EP3488466A1 - Module de puissance - Google Patents

Module de puissance

Info

Publication number
EP3488466A1
EP3488466A1 EP17740361.5A EP17740361A EP3488466A1 EP 3488466 A1 EP3488466 A1 EP 3488466A1 EP 17740361 A EP17740361 A EP 17740361A EP 3488466 A1 EP3488466 A1 EP 3488466A1
Authority
EP
European Patent Office
Prior art keywords
power module
leadframe
matrix
conductor tracks
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17740361.5A
Other languages
German (de)
English (en)
Inventor
Michael Leipenat
Christoph Nöth
Ralf Schmidt
Ronny Werner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP3488466A1 publication Critical patent/EP3488466A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H01L23/4951—Chip-on-leads or leads-on-chip techniques, i.e. inner lead fingers being used as die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

L'invention concerne un module de puissance comprenant un composant semi-conducteur (1) destiné à être mis en contact électrique sur ses faces supérieure et inférieure. L'invention est caractérisée en ce que le composant semi-conducteur (1) est mis en contact électrique sur sa face supérieure par l'intermédiaire d'une matrice formant « lead frame » (7) par application d'une pression de serrage.
EP17740361.5A 2016-09-07 2017-07-07 Module de puissance Withdrawn EP3488466A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016217007.4A DE102016217007A1 (de) 2016-09-07 2016-09-07 Leistungsmodul
PCT/EP2017/067094 WO2018046165A1 (fr) 2016-09-07 2017-07-07 Module de puissance

Publications (1)

Publication Number Publication Date
EP3488466A1 true EP3488466A1 (fr) 2019-05-29

Family

ID=59363133

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17740361.5A Withdrawn EP3488466A1 (fr) 2016-09-07 2017-07-07 Module de puissance

Country Status (6)

Country Link
US (1) US20190214340A1 (fr)
EP (1) EP3488466A1 (fr)
JP (1) JP6811310B2 (fr)
CN (1) CN109661724A (fr)
DE (1) DE102016217007A1 (fr)
WO (1) WO2018046165A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022209559A1 (de) 2022-09-13 2024-02-15 Zf Friedrichshafen Ag Halbbrückenmodul
WO2024114961A1 (fr) 2022-11-30 2024-06-06 Siemens Aktiengesellschaft Ensemble semi-conducteur comprenant au moins un élément semi-conducteur
EP4379789A1 (fr) 2022-11-30 2024-06-05 Siemens Aktiengesellschaft Dispositif semi-conducteur comprenant au moins un élément semi-conducteur

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0064383A3 (fr) 1981-05-06 1984-06-27 LUCAS INDUSTRIES public limited company Un empaquetage pour semiconducteur
US4395084A (en) 1981-07-06 1983-07-26 Teledyne Industries, Inc. Electrical socket for leadless integrated circuit packages
JP2882143B2 (ja) * 1991-12-10 1999-04-12 富士電機株式会社 半導体装置の内部配線構造
JPH06216288A (ja) * 1993-01-20 1994-08-05 Hitachi Ltd 半導体装置および該半導体装置用の外囲器
JPH09213878A (ja) * 1996-01-29 1997-08-15 Toshiba Corp 半導体装置
JP2002164503A (ja) * 2001-10-19 2002-06-07 Hitachi Ltd パワー半導体装置
JP4453498B2 (ja) * 2004-09-22 2010-04-21 富士電機システムズ株式会社 パワー半導体モジュールおよびその製造方法
JP4459883B2 (ja) * 2005-04-28 2010-04-28 三菱電機株式会社 半導体装置
JP2007081155A (ja) * 2005-09-14 2007-03-29 Hitachi Ltd 半導体装置
JP2009038077A (ja) * 2007-07-31 2009-02-19 Yamaha Corp プリモールドパッケージ型半導体装置及びその製造方法、モールド樹脂体、プリモールドパッケージ、マイクロフォンチップパッケージ
US8716069B2 (en) * 2012-09-28 2014-05-06 Alpha & Omega Semiconductor, Inc. Semiconductor device employing aluminum alloy lead-frame with anodized aluminum
JP2014183242A (ja) * 2013-03-20 2014-09-29 Denso Corp 半導体装置およびその製造方法
JP6304974B2 (ja) * 2013-08-27 2018-04-04 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
US20190214340A1 (en) 2019-07-11
JP2019531600A (ja) 2019-10-31
CN109661724A (zh) 2019-04-19
DE102016217007A1 (de) 2018-03-08
JP6811310B2 (ja) 2021-01-13
WO2018046165A1 (fr) 2018-03-15

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