EP2910334A4 - POLISHING METHOD AND METHOD FOR PRODUCING AN ALLOYING MATERIAL - Google Patents

POLISHING METHOD AND METHOD FOR PRODUCING AN ALLOYING MATERIAL

Info

Publication number
EP2910334A4
EP2910334A4 EP13844066.4A EP13844066A EP2910334A4 EP 2910334 A4 EP2910334 A4 EP 2910334A4 EP 13844066 A EP13844066 A EP 13844066A EP 2910334 A4 EP2910334 A4 EP 2910334A4
Authority
EP
European Patent Office
Prior art keywords
alloy material
producing alloy
polishing
polishing method
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13844066.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2910334A1 (en
Inventor
Hitoshi Morinaga
Kazusei Tamai
Yutaka Niwano
Maiko Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of EP2910334A1 publication Critical patent/EP2910334A1/en
Publication of EP2910334A4 publication Critical patent/EP2910334A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP13844066.4A 2012-10-03 2013-10-01 POLISHING METHOD AND METHOD FOR PRODUCING AN ALLOYING MATERIAL Withdrawn EP2910334A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012221448 2012-10-03
PCT/JP2013/076647 WO2014054611A1 (ja) 2012-10-03 2013-10-01 研磨方法及び合金材料の製造方法

Publications (2)

Publication Number Publication Date
EP2910334A1 EP2910334A1 (en) 2015-08-26
EP2910334A4 true EP2910334A4 (en) 2016-08-03

Family

ID=50434937

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13844066.4A Withdrawn EP2910334A4 (en) 2012-10-03 2013-10-01 POLISHING METHOD AND METHOD FOR PRODUCING AN ALLOYING MATERIAL

Country Status (7)

Country Link
US (1) US20150251293A1 (ja)
EP (1) EP2910334A4 (ja)
JP (1) JPWO2014054611A1 (ja)
KR (1) KR20150065757A (ja)
CN (1) CN104684684A (ja)
TW (1) TW201424933A (ja)
WO (1) WO2014054611A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6415569B2 (ja) * 2014-08-07 2018-10-31 株式会社フジミインコーポレーテッド チタン合金材料研磨用組成物
JP6085708B1 (ja) * 2016-04-01 2017-02-22 株式会社フジミインコーポレーテッド 合金材料用研磨組成物及び合金材料の研磨方法
JP6760880B2 (ja) * 2017-03-31 2020-09-23 株式会社フジミインコーポレーテッド マグネシウム又はマグネシウム合金の研磨用組成物及びそれを用いた研磨方法
KR102349153B1 (ko) * 2019-12-16 2022-01-10 주식회사 포스코 알루미늄 합금용 연마 용액, 그 제조방법 및 이를 이용한 연마 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323254A (ja) * 2000-05-12 2001-11-22 Kao Corp 研磨液組成物
JP2004243518A (ja) * 2004-04-08 2004-09-02 Toshiba Corp 研摩装置
US20060112647A1 (en) * 2004-11-30 2006-06-01 Kao Corporation Polishing composition
US20070010098A1 (en) * 2005-06-30 2007-01-11 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
US20100227435A1 (en) * 2009-03-09 2010-09-09 Joon-Sang Park Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
JP2010205796A (ja) * 2009-02-27 2010-09-16 Ebara Corp 基板処理装置と方法、半導体製造装置、半導体製造装置エンジニアリングシステムとシステム
JP2011219358A (ja) * 2004-02-25 2011-11-04 Hoya Corp マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法、露光用マスクの製造方法、反射型マスクブランクスの製造方法、及び反射型マスクの製造方法
US20120058709A1 (en) * 2010-09-08 2012-03-08 Makoto Fukushima Polishing apparatus and method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246068A (ja) 1988-03-29 1989-10-02 Kobe Steel Ltd アルミニウム合金基板の鏡面仕上げ方法
JPH03228564A (ja) 1990-02-02 1991-10-09 Nkk Corp チタン製磁気ディスク基板の鏡面加工方法
JPH07142430A (ja) * 1993-09-24 1995-06-02 Fujitsu Ltd 半導体基板の研磨装置
JP3788810B2 (ja) * 1995-02-20 2006-06-21 株式会社東芝 研磨装置
US5597442A (en) * 1995-10-16 1997-01-28 Taiwan Semiconductor Manufacturing Company Ltd. Chemical/mechanical planarization (CMP) endpoint method using measurement of polishing pad temperature
JP2005056987A (ja) * 2003-08-01 2005-03-03 Nitta Haas Inc 研磨装置および研磨方法
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
CN101628389A (zh) * 2008-07-17 2010-01-20 西北工业大学 一种tc17钛合金平面磨削的方法
SG176151A1 (en) * 2009-05-27 2011-12-29 Rogers Corp Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer
JP2012148376A (ja) * 2011-01-20 2012-08-09 Ebara Corp 研磨方法及び研磨装置
US8821215B2 (en) * 2012-09-07 2014-09-02 Cabot Microelectronics Corporation Polypyrrolidone polishing composition and method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001323254A (ja) * 2000-05-12 2001-11-22 Kao Corp 研磨液組成物
JP2011219358A (ja) * 2004-02-25 2011-11-04 Hoya Corp マスクブランクス用ガラス基板の製造方法、マスクブランクスの製造方法、露光用マスクの製造方法、反射型マスクブランクスの製造方法、及び反射型マスクの製造方法
JP2004243518A (ja) * 2004-04-08 2004-09-02 Toshiba Corp 研摩装置
US20060112647A1 (en) * 2004-11-30 2006-06-01 Kao Corporation Polishing composition
US20070010098A1 (en) * 2005-06-30 2007-01-11 Cabot Microelectronics Corporation Use of CMP for aluminum mirror and solar cell fabrication
JP2010205796A (ja) * 2009-02-27 2010-09-16 Ebara Corp 基板処理装置と方法、半導体製造装置、半導体製造装置エンジニアリングシステムとシステム
US20100227435A1 (en) * 2009-03-09 2010-09-09 Joon-Sang Park Chemical-mechanical polishing method for polishing phase-change material and method of fabricating phase-change memory device using the same
US20120058709A1 (en) * 2010-09-08 2012-03-08 Makoto Fukushima Polishing apparatus and method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014054611A1 *

Also Published As

Publication number Publication date
JPWO2014054611A1 (ja) 2016-08-25
WO2014054611A1 (ja) 2014-04-10
CN104684684A (zh) 2015-06-03
US20150251293A1 (en) 2015-09-10
EP2910334A1 (en) 2015-08-26
TW201424933A (zh) 2014-07-01
KR20150065757A (ko) 2015-06-15

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