JPS5516029A - Hot-melt type adhesive - Google Patents
Hot-melt type adhesiveInfo
- Publication number
- JPS5516029A JPS5516029A JP8838178A JP8838178A JPS5516029A JP S5516029 A JPS5516029 A JP S5516029A JP 8838178 A JP8838178 A JP 8838178A JP 8838178 A JP8838178 A JP 8838178A JP S5516029 A JPS5516029 A JP S5516029A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- hot
- melt type
- type adhesive
- stickiness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: To obtain a hot-melt type adhesive of good heat resistance, workability, etc., by melting and kneading homogeneously a composition comprising a stereoregular polypropylene resin, a thermoplastic resin, stickiness-imparting agent, a wax, and a filler.
CONSTITUTION: The objective adhesive can be obtained by melting and kneading homogeneously the following composition comprising (A) 40 parts by wt. of a polyolefin resin having a welt index of 3W50, consisting mainly of stereoregular polypropylene, (B) 2W50 parts by wt. of a thermoplastic resin having a softening point ≤ 250°C such as an ethylene-vinyl acetate copolymer of a vinyl acetate monomer content of 6W39 wt.%, (C) 2W80 parts by wt. of a stickiness-imparting agent such as a naturally-occurring or synthetic rosin, etc., (D) 2W50 parts by wt. of a naturally-occurring or synthetic wax, and (E) 3W100 parts by wt. of a powdered or short fiber-shaped filler.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8838178A JPS5516029A (en) | 1978-07-21 | 1978-07-21 | Hot-melt type adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8838178A JPS5516029A (en) | 1978-07-21 | 1978-07-21 | Hot-melt type adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5516029A true JPS5516029A (en) | 1980-02-04 |
Family
ID=13941206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8838178A Pending JPS5516029A (en) | 1978-07-21 | 1978-07-21 | Hot-melt type adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5516029A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180958A (en) * | 1981-04-24 | 1982-11-08 | Ririan Deii Makushiyaarii | Massager |
JPS6051768A (en) * | 1983-08-31 | 1985-03-23 | Du Pont Mitsui Polychem Co Ltd | Hot-melt adhesive composition |
JPS6096676A (en) * | 1983-10-31 | 1985-05-30 | Du Pont Mitsui Polychem Co Ltd | Hot-melt adhesive composition |
JP2009138196A (en) * | 2007-12-04 | 2009-06-25 | Sika Technology Ag | Hot melt adhesive with good adhesion to polyolefin |
JP2018083868A (en) * | 2016-11-21 | 2018-05-31 | 旭化学合成株式会社 | Hot-melt adhesive composition and bonding method using the same |
-
1978
- 1978-07-21 JP JP8838178A patent/JPS5516029A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57180958A (en) * | 1981-04-24 | 1982-11-08 | Ririan Deii Makushiyaarii | Massager |
JPH0237181B2 (en) * | 1981-04-24 | 1990-08-22 | Ririan Deii Makushaarii | |
JPS6051768A (en) * | 1983-08-31 | 1985-03-23 | Du Pont Mitsui Polychem Co Ltd | Hot-melt adhesive composition |
JPH0144222B2 (en) * | 1983-08-31 | 1989-09-26 | Mitsui Du Pont Polychemical | |
JPS6096676A (en) * | 1983-10-31 | 1985-05-30 | Du Pont Mitsui Polychem Co Ltd | Hot-melt adhesive composition |
JPH0144223B2 (en) * | 1983-10-31 | 1989-09-26 | Mitsui Du Pont Polychemical | |
JP2009138196A (en) * | 2007-12-04 | 2009-06-25 | Sika Technology Ag | Hot melt adhesive with good adhesion to polyolefin |
JP2018083868A (en) * | 2016-11-21 | 2018-05-31 | 旭化学合成株式会社 | Hot-melt adhesive composition and bonding method using the same |
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