parts by weight, 1 to 10 parts by weight, or 1 to 8 parts by weight, relative to 100 parts by weight of the thermosetting resin.
  • the weight ratio can be changed depending on the kind and ratio of the functional group of the thermosetting resin, the cross-linking density to be implemented, and the like.
  • the 3D printing composition may further comprise a filler.
  • the filler may be an organic filler, an inorganic filler, or a mixture thereof.
  • the specific kind of the filler that can be used in the present application is not particularly limited and for example, one or a mixture of two or more of carbon black, carbon nanotubes, glass fiber, silica, synthetic rubber, TiO 2 , an organic/inorganic pigment, clay, or talc, and the like may be used.
  • the filler may be included in an amount of 1 to 100 parts by weight, 10 to 80 parts by weight, or 20 to 60 parts by weight, relative to 100 parts by weight of the thermosetting resin.
  • the composition for 3D printing of the present application may comprise a thermoplastic resin.
  • the thermoplastic resin may include, for example, an acrylic resin, a silicone resin, a fluororesin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, polyurethane, a cellulose resin, a polyacetal resin or a polyamide resin.
  • styrene resin styrene-ethylene-butadiene-styrene block copolymer (SEBS), styrene-isoprene-styrene block copolymer (SIS), acrylonitrile-butadiene-styrene block copolymer (ABS), acrylonitrile-styrene-acrylate block copolymer (ASA), styrenebutadiene-styrene block copolymer (SBS), styrene homopolymer or a mixture thereof can be exemplified.
  • SEBS styrene-ethylene-butadiene-styrene block copolymer
  • SIS styrene-isoprene-styrene block copolymer
  • ABS acrylonitrile-butadiene-styrene block copolymer
  • ASA acrylonitrile-styrene-acrylate block
  • the olefin resin for example, a high-density polyethylene-based resin, a low-density polyethylene-based resin, a polypropylene-based resin, or a mixture thereof can be exemplified.
  • the thermoplastic elastomer for example, an ester-based thermoplastic elastomer, an olefin-based thermoplastic elastomer or a mixture thereof and the like can be used.
  • a polybutadiene resin or a polyisobutylene resin and the like can be used as the olefin-based thermoplastic elastomer.
  • polyoxyalkylene resin for example, a polyoxymethylene resin, a polyoxyethylene resin or a mixture thereof can be exemplified.
  • polyester resin for example, a polyethylene terephthalate resin, a polybutylene terephthalate resin or a mixture thereof and the like can be exemplified.
  • polyvinyl chloride resin for example, polyvinylidene chloride and the like can be exemplified.
  • a mixture of hydrocarbon resins can be included, and for example, hexatriacotane or paraffin and the like can be exemplified.
  • polyamide resin for example, nylon and the like can be exemplified.
  • acrylate resin for example, polybutyl (meth)acrylate and the like can be exemplified.
  • silicone resin for example, polydimethylsiloxane and the like can be exemplified.
  • fluororesin polytrifluoroethylene resin, polytetrafluoroethylene resin, polychlorotrifluoroethylene resin, polyhexafluoropropylene resin, polyfluorinated vinylidene, polyfluorinated vinyl, polyfluorinated ethylene propylene or a mixture thereof, and the like can be exemplified.
  • the above-listed resins may be also used, for example, by being grafted with maleic anhydride or the like, or by being copolymerized with the other resins as listed or monomers for producing resins, or by being modified with other compounds.
  • An example of such other compounds may include carboxyl-terminal butadiene-acrylonitrile copolymer and the like.
  • the composition for 3D printing according to the present application may comprise various additives depending on applications, the kind of the thermosetting resin, and the 3D printing process described below, in addition to the above-described constitutions, in the range without affecting the above-described effects of invention.
  • the resin composition may comprise a coupling agent, a cross-linking agent, a curable material, a tackifier, an ultraviolet stabilizer, or an antioxidant in an appropriate amount depending on the desired physical properties.
  • the curable material may mean a material having a thermosetting functional group and/or an active energy ray-curable functional group, which is separately included in addition to the components constituting the above-mentioned composition.
  • the present application also relates to a 3D printing method.
  • An exemplary 3D printing method may comprise a step of applying the above-described composition in three dimensions to form a three-dimensional shape.
  • the composition is applied in a three-dimensional manner to form a three-dimensional shape, and then, the vibrational heat is generated from the magnetic particles through the magnetic field application step, whereby the composition can be uniformly cured.
  • the step of applying a magnetic field is not particularly limited and can be performed with a known method by those skilled in the art.
  • the step of applying a magnetic field may be performed by applying a magnetic field with a current of 50 A to 500 A, 80 A to 450 A, or 120 A to 430 A at a frequency of 100 kHz to 1 GHz for 20 seconds to 60 minutes, 30 seconds to 30 minutes, or 30 seconds to 200 seconds.
  • the step of applying a magnetic field may comprise at least two steps of multi-profile methods.
  • the multi-profile method may be performed at a frequency of 100 kHz to 1 GHz.
  • the multi-profile method may comprise a first step of applying a magnetic field with a current of 10 A to 80 A for 20 seconds to 10 minutes, a second step of applying a magnetic field with a current of 80 A to 130 A for 20 seconds to 10 minutes and/or a third step of applying a magnetic field with a current of 150 A to 500 A for 5 seconds to 5 minutes.
  • the step of applying a magnetic field may also proceed in a manner that gives a gradient difference of the profile.
  • the method of giving a gradient difference is a method of sequentially raising the magnetic field with 100 to 200 A at an interval, which can block rapid exotherm and prevent characteristic deterioration of the cured product to cause thermal degradation depending on characteristics of the resin to be cured upon rapidly applying heat.
  • thermosetting can proceed with application of the magnetic field as described above, and may comprise additionally applying heat at 40°C to 100°C for 30 minutes to 24 hours, after applying the magnetic field. Furthermore, without being limited to the above, it is possible to apply heat together with applying the magnetic field.
  • the present application also relates to a three-dimensional solid shape.
  • the three-dimensional shape may comprise a cured product of the above-mentioned composition for 3D printing.
  • the present application also relates to a microelectronic device.
  • An exemplary microelectronic device may comprise a cured product comprising the above-described composition.
  • the cured product may be applied as a sealing material, but is not limited thereto.
  • the microelectronic device may include a micro battery, a biosensor, an actuator or the like.
  • the present application can provide a display device using the above-described composition as a sealing material or the like.
  • the present application provides a composition capable of precisely forming a three-dimensional solid shape and realizing uniform curing physical properties of a three-dimensional shape.
  • Figure 1 is photographs showing the compositions for 3D printing prepared in Examples and Comparative Examples of the present invention.
  • Magnetic particle-glass bubble particle composites are produced by reacting 0.3 g of glass bubble particles whose surface is substituted with amine groups (average particle diameter about 18 ⁇ m) and the magnetic particles in the aqueous solution such that the magnetic particles surround the surface of the glass bubble particles.
  • KSR-177 from Kukdo Chemical as an epoxy resin and an imidazole-based curing agent of Shikoku Kasei C11ZA as a curing agent were mixed at a weight ratio of 90:5 (KSR-177: C11ZA).
  • a composition for 3D printing was prepared by dispersing the magnetic composites prepared in advance in the mixture so as to have a solid content of 5 wt%.
  • a magnetic field was applied thereto with a current value of 100 A for 180 seconds in an external alternate-current magnetic field generator.
  • the magnetic field was applied by introducing the composition into a sample vial in a solenoid coil (3 turns, OD 50 mm, ID 35 mm) and adjusting the current value and time of the magnetic field generator (Easyheat from Ambrell).
  • the resin composition was cured with vibrational heat generated through application of the magnetic field to form a pattern or a three dimensional shape.
  • a composition for 3D printing was prepared and a three-dimensional shape was formed, in the same manner as in Example 1, except that MnOFe 2 O 3 particles (multi-magnetic domains, average particle diameter about 100 nm: measured by Field Emission Scanning Electron Microscope (using DLS)) were used as the magnetic particles.
  • MnOFe 2 O 3 particles multi-magnetic domains, average particle diameter about 100 nm: measured by Field Emission Scanning Electron Microscope (using DLS)
  • Ferromagnetic (hard type) Fe 2 O 3 particles single-magnetic domain, average particle diameter about 100 nm
  • a bisphenol-based epoxy resin and a curing agent were each mixed at a weight ratio of 5:95:5 to prepare a resin composition.
  • a magnetic field was applied thereto with a current value of 100 A for 180 seconds in an external alternate-current magnetic field generator.
  • the magnetic field was applied by introducing the composition into a sample vial in a solenoid coil (3 turns, OD 50 mm, ID 35 mm) and adjusting the current value and time of the magnetic field generator (Easyheat from Ambrell).
  • the resin composition was thermally cured with vibrational heat generated through application of the magnetic field to form a pattern or a three-dimensional shape.
  • Coercive force and saturation magnetization Ms were measured by placing the magnetic particles dried at room temperature in a vibrating sample magnetometer (SQUID, measured by Korea Basic Science Institute) and using an HS curve (VSM curve) at ⁇ 1 Tesla as an external magnetic field.
  • SQUID vibrating sample magnetometer
  • VSM curve HS curve
  • thermocouple For each three-dimensional shape produced in Examples and Comparative Example, immediately after the magnetic field application, a temperature inside the three-dimensional shape is confirmed by sticking a thermocouple therein.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Civil Engineering (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Soft Magnetic Materials (AREA)
EP17871708.8A 2016-11-21 2017-11-21 Composition pour l'impression en 3 dimensions Active EP3543287B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160155255A KR102202909B1 (ko) 2016-11-21 2016-11-21 3d 프린팅용 조성물
PCT/KR2017/013240 WO2018093230A2 (fr) 2016-11-21 2017-11-21 Composition pour l'impression 3d

Publications (3)

Publication Number Publication Date
EP3543287A2 true EP3543287A2 (fr) 2019-09-25
EP3543287A4 EP3543287A4 (fr) 2020-03-04
EP3543287B1 EP3543287B1 (fr) 2020-12-30

Family

ID=62145578

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17871708.8A Active EP3543287B1 (fr) 2016-11-21 2017-11-21 Composition pour l'impression en 3 dimensions

Country Status (6)

Country Link
US (1) US11232891B2 (fr)
EP (1) EP3543287B1 (fr)
JP (2) JP6943951B2 (fr)
KR (1) KR102202909B1 (fr)
CN (1) CN109715720B (fr)
WO (1) WO2018093230A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017052339A1 (fr) * 2015-09-25 2017-03-30 주식회사 엘지화학 Composition pour impression 3d
WO2017135576A1 (fr) * 2016-02-05 2017-08-10 주식회사 엘지화학 Composition pour impression 3d
JP6925689B2 (ja) * 2016-11-04 2021-08-25 エルジー・ケム・リミテッド 熱硬化性組成物
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물
CN111471140A (zh) * 2020-05-19 2020-07-31 深圳永昌和科技有限公司 一种磁控3d打印紫外光固化导电材料及其制备方法
WO2023189800A1 (fr) * 2022-03-30 2023-10-05 日本ゼオン株式会社 Particules creuses et leur procédé de production

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0689157B2 (ja) * 1989-06-14 1994-11-09 戸田工業株式会社 絶縁性材料の接着方法とそのための装置並びにその接着に使用する交番磁束によって磁気ヒステリシス発熱させるのに適した発熱材
US5123989A (en) * 1989-06-14 1992-06-23 Toda Kogyo Corporation Resin-bonding method
JP3633644B2 (ja) * 1994-03-24 2005-03-30 株式会社片山化学工業研究所 強磁性被覆多孔質シリカ微小粒子およびその用途
JP2000256388A (ja) * 1999-03-10 2000-09-19 Jsr Corp 核酸結合用磁性シリカ粒子および核酸単離方法
US6476113B1 (en) * 2000-06-07 2002-11-05 Remington Products Company Magnetically active flexible polymers
DE10037884A1 (de) 2000-08-03 2002-02-21 Henkel Kgaa Verfahren zur beschleunigten Klebstoffaushärtung
JP2003105067A (ja) * 2001-10-01 2003-04-09 Mitsui Chemicals Inc エポキシ樹脂組成物及びその製造方法
JP2004196574A (ja) * 2002-12-18 2004-07-15 National Institute Of Advanced Industrial & Technology 含スピネル型フェライト球状多孔質シリカ粒子及びその製造方法
EP1493590A1 (fr) 2003-07-03 2005-01-05 Sicpa Holding S.A. Procédé et moyens de production d'un dessin induit par magnétisme dans une composition de revêtement contenant des particules magnétiques
DE102005034925B4 (de) 2005-07-26 2008-02-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Magnetorheologische Elastomerkomposite sowie deren Verwendung
JP2007325850A (ja) * 2006-06-09 2007-12-20 Kyushu Institute Of Technology 温熱治療用マイクロカプセル発熱体及びその製造方法
JP5294588B2 (ja) 2006-08-11 2013-09-18 松本油脂製薬株式会社 導電性中空体およびその製造方法
CN101568422B (zh) * 2006-12-08 2013-02-13 3D系统公司 使用过氧化物固化的三维印刷材料体系和方法
KR100882735B1 (ko) * 2007-03-19 2009-02-06 도레이새한 주식회사 이방성 전도필름 및 이의 접착방법
JP5243558B2 (ja) * 2008-01-18 2013-07-24 ワイルド リバー コンサルティング グループ リミテッド ライアビリティー カンパニー 溶融成形ポリマー複合物およびその製造方法
US8211225B2 (en) 2008-04-09 2012-07-03 Sun Chemical Corp. Magnetic pigments and process of enhancing magnetic properties
CN103213281B (zh) 2013-04-09 2016-05-25 中国科学院重庆绿色智能技术研究院 基于磁流变材料的3d打印快速成型装置及方法
KR101567388B1 (ko) 2013-07-02 2015-11-10 한국과학기술연구원 중공코어 및 기공성 쉘층을 가지는 금속산화물 복합체 및 그 제조방법
JP6379850B2 (ja) * 2013-10-11 2018-08-29 セイコーエプソン株式会社 レーザー焼結用粉末および構造物の製造方法
WO2015175880A1 (fr) 2014-05-15 2015-11-19 Northwestern University Compositions d'encre pour impression 3d et procédés de formation d'objets faisant appel auxdites compositions d'encre
US20170120528A1 (en) * 2014-06-06 2017-05-04 Das-Nano, S.L. 3d printing material encoding
US20170189960A1 (en) * 2014-06-20 2017-07-06 Fujimi Incorporated Powder material for powder additive manufacturing and powder additive manufacturing method using same
JP2016011331A (ja) 2014-06-27 2016-01-21 セイコーエプソン株式会社 インク、インクセット、三次元造形物および三次元造形物の製造方法
KR101851424B1 (ko) 2014-08-19 2018-04-25 주식회사 엘지화학 담체-나노입자 복합체 및 이의 제조방법
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
JP2016088004A (ja) * 2014-11-07 2016-05-23 セイコーエプソン株式会社 三次元造形物の製造方法、三次元造形物製造装置および三次元造形物
US9757880B2 (en) * 2015-01-13 2017-09-12 Empire Technology Development Llc Spatial heat treatment of additively manufactured objects
DE102015003378A1 (de) 2015-03-17 2016-09-22 Jörg Beckmann Verfahren zum Strangpressen, Extrudieren, Spritzgießen oder 3D-Drucken eines Gegenstandes
WO2016178545A1 (fr) 2015-05-07 2016-11-10 주식회사 엘지화학 Imprimante 3d
CN104959594B (zh) * 2015-07-10 2017-02-22 北京科技大学 一种3d打印用高固相低粘度磁性合金粉的制备方法
KR102202909B1 (ko) * 2016-11-21 2021-01-14 주식회사 엘지화학 3d 프린팅용 조성물

Also Published As

Publication number Publication date
JP2019536890A (ja) 2019-12-19
CN109715720A (zh) 2019-05-03
JP2021191639A (ja) 2021-12-16
EP3543287B1 (fr) 2020-12-30
WO2018093230A2 (fr) 2018-05-24
EP3543287A4 (fr) 2020-03-04
CN109715720B (zh) 2021-05-25
US20190318857A1 (en) 2019-10-17
JP6943951B2 (ja) 2021-10-06
JP7262878B2 (ja) 2023-04-24
KR102202909B1 (ko) 2021-01-14
KR20180057080A (ko) 2018-05-30
US11232891B2 (en) 2022-01-25
WO2018093230A3 (fr) 2018-11-29

Similar Documents

Publication Publication Date Title
EP3543287B1 (fr) Composition pour l'impression en 3 dimensions
EP3412715B1 (fr) Composition pour impression 3d
EP3354376B1 (fr) Composition pour impression 3d
US11472971B2 (en) Composition for 3D printing
US11872623B2 (en) Thermosetting composition
KR102354937B1 (ko) 조성물
KR102176233B1 (ko) 3d 프린팅용 조성물

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20190219

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20200203

RIC1 Information provided on ipc code assigned before grant

Ipc: C08K 7/22 20060101ALI20200128BHEP

Ipc: C08K 3/20 20060101AFI20200128BHEP

Ipc: C08L 33/08 20060101ALN20200128BHEP

RIC1 Information provided on ipc code assigned before grant

Ipc: C08K 3/20 20060101AFI20200505BHEP

Ipc: C08K 7/22 20060101ALI20200505BHEP

Ipc: C08L 33/08 20060101ALN20200505BHEP

RIC1 Information provided on ipc code assigned before grant

Ipc: C08L 33/08 20060101ALN20200602BHEP

Ipc: C08K 7/22 20060101ALI20200602BHEP

Ipc: C08K 3/20 20060101AFI20200602BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602017030714

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: C08K0009120000

Ipc: C08K0003200000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: C08K 7/22 20060101ALI20200731BHEP

Ipc: C08K 3/20 20060101AFI20200731BHEP

Ipc: C08L 33/08 20060101ALN20200731BHEP

INTG Intention to grant announced

Effective date: 20200901

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1349891

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210115

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602017030714

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210331

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210330

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1349891

Country of ref document: AT

Kind code of ref document: T

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210330

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210430

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210430

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602017030714

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

26N No opposition filed

Effective date: 20211001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211121

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211130

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20211130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211130

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20211121

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20201230

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20171121

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20231023

Year of fee payment: 7

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20231024

Year of fee payment: 7

Ref country code: DE

Payment date: 20231023

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20201230