EP2960291B1 - Crosslinking aid and practical application thereof - Google Patents
Crosslinking aid and practical application thereof Download PDFInfo
- Publication number
- EP2960291B1 EP2960291B1 EP14753580.1A EP14753580A EP2960291B1 EP 2960291 B1 EP2960291 B1 EP 2960291B1 EP 14753580 A EP14753580 A EP 14753580A EP 2960291 B1 EP2960291 B1 EP 2960291B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- meth
- acrylate
- crosslinking
- crosslinking aid
- ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004132 cross linking Methods 0.000 title claims description 64
- 229920001038 ethylene copolymer Polymers 0.000 claims description 24
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 22
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 20
- 229920000193 polymethacrylate Polymers 0.000 claims description 20
- 239000011342 resin composition Substances 0.000 claims description 17
- 239000003566 sealing material Substances 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 26
- 150000001451 organic peroxides Chemical class 0.000 description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 6
- 239000005977 Ethylene Substances 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- -1 methacryloyl groups Chemical group 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 3
- 239000005058 Isophorone diisocyanate Substances 0.000 description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 3
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 3
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000005846 sugar alcohols Polymers 0.000 description 3
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 239000000370 acceptor Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- MOVRNJGDXREIBM-UHFFFAOYSA-N aid-1 Chemical compound O=C1NC(=O)C(C)=CN1C1OC(COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C(NC(=O)C(C)=C2)=O)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)COP(O)(=O)OC2C(OC(C2)N2C3=C(C(NC(N)=N3)=O)N=C2)CO)C(O)C1 MOVRNJGDXREIBM-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229940116351 sebacate Drugs 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DBOSBRHMHBENLP-UHFFFAOYSA-N 4-tert-Butylphenyl Salicylate Chemical compound C1=CC(C(C)(C)C)=CC=C1OC(=O)C1=CC=CC=C1O DBOSBRHMHBENLP-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- OKOBUGCCXMIKDM-UHFFFAOYSA-N Irganox 1098 Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)NCCCCCCNC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 OKOBUGCCXMIKDM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000012773 agricultural material Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 description 1
- 229960003328 benzoyl peroxide Drugs 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000011033 desalting Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 235000015203 fruit juice Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000001631 haemodialysis Methods 0.000 description 1
- 230000000322 hemodialysis Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Chemical class 0.000 description 1
- 239000002184 metal Chemical class 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012460 protein solution Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- PNWOTXLVRDKNJA-UHFFFAOYSA-N tert-butylperoxybenzene Chemical compound CC(C)(C)OOC1=CC=CC=C1 PNWOTXLVRDKNJA-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/36—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with compounds containing nitrogen, e.g. by nitration
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/20—Carboxylic acid amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2331/00—Characterised by the use of copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, or carbonic acid, or of a haloformic acid
- C08J2331/02—Characterised by the use of omopolymers or copolymers of esters of monocarboxylic acids
- C08J2331/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to applications of a crosslinking aid. More specifically, the present invention relates to applications of a widely used crosslinking aid comprising triallyl isocyanurate (TAIC) (for example, a sealing material for a solar cell, etc.).
- TAIC triallyl isocyanurate
- Patent Literature 1 a resin composition comprising an ethylene-based copolymer as a base material and an organic peroxide as a crosslinking agent mixed with the ethylene-based copolymer.
- an adhesive sheet for a solar cell which is constituted of 100 parts by weight of an ethylene-based copolymer and 0.05 to 0.5 parts by weight of an organic peroxide, and comprises a multifunctional monomer having four or more acryloyl and/or methacryloyl groups in total (Patent Literature 2).
- a sealing film for a solar cell which comprises an ethylene-unsaturated ester copolymer, a crosslinking agent and a crosslinking aid, in which the crosslinking aid comprises a polyfunctional (meth)acrylate of a polyhydric alcohol and TAIC (Patent Literature 3).
- TAIC is known as a useful crosslinking aid upon obtaining a molded body by curing a cross-linkable polymer.
- TAIC when crosslinking an ethylene-based vinyl acetate copolymer with an organic peroxide, TAIC is essentially required as a crosslinking aid, and is capable of providing a sealing material for a solar cell which has high transparency, adhesive properties, heat resistance and flexibility.
- a polymer having a polar group such as an ethylene-vinyl acetate copolymer tends to be insufficient in insulation properties (volume resistivity value) even when cross-linked using TAIC.
- a polyfunctional (meth)acrylate of a polyhydric alcohol according to the above-proposed conventional art.
- the present invention has been made in view of the above circumstances.
- the object of the present invention is to provide a crosslinking aid comprising TAIC, which serves for obtaining an adhesive resin composition exhibiting excellent insulation properties while maintaining good transparency, adhesive properties, heat resistance and flexibility of conventional crosslinked ethylene-vinyl acetate copolymers.
- the above object of the present invention can be achieved by using a specific compound in combination with TAIC.
- the present invention has been accomplished on the basis of the above findings, and includes the following aspects relating to a crosslinking aid and applications thereof.
- a crosslinking aid that is capable of providing an adhesive resin composition having excellent insulation properties while maintaining good transparency, adhesive properties, heat resistance and flexibility of conventional crosslinked ethylene-vinyl acetate copolymers.
- the crosslinking aid used in the present invention comprises a urethane poly(meth)acrylate in combination with TAIC.
- the urethane poly(meth)acrylate can be synthesized, for example, from an organic isocyanate and a hydroxyl group-containing (meth)acrylate.
- the urethane poly(meth)acrylate having a high molecular weight is preferred.
- the number-average molecular weight of the urethane poly(meth)acrylate is not less than 1000, and preferably not less than 1200.
- the upper limit of the number-average molecular weight of the urethane poly(meth)acrylate is usually 10,000.
- the organic isocyanate is a compound having two or more isocyanate groups in a molecule thereof.
- the organic group include a linear, branched or cyclic aliphatic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic ring group such as isocyanurate group.
- Specific examples of the organic isocyanate include 1,6-hexamethylene diisocyanate, isophorone diisocyanate, toluidine diisocyanate, MDI (diphenylmethane diisocyanate), hydrogenated MDI, xylylene diisocyanate, a trimer of 1,6-hexamethylene diisocyanate, and a trimer of isophorone diisocyanate.
- the hydroxyl group-containing (meth)acrylate is a (meth)acrylate having one or more hydroxyl groups in a molecule thereof.
- Examples of the hydroxyl group-containing (meth)acrylate include (meth)acrylates of polyhydric alcohols.
- hydroxyl group-containing (meth)acrylate examples include trimethylolpropane di(meth)acrylate, pentaerythritol trimethacrylate, dipentaerythritol tetra(meth)acrylate, tripentaerythritol (meth)acrylate, polyalkyl diol (meth)acrylates, polyethylene glycol (meth)acrylate, polyalkylene glycol (meth)acrylates, glycerin di(meth)acrylate and polyol (meth)acrylates.
- These hydroxyl group-containing (meth)acrylates may be in the form of a single acrylate or a mixture of these acrylates.
- Examples of commercially available products of the urethane poly(meth)acrylate include “UA-306H”, “UA-306T”, “UA-306I” and “UA-510H” all produced by Kyoeisha Chemical Co., Ltd., “KRM7864”, “KRM8452”, “EB1290”, “EB1290K” and “EB5129” all produced by Daicel Cytec Co., Ltd., “U-6HA”, “U-6LPA”, “U-15HA”, “UA-33H” and “UA-122P” all produced by Shin-Nakamura Chemical Co., Ltd., "UV7600B”, “UV7605B”, “UV7610B” and “UV7620EA” all produced by Nippon Synthetic Co.
- the blending ratio (weight ratio) of the urethane poly(meth)acrylate and TAIC is usually 1:9 to 9:1 and preferably 1:1 to 1:4.
- the crosslinking aid used in the present invention may contain a polyfunctional (meth)acrylate unless the effects of the present invention are adversely affected by addition thereof.
- the polyfunctional (meth)acrylate is a compound having two or more (meth)acryloyl groups, and preferably three (meth)acryloyl groups, in a molecule thereof.
- polyfunctional (meth)acrylate examples include trimethylolpropane tri(meth)acrylate, dimethylol propane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa (meth) acrylate.
- the crosslinking aid used in the present invention may be used in either radiation-crosslinking or heat-crosslinking. That is, the resin composition obtained by blending the crosslinking aid with a cross-linkable polymer can be used either as a radiation-crosslinking resin composition or as a heat-crosslinking resin composition.
- an ethylene copolymer is particularly preferred.
- the ethylene copolymer is a copolymer of ethylene as a main component and a monomer copolymerizable with the ethylene.
- the monomer include vinyl esters, unsaturated carboxylic acid esters, unsaturated carboxylic acids and metal salts thereof, unsaturated silicon compounds, and ⁇ -olefins.
- polar monomers are preferred.
- ethylene copolymer examples include ethylene-vinyl ester copolymers such as ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers such as ethylene-methyl acrylate copolymers and ethylene-isobutyl acrylate-methacrylic acid copolymers, and ionomers thereof.
- ethylene-vinyl ester copolymers such as ethylene-vinyl acetate copolymers, ethylene-unsaturated carboxylic acid ester copolymers such as ethylene-methyl acrylate copolymers and ethylene-isobutyl acrylate-methacrylic acid copolymers, and ionomers thereof.
- ethylene-vinyl acetate copolymers particularly preferred are the ethylene-vinyl acetate copolymers.
- the amount of the crosslinking aid of the invention compounded in the radiation-crosslinking resin composition or the heat-crosslinking resin composition is usually 0.1 to 3.0 parts by weight, and preferably 0.5 to 2.0 parts by weight based on 100 parts by weight of the ethylene copolymer.
- the amount of the polyfunctional (meth)acrylate compounded is usually 0.1 to 3.0 parts by weight, and preferably 0.5 to 2.0 parts by weight based on 100 parts by weight of the ethylene copolymer.
- a crosslinking agent is used together with the crosslinking aid.
- an organic peroxide may be generally used.
- the organic peroxide is not particularly limited as long as it is a known organic peroxide to generate peroxy radicals under the vulcanization conditions.
- organic peroxide examples include di-t-butylperoxide, dicumylperoxide, 2,5-dimethyl-2,5-di(benzoylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, t-butylperoxy-2-ethylhexyl-monocarbonate, 1,1-bis(t-butylperoxy)-3,5,5-trimethyl cyclohexane, 2,5-dimethylhexane-2,5-dihydroxyperoxide, t-butylcumylperoxide, ⁇ , ⁇ '-bis(t-butylperoxy)-p-diisopropyl benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne-3, benzoylperoxide, and t-butylperoxy benzene.
- the amount of the crosslinking agent compounded may vary depending on the type of the ethylene copolymer, and is usually 0.6 to 5 parts by weight, and preferably 1 to 2 parts by weight based on 100 parts by weight of the ethylene copolymer. In such a case as to carry out crosslinking by irradiation, the organic peroxide is not necessarily required.
- optional additives such as reinforcing agents, fillers, plasticizers, processing aids, lubricants, pigments, anti-aging agents, coupling agents, ultraviolet absorbers and acid acceptors can be used.
- anti-aging agents include dit-butyl-P-cresol, pentaerythrityl-tetraxy[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 2,2'-methylenebis(2-methyl-6-t-butylphenyl), bis(2,2,6,6-tetramethyl-4-piperadyl)sebacate, N,N'-hexane-1,6-diylbis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionamide], bis(2,2,6,6-tetramethyl-4-piperadyl)sebacate, hydroquinone monomethyl ether, and methylhydroquinone.
- the coupling agents include ⁇ -chloropropyl trimethoxysilane, vinyl triethoxysilane, vinyl-tris-( ⁇ -methoxyethoxy)silane, ⁇ -methacryloxypropyl trimethoxysilane, ⁇ -(3,4-ethoxy-cyclohexyl)ethyl trimethoxysilane, ⁇ -glycidoxypropyl trimethoxysilane, ⁇ -mercaptopropyltrimethoxysilane, ⁇ -aminopropyl trimethoxysilane, and N- ⁇ -(aminoethyl)- ⁇ -aminopropyl trimethoxysilane.
- ultraviolet absorbers include 2-hydroxy-4-n-octyloxy benzophenone, 2,2-hydroxy 6-4,4-dimethoxy benzophenone, 2-(2'-hydroxy-5-methylphenyl)benzotriazole, and p-t-butylphenyl salicylate.
- acid acceptors include magnesium hydroxide, calcium hydroxide, magnesium oxide, and zinc oxide.
- the amount of the additives added is usually not more than 10 parts by weight, and preferably not more than 5 parts by weight based on 100 parts by weight of the ethylene copolymer.
- the radiation used in the radiation-crosslinking accelerated electron beams, X-rays, ⁇ rays, ⁇ rays, ⁇ rays, and the like are available.
- the irradiation dose may vary depending on the cross-linkable elastomer to be used, and is usually 0.1 to 500 kGy.
- the heat-crosslinking is conducted by using a molding machine, for example, an injection molding machine, a compression molding machine and the like, and heating at a temperature of 150 to 200°C for about 2 to 30 min to obtain a molded body. If necessary, thereafter, the secondary crosslinking may be conducted by heating at a temperature of 150 to 200°C for 1 to 10 hr.
- the crosslinking of the ethylene copolymer composition described above particularly the crosslinking using an organic peroxide is preferred.
- the above ethylene copolymer composition is useful for use in the applications such as various packaging materials for foods, pharmaceuticals, industrial chemicals, and agricultural materials, various adhesive films, sealing films for various electric materials such as solar cells, liquid crystal, light emitting diodes, and organic EL, as well as useful for use in fields of hemodialysis, plasma component separation, desalting of protein solutions, fractionation, condensation, condensation of fruit juice, and wastewater treatment.
- the above ethylene copolymer composition is useful as a sealing material used for assembly of various electronic material modules.
- the sealing material in the case of a sealing material to be used in a considerably thickened form such as a sealing material for the solar cell, the sealing material fails to be cured with ultraviolet rays and electron beams, and therefore, the heat-crosslinking resin composition is used.
- Respective components shown in Table 1 below were kneaded with an open roll mill.
- EVA ethylene-vinyl acetate copolymer
- TAIC produced by NIPPON KASEI CHEMICAL COMPANY LIMITED was used as crosslinking aid 1
- respective compounds shown in Table 2 were used as crosslinking aid 2 in each Example or Comparative Example.
- the resulting composition was subjected to hot press crosslinking (primary crosslinking) at 150°C to obtain a sheet having a thickness of 1mm.
- a volume resistivity value of the sheet was measured by the method shown in Table 3. The measurement results are shown in Table 4.
- a urethane poly(meth)acrylate was synthesized using isophorone diisocyanate as an organic isocyanate and pentaerythritol triacrylate as a hydroxyl group-containing (meth)acrylate.
- the number-average molecular weight of the resulting urethane poly(meth)acrylate was measured by GPC. The measurement conditions are as follows.
- An EVA sheet was produced using the above urethane poly(meth)acrylate as the crosslinking aid 2, and the volume resistivity of the EVA sheet was measured in the same manner as in Examples 1 to 3 and Comparative Examples 1 to 4.
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- Medicinal Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
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- Photovoltaic Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (2)
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JP2013032282 | 2013-02-21 | ||
PCT/JP2014/054126 WO2014129573A1 (ja) | 2013-02-21 | 2014-02-21 | 架橋助剤およびその応用 |
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EP2960291B1 true EP2960291B1 (en) | 2018-12-26 |
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EP (1) | EP2960291B1 (ko) |
JP (1) | JP5888466B2 (ko) |
KR (1) | KR102092570B1 (ko) |
CN (1) | CN105164198B (ko) |
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KR20150119847A (ko) * | 2013-02-21 | 2015-10-26 | 니폰 가세이 가부시키가이샤 | 가교용 수지 조성물 및 봉지재 |
ES2632783T3 (es) | 2014-12-19 | 2017-09-15 | Evonik Degussa Gmbh | Sistemas de redes de cubierta para láminas de encapsulación que comprenden compuestos de bis-(alquenilamidas) |
ES2635260T3 (es) | 2014-12-19 | 2017-10-03 | Evonik Degussa Gmbh | Sistemas correticulantes para láminas de encapsulado que comprenden compuestos de urea |
EP3034531A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Dispersion zum einfachen Einsatz in der Herstellung von Verkapselungsfolien |
EP3034529B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für verkapselungsfolien umfassend (meth)acrylamidverbindungen |
EP3034525A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Pentaerythritolverbindungen |
EP3034568A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Triallylisocyanurat und Triallylcyanurat |
EP3034567B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Ethylenglykoldi(meth)acrylatverbindungen |
EP3034530A1 (de) | 2014-12-19 | 2016-06-22 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien umfassend Diene |
EP3034526B1 (de) | 2014-12-19 | 2017-06-14 | Evonik Degussa GmbH | Covernetzersysteme für Verkapselungsfolien |
CN110050038A (zh) * | 2017-01-10 | 2019-07-23 | 住友电工超效能高分子股份有限公司 | 交联树脂成型体、滑动构件、齿轮和轴承 |
KR101981331B1 (ko) * | 2017-03-30 | 2019-05-22 | 에스케이씨에코솔루션즈(주) | 태양전지용 봉지재 및 이를 포함하는 태양전지 모듈 |
JP7500457B2 (ja) | 2020-07-30 | 2024-06-17 | 京セラ株式会社 | 太陽電池モジュール |
CN113278225A (zh) * | 2021-07-07 | 2021-08-20 | 合肥市丽红塑胶材料有限公司 | 一种纳米二氧化硅增强pp材料及其制备工艺 |
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CA1285675C (en) * | 1985-03-25 | 1991-07-02 | Takaaki Sakamoto | Method of preparing polyphenylene oxide composition and laminate using the composition |
JPH07165964A (ja) * | 1993-12-13 | 1995-06-27 | Sekisui Chem Co Ltd | 発泡体の製造方法 |
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JP4559342B2 (ja) | 2005-10-27 | 2010-10-06 | 積水化学工業株式会社 | 太陽電池用接着シート |
JP2009135200A (ja) | 2007-11-29 | 2009-06-18 | Bridgestone Corp | 太陽電池用封止膜及びこれを用いた太陽電池 |
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JPWO2014189019A1 (ja) * | 2013-05-21 | 2017-02-23 | 日本化成株式会社 | 太陽電池用封止剤および架橋助剤 |
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CN105164198B (zh) | 2017-05-31 |
JPWO2014129573A1 (ja) | 2017-02-02 |
EP2960291A1 (en) | 2015-12-30 |
JP5888466B2 (ja) | 2016-03-22 |
TWI564342B (zh) | 2017-01-01 |
US20150353784A1 (en) | 2015-12-10 |
WO2014129573A1 (ja) | 2014-08-28 |
CN105164198A (zh) | 2015-12-16 |
TW201446877A (zh) | 2014-12-16 |
KR102092570B1 (ko) | 2020-03-24 |
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US9428672B2 (en) | 2016-08-30 |
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