JPS5554298A - Flux composition - Google Patents
Flux compositionInfo
- Publication number
- JPS5554298A JPS5554298A JP12617978A JP12617978A JPS5554298A JP S5554298 A JPS5554298 A JP S5554298A JP 12617978 A JP12617978 A JP 12617978A JP 12617978 A JP12617978 A JP 12617978A JP S5554298 A JPS5554298 A JP S5554298A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flexibility
- adhesiveness
- rosin
- plasticizers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To obtain the solder covering material which is superior in melt fluidity, flexibility and adhesiveness and does not have metal corrosiveness and stickiness by compounding fatty amide, EVA copolymer and plasticizers at the specific ratios to ordinary rosin base flux. CONSTITUTION:Compounding of 10-35% of fatty amide for preventing stickiness, 30-50% of EVA copolymer for giving adhesiveness and flexibility to solder and 5- 15% of plasticizers for plastics into the ordinary rosin base flux composed of 10- 35% of colophonium or derivatives such as of polymerized rosin, rosin modified phenolic resins, etc. and 0.2-10% of flux activators such as dimethyl amine hydrochloride, salicylic acid, etc. yields the solder covering material which is superior in adhesiveness to solder, flexibility and melt flowability at the soldering.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12617978A JPS5554298A (en) | 1978-10-16 | 1978-10-16 | Flux composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12617978A JPS5554298A (en) | 1978-10-16 | 1978-10-16 | Flux composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5554298A true JPS5554298A (en) | 1980-04-21 |
Family
ID=14928633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12617978A Pending JPS5554298A (en) | 1978-10-16 | 1978-10-16 | Flux composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5554298A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5877791A (en) * | 1981-10-31 | 1983-05-11 | Toppan Printing Co Ltd | Flux composition for soldering |
JPH0391196U (en) * | 1990-01-01 | 1991-09-17 | ||
EP2106318A4 (en) * | 2007-01-04 | 2013-05-01 | Fry Metals Inc | Flux formulations |
WO2013108663A1 (en) * | 2012-01-17 | 2013-07-25 | 千住金属工業株式会社 | Flux for flux-cored solder, and flux-cored solder |
JP2017503658A (en) * | 2013-11-12 | 2017-02-02 | アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. | Flux formulation |
CN111234538A (en) * | 2020-04-03 | 2020-06-05 | 东莞市瑞林森科技有限公司 | Wire insulating cement and preparation method thereof |
CN113305470A (en) * | 2021-05-28 | 2021-08-27 | 华天科技(西安)有限公司 | Cleaning soldering flux and preparation method and use method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4855853A (en) * | 1971-11-17 | 1973-08-06 |
-
1978
- 1978-10-16 JP JP12617978A patent/JPS5554298A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4855853A (en) * | 1971-11-17 | 1973-08-06 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5877791A (en) * | 1981-10-31 | 1983-05-11 | Toppan Printing Co Ltd | Flux composition for soldering |
JPH0391196U (en) * | 1990-01-01 | 1991-09-17 | ||
EP2106318A4 (en) * | 2007-01-04 | 2013-05-01 | Fry Metals Inc | Flux formulations |
WO2013108663A1 (en) * | 2012-01-17 | 2013-07-25 | 千住金属工業株式会社 | Flux for flux-cored solder, and flux-cored solder |
JP2013146740A (en) * | 2012-01-17 | 2013-08-01 | Denso Corp | Flux for resin flux cored solder, and resin flux cored solder |
JP2017503658A (en) * | 2013-11-12 | 2017-02-02 | アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. | Flux formulation |
CN111234538A (en) * | 2020-04-03 | 2020-06-05 | 东莞市瑞林森科技有限公司 | Wire insulating cement and preparation method thereof |
CN113305470A (en) * | 2021-05-28 | 2021-08-27 | 华天科技(西安)有限公司 | Cleaning soldering flux and preparation method and use method thereof |
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