JPS5581097A - Flux composition - Google Patents

Flux composition

Info

Publication number
JPS5581097A
JPS5581097A JP15305778A JP15305778A JPS5581097A JP S5581097 A JPS5581097 A JP S5581097A JP 15305778 A JP15305778 A JP 15305778A JP 15305778 A JP15305778 A JP 15305778A JP S5581097 A JPS5581097 A JP S5581097A
Authority
JP
Japan
Prior art keywords
rosin
wire solder
flux
flux composition
cemedine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15305778A
Other languages
Japanese (ja)
Inventor
Narutoshi Taguchi
Yukitsugu Kobata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP15305778A priority Critical patent/JPS5581097A/en
Publication of JPS5581097A publication Critical patent/JPS5581097A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To obtain an excellent non-corrosive flux composition for use in flux coated wire solder, by mixing rosin, thermoplastic synthetic resin, activator, plasticizer, etc. by specified ratio. CONSTITUTION:Rosin (polymer rosin, hydrogenated rosin, etc.) by 10-50wt%, vinyl acetate-ethylene copolymer (e.g. Cemedine 2545 made by Cemedine Ltd.) by 40-80wt%, activator (hydrohalogenic salt of organic amine, stearic acid, etc.) by 0.2-10wt%, and plasticizer (dioctyl phthalate, tricresyl phosphate, etc.) by 3-15wt% are mixed. This flux composition has a moderate acid value and excels in adhesion to the wire solder and fluidity when soldering. Therefore, when coated on a wire solder, an excellent coated wire solder completely free from scatter of flux when soldering may be obtained.
JP15305778A 1978-12-13 1978-12-13 Flux composition Pending JPS5581097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15305778A JPS5581097A (en) 1978-12-13 1978-12-13 Flux composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15305778A JPS5581097A (en) 1978-12-13 1978-12-13 Flux composition

Publications (1)

Publication Number Publication Date
JPS5581097A true JPS5581097A (en) 1980-06-18

Family

ID=15554030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15305778A Pending JPS5581097A (en) 1978-12-13 1978-12-13 Flux composition

Country Status (1)

Country Link
JP (1) JPS5581097A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877791A (en) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd Flux composition for soldering
JPS6234696A (en) * 1985-08-08 1987-02-14 Uchihashi Kinzoku Kogyo Kk Flux
JP2009542019A (en) * 2006-06-30 2009-11-26 ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト No-clean low-residue solder paste for semiconductor device applications
WO2013108663A1 (en) * 2012-01-17 2013-07-25 千住金属工業株式会社 Flux for flux-cored solder, and flux-cored solder
JP2017503658A (en) * 2013-11-12 2017-02-02 アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. Flux formulation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855853A (en) * 1971-11-17 1973-08-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855853A (en) * 1971-11-17 1973-08-06

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877791A (en) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd Flux composition for soldering
JPS6234696A (en) * 1985-08-08 1987-02-14 Uchihashi Kinzoku Kogyo Kk Flux
JP2009542019A (en) * 2006-06-30 2009-11-26 ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト No-clean low-residue solder paste for semiconductor device applications
WO2013108663A1 (en) * 2012-01-17 2013-07-25 千住金属工業株式会社 Flux for flux-cored solder, and flux-cored solder
JP2013146740A (en) * 2012-01-17 2013-08-01 Denso Corp Flux for resin flux cored solder, and resin flux cored solder
JP2017503658A (en) * 2013-11-12 2017-02-02 アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. Flux formulation

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