EP3068576A1 - Formulations de flux - Google Patents

Formulations de flux

Info

Publication number
EP3068576A1
EP3068576A1 EP13897342.5A EP13897342A EP3068576A1 EP 3068576 A1 EP3068576 A1 EP 3068576A1 EP 13897342 A EP13897342 A EP 13897342A EP 3068576 A1 EP3068576 A1 EP 3068576A1
Authority
EP
European Patent Office
Prior art keywords
flux
component
rosin
weight
certain examples
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP13897342.5A
Other languages
German (de)
English (en)
Other versions
EP3068576A4 (fr
Inventor
Narahari Pujari
Sanyogita Arora
Siuli Sarkar
Anna Lifton
Rahul RAUT
Bawa Singh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alpha Assembly Solutions Inc
Original Assignee
Alpha Metals Ltd
Alpha Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Metals Ltd, Alpha Metals Inc filed Critical Alpha Metals Ltd
Publication of EP3068576A1 publication Critical patent/EP3068576A1/fr
Publication of EP3068576A4 publication Critical patent/EP3068576A4/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste

Definitions

  • Embodiments of the technology disclosed herein relate generally to fluxes. More particularly, embodiments of the technology disclosed herein relate to fluxes that remain pliable and tack- free after coating and drying.
  • soldering processes It is the nature of soldering processes that a flux is necessary for the solder material to wet to a substrate.
  • the flux reacts with and thereby removes oxide surface layers on both the solder and the substrates. This ensures that clean metals are presented during reflow so wetting and associated intermetallic formation can proceed.
  • Fluxes are generally provided as liquids that can be painted, sprayed or otherwise dispensed onto the metallic surfaces prior to reflow. Also, such liquid fluxes can be used to pre- coat metal surfaces. In this case, the flux is deposited onto the metal and dried prior to use. This approach is often adopted for pre- forms.
  • a flux comprising a first component and an effective amount of a second component to provide pliability after deposition.
  • the flux may also be adherent.
  • the flux may comprise a third component that is effective to reduce, deter or prevent formation of unwanted chemical species on a surface of the component to which the flux is to be added.
  • the flux may comprise a fourth component that is effective to soften or render the flux flexible prior to or after deposition on a desired surface. Illustrative compounds for the first, second, third and fourth components are discussed in more detail below.
  • the flux may contain other components to provide a desired physical or chemical property to the flux.
  • the amounts of the first, second, third or fourth component may be selected to control the tackiness of the flux. In certain examples, the amount of the third component or the fourth component may be selected to induce a desired degree of curing for tack- free and transparent flux.
  • a rosin flux comprising an activated rosin and an effective amount of a polymeric component to render the rosin flux pliable after deposition.
  • the polymeric component may be mixed or combined with a resin or a rosin to provide the flux.
  • an activator, softener, plasticizer or the like may also be added to the activated rosin component, and optionally the resin or rosin, to provide the flux.
  • reactive diluent may be added to provide a thermally or UV curable resilient flux formulation.
  • a part pre-coated with a flux may comprise an effective amount of an activated rosin and polymeric components to render the flux highly active and pliable after deposition on a surface.
  • the flux coated on the part comprises a first component and an effective amount of a second component to provide a pliable flux after the flux has been coated and dried.
  • the flux coated on the part may also comprise additional components to provide a desired physical or chemical property to the flux.
  • a kit comprising a flux and instructions for using the flux.
  • the flux of the kit comprises an effective amount of an activated rosin adduct and polymeric components to render the flux pliable and active after deposition on a surface.
  • the flux comprises a first component and an effective amount of a second component to provide a pliable flux after the flux has been coated and dried.
  • the kit may also include one or more parts to be coated with the flux.
  • the kit may also include a solder for use with the flux.
  • an electrical component comprising an effective amount of a pliable flux deposited on the electrical component.
  • the flux comprises an effective amount of an activated rosin adduct and polymeric components to render the flux pliable after deposition on a surface of the electrical component.
  • the flux comprises a first component and a second component present in an effective amount to provide an active and pliable flux after the flux has been coated and dried.
  • the flux deposited on the electrical component may also comprise additional components to provide a desired physical or chemical property to the flux.
  • a method of producing a pre- form comprises depositing a pliable flux on a surface of a part.
  • the method may also include drying the deposited flux.
  • hot melting and/or solvent drying processes may be used.
  • the method may further include packaging the pre- form. Additional steps that may be used in producing a preform are discussed in more detail below.
  • a method of facilitating production of a flux coated part comprising providing a pliable flux and instructions for using the pliable flux with a part, such as an electrical or mechanical component, is provided.
  • the method may further include providing a solder for use with the pliable flux and a part, such as an electrical or mechanical component.
  • a flux comprising a resin, an effective amount of activated rosin adduct and oligomeric or polymeric components to provide pliability to the flux after deposition of the flux, an activator, and a surface active agent is disclosed.
  • Illustrative resins, oligomeric/polymeric components, activators and surface active agent are described herein.
  • a flux comprising an activated rosin adduct, an effective amount of a polymeric component to provide pliability to the flux after deposition of the flux, an activator, and a plasticizer is provided.
  • a polymeric component to provide pliability to the flux after deposition of the flux
  • an activator to provide pliability to the flux after deposition of the flux
  • a plasticizer to provide pliability to the flux after deposition of the flux.
  • Illustrative rosins, polymeric components, activators and plasticizers are disclosed herein.
  • a flux comprising a resin, an effective amount of an activated rosin adduct and reactive diluent to provide pliability to the flux after deposition of the flux, an activator and a plasticizer is disclosed.
  • Illustrative rosin adducts, reactive diluent, activators and plasticizers are described herein.
  • a flux comprising an activated rosin adduct, rosin ester, an effective amount of a polymeric component, an activator, and surface active agent.
  • Illustrative activated rosins adduct, rosin ester, polymeric component, activators and surface active agent are described herein.
  • a flux comprising an activated resin, an oligomeric component, an activator, and an effective amount of a plasticizer to render the flux soft prior to or after deposition on the surface is disclosed.
  • Illustrative rosins, polymeric components, activators and plasticizers are described herein.
  • a flux comprising an activated resin, a polymeric component, an activator, and an effective amount of a plasticizer to render the flux soft prior to or after deposition on a surface.
  • a plasticizer to render the flux soft prior to or after deposition on a surface.
  • a flux comprising a resin, a polymeric
  • an adherent flux comprising a resin, a polymeric component, wherein the resin and the polymeric component are each present in an effective amount to provide an adherent flux, an activator, and a plasticizer is disclosed.
  • Illustrative resins, polymeric components, activators and plasticizers are disclosed herein.
  • an adherent flux comprising a rosin, a polymeric component, wherein the rosin and the polymeric component are each present in an effective amount to provide an adherent flux, an activator, and a plasticizer.
  • rosins, polymeric components, activators and plasticizers are disclosed herein.
  • a flux comprising an activated rosin adduct, an oligomeric or polymeric component, an activator, and an effective amount of a plasticizer to provide tack to the tacky flux.
  • activated rosins, polymeric components, activators and plasticizers are disclosed herein.
  • a thermally curable flux comprising an activated rosin adduct, a reactive diluent, to provide thermally curable flux, an effective amount of an activator, and a plasticizer is disclosed.
  • activated rosin adducts, reactive diluents, activators and plasticizers are described herein.
  • a thermally curable flux comprising an activated rosin adduct, a polymeric component, a reactive diluent, to provide thermally curable flux, an effective amount of an activator, and a surface active agent is disclosed.
  • activated rosin adducts, polymeric components, reactive diluents, activators and surface active agent are described herein.
  • a photosensitive flux comprising an activated rosin adduct, a reactive diluent, an effective amount of an activator and photosensitive component to provide photosensitive flux.
  • Illustrative rosins adducts, reactive diluents, activators, photosensitive components and plasticizers are disclosed herein.
  • a photosensitive flux comprising an activated rosin adduct, a polymeric component, a reactive diluent, an effective amount of an activator and photosensitive component to provide photosensitivity and plasticizer.
  • Illustrative rosins adducts, polymeric component, reactive diluents, activators, photosensitive components and plasticizers are disclosed herein.
  • the fluxes disclosed herein may be used in a soldering operation to assemble an electrical component, such as a printed circuit board, a mechanical component, such as copper pipe used in plumbing applications or other components that may need to be joined.
  • the flux may be used in the assembly of semiconductor components, photovoltaic systems such as solar panels and the like.
  • embodiments of the fluxes disclosed herein may be pliable and adhere to a desired surface.
  • the pliable flux may be tacky, whereas in other examples the pliable flux may be non-tacky. Tackiness of the flux may be assessed, for example, using IPC-TM-650 Method 2.4.44 dated March 1998.
  • the degree to which the flux is tacky may be controlled be selecting suitable amounts of the components in the flux. More particularly, the degree of tackiness of the flux may advantageously be controlled based on the amounts of the third and fourth components, as discussed in more detail below.
  • an adhesive may be used to retain the flux on a desired surface.
  • a flux comprising a first component and an effective amount of a second component to provide a pliable flux after the flux has been coated and dried is provided.
  • pliable or “pliability” refers to a flux that can bend (or be bent), deform or the like easily without breaking or cracking.
  • Pliability also refers to the flexibility and adherence of a flux layer deposited on a base material. Pliability may be evaluated using similar methods to those of adherence, e.g., ASTM 1676-03 dated 2003.
  • the first component may be a resin.
  • the resin may be acidic, neutral or basic.
  • the resin may be a naturally occurring resin or may be a synthetic resin. Combinations of natural and synthetic resins may also be used.
  • Illustrative resins for use in the fluxes disclosed herein include, but are not limited to, phenolic resins, thermosetting resins, thermoplastic resins and the like. Examples of other resins that may be used include, but are not limited to, TACOLYN 1065 resin dispersion, TACOLYN 1070 resin and FORAL 85-55WKX resin (each of which is also available from Hercules, Inc.,
  • Shellac naturally occurring gum lac
  • synthetic and naturally occurring waxes may also be used alone or in combination with other materials. Additional suitable resins will be readily selected by the person of ordinary skill in the art, given the benefit of this disclosure.
  • the first component of the flux may be a rosin.
  • rosins are brittle and friable.
  • the overall flux formulation is pliable when dried.
  • the rosin may be acidic, neutral or basic.
  • the rosin may be a naturally occurring resin or may be a synthetic rosin.
  • rosin may be activated by forming high softening point adducts. Combinations of natural and synthetic rosins may also be used.
  • Illustrative rosins include, but are not limited to, an unmodified rosin such as, for example, a gum rosin, a tall oil rosin, or a wood rosin, or a modified or altered rosin such as a hydrogenated rosin, a disproportionated rosin, a rosin ester, or rosin-modified resin. Combinations of modified and unmodified rosins may also be used.
  • Other suitable rosins include, for example, acid or anhydride adducts of rosins. Activated rosins may provide additional activity to the flux.
  • the second component of the fluxes disclosed herein is typically selected to provide a flux that is pliable and/or highly adhered after drying, e.g., passes ASTM Tape Test D3359-02 dated 2002.
  • the second component may be selected from oligomers, polymers, resins, amides, amines, reactive diluents and mixtures thereof.
  • an oligomer or polymer that exhibits an acceptable high level of post-coating ductility may be used in the base carrier.
  • the polymer may be selected from any one or more of the following: polyamide resins (e.g., Versamid products supplied by Cognis Corp.
  • polymerized rosin and oligomers may be selected from any one or more of the following: suppliers: Eastman company, (Dymerex and Poly-Pale series products), Arakawa Chemicals Inc., Hercules Inc., etc.
  • a mixture of a polyamide, an acrylic, an ethylene acrylic co-polymer and higher homologues thereof may be used as the second component. Additional suitable materials for use as the second component of the fluxes disclosed herein will be readily selected by the person of ordinary skill in the art, given the benefit of this disclosure.
  • the exact weight percentage of the first component and the second component may be variable provided that a pliable flux is produced. It may be desirable to alter the amount of the first component based on the amount and properties of the second component used in the flux formulation. Similarly, the amount of the second component may be altered based on the amount of first component that is present. In certain examples, about 5 weight percent to about 99 weight percent of the first component, more particularly about 15 weight percent to about 95 weight percent, of the first component is present in the flux formulation. As discussed herein, the second component of the flux formulation is present in an effective amount to provide a pliable flux.
  • the amount of the second component may vary from about 1 weight percent to about 80 weight percent, more particularly about 5 weight percent to about 50 weight percent, e.g., about 15 weight percent to about 35 weight percent.
  • the first component is typically selected in a suitable amount to provide adherence, pliability, and/or flux activity.
  • the amount of the second component may be greater or less than these illustrative ranges depending on the properties of the other components present in the flux.
  • the flux may comprise a third component that is effective to reduce, deter or prevent formation of unwanted chemical species on a surface of the component to which the flux is to be added.
  • the third component may be, or may include, an antioxidant or an activator.
  • the antioxidant is present in an effective amount to reduce, deter or prevent formation of oxides on the surface where the flux is deposited.
  • Illustrative antioxidants include, but are not limited to, amines, phenols, condensation products of aldehydes and amines, chromates, nitrites,
  • the activator may be one or more compounds that fall into the general class of compounds that are carboxylic acids, sulfonic acids, phosphonic acids, phosphate esters, amino acids, alkanolamines, halide bearing compounds, and combinations thereof.
  • Illustrative activators suitable for use in the fluxes disclosed herein include, but are not limited to, carboxylic acids (adipic, fumaric, maleic, malonic, glutaric succinic acid, para-tertiary-butylbenzoic acid, trimellitic acid, trimesic acid, hemimellitic acid, etc.) ionic halides, amine hydrohalides (dimethylamine hydrohalide, cyclohexylamine
  • ammonium salts such as fluoroborate and bromide
  • surfactants lipids, fats, waxes and the like.
  • monocarboxylic acids, dicarboxylic acids or polycarboxylic acids may be used as an activator.
  • suitable activators include, but are not limited to, ketocarboxylic acids, levulinic acid, sulfonic acids, benzenesulfonic acid, toluenesulfonic acid, phosphonic acids, phosphonoacetic acid, l-hydroxyethylidene-l,l-diphosphonic acid and phenyl phosphonic acid.
  • Esters such as phosphate esters, monophosphate esters, diphosphate esters based on aliphatic alcohols, aliphatic ethoxylated alcohols, aromatic alcohols or aromatic ethoxylated alcohols may also be used as activators.
  • one or more amino acids may be used as an activator.
  • activators include, but are not limited to, glycine, aminobutyric acid, aminovaleric acid, alkanolamines, triisopropanolamine, triethanolamine, non-ionic halide compounds or organic halides such as trans-2,3-dibromo-2-butene-l,4-diol, meso-2,3-dibromosuccinic acid, 5-bromosalicylic acid, 3,5-dibromosalicylic acid, water-soluble mono and dibromo compounds, and halide free water soluble compounds. Additional compounds suitable for use as activators will be readily selected by the person of ordinary skill in the art, given the benefit of this disclosure.
  • the flux may include one or more activators which may take the form of a supporting activator package.
  • a supporting activator package includes one or more activators appropriate to the solder material to be used with the flux.
  • the activator package may also include a substrate to be soldered and the electrochemical/corrosion requirements of the application being served.
  • the amount of third component used in the flux may vary.
  • the third component is present from about 0 weight percent to about 30 weight percent, more particularly about 0 weight percent to about 20 weight percent, e.g., about 0 weight percent to about 10 weight percent, based on the total weight of the flux.
  • the amount of the third component is typically selected to provide for pliability and activity.
  • a fourth component may be, or may include, one or more plasticizers.
  • the exact plasticizer used depends, at least in part, on the compounds selected for the first, second and third components.
  • a suitable plasticizer may be selected such that the overall flux is soft or rendered softer than a flux without the plasticizer.
  • Illustrative general classes of plasticizers suitable for use in the fluxes disclosed herein include, but are not limited to, phthalate-based plasticizers, adipate-based plasticizers, trimellitates, maleates, sebacates, benzoates, epoxidized vegetable oils, sulfonamides, organophosphates, glycols, polyethers and various ethylene oxide-propylene oxide (EO/PO) copolymers.
  • Illustrative specific plasticizers suitable for use in the fluxes disclosed herein include, but are not limited to, tetrahydrofurfurylalcohol, bis(2-ethylhexyl) phthalate (DEHP), diisononyl phthalate (DINP), bis(n-butyl)phthalate (DnBP, DBP), butyl benzyl phthalate (BBzP), diisodecyl phthalate (DIDP), di-n-octyl phthalate (DOP or DnOP), diethyl phthalate (DEP), diisobutyl phthalate (DIBP), di-n-hexyl phthalate, dimethyl adipate (DM AD), monomethyl adipate (MMAD), dioctyl adipate (DO A), trimethyl trimellitate (TMTM), tri-(2-ethylhexyl) trimellitate (TEHTM-MG), tri-(n-octy
  • ATBC trioctyl citrate
  • TOC trioctyl citrate
  • ATOC acetyl trioctyl citrate
  • THC trihexyl citrate
  • BTHC butyryl trihexyl citrate
  • TMC trimethyl citrate
  • NG nitroglycerine
  • BTTN butanetriol trinitrate
  • MEN metriol trinitrate
  • DEGN diethylene glycol dinitrate
  • BDNPF bis(2,2-dinitropropyl)formal
  • BDNPA bis(2,2- dinitropropyl)acetal
  • TNEN 2,2,2-Trinitroethyl 2-nitroxyethyl ether
  • TNEN 2,2,2-Trinitroethyl 2-nitroxyethyl ether
  • reactive diluents may be used along with either rosin based or rosin free activators. Such formulations may be thermally cured to achieve the pliable flux.
  • reactive diluents may include but not restricted to: 1,6-hexanediol diglycidyl ether, allyl glycidyl ether, normal-butylglycidyl ether, polypropyleneglycol diglycidyl ether, tridecyl glycidyl ether, Bisphenol-A diglycidyl ether based resin, Bisphenol-A diglycidyl ether based resin, methylene dianiline tetraglycidyl ether, tris hydroxyphenyl methane triglycidyl ether, 1,4- butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, polypropyleneglycol diglycidyl ether, trimethylolpropane triglycidyl ether, catro oil glycidyl ester etc.
  • Additioanl activators include: Malkyd resin, maleated rosin, amine derivatized rosin, Methylene dianiline activator, triethylenetetramine, ancamineTM, Methylene dianiline adduct, organic anhydride activator, Norbornene type anhydride activator, Diamino diphenyl sulfone activator, BF3 - amine accelerator, polyamines, polyamides, imidazole based activator etc.
  • a pliable flux coating may be achieved with a photosensitive component along with reactive diluents.
  • photosensitizers may include but are not limited to: benzophenone, acetophenone, benzin and benzoin compounds, thixanthones, quinone derivatives, Irgacure 184, Irgacure 127, Irgacure 1700, Irgacure 2559, Ciba darocure ® 1173, and chemcure series photoinitiators.
  • Formulations may vary and photosensitive components are preferably present in an effective amount to achieve a cured pliable flux. Illustrative amounts include, but are not limited to, 0 weight percent to about 15 weight percent, more particularly, about 0 weight percent to about 10 weight percent, e.g., about 0 weight percent to about 5 weight percent.
  • the exact amount of fourth component used in the flux formulations may vary and preferably is present in an effective amount to soften the flux as compared to a flux that does not include the fourth component.
  • Illustrative amounts include, but are not limited to, 0 weight percent to about 15 weight percent, more particularly, about 0 weight percent to about 10 weight percent, e.g., about 0 weight percent to about 5 weight percent.
  • the amount of the fourth component is typically selected to provide for pliability.
  • the flux may contain other components to provide a desired physical or chemical property to the flux.
  • the flux may include a temperature indicator to provide visual feedback that the flux has exceeded a certain temperature.
  • temperature indicators include, but are not limited to, Irgalite bordeaux (Ciba Geigy (Tarrytown, NY)), Acid Red (Sigma- Aldrich (St. Louis, MO)), and Irgalite Red NBSP (Ciba Geigy).
  • the flux may include a dye or colorant to impart a desired color to the flux.
  • the flux may be colored coded to provide indicia (e.g., the source of the flux is Fry's Metals), the composition of the flux (e.g., leaded flux, lead free flux, halide free flux, etc.), or to provide an indicator of what type of solder should be used with the flux.
  • the flux may be color coded for a particular application. For example, flux suitable for use in printed circuit board applications may be blue, flux suitable for use in copper plumbing applications may be red, and flux suitable for brazing applications may be yellow.
  • pliable fluxes may all be color coded with a first color to distinguish such fluxes from conventional non-pliable fluxes. It will be within the ability of the person of ordinary skill in the art, given the benefit of this disclosure, to select suitable colorants for use in the fluxes disclosed herein.
  • the colorant may be UV-sensitive or absorb UV light such that it may be observed by exposing the colorant to a UV light source.
  • Illustrative UV-sensitive colorants include, but are not limited to, Blankophor SOL (Bayer), Optiblanc SPL-10 (3 V Inc.) and Tinopal SFP (Ciba).
  • Blankophor SOL Blankophor SOL (Bayer)
  • Optiblanc SPL-10 3 V Inc.
  • Tinopal SFP Ciba
  • the exact amount of UV-sensitive colorant used may vary, and illustrative amounts include, but are not limited to, about 0.0005% by weight to about 1% by weight.
  • the flux may also contain other agents to impart a desired property to the flux.
  • viscosity modifiers for example, surfactants, thixotropic agents and the like may be added to the flux to provide a desired consistency or property to facilitate easier handling or deposition of the flux on a desired surface.
  • Illustrative viscosity modifiers include, but are not limited to, glycerol, glycols, stabilite, alkyl glycidyl ethers, ethyl cellulose, hydroxypropyl cellulose, butyl methacrylate, and feldspar.
  • the viscosity modifier may be a polymer that has a molecular weight of at least about 25,000 g/mol, more particularly, at least about 50,000 g/mol.
  • Illustrative thixotropic agents include, but are not limited to, clays, gels, sols, waxes, polyamides, oxidized poly ethyenes, polyamide/polyethylene mixtures, and the like.
  • surface wetting may be promoted by the addition of one or more anionic surfactants or other surface-active agents.
  • suitable surface-active agents include fluorinated surfactants, siloxane or silane modified surface active agents as well as nonionic, cationic and amphoteric surfactants.
  • the surfactant is generally present in a concentration of less than 2.0%, by weight, of the flux.
  • the surfactant concentration may be not more than 1.0%, by weight, of the flux.
  • the concentration of the surfactant may be selected to enable the flux to wet thoroughly the surfaces to be soldered, while not contributing substantially to the level of flux residues that will be left behind after soldering.
  • Nonionic, cationic and amphoteric surfactants can also be used.
  • Illustrative surfactants include, but are not limited to, Zonyl FSN
  • Fluorosurfactant (described as a perfluoroalkyl ethoxylate) available from E. I. DuPont de Nemours & Co., Inc., Fluorad FC-430 (described as a fluoroaliphatic polymeric ester) available from the Industrial Chemical Products Division of 3M, and ATSURF fluoro surfactants available from Imperial Chemical Industries.
  • Other illustrative surfactants include, but are not limited to, alkoxysilanes (polyalkyleneoxide modified heptamethyltrisiloxane), ethers
  • polyoxypolyethyleneglycol methyl ether, polyoxyethylenecetyl ether polydimethylsiloxane, polyether modified polydimethylsiloxane, polyester modified polydimethylsiloxane, hexadimethyl silane, hexadimethyldisilazane,.
  • polyoxyethylenesorbitan monooleate water- soluble ethylene oxide adducts of an ethylene glycol base, water-soluble ethylene oxide- propylene oxide adducts of a propylene glycol base, a polycarboxylic acid (a dicarboxylic acid having at least 3 carbon atoms), a dimenzed carboxylic acid, a polymerized carboxylic acid, and the like.
  • the flux may also include minor amounts of other components, such as biocides, fillers, dyes, foaming agents, de-foaming agents and stabilizers.
  • other components such as biocides, fillers, dyes, foaming agents, de-foaming agents and stabilizers.
  • the exact amount of these other agents used may vary and is typically less than about 1% to 2% by weight of the flux.
  • the flux may take various forms including a liquid, a paste, a solid or may take other forms.
  • the flux may be packaged such that the flux may be deposited by brushing, coating, spraying, spray coating, dipping, rolling or other methods.
  • the flux may be packaged in a pen type device such that application of the flux may be accomplished by contacting the pen tip with a surface.
  • the pen type device may include a heated tip such that the flux can be melted prior to contacting a surface.
  • the flux may be loaded into a device similar to a glue gun, and after heating, may be deposited on a desired surface. It will be within the ability of the person or ordinary skill in the art, given the benefit of this disclosure, to select suitable methods for depositing the fluxes disclosed herein.
  • the fluxes disclosed herein may be used with many different components where two or more joints are connected. Illustrative applications include plumbing applications, brazing applications, and soldering applications. In a particular application, the fluxes may be used with electrical components and electrical conductors including, but not limited to, photovoltaic wires, photovoltaic ribbons, and interconnects of printed circuit boards.
  • the flux may be used with components that include two or more materials.
  • the flux may be used with a wire that has been co-extruded and includes a first material on the inside and a second material on the outside.
  • the fluxes may be used with alloys, laminates, composite materials and other components that include two or more materials.
  • the fluxes disclosed herein may also be used at joints in sheet-metal objects such as food cans, roof flashing, drain gutters and automobile radiators.
  • the fluxes disclosed herein may be used in a soldering operation to assemble jewelry and small mechanical parts.
  • the fluxes may be used in soldering to join lead came and copper foil in stained glass work. Additional applications are discussed in more detail below.
  • the fluxes disclosed herein may be used as a protective coating.
  • a mechanical or electrical component may be coated with a flux to prevent oxidation of the surface of the component.
  • the flux may be removed prior to use of the component or may be left on the component in the case where the flux does not interfere with the intended function of the component.
  • the fluxes disclosed herein may be deposited in layers.
  • layers of two or more different types of flux may be deposited.
  • the exact amount of each layer may vary from about 0.01% by weight to about 10% by weight based on the overall weight of the part the flux is deposited on, more particularly about 0.1% by weight to about 5% by weight.
  • the total amount of the layers of flux may vary from about 0.2% by weight to about 4% by weight, though the amount selected may be more or less to provide a thinner or thicker total thickness depending on the intended application of the flux.
  • the flux layer may be transparent and may be used, for example, as a protective coating on a surface. It will be recognized by the person of ordinary skill in the art, given the benefit of this disclosure, that more or less flux may be required depending on the nature of the surfaces to be coupled or joined. For example, where the material is minimally susceptible or not susceptible to oxidation, a molecular layer or several molecular layers of flux may be deposited on the surface, e.g., in a vacuum or the like.
  • a flux film is provided.
  • the flux film may be produced by depositing flux to a desired thickness on a backing or a carrier. After drying, the film may be peeled or removed from the backing or carrier and deposited onto a desired surface.
  • the film may be laminated to a surface to form a composite.
  • the flux film may be laminated to a printed circuit board.
  • the flux film may be photoimaged to create a flux pattern.
  • An electrical component may be placed at a desired area on the patterned flux and then soldered.
  • the fluxes disclosed herein may be used with many different types of electrical and mechanical components.
  • leads of electrical components may be passed through holes in the board and placed in contact with conductive contacts on the other side of the board, and/or lead less chip components are mounted on the bottom side of the board with an adhesive.
  • the pliable flux may then be applied to the board by spray or wave methods.
  • the flux may be applied so as to coat the surface of the board, to remove oxides and/or prevent cleaned metallic surfaces from re-oxidation.
  • the fluid component of the flux may be evaporated or otherwise removed, and during soldering, the first component and optionally the second component may change phase of properties, e.g., melt or change viscosity.
  • the rosin or resin may form a hard, non- tacky, hydrophobic resinous layer.
  • Such thermal processing may provide high surface insulation resistance, which promotes the reliability of electrically conductive solder connections.
  • the fluxes disclosed herein may be used with drawn wire.
  • Drawn wire may be produced using conventional wire drawing methods. For example, a metal may be heated and pulled or pushed through a die. The pulled wire may be wound around a drum. In continuous-wire drawing configurations, a series of dies through which the wire passes in a continuous manner may be used. Problems of feeding between each die is solved by using a block between each die, so that as the wire issues it coils around the block and is aided to the next die. The speeds of the blocks may be increased successively, so that the elongation due to drawing is taken up and any slip is taken into account.
  • the drawn wire may be covered with a coating or an insulator, such as rubber, plastic or the like.
  • the drawn wire may be solid or may be stranded. A selected portion or surface of the wire may be pre-coated with one or more of the fluxes disclosed herein. Alternatively, the fluxes disclosed herein may be selected for use with a drawn wire by an end-user. In some examples, the drawn wire may be pre-coated and bent to a desired shape.
  • flux combined with additional materials to form a mixture prior to or after deposition on a selected surface.
  • additional materials include, but are not limited to, metals and metal alloys, ceramics, powders, fillers, particles, binders, solder alloys and the like.
  • the additional materials may be mixed into the flux and the mixture may then be deposited on a surface.
  • the flux coating may be deposited and then impregnated with such additional materials.
  • the flux may be loaded into a carrier which may be used to facilitate transfer of the flux to a desired surface.
  • the flux may be loaded into a carrier in the form of strips, e.g. similar to tape, and the entire strip may be wrapped around a joint prior to soldering.
  • carrier vehicles include, but are not limited to, a scrim, a web, a mesh, a polymer network and the like.
  • the fluxes disclosed herein may be used with solder preforms.
  • the solder preforms may take various shapes including, but not limited to, washers, sleeves, collars, and rectangles. Additional suitable shapes and configurations for solder preforms will be readily selected by the person of ordinary skill in the art, given the benefit of this disclosure.
  • the fluxes disclosed herein may be used to join two or more metal pipes.
  • copper pipes commonly used in delivering potable water may be joined using the fluxes disclosed herein along with a suitable solder, e.g., a lead-free solder such as a silver-based solder.
  • the copper pipe may be pre-coated on a selected portion, e.g., at each end, so that flux does not need to be added by an end-user prior to soldering.
  • the entire outside surface of the copper pipe may be pre-coated with a flux so that if the pipe is cut at a desired location, the end of the pipe to be soldered still contains flux.
  • the flux may be coated on the pipe by an end-user prior to soldering. It will be within the ability of the person of ordinary skill in the art, given the benefit of this disclosure, to use the fluxes disclosed herein to join metal pipes.
  • the pliable nature of the fluxes disclosed herein renders them useful with parts having non-circular cross sections.
  • most wire is cylindrical in form and has a circular cross-section.
  • the circular cross-section lacks
  • parts having rectangular, triangular or other non-circular cross section may have sharp angles.
  • Traditional fluxes have not proved useful when used on parts having a non-circular cross-section due to the brittle nature of the flux resulting in flaking off and cracking.
  • the pliable nature of the fluxes disclosed herein allows them to be coated and used with parts having a non-circular cross section without any substantial flaking off or cracking of the flux at the corners of the part.
  • it may be possible to increase the amount of flux used as the surface area of the non-circular component may be larger as compared to the surface area of a circular component.
  • the flux may be coated on the entire part or may be coated on a portion of the part.
  • the fluxes may be used as a binder for solder powders that may subsequently be pressed to form a final shape.
  • the final shape would be used as a preform of solder. This is akin to powder metallurgy or ceramic pressing processes used in making complex net shapes.
  • the fluxes disclosed herein may be used to coat powder. This result may be achieved by variants of physical vapor deposition such as a fluidized bed, as well as immersion techniques. Such powder is ideally suited for enhanced solder paste formulations. Such powder may also be impregnated with other materials, such as those materials commonly used in powder metallurgy. It will be within the ability of the person of ordinary skill in the art, given the benefit of this disclosure, to select suitable techniques to coat powder using the fluxes disclosed herein.
  • the fluxes disclosed herein may take various shapes.
  • the fluxes may be used in the form of spheres, e.g., as a protective coating for spheres of a ball grid array.
  • the fluxes may be used as thin films having a constant or variable thickness at different portions of the thin film.
  • the fluxes may be used in the form of strips or pieces that can be wrapped around a joint prior to soldering. Such strips may optionally include an adhesive or the like to retain, at least temporarily, the solder strip in place.
  • the flux may take a suitable form to prevent or reduce oxidation by FRET corrosion, e.g., corrosion from two surfaces rubbing together.
  • the flux may also be used in the production of numerous different electrical components including, but not limited to, televisions, cellular phones, printers, automotive electronics, aeronautic electronics, medical electronics,
  • photovoltaic cells military electronics, electrical conductors for heaters (rear window defrosters), flexible circuits and other electrical devices where it may be desirable to connect two or more components.
  • the fluxes disclosed herein may be prepared using many different suitable methods.
  • the first component and the second component are combined and melted.
  • the second component may be melted prior to addition of the first component.
  • the third and fourth component, and optionally additional components may then be added to the mixture of the first and second components.
  • the various components may be added to a solvent, solvent mixture or solvent system to disperse or dissolve the various components. Agitation, shaking, blending, vortexing, heating and the like may be used to increase the rate at which the various components are mixed and/or dissolved in a selected solvent, solvent mixture or cosolvent system.
  • a method of producing flux films comprises disposing or otherwise depositing a flux on a substrate or a mold. Subsequent to deposition, the film of flux may be removed from the substrate to provide a stand-alone flux film.
  • films of metals covered with flux may be produced.
  • the metal films may be deposited using suitable techniques such as, for example, vapor deposition techniques.
  • wires of flux containing metallic powders and alloys may be produced.
  • the metallic powders and alloys may be mixed with the flux prior to deposition or may be sprayed or co-sprayed by a stream to mix the flux and metallic powders and alloys in situ. Suitable techniques for producing flux films, either alone or with metals or alloys will be recognized by the person of ordinary skill in the art, given the benefit of this disclosure.
  • the flux films may be photoimaged. In some examples, flux films including one or more metal fillers may be photoimaged. In certain examples, a flux film comprising a variable amount of tackiness is provided. In some examples, only a portion of the flux film is tacky and adherent such that the adherent portion may be placed or stuck to a desired surface. In other examples, a flux film where a single side of the flux film is tacky is provided. In some examples, both sides of a flux film may be tacky. In certain examples, at least some portion, but not all, of each side of a flux film may be tacky. In some examples, solder performs that are tacky on at least some portion or all of one side but not tacky on the other side may be produced using the fluxes disclosed herein.
  • embodiments of the fluxes disclosed herein may be mixed with one or more binders, e.g., powders, fillers and the like.
  • a binder may be mixed with the flux in an effective amount such that when the flux is compacted under pressure, the binder is effective to bind the flux.
  • the binder may also be selected to function as a release agent, e.g., as a mold release to reduce or prevent sticking to a die.
  • Suitable binders include, but are not limited to, polyvinyl alcohols, poly( vinyl pyrrolidone), celluloses (methyl cellulose, hydroxypropyl methyl cellulose and other similar species), fatty acids and their derivatives (metal salts and polymers of fatty acids), and natural and synthetic waxes.
  • the components of the flux may be configured to impart a desired solubility in a selected solvent.
  • the flux formulation disclosed herein may be soluble in alcohols such as isopropanol or in organic solvents such as methylene chloride, chloroform, ethyl acetate, hexane or mixtures thereof. Additionally, hydrophobic solvents like diethyl ether, toluene, isopar or mixtures thereof may be used. A solution of such a flux at various solids contents can be used to dip, spray, brush, vapor or otherwise coat a solder material. Embodiments of the fluxes disclosed herein provide high adherence.
  • the flux coating may be applied to pre- form precursor material, e.g., strip material can be pre-coated before pre- forms are stamped. For many pre- form geometries, this result is an enormous benefit in coated pre- form production.
  • the flux is desirably insoluble in other cleaning solvents used in the pre- form production process.
  • the flux may be insoluble in selected solvents to facilitate suspension but not dissolution of the flux in such selected solvents.
  • Versamid 940 and Versamid 750 are commercially available from
  • a pliable, non-tacky flux was prepared by combining rosin anhydride adduct (maleated rosin), polymerized rosin (Dymerex), Arakawa KR-604 (or Arakawa KR-612), adipic acid and suberic acid.
  • the process used to prepare the flux was as follows: The amount or resin and/or rosin was weighed and added to a clean mixing tank equipped with a heating jacket. The mixture was heated slowly to 130-140°C to avoid overheating the components. When about half of the resin melted, mixing was initiated. The resins were melted completely at 130-140°C. The desired amount of organic acid was weighed out and added to the mixing tank until all of the solids were dissolved.
  • plasticizer when present was weighed out and added to the mixing tank, and the mixture was mixed for about 10 minutes. The resulting mixture was transferred to a storage container or used to coat metal ribbon or wire. Solidified flux may be re-melted prior to use. The solid flux may also be dissolved in a suitable solvent such that the flux may be sprayed to coat pre- forms, solder powder, solder foil (to stamp preforms), composite metal ribbon, solid solder wire, etc. Similarly, flux may be prepared by dissolving pre-weighed ingredients in the solvent or solvent mixtures at room temperature. Flux to solvent ratio may be tuned as per the desired application.
  • the flux in this example included 20% by weight rosin anhydride adduct, 35% by weight polymerized rosin (Dymerex), 20% by weight Arakawa KE-604, 20% by weight adipic acid and 5% by weight suberic acid. Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good as determined by passing of the bent wire test. The flux was almost tack-free as characterized by IPC-TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining rosin anhydride, polymerized rosin (Dymerex), Foral AX, adipic acid and suberic acid.
  • the flux included 55% by weight polymerized rosin (Dymerex), 10% by weight rosin anhydride adduct and Foral AX each, 20% by weight adipic acid and 5% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining rosin ester, polymerized rosin (Dymerex), Arakawa KE 604, adipic acid, and suberic acid.
  • the flux included 20% by weight rosin ester, 35% by weight Dymerex, 20 wt% by weight Arakawa KE604, 20% by weight adipic acid and 5% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining rosin anhydride, partially dimerized rosin (Poly-Pale), Foral AX, adipic acid, and suberic acid.
  • the flux included 10% by weight rosin anhydride, 55% by weight Poly-Pale, 10% by weight Foral AX, 20% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was non-tacky as characterized by IPC-TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining rosin anhydride, partially dimerized rosin (Poly-Pale), versamid 940, adipic acid, and suberic acid.
  • the flux included 20% by weight rosin anhydride, 50% by weight polymerized rosin (Dymerex), 5% by weight versamid, 20 wt% by weight adipic acid and 5% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining rosin anhydride, polymerized rosin (Dymerex), Foral AX E, Versamid 940, adipic acid, and suberic acid.
  • the flux included 20% by weight rosin anhydride, 30% by weight polymerized rosin (Dymerex), 10% by weight Foral AX E, 15% by weight Versamid, 20% by weight adipic acid and 5% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining Versamid 940, polymerized rosin (Dymerex), adipic acid, and suberic acid.
  • the flux included 53% by weight Versamid 940, 22% by weight polymerized rosin (Dymerex), 20% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was non-tacky as characterized by IPC-TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining rosin anhydride, partially dimerized rosin (Poly-Pale), BYK 310, adipic acid, and suberic acid
  • the flux included 20% by weight rosin anhydride, 50% by weight partially dimerized rosin (Poly-Pale), 0.1% by weight BYK310, 24.9% by weight adipic acid and 5% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining Versamid 940, KE604, partially dimerized rosin (Poly-Pale), BYK 310, adipic acid, and suberic.
  • the flux included 8.7 % by weight versamid, 15.71 % by weight KE604, 42.14 % by weight partially dimerized rosin (Poly-Pale), 1.43 % by weight BYK310, 26% by weight adipic acid and 6.02% by weight suberic acid.
  • a pliable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, polypropyleneglycol diglycidyl ether, adipic acid and suberic acid. 50% by weight rosin anhydride adduct, 25% by weight polypropyleneglycol diglycidyl ether, 20% by weight adipic acid and 5% by weight suberic acid. Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good. The flux was tacky as characterized by IPC- TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, polymerized rosin (Dymerex), polypropyleneglycol diglycidyl ether, adipic acid and suberic acid. 35% by weight polymerized rosin (Dymerex), 20% by weight rosin anhydride adduct, 10% by weight polypropyleneglycol diglycidyl ether, 20% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was tacky as characterized by IPC- TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, trimethylolpropane triglycidyl ether, adipic acid and suberic acid. 60% by weight rosin anhydride adduct, 20% by weight polypropyleneglycol diglycidyl ether, 15% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was tacky as characterized by IPC- TM-650 Method 2.4.44 dated March 1998.
  • a pliable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, polymerized rosin (Dymerex), trimethylolpropane triglycidyl ether, adipic acid and suberic acid. 35% by weight polymerized rosin (Dymerex), 30% by weight rosin anhydride adduct, 10% by weight trimethylolpropane triglycidyl ether, 20% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was tacky as characterized by IPC- TM-650 Method 2.4.44 dated March 1998.
  • a pliable UV curable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, polypropyleneglycol diglycidyl ether, Irgacure 184 (or Ciba darocure R 1173), adipic acid and suberic acid. 48% by weight rosin anhydride adduct, 24% by weight polypropyleneglycol diglycidyl ether, 3% by weight Ciba darocure R 1173, 20% by weight adipic acid and 5% by weight suberic acid.
  • Resiliency of the flux was tested by bending wire beyond a 360° angle and by twisting wire beyond 360° and inspecting for cracks, delamination and adhesion. The resiliency and adherence of the flux in this example was good.
  • the flux was tacky as characterized by IPC- TM-650 Method 2.4.44 dated March 1998.
  • a pliable UV curable flux was prepared as described in Example 1 by combining mildly activated rosin anhydride adduct, polymerized rosin (Polymerized rosin (Dymerex)), trimethylolpropane triglycidyl ether, Irgacure 184 (or Ciba darocure R 1173), adipic acid and suberic acid.
  • Example 1 was repeated except that the malkyd resin was used in lieu of rosin-anhydride adduct. Flux was tack-free as per IPC-TM-650 testing method 2.4.44 dated March 1998.
  • Example 2 was repeated except that the malkyd resin was used in lieu of rosin-anhydride adduct. Flux was tack-free as per IPC-TM-650 testing method 2.4.44 dated March 1998.
  • Example 9 was repeated except that the poly (vinyl pyrrolidone) K30 was used in lieu of
  • Example 9 was repeated except that the BYK4510 was used in lieu of BYK310. Flux was tack-free as per IPC-TM-650 testing method 2.4.44 dated March 1998.
  • Example 9 was repeated except that the BYK307 was used in lieu of BYK310. Flux was tack-free as per IPC-TM-650 testing method 2.4.44 dated March 1998.
  • Example 18 was repeated except that the amount of poly (vinyl pyrrolidone) K30 was increased to 5% by weight. Adipic acid amount was decreased accordingly. Flux was tack-free as per IPC-TM-650 testing method 2.4.44 dated March 1998.
  • references to "or” may be construed as inclusive so that any terms described using “or” may indicate any of a single, more than one, and all of the described terms. Any references to direction or relative position are intended for convenience of description, not to limit the present compositions, devices and methods or their components to any one positional or spatial orientation.

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Abstract

L'invention concerne des formulations de flux qui, une fois déposées, demeurent flexibles et sans pégosité. Dans certains exemples, le flux comprend un premier constituant et, en quantité efficace, un deuxième constituant permettant d'obtenir un flux flexible une fois déposé. Le flux peut également contenir des activateurs, des plastifiants, des tensioactifs et d'autres constituants.
EP13897342.5A 2013-11-12 2013-11-12 Formulations de flux Pending EP3068576A4 (fr)

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JP6560283B2 (ja) * 2017-03-17 2019-08-14 株式会社タムラ製作所 フラックス組成物及びソルダペースト
JP7370327B2 (ja) * 2018-08-24 2023-10-27 ハリマ化成株式会社 エステル樹脂及びエステル樹脂の製造方法
US20220226940A1 (en) * 2019-07-25 2022-07-21 Stepan Company Non-aqueous solder flux composition
CN111390429B (zh) * 2020-04-21 2021-09-14 深圳市唯特偶新材料股份有限公司 焊接后成膜具有三防效果的助焊膏及其制备方法
JP6992243B1 (ja) * 2021-03-31 2022-02-03 千住金属工業株式会社 フラックスコートはんだプリフォーム用フラックス、フラックスコートはんだプリフォーム、及び電子基板に電子部品を実装する方法
CN113084393B (zh) * 2021-04-21 2022-06-17 兰州理工大学 一种用于金属材料焊接的抗氧化助焊剂
TW202327121A (zh) * 2021-12-16 2023-07-01 阿爾發金屬化工公司 製造太陽能模組之方法

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WO2015072974A1 (fr) 2015-05-21
KR102234416B1 (ko) 2021-04-01
KR20210035926A (ko) 2021-04-01
JP6395830B2 (ja) 2018-09-26
KR20160081924A (ko) 2016-07-08
CN105813795A (zh) 2016-07-27
KR102376450B1 (ko) 2022-03-17
JP2017503658A (ja) 2017-02-02

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