JPS5554298A - Flux composition - Google Patents

Flux composition

Info

Publication number
JPS5554298A
JPS5554298A JP12617978A JP12617978A JPS5554298A JP S5554298 A JPS5554298 A JP S5554298A JP 12617978 A JP12617978 A JP 12617978A JP 12617978 A JP12617978 A JP 12617978A JP S5554298 A JPS5554298 A JP S5554298A
Authority
JP
Japan
Prior art keywords
solder
flexibility
adhesiveness
rosin
plasticizers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12617978A
Other languages
Japanese (ja)
Inventor
Narutoshi Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Original Assignee
SENJIYU KINZOKU KOGYO KK
Senju Metal Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SENJIYU KINZOKU KOGYO KK, Senju Metal Industry Co Ltd filed Critical SENJIYU KINZOKU KOGYO KK
Priority to JP12617978A priority Critical patent/JPS5554298A/en
Publication of JPS5554298A publication Critical patent/JPS5554298A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613Polymers, e.g. resins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To obtain the solder covering material which is superior in melt fluidity, flexibility and adhesiveness and does not have metal corrosiveness and stickiness by compounding fatty amide, EVA copolymer and plasticizers at the specific ratios to ordinary rosin base flux. CONSTITUTION:Compounding of 10-35% of fatty amide for preventing stickiness, 30-50% of EVA copolymer for giving adhesiveness and flexibility to solder and 5- 15% of plasticizers for plastics into the ordinary rosin base flux composed of 10- 35% of colophonium or derivatives such as of polymerized rosin, rosin modified phenolic resins, etc. and 0.2-10% of flux activators such as dimethyl amine hydrochloride, salicylic acid, etc. yields the solder covering material which is superior in adhesiveness to solder, flexibility and melt flowability at the soldering.
JP12617978A 1978-10-16 1978-10-16 Flux composition Pending JPS5554298A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12617978A JPS5554298A (en) 1978-10-16 1978-10-16 Flux composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12617978A JPS5554298A (en) 1978-10-16 1978-10-16 Flux composition

Publications (1)

Publication Number Publication Date
JPS5554298A true JPS5554298A (en) 1980-04-21

Family

ID=14928633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12617978A Pending JPS5554298A (en) 1978-10-16 1978-10-16 Flux composition

Country Status (1)

Country Link
JP (1) JPS5554298A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877791A (en) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd Flux composition for soldering
JPH0391196U (en) * 1990-01-01 1991-09-17
EP2106318A4 (en) * 2007-01-04 2013-05-01 Fry Metals Inc Flux formulations
WO2013108663A1 (en) * 2012-01-17 2013-07-25 千住金属工業株式会社 Flux for flux-cored solder, and flux-cored solder
JP2017503658A (en) * 2013-11-12 2017-02-02 アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. Flux formulation
CN111234538A (en) * 2020-04-03 2020-06-05 东莞市瑞林森科技有限公司 Wire insulating cement and preparation method thereof
CN113305470A (en) * 2021-05-28 2021-08-27 华天科技(西安)有限公司 Cleaning soldering flux and preparation method and use method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855853A (en) * 1971-11-17 1973-08-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4855853A (en) * 1971-11-17 1973-08-06

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5877791A (en) * 1981-10-31 1983-05-11 Toppan Printing Co Ltd Flux composition for soldering
JPH0391196U (en) * 1990-01-01 1991-09-17
EP2106318A4 (en) * 2007-01-04 2013-05-01 Fry Metals Inc Flux formulations
WO2013108663A1 (en) * 2012-01-17 2013-07-25 千住金属工業株式会社 Flux for flux-cored solder, and flux-cored solder
JP2013146740A (en) * 2012-01-17 2013-08-01 Denso Corp Flux for resin flux cored solder, and resin flux cored solder
JP2017503658A (en) * 2013-11-12 2017-02-02 アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. Flux formulation
CN111234538A (en) * 2020-04-03 2020-06-05 东莞市瑞林森科技有限公司 Wire insulating cement and preparation method thereof
CN113305470A (en) * 2021-05-28 2021-08-27 华天科技(西安)有限公司 Cleaning soldering flux and preparation method and use method thereof

Similar Documents

Publication Publication Date Title
JPS5566981A (en) Hot-melt adhesive composition
DK153564C (en) POLYESTERAMIDE MELTING CLAIMS
JPS5554298A (en) Flux composition
JPS56145965A (en) Hot-melt adhesive
JPS5516055A (en) Heat-sensitive adhesive, its preparation and adhesive sheet
EP0361728A3 (en) Adhesive polyimide compositions
JPS53129234A (en) Composition for hot-melt adhesive
JPS53127546A (en) Polyolefin composition having improved adhesiveness
JPS54142298A (en) Heat-resistant curable resin composition
JPS5221048A (en) Hot melt composition
JPS56167776A (en) Adhesive resin composition
JPS53114842A (en) Production of composition for hot-melt type traffic paint
JPS53114852A (en) Polyolefin composition
DE3360838D1 (en) Composition for coating objects
JPS5242549A (en) Polyamide resin compositions
JPS5457543A (en) Hot-melt adhesive composition for metal and polyolefin
JPS5491539A (en) Adhesive
JPS5238549A (en) Adhesive composition
JPS5371139A (en) Hot-melt adhesive compositions
JPS5436344A (en) Thermally fusible type of material for marking road lanes
JPS5290547A (en) Polyolefin composition
JPS5424946A (en) Hot-melt traffic paint composition
JPS5244863A (en) Novel resin compositions
JPS54127441A (en) Hot-melt adhesive composition
JPS5272753A (en) Softened polyamide compositions