EP2746876A3 - Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells - Google Patents

Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells Download PDF

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Publication number
EP2746876A3
EP2746876A3 EP13181421.2A EP13181421A EP2746876A3 EP 2746876 A3 EP2746876 A3 EP 2746876A3 EP 13181421 A EP13181421 A EP 13181421A EP 2746876 A3 EP2746876 A3 EP 2746876A3
Authority
EP
European Patent Office
Prior art keywords
wafer
anodically bonded
fabrication techniques
diameter
sacrificial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13181421.2A
Other languages
German (de)
French (fr)
Other versions
EP2746876B1 (en
EP2746876A2 (en
Inventor
Daniel W. Younger
Jeff A. Ridley
Son T. Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/662,850 external-priority patent/US8941442B2/en
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of EP2746876A2 publication Critical patent/EP2746876A2/en
Publication of EP2746876A3 publication Critical patent/EP2746876A3/en
Application granted granted Critical
Publication of EP2746876B1 publication Critical patent/EP2746876B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04F—TIME-INTERVAL MEASURING
    • G04F5/00—Apparatus for producing preselected time intervals for use as timing standards
    • G04F5/14—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks
    • G04F5/145—Apparatus for producing preselected time intervals for use as timing standards using atomic clocks using Coherent Population Trapping

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  • Life Sciences & Earth Sciences (AREA)
  • Ecology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Ceramic Products (AREA)
  • Micromachines (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

A method of fabricating one or more vapor cells comprises forming one or more vapor cell dies in a first wafer having a first diameter, and anodically bonding a second wafer to a first side of the first wafer over the vapor cell dies, the second wafer having a second diameter. A third wafer is positioned over the vapor cell dies on a second side of the first wafer opposite from the second wafer, with the third wafer having a third diameter. A sacrificial wafer is placed over the third wafer, with the sacrificial wafer having a diameter that is larger than the first, second and third diameters. A metallized bond plate is located over the sacrificial wafer. The third wafer is anodically bonded to the second side of the first wafer when a voltage is applied to the metallized bond plate while the sacrificial wafer is in place.
EP13181421.2A 2012-10-29 2013-08-22 Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells and corresponding wafer structure Active EP2746876B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/662,850 US8941442B2 (en) 2010-02-04 2012-10-29 Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells

Publications (3)

Publication Number Publication Date
EP2746876A2 EP2746876A2 (en) 2014-06-25
EP2746876A3 true EP2746876A3 (en) 2018-01-10
EP2746876B1 EP2746876B1 (en) 2019-04-10

Family

ID=49028964

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13181421.2A Active EP2746876B1 (en) 2012-10-29 2013-08-22 Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells and corresponding wafer structure

Country Status (3)

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EP (1) EP2746876B1 (en)
JP (1) JP6198522B2 (en)
CN (1) CN103792838B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6488599B2 (en) 2014-09-08 2019-03-27 セイコーエプソン株式会社 Quantum interferometer, atomic cell manufacturing method, and electronic apparatus
JP6852377B2 (en) * 2016-12-12 2021-03-31 株式会社村田製作所 Atomic oscillators and electronics
CN107128871B (en) * 2017-05-10 2019-04-05 中国电子科技集团公司第四十九研究所 A kind of physical package part and its packaging method based on MEMS Atom Chip
US10544039B2 (en) * 2017-09-08 2020-01-28 Texas Instruments Incorporated Methods for depositing a measured amount of a species in a sealed cavity
JP2019165332A (en) * 2018-03-19 2019-09-26 株式会社リコー Electronic device and atomic oscillator
JP7232510B2 (en) * 2019-01-31 2023-03-03 国立研究開発法人情報通信研究機構 quantum optics

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1591846A2 (en) * 2004-04-26 2005-11-02 Northrop Grumman Corporation Middle layer of die structure that comprises a cavity that holds an alkali metal
US20060022761A1 (en) * 2004-07-16 2006-02-02 Abeles Joseph H Chip-scale atomic clock (CSAC) and method for making same
JP2009212416A (en) * 2008-03-06 2009-09-17 Epson Toyocom Corp Method of manufacturing gas cell, and gas cell
JP2009215099A (en) * 2008-03-10 2009-09-24 Konica Minolta Holdings Inc Anode bonding method and method for manufacturing droplet delivery head
EP2362281A2 (en) * 2010-02-04 2011-08-31 Honeywell International Inc. Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005016965A (en) * 2003-06-23 2005-01-20 Sumitomo Precision Prod Co Ltd Package and manufacturing method thereof, vibrating gyroscope and manufacturing method thereof
US7400207B2 (en) * 2004-01-06 2008-07-15 Sarnoff Corporation Anodically bonded cell, method for making same and systems incorporating same
JP5121493B2 (en) * 2008-02-21 2013-01-16 セイコーインスツル株式会社 Method for manufacturing piezoelectric vibrator
CN101407372B (en) * 2008-11-07 2011-01-12 清华大学 Method for manufacturing atomic vapour bubble
CN101598772B (en) * 2009-06-26 2011-12-07 中北大学 Micro atom steam bubble making method
JP5421690B2 (en) * 2009-08-12 2014-02-19 セイコーインスツル株式会社 Package manufacturing method
US20110187464A1 (en) * 2010-02-04 2011-08-04 Honeywell International Inc. Apparatus and methods for alkali vapor cells
US8242851B2 (en) * 2010-02-04 2012-08-14 Honeywell International Inc. Processes for stabilizing a VCSEL in a chip-scale atomic clock
JP2012191138A (en) * 2011-03-14 2012-10-04 Seiko Epson Corp Gas cell unit, atomic oscillator and electronic apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1591846A2 (en) * 2004-04-26 2005-11-02 Northrop Grumman Corporation Middle layer of die structure that comprises a cavity that holds an alkali metal
US20060022761A1 (en) * 2004-07-16 2006-02-02 Abeles Joseph H Chip-scale atomic clock (CSAC) and method for making same
JP2009212416A (en) * 2008-03-06 2009-09-17 Epson Toyocom Corp Method of manufacturing gas cell, and gas cell
JP2009215099A (en) * 2008-03-10 2009-09-24 Konica Minolta Holdings Inc Anode bonding method and method for manufacturing droplet delivery head
EP2362281A2 (en) * 2010-02-04 2011-08-31 Honeywell International Inc. Fabrication techniques to enhance pressure uniformity in anodically bonded vapor cells

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DOUAHI A ET AL: "New Vapor Cell Technology for Chip Scale Atomic Clock", FREQUENCY CONTROL SYMPOSIUM, 2007 JOINT WITH THE 21ST EUROPEAN FREQUEN CY AND TIME FORUM. IEEE INTERNATIONAL, IEEE, PI, 1 May 2007 (2007-05-01), pages 58 - 61, XP031137920, ISBN: 978-1-4244-0646-3 *
R F WOHENBUTTEL ET AL: "Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature", SENSORS AND ACHCATORS A, vol. 43, 1 January 1994 (1994-01-01), pages 22 - 29, XP055429214 *

Also Published As

Publication number Publication date
JP6198522B2 (en) 2017-09-20
JP2014088308A (en) 2014-05-15
EP2746876B1 (en) 2019-04-10
CN103792838A (en) 2014-05-14
CN103792838B (en) 2017-08-11
EP2746876A2 (en) 2014-06-25

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