EP2815462B1 - Vorrichtung zur kontaktierung einer leiterplatte - Google Patents

Vorrichtung zur kontaktierung einer leiterplatte Download PDF

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Publication number
EP2815462B1
EP2815462B1 EP13702340.4A EP13702340A EP2815462B1 EP 2815462 B1 EP2815462 B1 EP 2815462B1 EP 13702340 A EP13702340 A EP 13702340A EP 2815462 B1 EP2815462 B1 EP 2815462B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
contact
contact elements
intake
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13702340.4A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2815462A1 (de
Inventor
Manfred RAHBERGER
Frank Tatzel
Steffen Thies
Roland NEUHAUSER
Tobias OBERHAUSER
Hauke SCHÜTT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP2815462A1 publication Critical patent/EP2815462A1/de
Application granted granted Critical
Publication of EP2815462B1 publication Critical patent/EP2815462B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/81—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to another cable except for flat or ribbon cable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/64—Means for preventing incorrect coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/22—End pieces terminating in a spring clip
    • H01R11/24—End pieces terminating in a spring clip with gripping jaws, e.g. crocodile clip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/771—Details
    • H01R12/774—Retainers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Definitions

  • the invention relates to a device for contacting a printed circuit board, which is to be connected at least temporarily with, for example, a measuring device or any circuit according to the preamble of claim 1.
  • the publication EP 0 131 410 A2 discloses an apparatus for reading an external memory card.
  • the memory card is inserted into a receptacle of a housing part and then the receptacle is pressed about a rotation axis in a contact state.
  • the publication US 2006/0279317 A1 describes a device for testing a test object.
  • the device has a movable pusher with a receptacle for receiving the test object for guiding the test object into an electrical contact position.
  • the present invention seeks to provide a device that allows a simple, fast contacting a circuit board and in particular avoids the use of high plug or contact forces, so that damage to the circuit board can be avoided even then when the circuit board is built on a flexible carrier plate.
  • the invention is based on the idea to contact a circuit board quickly, easily, safely and in particular under the action of low contact forces with mating contacts by first fixed the circuit board or the corresponding portion to be contacted the circuit board in a receptacle and then by a guided movement or Moving the circuit board or the relevant portion, preferably fixed in the receptacle, contacting of printed circuit board and contact elements is effected.
  • the device further comprises (at least) a centering element, through which the circuit board is centered before contacting the contact elements. This is preferably done by the guided movement or displacement of the printed circuit board relative to the contact elements.
  • (at least) one (preferably tapered in at least one section) centering be provided on which an opening of the circuit board is pushed, whereby it is centered. This can ensure that the conductor tracks of the printed circuit board are aligned exactly with the associated contact elements.
  • At least two centering pins can be provided, which differ with respect to their shape, arrangement and / or dimensioning and can engage in correspondingly arranged and / or dimensioned openings of the printed circuit board.
  • a coding can be created that can prevent incorrect insertion of the circuit board.
  • the circuit board is moved or moved together with the receptacle to contact the contact elements.
  • the circuit board is moved or moved together with the receptacle to contact the contact elements.
  • the receptacle is resiliently mounted. This can be achieved on the one hand, that the recording in the unloaded state, i. if it is not acted upon by the means for moving with a force causing a movement, is acted upon by the resilient mounting in an initial position in which the circuit board does not contact the contact elements. This can ensure that the circuit board does not make contact with the contact elements when plugged into the receptacle.
  • the displacement of the printed circuit board including the receptacle with the aim of contacting the contact elements can then take place counter to the reaction force of the resilient mounting of the recording.
  • the spring preload generated thereby can also be used to fix the circuit board in the contact elements contacting position (contact position).
  • the device according to the invention has a housing with a first housing part forming the receptacle and a second housing part comprising the contact elements, wherein the two housing parts are rotatable relative to one another.
  • the two housing parts are connected to each other such that in a first rotational position inserted into the recording circuit board would contact the contact elements and contacted and in a second rotational position inserted into the recording circuit board contact elements would not contact or joriert.Weiterhin are the both housing parts acted upon by means of a spring element in the first rotational position.
  • the two housing parts would then rotated relative to each other in the second rotational position (eg manually), so that insertion of the circuit board without contacting the contact elements can be done. Relieving the two housing parts can then cause the two housing parts are automatically moved due to the spring load in the first rotational position and are fixed in this by the spring load.
  • At least one DC contact element can be provided for the transmission of direct current.
  • the HF contact element may advantageously comprise a center contact part which is arranged coplanar between two outer contact parts.
  • coaxial cables are advantageously suitable for the transmission of high-frequency signals, it may furthermore be preferred for the center contact part to be electrically connected to an inner conductor and the outer contact parts to be electrically connected to an outer conductor of a coaxial cable which leaves the device.
  • the device or the RF contact element (s) can be connected, for example, to a measuring device.
  • the DC contact element can be electrically connected to a preferably flat flexible conductor which leads away from the device.
  • This can be characterized by low costs and a small footprint.
  • a direct contact with one or more copper strands is also possible.
  • RF signals high-frequency signals
  • the in the Fig. 1 to 5 Device shown comprises a housing 1. Within the housing 1, a support plate 2 is arranged, on the surface of which a plurality of electrical contact elements 3 are arranged. Each of these contact elements 3 is connected to a signal line 4, which are led out through an opening on one side of the housing 1 from this.
  • the signal lines 4 may, for example, lead to a measuring device (not shown) via which a functional test of a printed circuit board 5 is to take place. For the functional test is provided to contact the printed circuit board 5 defined with the contact elements 3, so that each of the contact elements 3 a e predetermined position on one of Conductors of the circuit board 5 contacted.
  • one end of the printed circuit board 5 is inserted into a receptacle 6 which is formed by a receiving element 7 arranged inside the housing 1.
  • the receiving element 7, which is preferably made of plastic, comprises two parts (cf. Fig. 5 ), the receptacle 6 and a resiliently connected mounting plate 8, which is fixed immovably within the housing 1.
  • the receptacle 6 is designed so that it at least partially encloses the inserted therein portion of the circuit board 5 on five sides (plug-side end, top, both side surfaces and bottom) and in particular leaves free only a portion on its underside, on which the to be contacted interconnects are located.
  • the circuit board 5 is inserted so far into the receiving slot formed by the receptacle 6 until its end abuts the bottom of the receiving slot.
  • the device further comprises an actuating element in the form of a slider 9.
  • the slider 9 forms a survey 10, which is guided in a corresponding recess of the housing 1. By means of the elevation 10, the slider 9 can be moved manually in the directions defined by the recess of the housing 1. Parallel grooves in the surface of the survey 10 ensure sufficient slip resistance when the slide is operated, for example, with the thumb of one hand.
  • the circuit board 5 is first positioned exactly to the contact elements 3 by several s pitz tapered positioning pins (not shown) in corresponding positioning holes of the circuit board 5 (see. Fig. 1 ) intervene. Only after the intervention of the positioning pins in the positioning and the resulting positioning of the circuit board 5, ie after a further pivoting of the receptacle 6 and the recorded portion of the circuit board 5, contacting the arranged on the underside of the circuit board 5 interconnects with the contact elements 3. This ensures that the contacting takes place exactly at the intended positions of the tracks.
  • the frictional fixing of the slide 9 is effected by the friction which prevails between contact surfaces of the slide 9 and associated contact surfaces of the housing 1 and the receiving element 7.
  • This friction can readily be chosen so large that the desired non-positive fixation is achieved, since the slider 9 is clamped by the resilient loading of the receptacle 6 between this and the housing 1.
  • This resilient load not only results from the deformation of the connection of the receptacle 6 to the mounting plate 8, but in addition from restoring forces that transmit the contact elements 3 on the circuit board 5 and this in turn on the receptacle 6.
  • the contact elements 3 can be resiliently mounted or in the form of spring contact pins, in which at least two parts against the bias of a spring element (in particular telescopically) are mutually displaceable, be formed.
  • the contact elements 3 may be formed, for example, as conventional coplanar LIGA contacts. If, on the other hand, a transfer of direct current takes place, the contacts may in particular be conventional Fe derromeroche. Of course, a combination of different contact elements (e.g., LIGA contacts and spring contact pins) may also be used.
  • the in the Fig. 6 to 13 illustrated embodiment of a device according to the invention comprises a two-part housing.
  • a main body 11 (second housing part) of the housing is part of a lower part of the device.
  • a cover 12 (first housing part) of the housing is part of an upper part of the device.
  • Base body 11 and lid 12 are pivotally connected to each other via two cylindrical dowel pins 13.
  • the main body 11 of the housing forms a receiving recess, in which two (electrically conductive) RF contact elements 14 are arranged.
  • the RF contact elements 14 are formed as coplanar contact elements made of metal and each comprise a center contact part 15 and two laterally adjacent to the center contact part 15 arranged outer contact parts 16 in coplanar alignment.
  • Their position relative to one another is secured by two respective insulation bodies 17 which are fastened to the RF contact elements 14 in the vicinity of the cable end (for example by gluing).
  • the HF contact elements 14 are connected to the base body 11 of the housing (for example adhesively bonded).
  • the contact points of the HF contact elements 14 formed on the contact-side end can be in contact with associated contact points of a printed circuit board 18 to be tested (cf. Fig. 8 ) Dodge spring loaded. This provides for a defined contact pressure and for one Tolerance compensation.
  • the RF contact elements 14 are each connected to a coaxial cable 19.
  • an end tapered inner conductor 20 of each coaxial cable 19 contacts the center contact part 15 of the associated RF contact elements 14, while the two outer contact parts 16 of each of the RF contact elements 14 (via the electrically conductive base body 11) with an outer conductor 39 of the associated coaxial cable 19 electrically are conductively connected.
  • High-frequency signals are to be transmitted between the printed circuit board 18 and a measuring device (not shown) via the HF contact elements 14 and the coaxial cables 19.
  • a measuring device not shown
  • the main body 11 of the housing in an electrically conductive manner, for example made of metal or else of a metallised (for example metallic coated) plastic.
  • the design of the RF contact elements 14 as KoplanarKeyimplantation and the transmission by means of the coaxial cable 19 contributes to a good shielding of the high-frequency signals.
  • the main body 11 also comprises two positioning pins 21, which engage in associated positioning openings 22 of the printed circuit board 18 in order to position them exactly in the device and to fix them therein. Different diameters of the two positioning pins / positioning pairs ensure that the printed circuit board 18 is inserted into the device in the correct orientation.
  • the lower part of the device further comprises a spring element in the form of a spring comb 23 (see. Fig. 11 ).
  • This has a base body, via which the spring comb 23 is fixed to the base body 11 of the housing.
  • a plurality of spring fingers 24 extend from the base body.
  • the spring comb 23 is intended to ensure reliable contacting of the printed circuit board 18 with contact regions (DC contact elements) formed by the upper part of the device.
  • Two lateral support arms 25 prevent tilting of the spring comb 23 at a load of the spring fingers 24.
  • the spring comb 23 may advantageously be formed of plastic.
  • the cover 12 of the housing forms a receptacle 26 for the printed circuit board 18.
  • Two lateral guide slots 27 lead the insertion and withdrawal movement of the printed circuit board 18.
  • a flex board 28 (flat conductor) protrudes with one of its ends into the receptacle 26.
  • the end contact areas (DC contact elements 30) form. These should contact the associated contact areas of printed conductors 31 of the printed circuit board 18.
  • the cover 12 of the housing can therefore also advantageously be made of plastic (for example thermoplastic).
  • the flexplate 28 has positioning openings for its positioning and fixing, in which positioning pins 32 of the cover 12 protrude.
  • the attachment of the flex board 28 to the cover 12 is also carried out by a distortion between the lid 12 and a spring element 33 with the interposition of an elastomeric element 34.
  • the connection of these elements with the lid 12 can be done for example by formed by the lid 12 rivet dome 35, which extend through attachment openings of the spring element 33.
  • the free ends of the rivet domes 35 can then be deformed thermally or by pressure, thereby increasing their diameter in the end region. This results in a positive connection with the spring element 33.
  • the deformation of the rivet mandrel 35 takes place with simultaneous application of pressure to the spring element 33 and consequent compression of the elastomeric element 34, which remains at least partially upright after forming the rivet mandrel 35.
  • the housing or the device In the assembled state of the device acts as a leg spring spring element 33, the housing or the device in its closed position (first rotational position), as shown for example in the Fig. 1 is shown. In this position, the circuit board 18 can not be inserted into the receptacle 26, since the positioning pins 21 protrude into the receptacle 26.
  • the housing can be relieved.
  • the spring element 33 then moves the two housing parts back into their closed position and holds (fixes) it in this position.
  • the positioning pins 21 of the lower part engage in the positioning openings 22 of the printed circuit board 18.
  • the printed circuit board 18 is thereby accurately positioned and fixed in the device.
  • Two stop pins 36 rest against the printed circuit board 18 and thus limit the elastic deformation of the RF contact elements 14, whereby their damage can be avoided.
  • the RF contact elements 14 protrude beyond the stop pins 36 by a defined amount.
  • the elastically deformed by the closing of the device spring fingers 24 of the spring comb 23 provide for a sufficient contact pressure and a tolerance compensation.
  • a spring finger 24 is provided per DC contact pair. This can ensure that each DC contact pair loaded even with a flexible support plate 38 of the circuit board 18 with the required contact pressure and for each individual tolerance compensation is achieved.
  • a corresponding functionality can also be achieved by a (not shown) spring element as a substitute for the spring comb 23 having a common spring body (eg in the form of a leg spring), wherein on the circuit board 18 facing edge (as a continuous pressure edge) individual contact knobs an elastic material are applied.
  • the spring body can then provide substantially for the contact pressure, while the contact knobs ensure the individual tolerance compensation.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
EP13702340.4A 2012-02-17 2013-01-24 Vorrichtung zur kontaktierung einer leiterplatte Active EP2815462B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202012001645U DE202012001645U1 (de) 2012-02-17 2012-02-17 Vorrichtung zur Kontaktierung einer Leiterplatte
PCT/EP2013/000214 WO2013120580A1 (de) 2012-02-17 2013-01-24 Vorrichtung zur kontaktierung einer leiterplatte

Publications (2)

Publication Number Publication Date
EP2815462A1 EP2815462A1 (de) 2014-12-24
EP2815462B1 true EP2815462B1 (de) 2018-08-08

Family

ID=47632970

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13702340.4A Active EP2815462B1 (de) 2012-02-17 2013-01-24 Vorrichtung zur kontaktierung einer leiterplatte

Country Status (10)

Country Link
US (1) US9240643B2 (ko)
EP (1) EP2815462B1 (ko)
JP (1) JP6254537B2 (ko)
KR (1) KR101901743B1 (ko)
CN (1) CN104115336B (ko)
CA (1) CA2876631C (ko)
DE (1) DE202012001645U1 (ko)
HK (1) HK1201993A1 (ko)
TW (1) TWM462374U (ko)
WO (1) WO2013120580A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9568499B2 (en) * 2013-11-22 2017-02-14 Tektronix, Inc. High performance LIGA spring interconnect system for probing application
US9142903B2 (en) * 2013-11-22 2015-09-22 Tektronix, Inc. High performance multiport connector system using LIGA springs
CN104319505B (zh) * 2014-11-17 2018-01-19 合肥京东方光电科技有限公司 柔性印刷电路板插接治具
JP6821918B2 (ja) * 2016-02-18 2021-01-27 大日本印刷株式会社 導光板及び表示装置
US10847912B2 (en) 2018-03-19 2020-11-24 Rohde & Schwarz Gmbh & Co. Kg Broadband socket connector, broadband plug connector, and system thereof
TWI718610B (zh) * 2018-08-09 2021-02-11 日商歐姆龍股份有限公司 探針單元
CN114062903A (zh) * 2021-12-17 2022-02-18 深圳市微特精密科技股份有限公司 一种HSBP背板和PCIE Switch板多模式兼容测试装置
CN114778902B (zh) * 2022-06-27 2022-11-11 武汉永鼎光通科技有限公司 Pcba加电测试装置及防止过插的夹具

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0131410A2 (en) * 1983-07-06 1985-01-16 Tokyo Tatsuno Company Limited Device for reading and writing IC-external storage card

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1174063A (fr) * 1957-03-30 1959-03-05 Coupleurs électriques à bornes
FR2492213A1 (fr) * 1980-10-15 1982-04-16 Labo Electronique Physique Boitier pour carte porteuse d'information muni d'un systeme de verrouillage de ladite carte
JPS5972753U (ja) * 1982-11-04 1984-05-17 株式会社東芝 付属機器
JPS59187162U (ja) * 1983-05-30 1984-12-12 三菱電機株式会社 プリント配線板装置
JPS6022795A (ja) * 1983-07-18 1985-02-05 Tokyo Tatsuno Co Ltd 板状記憶媒体の読取り・書込み装置
US4700997A (en) * 1986-11-14 1987-10-20 Minnesota Mining And Manufacturing Company Electrical connector
GB2235078B (en) * 1989-08-19 1993-09-08 Technophone Ltd Card reader
US6447305B1 (en) * 1996-05-14 2002-09-10 Miraco, Inc. Circuit to printed circuit board stored energy connector
JP2000277218A (ja) * 1999-03-19 2000-10-06 Ace Five:Kk ケーブル組立体
US6447317B1 (en) * 2001-07-11 2002-09-10 Hon Hai Precision Ind. Co., Ltd. Backplane connector
US6623312B2 (en) * 2001-10-04 2003-09-23 Unilead International Precordial electrocardiogram electrode connector
JP3976276B2 (ja) * 2005-06-10 2007-09-12 日本航空電子工業株式会社 検査装置
JP4558588B2 (ja) * 2005-06-14 2010-10-06 第一電子工業株式会社 コネクタ
JP2008135209A (ja) * 2006-11-27 2008-06-12 Fujifilm Corp クリップ式コネクタ
JP4908374B2 (ja) * 2007-10-17 2012-04-04 日本航空電子工業株式会社 コネクタ装置
JP5436088B2 (ja) * 2008-08-19 2014-03-05 矢崎総業株式会社 フレキシブル集約配線コネクタ
US20100105230A1 (en) * 2008-10-23 2010-04-29 Sony Ericsson Mobile Communications Ab Connector
JP5410872B2 (ja) * 2009-07-27 2014-02-05 モレックス インコーポレイテド ハイブリッドコネクタ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0131410A2 (en) * 1983-07-06 1985-01-16 Tokyo Tatsuno Company Limited Device for reading and writing IC-external storage card

Also Published As

Publication number Publication date
WO2013120580A1 (de) 2013-08-22
CA2876631A1 (en) 2013-08-22
CN104115336B (zh) 2017-02-22
CN104115336A (zh) 2014-10-22
KR101901743B1 (ko) 2018-09-28
EP2815462A1 (de) 2014-12-24
KR20140125442A (ko) 2014-10-28
JP2015507341A (ja) 2015-03-05
DE202012001645U1 (de) 2013-05-21
TWM462374U (zh) 2013-09-21
HK1201993A1 (en) 2015-09-11
CA2876631C (en) 2018-04-10
US9240643B2 (en) 2016-01-19
JP6254537B2 (ja) 2017-12-27
US20150024619A1 (en) 2015-01-22

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