EP2746876A3 - Herstellungstechniken zur Verbesserung der Druckgleichförmigkeit in anodisch gebundenen Dampfzellen - Google Patents
Herstellungstechniken zur Verbesserung der Druckgleichförmigkeit in anodisch gebundenen Dampfzellen Download PDFInfo
- Publication number
- EP2746876A3 EP2746876A3 EP13181421.2A EP13181421A EP2746876A3 EP 2746876 A3 EP2746876 A3 EP 2746876A3 EP 13181421 A EP13181421 A EP 13181421A EP 2746876 A3 EP2746876 A3 EP 2746876A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- wafer
- anodically bonded
- fabrication techniques
- diameter
- sacrificial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04F—TIME-INTERVAL MEASURING
- G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
- G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
- G04F5/145—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks using Coherent Population Trapping
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Ecology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
- Ceramic Products (AREA)
- Micromachines (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/662,850 US8941442B2 (en) | 2010-02-04 | 2012-10-29 | Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2746876A2 EP2746876A2 (de) | 2014-06-25 |
EP2746876A3 true EP2746876A3 (de) | 2018-01-10 |
EP2746876B1 EP2746876B1 (de) | 2019-04-10 |
Family
ID=49028964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13181421.2A Active EP2746876B1 (de) | 2012-10-29 | 2013-08-22 | Herstellungstechniken zur Verbesserung der Druckgleichförmigkeit in anodisch gebundenen Dampfzellen und Mikroplättchenstruktur dazu |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2746876B1 (de) |
JP (1) | JP6198522B2 (de) |
CN (1) | CN103792838B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6488599B2 (ja) | 2014-09-08 | 2019-03-27 | セイコーエプソン株式会社 | 量子干渉装置、原子セルの製造方法および電子機器 |
JP6852377B2 (ja) * | 2016-12-12 | 2021-03-31 | 株式会社村田製作所 | 原子発振器および電子機器 |
CN107128871B (zh) * | 2017-05-10 | 2019-04-05 | 中国电子科技集团公司第四十九研究所 | 一种基于mems原子芯片的物理封装件及其封装方法 |
US10544039B2 (en) * | 2017-09-08 | 2020-01-28 | Texas Instruments Incorporated | Methods for depositing a measured amount of a species in a sealed cavity |
JP2019165332A (ja) * | 2018-03-19 | 2019-09-26 | 株式会社リコー | 電子デバイスおよび原子発振器 |
JP7232510B2 (ja) * | 2019-01-31 | 2023-03-03 | 国立研究開発法人情報通信研究機構 | 量子光学装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1591846A2 (de) * | 2004-04-26 | 2005-11-02 | Northrop Grumman Corporation | Mittelschicht für Matrizeanordnung mit einem alkalimetalgefüllten Hohlraum |
US20060022761A1 (en) * | 2004-07-16 | 2006-02-02 | Abeles Joseph H | Chip-scale atomic clock (CSAC) and method for making same |
JP2009212416A (ja) * | 2008-03-06 | 2009-09-17 | Epson Toyocom Corp | ガスセルの製造方法及びガスセル |
JP2009215099A (ja) * | 2008-03-10 | 2009-09-24 | Konica Minolta Holdings Inc | 陽極接合方法及び液滴吐出ヘッドの製造方法 |
EP2362281A2 (de) * | 2010-02-04 | 2011-08-31 | Honeywell International Inc. | Herstellungstechniken zur Verbesserung der Druckgleichförmigkeit in anodisch gebundenen Dampfzellen |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005016965A (ja) * | 2003-06-23 | 2005-01-20 | Sumitomo Precision Prod Co Ltd | パッケージおよびその製造方法、ならびに振動ジャイロおよびその製造方法 |
US7400207B2 (en) * | 2004-01-06 | 2008-07-15 | Sarnoff Corporation | Anodically bonded cell, method for making same and systems incorporating same |
JP5121493B2 (ja) * | 2008-02-21 | 2013-01-16 | セイコーインスツル株式会社 | 圧電振動子の製造方法 |
CN101407372B (zh) * | 2008-11-07 | 2011-01-12 | 清华大学 | 一种原子蒸气泡的制作方法 |
CN101598772B (zh) * | 2009-06-26 | 2011-12-07 | 中北大学 | 微型原子蒸汽泡制作方法 |
JP5421690B2 (ja) * | 2009-08-12 | 2014-02-19 | セイコーインスツル株式会社 | パッケージの製造方法 |
US20110187464A1 (en) * | 2010-02-04 | 2011-08-04 | Honeywell International Inc. | Apparatus and methods for alkali vapor cells |
US8242851B2 (en) * | 2010-02-04 | 2012-08-14 | Honeywell International Inc. | Processes for stabilizing a VCSEL in a chip-scale atomic clock |
JP2012191138A (ja) * | 2011-03-14 | 2012-10-04 | Seiko Epson Corp | ガスセルユニット、原子発振器および電子装置 |
-
2013
- 2013-08-22 EP EP13181421.2A patent/EP2746876B1/de active Active
- 2013-08-27 JP JP2013175327A patent/JP6198522B2/ja active Active
- 2013-08-29 CN CN201310383281.9A patent/CN103792838B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1591846A2 (de) * | 2004-04-26 | 2005-11-02 | Northrop Grumman Corporation | Mittelschicht für Matrizeanordnung mit einem alkalimetalgefüllten Hohlraum |
US20060022761A1 (en) * | 2004-07-16 | 2006-02-02 | Abeles Joseph H | Chip-scale atomic clock (CSAC) and method for making same |
JP2009212416A (ja) * | 2008-03-06 | 2009-09-17 | Epson Toyocom Corp | ガスセルの製造方法及びガスセル |
JP2009215099A (ja) * | 2008-03-10 | 2009-09-24 | Konica Minolta Holdings Inc | 陽極接合方法及び液滴吐出ヘッドの製造方法 |
EP2362281A2 (de) * | 2010-02-04 | 2011-08-31 | Honeywell International Inc. | Herstellungstechniken zur Verbesserung der Druckgleichförmigkeit in anodisch gebundenen Dampfzellen |
Non-Patent Citations (2)
Title |
---|
DOUAHI A ET AL: "New Vapor Cell Technology for Chip Scale Atomic Clock", FREQUENCY CONTROL SYMPOSIUM, 2007 JOINT WITH THE 21ST EUROPEAN FREQUEN CY AND TIME FORUM. IEEE INTERNATIONAL, IEEE, PI, 1 May 2007 (2007-05-01), pages 58 - 61, XP031137920, ISBN: 978-1-4244-0646-3 * |
R F WOHENBUTTEL ET AL: "Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature", SENSORS AND ACHCATORS A, vol. 43, 1 January 1994 (1994-01-01), pages 22 - 29, XP055429214 * |
Also Published As
Publication number | Publication date |
---|---|
CN103792838B (zh) | 2017-08-11 |
EP2746876A2 (de) | 2014-06-25 |
EP2746876B1 (de) | 2019-04-10 |
JP2014088308A (ja) | 2014-05-15 |
JP6198522B2 (ja) | 2017-09-20 |
CN103792838A (zh) | 2014-05-14 |
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