EP2727898A4 - Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat pour circuit céramique, substrat pour circuit maître céramique, et module d'alimentation à semi-conducteurs - Google Patents

Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat pour circuit céramique, substrat pour circuit maître céramique, et module d'alimentation à semi-conducteurs

Info

Publication number
EP2727898A4
EP2727898A4 EP12803785.0A EP12803785A EP2727898A4 EP 2727898 A4 EP2727898 A4 EP 2727898A4 EP 12803785 A EP12803785 A EP 12803785A EP 2727898 A4 EP2727898 A4 EP 2727898A4
Authority
EP
European Patent Office
Prior art keywords
circuit substrate
filler metal
brazing filler
ceramic
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12803785.0A
Other languages
German (de)
English (en)
Other versions
EP2727898A1 (fr
EP2727898B1 (fr
EP2727898A9 (fr
Inventor
Hisayuki Imamura
Suguru Fujita
Junichi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Publication of EP2727898A1 publication Critical patent/EP2727898A1/fr
Publication of EP2727898A9 publication Critical patent/EP2727898A9/fr
Publication of EP2727898A4 publication Critical patent/EP2727898A4/fr
Application granted granted Critical
Publication of EP2727898B1 publication Critical patent/EP2727898B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/023—Hydrogen absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6562—Heating rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6565—Cooling rate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/128—The active component for bonding being silicon
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/368—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59—Aspects relating to the structure of the interlayer
    • C04B2237/597—Aspects relating to the structure of the interlayer whereby the interlayer is continuous but porous, e.g. containing hollow or porous particles, macro- or micropores or cracks
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/706—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the metallic layers or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Composite Materials (AREA)
  • Structural Engineering (AREA)
  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
EP12803785.0A 2011-06-30 2012-07-02 Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat céramique pour circuit et substrat maître céramique pour circuit Active EP2727898B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011146708 2011-06-30
PCT/JP2012/066859 WO2013002407A1 (fr) 2011-06-30 2012-07-02 Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat pour circuit céramique, substrat pour circuit maître céramique, et module d'alimentation à semi-conducteurs

Publications (4)

Publication Number Publication Date
EP2727898A1 EP2727898A1 (fr) 2014-05-07
EP2727898A9 EP2727898A9 (fr) 2014-08-20
EP2727898A4 true EP2727898A4 (fr) 2016-03-23
EP2727898B1 EP2727898B1 (fr) 2017-02-01

Family

ID=47424292

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12803785.0A Active EP2727898B1 (fr) 2011-06-30 2012-07-02 Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat céramique pour circuit et substrat maître céramique pour circuit

Country Status (5)

Country Link
US (1) US9780011B2 (fr)
EP (1) EP2727898B1 (fr)
JP (1) JP5725178B2 (fr)
CN (1) CN103619779B (fr)
WO (1) WO2013002407A1 (fr)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2480052B1 (fr) * 2009-09-15 2017-08-09 Kabushiki Kaisha Toshiba Carte de circuit céramique et procédé de fabrication associé
US9504144B2 (en) 2012-02-01 2016-11-22 Mitsubishi Materials Corporation Power module substrate, power module substrate with heat sink, power module, method of manufacturing power module substrate, and copper member-bonding paste
EP2861046B1 (fr) * 2013-08-15 2016-11-16 Hitachi Metals, Ltd. Procédé de fabrication de carte de circuit en céramique et carte de circuit en céramique
CN106255674B (zh) * 2014-04-30 2019-11-01 日本碍子株式会社 陶瓷部件与金属部件的接合体及其制法
JP6797018B2 (ja) * 2014-07-24 2020-12-09 デンカ株式会社 ろう材及びこれを用いたセラミック基板
WO2016068272A1 (fr) * 2014-10-31 2016-05-06 三菱マテリアル株式会社 Pâte de scellement, matériau de liaison par soudure ainsi que procédé de fabrication de celui-ci, matériau de couverture pour scellement ainsi que procédé de fabrication de celui-ci, et procédé de scellement de boîtier
US9731384B2 (en) * 2014-11-18 2017-08-15 Baker Hughes Incorporated Methods and compositions for brazing
KR20160061182A (ko) * 2014-11-21 2016-05-31 현대자동차주식회사 은 페이스트의 접합 방법
CN108026355B (zh) * 2015-03-19 2020-05-12 衡所华威电子有限公司 环氧树脂组合物、其制备和用途
JP6646394B2 (ja) * 2015-09-28 2020-02-14 京セラ株式会社 ろう付け用ペースト組成物
WO2017108939A1 (fr) * 2015-12-22 2017-06-29 Heraeus Deutschland GmbH & Co. KG Céramiques liées à des feuilles métalliques ou à des feuilles hybrides à base d'un métal par l'intermédiaire d'une pâte en film épais
JP2017135374A (ja) * 2016-01-22 2017-08-03 三菱マテリアル株式会社 接合体、パワーモジュール用基板、パワーモジュール、接合体の製造方法及びパワーモジュール用基板の製造方法
US9682445B1 (en) * 2016-02-12 2017-06-20 The Boeing Company Diffusion-bonded metallic materials
US10252371B2 (en) 2016-02-12 2019-04-09 The Boeing Company Diffusion-bonded metallic materials
EP3216545B2 (fr) * 2016-03-07 2022-09-28 Heraeus Deutschland GmbH & Co. KG Poudre en metal noble et son utilisation pour la fabrication de composants
JP2017217694A (ja) * 2016-06-10 2017-12-14 京セラ株式会社 銀ロウペースト組成物
CN105921908A (zh) * 2016-06-23 2016-09-07 国网江苏省电力公司宿迁供电公司 一种银钎焊料及其制备方法
JP6799479B2 (ja) * 2017-03-03 2020-12-16 Ｄｏｗａメタルテック株式会社 金属−セラミックス回路基板の製造方法
KR102504621B1 (ko) * 2017-05-30 2023-02-27 덴카 주식회사 세라믹스 회로 기판 및 그것을 사용한 모듈
JP7301740B2 (ja) * 2017-05-30 2023-07-03 デンカ株式会社 セラミックス回路基板及びその製造方法
DE102017114893B4 (de) 2017-07-04 2023-11-23 Rogers Germany Gmbh Lötmaterial zum Aktivlöten und Verfahren zum Aktivlöten
US11483926B2 (en) 2017-07-25 2022-10-25 Denka Company Limited Ceramic circuit board and production method therefor
CN110945971B (zh) * 2017-08-24 2023-09-26 阿莫善斯有限公司 制造陶瓷基板的方法以及陶瓷基板
JP2019044222A (ja) * 2017-08-31 2019-03-22 三菱マテリアル株式会社 Ｉｎ−Ｃｕ合金粉末、Ｉｎ−Ｃｕ合金粉末の製造方法、Ｉｎ−Ｃｕ合金スパッタリングターゲット及びＩｎ−Ｃｕ合金スパッタリングターゲットの製造方法
JP6898203B2 (ja) * 2017-10-27 2021-07-07 株式会社 日立パワーデバイス パワー半導体モジュール
JP7230432B2 (ja) * 2017-11-02 2023-03-01 三菱マテリアル株式会社 接合体、及び、絶縁回路基板
DE102017128308B4 (de) * 2017-11-29 2020-04-23 Rogers Germany Gmbh Verfahren zur Herstellung eines Metall-Keramik-Substrats
US10668571B2 (en) * 2017-12-14 2020-06-02 General Electric Company Nanoparticle powders, methods for forming braze pastes, and methods for modifying articles
WO2020105734A1 (fr) * 2018-11-22 2020-05-28 デンカ株式会社 Composite céramique-cuivre, procédé de production de composite céramique-cuivre, carte de circuit imprimé céramique, et module de puissance
CN109648221A (zh) * 2018-11-29 2019-04-19 中国科学院电工研究所 一种钎焊电子浆料及其制备方法和应用
JPWO2020196299A1 (fr) * 2019-03-22 2020-10-01
WO2020208698A1 (fr) * 2019-04-09 2020-10-15 日本碍子株式会社 Substrat lié et procédé permettant de fabriquer un substrat lié
JP2021051913A (ja) * 2019-09-25 2021-04-01 Ｄｏｗａエレクトロニクス株式会社 接合材、接合材の製造方法、接合方法及び半導体装置
CN110860817A (zh) * 2019-09-29 2020-03-06 北京时代民芯科技有限公司 一种焊料片和用该焊料片焊接的功率器件芯片封装方法
WO2021200866A1 (fr) * 2020-03-30 2021-10-07 デンカ株式会社 Carte de circuit imprimé, corps assemblé et leurs procédés de production
CN111644739A (zh) * 2020-06-15 2020-09-11 哈尔滨工业大学 用于空气气氛钎焊ysz陶瓷的钎料体系及钎焊方法
WO2022024990A1 (fr) * 2020-07-27 2022-02-03 株式会社 東芝 Corps assemblé, carte de circuit, dispositif à semi-conducteur et procédé de fabrication de corps assemblé
KR20220105849A (ko) * 2021-01-21 2022-07-28 주식회사 엘엑스세미콘 인쇄회로용 기판의 제조방법
WO2022234492A1 (fr) 2021-05-04 2022-11-10 Federal-Mogul Ignition Gmbh Électrode de bougie d'allumage et son procédé de fabrication
JP2023013630A (ja) * 2021-07-16 2023-01-26 三菱マテリアル株式会社 銅／セラミックス接合体、および、絶縁回路基板
JP2023013631A (ja) * 2021-07-16 2023-01-26 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、および、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
US11901705B2 (en) 2021-07-22 2024-02-13 Federal-Mogul Ignition Gmbh Electrode tip assembly for a spark plug and method of manufacturing the same
CN114029651B (zh) * 2021-11-18 2022-07-01 东北大学 含钛活性钎料及其制备方法和应用
US11621544B1 (en) 2022-01-14 2023-04-04 Federal-Mogul Ignition Gmbh Spark plug electrode and method of manufacturing the same
US11831130B2 (en) 2022-03-29 2023-11-28 Federal-Mogul Ignition Gmbh Spark plug, spark plug electrode, and method of manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5807626A (en) * 1995-07-21 1998-09-15 Kabushiki Kaisha Toshiba Ceramic circuit board
JPH11130555A (ja) * 1997-10-28 1999-05-18 Kyocera Corp セラミックス−銅接合用ろう材
JP2005112677A (ja) * 2003-10-09 2005-04-28 Hitachi Metals Ltd セラミックス基板用ろう材及びこれを用いたセラミックス回路基板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3635369A1 (de) * 1986-10-17 1988-04-28 Degussa Verfahren zum beschichten von oberflaechen mit hartstoffen
US4883745A (en) * 1988-11-07 1989-11-28 Gte Products Corporation Silver-copper-titanium brazing alloy containing crust inhibiting element
JPH04285076A (ja) 1991-03-14 1992-10-09 Tanaka Kikinzoku Kogyo Kk セラミックス接合用ペーストろう材
US6413649B2 (en) * 1998-03-06 2002-07-02 The Morgan Crucible Company Plc Silver-copper-nickel infiltration brazing filler metal and composites made therefrom
JP4493158B2 (ja) * 2000-05-29 2010-06-30 京セラ株式会社 セラミック回路基板
JP2002292490A (ja) * 2001-03-29 2002-10-08 Tanaka Kikinzoku Kogyo Kk 活性金属ろう材及びその製造方法
JP2003335585A (ja) * 2002-05-22 2003-11-25 Tanaka Kikinzoku Kogyo Kk 活性金属法によるセラミックスの接合方法
JP3714557B2 (ja) * 2003-04-21 2005-11-09 日立金属株式会社 セラミックス基板用ろう材及びこれを用いたセラミックス回路基板、パワー半導体モジュール
US20060219756A1 (en) 2003-08-02 2006-10-05 Kaoru Tada Active binder for brazing, part for brazing employing the binder, brazed product obtained with the binder, and silver brazing material
US20100189594A1 (en) * 2006-01-16 2010-07-29 Hitachi Metals, Ltd. Solder alloy, solder ball and solder joint using same
US20090139607A1 (en) * 2007-10-28 2009-06-04 General Electric Company Braze compositions and methods of use
CN101318268A (zh) * 2008-06-23 2008-12-10 哈尔滨工业大学 低温钎料及其制备方法
CN101332545A (zh) * 2008-06-23 2008-12-31 哈尔滨工业大学 活性钎料及其制备方法
JP2009170930A (ja) * 2009-03-12 2009-07-30 Hitachi Metals Ltd セラミックス回路基板及びこれを用いたパワー半導体モジュール
CN101972904B (zh) * 2010-11-19 2012-09-19 哈尔滨正德科技开发有限公司 一种用于硬质合金刀具钎焊的高温钎料的制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5807626A (en) * 1995-07-21 1998-09-15 Kabushiki Kaisha Toshiba Ceramic circuit board
JPH11130555A (ja) * 1997-10-28 1999-05-18 Kyocera Corp セラミックス−銅接合用ろう材
JP2005112677A (ja) * 2003-10-09 2005-04-28 Hitachi Metals Ltd セラミックス基板用ろう材及びこれを用いたセラミックス回路基板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013002407A1 *

Also Published As

Publication number Publication date
EP2727898A1 (fr) 2014-05-07
WO2013002407A1 (fr) 2013-01-03
US9780011B2 (en) 2017-10-03
EP2727898B1 (fr) 2017-02-01
JP5725178B2 (ja) 2015-05-27
EP2727898A9 (fr) 2014-08-20
CN103619779B (zh) 2015-07-01
JPWO2013002407A1 (ja) 2015-02-23
US20140126155A1 (en) 2014-05-08
CN103619779A (zh) 2014-03-05

Similar Documents

Publication Publication Date Title
EP2727898A4 (fr) Métal d'apport de brasage, pâte métallique d'apport de brasage, substrat pour circuit céramique, substrat pour circuit maître céramique, et module d'alimentation à semi-conducteurs
EP2811513A4 (fr) Substrat pour modules de courant, substrat avec dissipateur thermique pour modules de courant, module de courant, procédé de fabrication de substrat pour modules de courant, et pâte pour liaison d'élément de cuivre
EP2764538A4 (fr) Composants électroniques à semiconducteurs pour haute puissance à fiabilité accrue
EP2816593A4 (fr) Structure de joint à brasure tendre, module de puissance, substrat fixé au dissipateur de chaleur pour module de puissance, procédé de production dudit substrat et pâte destinée à former une sous-couche de soudure
EP2851907A4 (fr) Pâte conductrice, procédé de formation de câblage, composant électronique, et cellule solaire au silicium
EP2940727A4 (fr) Substrat pour module électrique, substrat pour module électrique à élément métallique, module électrique à élément métallique, procédé de fabrication de substrat pour module électrique, procédé de fabrication de substrat pour module électrique à élément métallique
EP2833398A4 (fr) Substrat pour module de puissance, substrat pour module de puissance à dissipateur thermique, module de puissance, et procédé de fabrication de substrat pour module de puissance
EP2908333A4 (fr) Dispositif à semi-conducteur, carte de circuit imprimé en céramique et procédé de fabrication de dispositif à semi-conducteur
EP3053899A4 (fr) Assemblage de matériaux en cu/céramique, procédé de fabrication d'assemblage de matériaux en cu/céramique, et substrat pour module de puissance
EP3058586A4 (fr) Substrat de conditionnement de circuit intégré
EP2522030A4 (fr) Dispositifs et composants électroniques pour des circuits de puissance à haut rendement
EP2826589A4 (fr) Décapant, composition de soudure et procédé de production d'un substrat supportant un circuit électronique
EP2743978A4 (fr) Substrat pour module de puissance, substrat pour module de puissance à puit thermique, module de puissance et procédé de fabrication de substrat pour module de puissance
EP2868424A4 (fr) Alliage à braser, pâte à braser, et carte de circuit électronique
EP2833399A4 (fr) Substrat de module de puissance, substrat de module de puissance muni de dissipateur thermique, et module de puissance
EP2980844A4 (fr) Substrat pour des modules de puissance, substrat ayant un dissipateur thermique pour des modules de puissance, et module de puissance
EP2763166A4 (fr) Structure de dissipation de chaleur, module de puissance, procédé pour fabriquer une structure de dissipation de chaleur et procédé pour fabriquer un module de puissance
EP3041046A4 (fr) Plaquette de substrat de montage, substrat en céramique multicouche, substrat de montage, module de puce, et procédé de fabrication d'une plaquette de substrat de montage
EP2930744A4 (fr) Substrat pour modules de puissance, substrat avec dissipateur thermique pour modules de puissance, module de puissance, procédé de fabrication de substrat pour modules de puissance, et pâte pour collage d'une plaque de cuivre, et procédé pour produire un corps métallisé
EP2563103A4 (fr) Substrat de connexion, procédé de fabrication d'un substrat de connexion et pâte pour trou métallisé
EP2719497A4 (fr) Pâte à souder
EP2511043A4 (fr) Flux pour pâte à braser et pâte à braser
EP2524763A4 (fr) Pâte à braser
EP2753159A4 (fr) Substrat de câblage en céramique frittée stratifiée, et boîtier de semi-conducteur contenant le substrat de câblage
EP2698684A4 (fr) Circuit intégré à semi-conducteurs

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20131208

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160222

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 5/08 20060101ALI20160216BHEP

Ipc: C22C 1/04 20060101ALI20160216BHEP

Ipc: H05K 3/38 20060101ALN20160216BHEP

Ipc: B22F 9/02 20060101ALN20160216BHEP

Ipc: B22F 7/06 20060101AFI20160216BHEP

Ipc: B23K 35/36 20060101ALI20160216BHEP

Ipc: H01L 23/373 20060101ALI20160216BHEP

Ipc: H05K 1/03 20060101ALN20160216BHEP

Ipc: B23K 35/02 20060101ALI20160216BHEP

Ipc: C04B 37/02 20060101ALN20160216BHEP

Ipc: H01L 23/15 20060101ALI20160216BHEP

Ipc: C22C 5/06 20060101ALI20160216BHEP

Ipc: B23K 35/30 20060101ALI20160216BHEP

Ipc: B23K 101/40 20060101ALN20160216BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602012028374

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: C04B0037020000

Ipc: B22F0007060000

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 101/40 20060101ALN20160824BHEP

Ipc: B23K 35/36 20060101ALI20160824BHEP

Ipc: H05K 3/38 20060101ALN20160824BHEP

Ipc: B22F 9/02 20060101ALN20160824BHEP

Ipc: B23K 35/02 20060101ALI20160824BHEP

Ipc: B23K 35/30 20060101ALI20160824BHEP

Ipc: B22F 7/06 20060101AFI20160824BHEP

Ipc: C22C 5/06 20060101ALI20160824BHEP

Ipc: H05K 1/03 20060101ALN20160824BHEP

Ipc: H01L 23/373 20060101ALI20160824BHEP

Ipc: C04B 37/02 20060101ALN20160824BHEP

Ipc: C22C 1/04 20060101ALI20160824BHEP

Ipc: C22C 5/08 20060101ALI20160824BHEP

Ipc: H01L 23/15 20060101ALI20160824BHEP

INTG Intention to grant announced

Effective date: 20160909

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: AT

Ref legal event code: REF

Ref document number: 865124

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170215

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602012028374

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170201

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 865124

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170501

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170502

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170601

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170501

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170601

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602012028374

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20171103

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20170702

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20180330

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170731

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170731

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170702

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170702

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170731

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20170731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170702

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170702

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20120702

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170201

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 602012028374

Country of ref document: DE

Representative=s name: GRUENECKER PATENT- UND RECHTSANWAELTE PARTG MB, DE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R081

Ref document number: 602012028374

Country of ref document: DE

Owner name: PROTERIAL, LTD., JP

Free format text: FORMER OWNER: HITACHI METALS, LTD., TOKYO, JP

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230531

Year of fee payment: 12