EP3276415A4 - Photosensitive resin composition - Google Patents
Photosensitive resin composition Download PDFInfo
- Publication number
- EP3276415A4 EP3276415A4 EP16768697.1A EP16768697A EP3276415A4 EP 3276415 A4 EP3276415 A4 EP 3276415A4 EP 16768697 A EP16768697 A EP 16768697A EP 3276415 A4 EP3276415 A4 EP 3276415A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- resin composition
- photosensitive resin
- photosensitive
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/42—Polyamides containing atoms other than carbon, hydrogen, oxygen, and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/38—Thiocarbonic acids; Derivatives thereof, e.g. xanthates ; i.e. compounds containing -X-C(=X)- groups, X being oxygen or sulfur, at least one X being sulfur
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Polyamides (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015060465 | 2015-03-24 | ||
PCT/JP2016/058763 WO2016152794A1 (ja) | 2015-03-24 | 2016-03-18 | 感光性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3276415A1 EP3276415A1 (en) | 2018-01-31 |
EP3276415A4 true EP3276415A4 (en) | 2018-09-19 |
Family
ID=56978416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16768697.1A Withdrawn EP3276415A4 (en) | 2015-03-24 | 2016-03-18 | Photosensitive resin composition |
Country Status (8)
Country | Link |
---|---|
US (1) | US10584205B2 (zh) |
EP (1) | EP3276415A4 (zh) |
JP (1) | JP6801452B2 (zh) |
KR (1) | KR102281541B1 (zh) |
CN (1) | CN107407877B (zh) |
SG (1) | SG11201707712TA (zh) |
TW (1) | TWI688825B (zh) |
WO (1) | WO2016152794A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017122623A1 (ja) * | 2016-01-15 | 2017-07-20 | 東レ株式会社 | 硬化膜およびその製造方法 |
US10930601B2 (en) * | 2016-10-31 | 2021-02-23 | The Regents Of The University Of California | Flexible fan-out wafer level process and structure |
KR102460973B1 (ko) * | 2016-11-10 | 2022-11-02 | 도레이 카부시키가이샤 | 디아민 화합물, 그것을 사용한 내열성 수지 및 수지 조성물 |
WO2019181782A1 (ja) * | 2018-03-22 | 2019-09-26 | 東レ株式会社 | アルカリ可溶性樹脂、感光性樹脂組成物、感光性シート、硬化膜、層間絶縁膜または半導体保護膜、硬化膜のレリーフパターンの製造方法、電子部品または半導体装置 |
KR102324616B1 (ko) * | 2018-07-13 | 2021-11-09 | 주식회사 엘지화학 | 감광성 수지 조성물, 감광성 수지막 및 반도체 절연 필름 |
KR102636334B1 (ko) * | 2018-12-05 | 2024-02-14 | 후지필름 가부시키가이샤 | 패턴 형성 방법, 감광성 수지 조성물, 경화막, 적층체, 및 디바이스 |
KR102694000B1 (ko) * | 2021-12-22 | 2024-08-08 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막, 재배선층 및 반도체 장치 |
KR102670557B1 (ko) * | 2021-12-22 | 2024-05-28 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용한 감광성 수지막, 재배선층 및 반도체 장치 |
CN114621437B (zh) * | 2022-04-01 | 2023-08-18 | 吉林奥来德光电材料股份有限公司 | 用于制备感光树脂薄膜的化合物、其制备方法和应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007058017A (ja) * | 2005-08-26 | 2007-03-08 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物 |
EP3267254A1 (en) * | 2015-03-04 | 2018-01-10 | Toray Industries, Inc. | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52145157A (en) * | 1976-05-24 | 1977-12-02 | Kao Corp | Cultivation of shiitake mushroom |
JP2000275841A (ja) * | 1999-03-26 | 2000-10-06 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
US6524764B1 (en) * | 1999-06-01 | 2003-02-25 | Toray Industries, Inc. | Positive-type photosensitive polyimide precursor composition |
CN1522387A (zh) * | 2001-05-30 | 2004-08-18 | 钟渊化学工业株式会社 | 光敏性树脂组合物及用该组合物的光敏性干膜抗蚀剂、光敏性射线遮挡膜 |
JP4692219B2 (ja) | 2004-10-29 | 2011-06-01 | Jsr株式会社 | ポジ型感光性絶縁樹脂組成物およびその硬化物 |
US7524617B2 (en) * | 2004-11-23 | 2009-04-28 | E.I. Du Pont De Nemours And Company | Low-temperature curable photosensitive compositions |
KR101252321B1 (ko) * | 2005-06-30 | 2013-04-08 | 도레이 카부시키가이샤 | 감광성 수지 조성물 및 접착 개량제 |
JP4804312B2 (ja) | 2006-11-16 | 2011-11-02 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
JP5196148B2 (ja) | 2008-06-11 | 2013-05-15 | 住友電気工業株式会社 | 感光性樹脂組成物およびそれを用いたポリイミド樹脂膜、フレキシブルプリント配線板 |
JP2010229210A (ja) | 2009-03-26 | 2010-10-14 | Toray Ind Inc | 樹脂組成物 |
JPWO2012073972A1 (ja) * | 2010-12-01 | 2014-05-19 | 日立化成株式会社 | 接着剤層付き半導体ウェハ、半導体装置の製造方法及び半導体装置 |
JP5548604B2 (ja) * | 2010-12-21 | 2014-07-16 | 富士フイルム株式会社 | 感光性樹脂組成物 |
JP5735341B2 (ja) | 2011-04-28 | 2015-06-17 | 株式会社カネカ | ポジ型感光性樹脂組成物 |
CN103975294B (zh) | 2011-12-05 | 2016-08-24 | 日立化成株式会社 | 触摸面板用电极的保护膜的形成方法、感光性树脂组合物及感光性元件、以及触摸面板的制造方法 |
JP6212970B2 (ja) * | 2011-12-05 | 2017-10-18 | 日立化成株式会社 | タッチパネル用電極の保護膜及びタッチパネル |
CN104641291B (zh) | 2012-09-24 | 2017-12-12 | 东丽株式会社 | 正型感光性树脂组合物 |
WO2014097992A1 (ja) * | 2012-12-20 | 2014-06-26 | 東レ株式会社 | 感光性樹脂組成物、耐熱性樹脂膜の製造方法および表示装置 |
JP5962546B2 (ja) * | 2013-03-06 | 2016-08-03 | Jsr株式会社 | 感放射線性樹脂組成物、硬化膜、その形成方法、及び表示素子 |
JP2014224855A (ja) * | 2013-05-15 | 2014-12-04 | 日立化成株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法、及び、該パターン硬化膜を有する半導体装置 |
JP6205955B2 (ja) * | 2013-07-31 | 2017-10-04 | 日立化成株式会社 | 半導体装置の製造方法及びその製造方法によって得られる半導体装置 |
-
2016
- 2016-03-18 KR KR1020177028508A patent/KR102281541B1/ko active IP Right Grant
- 2016-03-18 JP JP2016518460A patent/JP6801452B2/ja active Active
- 2016-03-18 CN CN201680017018.XA patent/CN107407877B/zh active Active
- 2016-03-18 WO PCT/JP2016/058763 patent/WO2016152794A1/ja active Application Filing
- 2016-03-18 SG SG11201707712TA patent/SG11201707712TA/en unknown
- 2016-03-18 US US15/557,623 patent/US10584205B2/en active Active
- 2016-03-18 EP EP16768697.1A patent/EP3276415A4/en not_active Withdrawn
- 2016-03-23 TW TW105108917A patent/TWI688825B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007058017A (ja) * | 2005-08-26 | 2007-03-08 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物 |
EP3267254A1 (en) * | 2015-03-04 | 2018-01-10 | Toray Industries, Inc. | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device |
Non-Patent Citations (1)
Title |
---|
See also references of WO2016152794A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR102281541B1 (ko) | 2021-07-26 |
JP6801452B2 (ja) | 2020-12-16 |
TWI688825B (zh) | 2020-03-21 |
US10584205B2 (en) | 2020-03-10 |
JPWO2016152794A1 (ja) | 2018-01-11 |
CN107407877B (zh) | 2021-01-01 |
TW201642028A (zh) | 2016-12-01 |
KR20170131489A (ko) | 2017-11-29 |
WO2016152794A1 (ja) | 2016-09-29 |
US20180066107A1 (en) | 2018-03-08 |
CN107407877A (zh) | 2017-11-28 |
SG11201707712TA (en) | 2017-10-30 |
EP3276415A1 (en) | 2018-01-31 |
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Legal Events
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