EP3465725B1 - Méthode de fabrication d'une photocathode à nanofils - Google Patents
Méthode de fabrication d'une photocathode à nanofils Download PDFInfo
- Publication number
- EP3465725B1 EP3465725B1 EP17731230.3A EP17731230A EP3465725B1 EP 3465725 B1 EP3465725 B1 EP 3465725B1 EP 17731230 A EP17731230 A EP 17731230A EP 3465725 B1 EP3465725 B1 EP 3465725B1
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- EP
- European Patent Office
- Prior art keywords
- nanowires
- photocathode
- substrate
- iii
- growth
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- 239000002070 nanowire Substances 0.000 title claims description 52
- 238000000034 method Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims description 38
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 16
- 230000012010 growth Effects 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000010931 gold Substances 0.000 claims description 10
- 229910052737 gold Inorganic materials 0.000 claims description 10
- 238000001451 molecular beam epitaxy Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000003595 spectral effect Effects 0.000 claims description 7
- 230000004907 flux Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 2
- 230000003698 anagen phase Effects 0.000 claims 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 230000005670 electromagnetic radiation Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 230000010287 polarization Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000002086 nanomaterial Substances 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 238000002128 reflection high energy electron diffraction Methods 0.000 description 3
- 238000004626 scanning electron microscopy Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002113 nanodiamond Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910005542 GaSb Inorganic materials 0.000 description 1
- 241000449533 Gabia Species 0.000 description 1
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 1
- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- -1 SbNaK or SbNa 2 KCs Chemical class 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000001341 grazing-angle X-ray diffraction Methods 0.000 description 1
- 238000000097 high energy electron diffraction Methods 0.000 description 1
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910002058 ternary alloy Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/34—Photo-emissive cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/12—Manufacture of electrodes or electrode systems of photo-emissive cathodes; of secondary-emission electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/34—Photoemissive electrodes
- H01J2201/342—Cathodes
- H01J2201/3421—Composition of the emitting surface
- H01J2201/3423—Semiconductors, e.g. GaAs, NEA emitters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J40/00—Photoelectric discharge tubes not involving the ionisation of a gas
- H01J40/02—Details
- H01J40/04—Electrodes
- H01J40/06—Photo-emissive cathodes
Definitions
- the present invention relates to the field of photocathodes, in particular for electromagnetic radiation detectors such as image intensifiers or sensors of the EBCMOS (Electron Bombarded CMOS) or EBCDD (Electron Bombarded CDD) type.
- electromagnetic radiation detectors such as image intensifiers or sensors of the EBCMOS (Electron Bombarded CMOS) or EBCDD (Electron Bombarded CDD) type.
- Electromagnetic radiation detectors such as, for example, image intensifier tubes and photomultiplier tubes, detect electromagnetic radiation by converting it into a light or electrical output signal. They usually include a photocathode for receiving the electromagnetic radiation and emitting a flow of photoelectrons in response, an electron multiplier device for receiving said flow of photoelectrons and emitting in response a flow of so-called secondary electrons, then an output device for receiving said flow of secondary electrons and emit the output signal in response.
- Photocathodes ensure the conversion of a flow of incident photons into a flow of photoelectrons. They are generally composed of a substrate transparent to the spectral band of interest and an electro-emissive layer deposited on the rear face of this substrate.
- Photocathodes can be characterized by their quantum efficiency QE (Quantum Efficiency) defined as the average percentage of incident photons converted into photoelectrons or by their sensitivity defined as the photocathode current generated by a given luminous flux.
- QE Quantum Efficiency
- So-called second generation photocathodes use an electro-emissive layer of a multi-alkaline compound such as SbNaK or SbNa 2 KCs, deposited by CVD (Chemical Vapor Deposition) on a glass substrate.
- the thickness of the photoemissive layer is usually between 50 and 200 nm.
- the sensitivity of these photocathodes is generally 700 to 800 ⁇ A / lm and its quantum efficiency is relatively low (around 15%).
- the so-called third generation photocathodes use an electro-emissive GaAs layer, epitaxied by MOCVD (Metal Organic Chemical Vapor Desposition) and transferred to a glass substrate.
- the thickness of the electro-emissive layer is generally of the order of 2 ⁇ m.
- the sensitivity of such a photocathode is of the order of 1500 to 2000 ⁇ A / lm.
- Third generation photocathodes have high quantum efficiency, of the order of 30%, but their manufacturing is complex and expensive.
- nanostructured photocathodes As described in the application WO-A-2003/043045 . These photocathodes are obtained by etching a pattern of channels in an alumina matrix and filling these channels, by an electrodeposition technique, with an electro-emissive material such as an alkaline compound or a III-V semiconductor.
- photocathodes can achieve high sensitivities but are complex to manufacture.
- the transfer of the emissive layer onto a transparent substrate at the spectral band of interest turns out to be particularly delicate due to the fragility of the nanostructure.
- the nanostructure is directly etched in a substrate constituting the input window of the photocathode, a significant part of the conversion takes place in the massive part of the semiconductor layer so that the quantum yield is reduced by the recombinations within it.
- the aim of the present invention is therefore to provide a method of manufacturing a photocathode with high sensitivity levels/quantum efficiency.
- the present invention is defined by a photocathode manufacturing method as given in claim 1.
- Advantageous embodiments are given in the dependent claims.
- the present invention is based on the surprising observation that it is possible, under certain conditions, to directly epitaxy III-V semiconductor nanowires with high crystalline quality on an amorphous substrate such as a glass substrate.
- an amorphous substrate such as a glass substrate.
- the research carried out to date in terms of nanowire growth focused either on crystalline substrates or on amorphous substrates undergoing a prior surface crystallization step.
- FIG. 1A schematically represents a first nanowire photocathode structure, which can be produced by a manufacturing method according to the invention.
- the photocathode comprises an amorphous substrate such as a glass substrate, 110, constituting the input window of the image intensifier or sensor.
- the amorphous substrate material is chosen to be transparent in the working spectral band of the photocathode. If necessary, the amorphous substrate can be nano-structured to allow a more regular distribution of the nanowires at the cost of greater complexity. Growth then begins in the wells of the nanostructure.
- the substrate is covered with a mat of nanowires made of III-V semiconductor material, for example GaN, InGaN, InGaAs, GaP, InGaP, InAs, GaSb, GaAsSb, AlGaAS, AlGaASP, GaBiAs and more generally their ternary and quaternary alloys.
- III-V semiconductor material for example GaN, InGaN, InGaAs, GaP, InGaP, InAs, GaSb, GaAsSb, AlGaAS, AlGaASP, GaBiAs and more generally their ternary and quaternary alloys.
- the nanowires are doped with a P-type material, for example Zn, Be, C, or an amphoteric material such as Si.
- a P-type material for example Zn, Be, C, or an amphoteric material such as Si.
- the nanowire mat, 120 is grown directly on the amorphous substrate by molecular beam epitaxy (MBE), as described later.
- MBE molecular beam epitaxy
- the nanowires have a diameter of 20 to 500 nm, preferably between 50 to 150 nm.
- the nanowire mat has a density of 10 5 to 10 10 cm -2 , preferably 10 8 to 10 9 cm -2 .
- a metal layer, 130 acts as an electrode and makes it possible to apply polarization to the mat of nanowires.
- This polarization is negative with respect to a distant anode (not shown), opposite the photocathode.
- the photons arriving on the entrance face of the substrate, transparent at the wavelength of interest generate electron-hole pairs within the nanowires.
- the holes are eliminated by recombination with the electrons provided by the polarization electrode, 130.
- the electrons generated can be emitted over the entire length of the nanowires.
- the nanowires are covered with a layer intended to lower the work function, for example in LiO, CsO or NF 3 and therefore to facilitate the extraction of electrons in a vacuum.
- the electrons extracted from the nanowires can then be multiplied by an electron multiplier, 140, such as a wafer of microchannels or a layer of nanodiamonds (NDs).
- the secondary electrons thus generated can then form an image on a phosphorescent screen or on a matrix of CMOS transistors or even a CCD matrix (EBCCD), in a manner known per se.
- the electrons extracted from the nanowires can directly impact the rear face of an EBCMOS (Electron Bombarded CMOS) sensor.
- EBCMOS Electro Bombarded CMOS
- the phosphor screen, the CCD, CMOS or EBCMOS matrix constitute the output window of the detector.
- FIG. 1B schematically represents a second structure of a nanowire photocathode, which can be produced by a manufacturing method according to the invention.
- the elements identical to those of the Fig. 1A bear the same reference numbers and will not be described again.
- This second structure differs from the first by the presence of a contact layer, 135, transparent in the spectral band of interest and conductive, for example, an ITO layer, a graphene layer, or even a thin polycrystalline layer of heavily P-doped III-V semiconductor material, deposited on the substrate before the growth of the nanowire mat.
- the contact layer, 135, is electrically connected to the polarization electrode, 130.
- FIG. 1 C schematically represents a third structure of a nanowire photocathode which can be produced by a manufacturing method according to the invention.
- the elements identical to those of the Fig. 1B bear the same reference numbers and will not be described again.
- This third structure differs from the previous one by the presence of an anti-reflection layer, 125.
- This anti-reflection layer is deposited on the surface of the substrate before the deposition of the contact layer, 135. It prevents light from entering the strip working spectral of the photocathode is reflected by the interface between the substrate, 110, and the contact layer, 135.
- FIGs. 1A to 1C illustrate photocathode structures operating in transmission in the sense that they are located between the input window and the output window of the detector.
- these photocathodes can operate in reflection. More precisely, the flow of photons is in this case incident on the rear face of the photocathode (with an angle of incidence determined by input optics) and the photoelectrons generated in the nanowires are emitted by this same rear face.
- the entrance and exit windows of the detector are therefore located here on the same side of the photocathode.
- amorphous substrate such as a glass substrate
- an anti-reflective layer and a contact layer will be described below.
- the growth of the nanowires is carried out by molecular beam epitaxy (MBE) of the III-V semiconductor material on the amorphous substrate.
- MBE molecular beam epitaxy
- a gold film is first deposited on the substrate.
- the gold is deposited at a temperature between 800 and 1200°C (temperature of the MBE cell) on the ambient or hot substrate, preferably between 400°C and 700°C, for a period of 1 to 30 min.
- At the end of the deposition of the gold film we wait for a period of 30 seconds to 30 minutes, so that the gold dewets on the substrate.
- Gold particles 5 to 50nm in diameter are then formed on the glass substrate.
- a colloidal solution of gold particles having the aforementioned size can be dispersed on the surface of the substrate. In all cases, the gold particles act as precursors for the growth of III-V material nanowires.
- the gold film is deposited or dispersed on the contact layer.
- the dewetting and nucleation phenomenon is essentially the same as on the glass substrate.
- the growth of the nanowires is then carried out in the same MBE frame, which avoids any contamination by ambient air. It is carried out in a temperature range of 400 to 700°C. The temperature is measured using a pyrometer adapted to the wavelength of the III-V materials making up the nanowires.
- the atomic fluxes are chosen to correspond to growth rates between 0.5 ⁇ /s and 10 ⁇ /s.
- the flows are calibrated by high energy electron diffraction at grazing incidence or RHEED ( Reflection High Energy Electron Diffraction ) by observing the RHEED observations corresponding to the deposition of successive layers, in a manner known per se. After a few seconds of growth, the diffraction pattern shows semicircles indicating the growth of single-crystal nanowires in a multitude of directions.
- FIG. 2 represents a photograph obtained by scanning electron microscopy (SEM) of a mat of GaAs nanowires having grown by MBE epitaxy on a glass substrate (Corning TM 7056).
- the flow ratio of the III-V materials during growth so that the nanowires have a wider band gap at their base (and at their periphery) than at their top (and in their hearts).
- This variation in composition can be carried out in stages over time. Alternatively, it could be gradual so as to obtain a positive band gap gradient directed from the core of the nanowires towards their periphery.
- this variant will make it possible to absorb a wider spectral band than with a simple homogeneous composition.
- an activation layer of LiO, CsO or NF 3 At the end of the growth of the nanowires, in the same frame or without breaking the ultra-high vacuum, we can advantageously deposit an activation layer of LiO, CsO or NF 3 .
- the electrons generated in the nanowires have a high probability of being emitted into a vacuum before being recombined.
- the emission of photoelectrons can take place all along the nanowires. What's more, the high electric field due to the tip effect also increases the emission probability compared to a conventional planar photocathode configuration.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1654896A FR3051963B1 (fr) | 2016-05-31 | 2016-05-31 | Photocathode a nanofils et methode de fabrication d'une telle photocathode |
PCT/FR2017/051321 WO2017207898A2 (fr) | 2016-05-31 | 2017-05-29 | Photocathode à nanofils et méthode de fabrication d'une telle photocathode |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3465725A2 EP3465725A2 (fr) | 2019-04-10 |
EP3465725B1 true EP3465725B1 (fr) | 2023-09-27 |
Family
ID=57136980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP17731230.3A Active EP3465725B1 (fr) | 2016-05-31 | 2017-05-29 | Méthode de fabrication d'une photocathode à nanofils |
Country Status (8)
Country | Link |
---|---|
US (1) | US11043350B2 (zh) |
EP (1) | EP3465725B1 (zh) |
JP (1) | JP7033556B2 (zh) |
KR (1) | KR102419131B1 (zh) |
FR (1) | FR3051963B1 (zh) |
IL (1) | IL263234B2 (zh) |
TW (1) | TWI747907B (zh) |
WO (1) | WO2017207898A2 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108281337B (zh) * | 2018-03-23 | 2024-04-05 | 中国工程物理研究院激光聚变研究中心 | 光电阴极及x射线诊断系统 |
JP6958827B1 (ja) * | 2020-05-20 | 2021-11-02 | 国立大学法人静岡大学 | 光電陰極及び光電陰極の製造方法 |
CN112530768B (zh) * | 2020-12-21 | 2024-02-27 | 中国计量大学 | 一种高量子效率的纳米阵列光电阴极及其制备方法 |
CN113964003A (zh) * | 2021-10-09 | 2022-01-21 | 电子科技大学长三角研究院(湖州) | 一种具有纳米管结构的GaN光电阴极及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001143648A (ja) | 1999-11-17 | 2001-05-25 | Hitachi Ltd | 光励起電子線源および電子線応用装置 |
US6908355B2 (en) * | 2001-11-13 | 2005-06-21 | Burle Technologies, Inc. | Photocathode |
JP2006302610A (ja) | 2005-04-19 | 2006-11-02 | Hamamatsu Photonics Kk | 半導体光電陰極 |
JP2008135350A (ja) | 2006-11-29 | 2008-06-12 | Hamamatsu Photonics Kk | 半導体光電陰極 |
US20100180950A1 (en) * | 2008-11-14 | 2010-07-22 | University Of Connecticut | Low-temperature surface doping/alloying/coating of large scale semiconductor nanowire arrays |
JP5437487B2 (ja) * | 2010-06-03 | 2014-03-12 | nusola株式会社 | 光蓄電装置 |
WO2012067687A2 (en) | 2010-08-26 | 2012-05-24 | The Ohio State University | Nanoscale emitters with polarization grading |
WO2013126432A1 (en) * | 2012-02-21 | 2013-08-29 | California Institute Of Technology | Axially-integrated epitaxially-grown tandem wire arrays |
CN103594302B (zh) * | 2013-11-19 | 2016-03-23 | 东华理工大学 | 一种GaAs纳米线阵列光电阴极及其制备方法 |
US9478385B2 (en) * | 2013-11-26 | 2016-10-25 | Electronics And Telecommunications Research Institute | Field emission device having field emitter including photoelectric material and method of manufacturing the same |
CN104752117B (zh) * | 2015-03-03 | 2017-04-26 | 东华理工大学 | 一种垂直发射AlGaAs/GaAs纳米线的NEA电子源 |
CA2923897C (en) * | 2015-03-16 | 2023-08-29 | Zetian Mi | Photocathodes and dual photoelectrodes for nanowire photonic devices |
FR3034908B1 (fr) | 2015-04-08 | 2017-05-05 | Photonis France | Photocathode multibande et detecteur associe |
US9818894B2 (en) * | 2015-09-02 | 2017-11-14 | Physical Optics Corporation | Photodetector with nanowire photocathode |
-
2016
- 2016-05-31 FR FR1654896A patent/FR3051963B1/fr active Active
-
2017
- 2017-05-26 TW TW106117587A patent/TWI747907B/zh active
- 2017-05-29 JP JP2018562635A patent/JP7033556B2/ja active Active
- 2017-05-29 US US16/305,669 patent/US11043350B2/en active Active
- 2017-05-29 WO PCT/FR2017/051321 patent/WO2017207898A2/fr unknown
- 2017-05-29 KR KR1020187034878A patent/KR102419131B1/ko active IP Right Grant
- 2017-05-29 EP EP17731230.3A patent/EP3465725B1/fr active Active
-
2018
- 2018-11-22 IL IL263234A patent/IL263234B2/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2019523522A (ja) | 2019-08-22 |
IL263234A (en) | 2018-12-31 |
US20200328056A1 (en) | 2020-10-15 |
KR20190013800A (ko) | 2019-02-11 |
JP7033556B2 (ja) | 2022-03-10 |
US11043350B2 (en) | 2021-06-22 |
EP3465725A2 (fr) | 2019-04-10 |
TWI747907B (zh) | 2021-12-01 |
IL263234B2 (en) | 2023-08-01 |
KR102419131B1 (ko) | 2022-07-08 |
TW201810695A (zh) | 2018-03-16 |
WO2017207898A3 (fr) | 2018-01-25 |
IL263234B1 (en) | 2023-04-01 |
FR3051963A1 (fr) | 2017-12-01 |
FR3051963B1 (fr) | 2020-12-25 |
WO2017207898A2 (fr) | 2017-12-07 |
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