EP2697565B1 - Explosionsgeschütztes led-modul - Google Patents

Explosionsgeschütztes led-modul Download PDF

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Publication number
EP2697565B1
EP2697565B1 EP12716238.6A EP12716238A EP2697565B1 EP 2697565 B1 EP2697565 B1 EP 2697565B1 EP 12716238 A EP12716238 A EP 12716238A EP 2697565 B1 EP2697565 B1 EP 2697565B1
Authority
EP
European Patent Office
Prior art keywords
led
explosion
module according
led module
proof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12716238.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2697565A1 (de
Inventor
Jens Burmeister
Bernd Schwarz
Gerhard Schwarz
Michael Ketterer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eaton Intelligent Power Ltd
Original Assignee
Eaton Intelligent Power Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eaton Intelligent Power Ltd filed Critical Eaton Intelligent Power Ltd
Publication of EP2697565A1 publication Critical patent/EP2697565A1/de
Application granted granted Critical
Publication of EP2697565B1 publication Critical patent/EP2697565B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V25/00—Safety devices structurally associated with lighting devices
    • F21V25/12—Flameproof or explosion-proof arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/04—Provision of filling media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • LED light-emitting diodes
  • Ex-i the type of protection Ex-i. This means that the LED is supplied via a safety barrier which limits current / voltage to such an extent that neither ignition energy nor ignition temperature is reached for an explosive mixture.
  • the maximum surface temperature of the corresponding component is also limited.
  • LEDs are known, which are designed according to the type of protection Ex-m "Vergusskapselung". This means that at least parts of the LED, which could be sources of ignition for a corresponding explosive mixture, are embedded in a potting compound. As a result, a corresponding arc can not pass through to the explosive mixture outside the enclosure.
  • GB 2428467 A discloses an explosion-proof LED module with at least one light emitting diode, a heat sink connected thereto and a LED cover covering the LED at least in the emission direction. This extends into a Einsteckverianaung the heat sink and in the insertion recess, the cover is surrounded by a potting compound sealing the LEDs relative to an external and possibly explosive atmosphere.
  • GB 2458345 A describes a sealed lighting unit with an array of LEDs.
  • the LEDs are arranged on a first surface of a printed circuit and covered by a plurality of lens elements in the emission direction.
  • US 2006/227558 A1 describes a lamp with an outer shell for dissipating heat from the light source. As light elements LEDs can be used.
  • the outer shell is inserted with its free ends in a recess at an upper end of a metallic sleeve.
  • the present invention has for its object to provide an explosion-proof LED module, in which the production is relatively simple and inexpensive from prefabricated parts in a short time.
  • the explosion-proof LED module is further distinguished by the fact that sufficient cooling is provided in accordance with the type of protection "intrinsic safety" and an embedding of the component corresponding to the type of protection "encapsulation”.
  • the solution according to the invention is characterized in that the explosion-proof LED module has at least one light emitting diode LED, a heat sink connected thereto and an LED cover covering the LED at least in the emission direction, this LED cover extending into an insertion recess of the heat sink and is surrounded in this insertion recess of a potting compound sealing the LED relative to an external and possibly explosive atmosphere.
  • Such an explosion-proof LED module is easy to manufacture and has various advantages that are otherwise known only for the realization of different types of protection for themselves, see the above statements.
  • the heat sink has at least one extending in its body longitudinal insertion recess, in which the LED board is placed on a cooling surface.
  • the cooling surface can have corresponding dimensions as the board, see length and width.
  • Directly sealed LEDs do not need to be used, and at the same time the space surrounding the LED is relatively small due to the use of potting compound, heat sink with plug-in recess and LED seal. A sufficient cooling of the LED is given, and a passage of an arc to the outside in an optionally explosive mixture is reliably prevented.
  • a corresponding explosion-proof LED module can optionally be formed with only one LED on an LED board and the corresponding parts.
  • a corresponding LED board can be used, on which a plurality of LEDs in the longitudinal direction of the board, for example, are arranged next to each other and at a distance.
  • LED boards are known per se and can be manufactured in different lengths and widths as needed.
  • RGB boards or flexible boards which are optimally adapted to the particular circumstances by their flexibility. In such flexible circuit boards also proves to be an advantage that they can be processed easily and inexpensively.
  • the realization of such an explosion-proof LED module with a plurality of LEDs is further simplified if the heat sink is likewise designed for all LEDs of the LED board. That is, it is only used a heat sink on which, for example, the board is arranged directly with the LEDs.
  • the heat sink may also be formed of multiple, in particular the same body segments.
  • board or cooling surface each have larger dimensions in length or width compared to the other part.
  • heat sink and LED board can be applied either on the cooling surface or on the board a corresponding heat-conducting foil.
  • the cooling surface in the body longitudinal direction of the heat sink can be surrounded on both sides at least in places by the Einsteckverianaung.
  • the insertion recesses extend at least along the cooling surface on both sides to this. It is also possible that also at longitudinal ends of the cooling surface, the plug-in depression is present, so that this substantially completely surrounds the cooling surface.
  • the LED cover can have a number of plug-in elements protruding in the direction of the insertion recess for attachment to the heat sink.
  • the LED board can be screwed to the heat sink. Then the protective cover or LED cover is placed and held in position and shed. To Curing the potting a corresponding holding device for the cover is removed and then held only by the potting.
  • a latching recess extending substantially perpendicular to the body longitudinal direction and extending along the plug-in recess can be formed. This means that no exact assignment between locking element and counter-locking element is necessary and even a displacement of the LED cover after engagement of the locking elements in the locking recess is possible.
  • a corresponding counter-latching element may be provided for each latching element, each of which is formed by only a corresponding latching recess which is formed substantially perpendicular to the body longitudinal direction within the insertion recess.
  • the locking elements are arranged on both sides of the cooling surface in pairs or offset from each other.
  • the insertion recess in the direction counter-latching element may have a varying cross-section and / or a direction-changing course.
  • the insertion recess increases, for example, in the direction of the latching recess in cross section.
  • the detent recess has a course which is formed, for example, in the direction of the counter-detent element in a wave-shaped, zigzag-shaped or the like.
  • a Vergussverianaung may be formed on each of the longitudinal ends of the LED board in the heat sink.
  • This Vergussverianaung can be formed with the same depth as the Einsteckverianaung, but also with a different depth. For example, in the area of Vergussverianaung no corresponding Insertion be arranged more so that they no longer need to be arranged in the potting compound, whereby a smaller depth of Vergussverianaung compared to the insertion recess is possible.
  • the LED cover can have a protruding in the direction of insertion recess or Vergussverianaung, in particular circumferential peripheral edge. This is arranged in the potting compound arranged on the heat sink LED cover, so that the sealing of the LEDs relative to the outer atmosphere takes place substantially on the immersion of this peripheral edge in the potting compound.
  • the male members are formed separately from the peripheral edge and protrude from the remaining LED cover in the direction of insertion recess.
  • the male members may protrude from the peripheral edge.
  • the LED cover in its longitudinal direction identifies a uniform curvature for receiving all LEDs.
  • the LED cover has convexly curved LED domes from the LEDs, with one LED dome in each case being assigned to one LED.
  • the individual LED domes are formed as a lens system for the LED or include such.
  • the corresponding dome may also be formed as an optical element, for example, determines the emission of the LED, which makes the radiation of all LEDs continuous, so that the LEDs do not appear as point light sources, etc.
  • Reflective devices can also be provided within the LED cover or domes, which likewise serve to align the light, or covers or domes can have surface structures on the inside or outside which likewise influence the light output or light intensity.
  • the length of such a LED module with LED board can be approximately equal to a tubular fluorescent lamp, so that they can be replaced by the LED module are.
  • corresponding fluorescent lamps it is likewise known that several, for example two, are arranged next to one another.
  • the heat sink has two lateral ends inclined transversely to the vertical, and an LED board with LED cover and potting compound is arranged on each of these side ends, ie each This side ends is almost a lamp similar to a fluorescent lamp.
  • the LED module in any length, even much shorter than the length of a tubular fluorescent lamp.
  • the length of a fluorescent lamp (18, 36 & 58W or equivalent in other countries) can be achieved by assembling multiple modules. It can also be built lights, which then differ significantly from these standard lengths.
  • the heat sink is made of metal and, for example, additionally has cooling fins.
  • the heat sink is constructed in several parts and in this way has a metal cooling core with cooling fins and a surrounding plastic housing.
  • the LED cover can be produced from a corresponding transparent or at least translucent material, such as, for example, borosilicate, temperature-change-resistant glass or else from a plastic such as polycarbonate or the like.
  • the LED cover may optionally be colored and / or coated in various colors.
  • the potting compound can also be formed from a corresponding material such as polyurethane resin, epoxy resin, silicone resin or the like.
  • the potting compound is a casting resin in which a solidification takes place by a chemical reaction, which is irreversible.
  • Corresponding casting resins other than those mentioned above are also possible.
  • Fig. 1 shows a side elevational view of an exploded view of an LED module 1 according to the invention.
  • the LED module 1 has a heat sink 3, which extends in the longitudinal direction 10.
  • LEDs 2 are arranged, which are all arranged together on an LED board 8. This extends in the longitudinal direction of the board 9 substantially over the entire length of the heat sink 3.
  • the heat sink has a number of cooling fins 28, see also Fig. 3-5 .
  • the different parts of the LED module are shown exploded.
  • the LED board 8 is visible with a plurality of LEDs 2, over which a corresponding LED cover 5 and over this a potting compound 7 is arranged. All these parts extend substantially over the entire length of the heat sink 3, see also the other side end 25th
  • the LED board 8 is inserted into an insertion recess 11 at the respective side ends 24 and 25, and is provided with a corresponding cooling surface 12, see also Fig. 3 , in Appendix. Between LED board 8 and cooling surface, a heat conducting foil, not shown, may additionally be arranged.
  • the cooling surface 12 extends along the insertion recess 11 and forms the lower end, see again Fig. 3 , Appropriate means may be provided on or assigned to the cooling surface 11, which fix or at least position the LED board 8 in a specific relative position. Corresponding devices can also be provided only at the ends of the insertion recess 11 or the cooling surface 12.
  • the potting compound 7 is not a separate part, but the potting compound is usually formed from a casting resin, which is poured into the insertion recess 11 and also a corresponding insertion recess 6, see the following embodiment. There, the potting compound 7 then hardens and solidifies in a mold Fig. 1 , see reference number 7.
  • a corresponding cross section of the cured potting compound is denoted by reference numeral 7 in FIG Fig. 3 is again indicated that this part is not cured and used in this form, but only after pouring and curing the potting takes on this appropriate form.
  • Vergussveriana 19 are formed, see Fig. 1 , in which the end portions 26 and 27 of the potting compound 7 are arranged.
  • the LED cover 5 has on its insertion recess 6, see also Fig. 3 , Submitting underside a plurality of male members 13. These are inserted when arranging the LED cover 5 on the heat sink 3 in the insertion recess 6 and there latched by means of locking elements 14 at free ends of the male elements 13 in corresponding locking recesses 16, see also Fig. 4 or 5.
  • the LED cover 5 has a peripheral peripheral edge 22 which dips into the potting compound 7 when the LED cover 5 is fastened to the heat sink 3, see also Fig. 4 , From this peripheral edge 22 are the corresponding male members 13 from, see Fig. 1 ,
  • Fig. 2 is a side view of the LED module 1 after Fig. 1 shown. In particular, some sections are marked, the following Fig. 3-5 see section lines III-III, IV-IV and VV.
  • the LED cover 5 has a number of LED domes 23, see also Fig. 1 of which each one of an LED 2 of the LED board 8 is assigned.
  • corresponding LED domes 23 are arranged, for example, at longitudinal ends 20 and 21 of the LED board 8 in order to cover there still located LEDs 2.
  • the LED cover 5 is surrounded along its entire circumference by the potting compound 7, see end sections 26 and 27 and into the insertion recess 6 potted potting compound 7 Fig. 3-5 ,
  • Fig. 3 corresponds to a section along the line III-III Fig. 2 in the exploded representation after Fig. 1 ,
  • the heat sink 3 has mirror-image halves 29, 30 which are releasably connected to one another at their adjacent sides. Each of these halves has a metal inner body with protruding from this cooling ribs 28. These are arranged in a housing formed, for example, of plastic.
  • an LED board 8 On each of the side ends 24, 25 of the entire heat sink 3, an LED board 8, an LED cover 5 and corresponding potting compound 7 are each arranged.
  • the LED board 8 is arranged on the cooling surface 12 within the insertion recess 11.
  • the cooling surface 12 is delimited along its longitudinal sides by the insertion recess 6, which extends into the cooling body 3 and in particular for receiving the insertion elements 13, see Fig. 5 , And at least partially receiving the potting compound 7 is used.
  • the insertion recess 6 has a changing cross section, see also reference numeral 17 in FIG Fig. 4 ,
  • the cross section of the Einsteckseite ie from the cooling surface 12 forth, increases.
  • the cross-section may later decrease again and overall, the insertion recess 6 may have a course 18, see again Fig. 4 changing his direction.
  • Lower ends of the insertion recess 6 have lateral latching depressions 16, which serve as a counter-latching element 15 for arranged at free ends of the male elements 13 locking elements 14, see also Fig. 5 , In the area between the male members 13, see for example Fig. 4 , The peripheral edge 22 of the LED cover 5 extends into the Potting compound 7, which substantially completely fills the insertion recess 6 and essentially leaves only the LED domes 23 free.
  • the LED cover is completely arranged with its peripheral edge 22 and the male members 13 in the potting compound 7.
  • the corresponding LEDs 2 have a certain emission range or a radiation direction 4, which is essentially determined by the corresponding LED dome 23.
  • the potting compound 7, see for example Fig. 3 also areas between the LED domes 23 can leave uncovered, and extends in such a case only in the circumferential direction around the LED cover 5, see in particular Einsteckvertiefung 6 and insertion recess 11 with peripheral Vergussveriana 19, see again Fig. 1 or 2 ,
  • Fig. 3 In addition, an electrical supply line 31 is shown, which is inserted in the region of a longitudinal end of the LED board 8 in the insertion recess 6 for electrically contacting the LED board 8. These are sealed by the potting compound 7 analogous to the LED cover 5.
  • Fig. 4 In particular, the LED cover 5 between corresponding male members 13 is shown in section, wherein the peripheral edge 22 is immersed in the potting compound 7.
  • Fig. 5 the LED cover 5 is shown in the region of a male member 13 with locking element 14, which extends substantially to the bottom of the insertion recess 6 and there with a counter-detent element 15 in the form of a detent recess 16 is engaged.
  • the heat sink 3 is optionally composed of two halves 29, 30, see Fig. 3 , and these halves joined together. Subsequently is placed along the cooling surface 12, the LED board 8 with interposed heat conducting foil.
  • the LED cover 5 is placed in a next step, which engages with its male elements 13 in the insertion recess 6. By applying appropriate pressure on the LED cover 5, this is so far introduced with their male members 13 in the insertion recess 6, that finally a locking of the locking elements 14 takes place with the locking recess 16 as a counter-latching element 15, see also Fig. 5 , Thereafter, the potting compound 7 is poured into the insertion recess 6 and also at the longitudinal ends 20, 21 of the LED board 8 and the LED cover 5 in the corresponding Vergussveriana Heidelberg 19 of the insertion recess 11.
  • LED board with LEDs and LED cover 5 Due to the special arrangement of LED board with LEDs and LED cover 5 remains a corresponding space between LEDs and LED cover due to the diving bell principle. That is, it creates a flood-proof cover for the LEDs.
  • the LED module 1 After curing of the potting compound 7, the LED module 1 is ready for use, with all LEDs can be operated in an explosive atmosphere due to the seal on the potting compound and the corresponding cooling of each LED.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
EP12716238.6A 2011-04-15 2012-04-04 Explosionsgeschütztes led-modul Active EP2697565B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011017162A DE102011017162A1 (de) 2011-04-15 2011-04-15 Explosionsgeschütztes LED-Modul
PCT/EP2012/001496 WO2012139728A1 (de) 2011-04-15 2012-04-04 Explosionsgeschütztes led-modul

Publications (2)

Publication Number Publication Date
EP2697565A1 EP2697565A1 (de) 2014-02-19
EP2697565B1 true EP2697565B1 (de) 2019-03-06

Family

ID=45999767

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12716238.6A Active EP2697565B1 (de) 2011-04-15 2012-04-04 Explosionsgeschütztes led-modul

Country Status (13)

Country Link
US (1) US9541272B2 (ru)
EP (1) EP2697565B1 (ru)
JP (2) JP2014515191A (ru)
KR (2) KR101666707B1 (ru)
CN (1) CN103562630B (ru)
AU (1) AU2012242213B2 (ru)
BR (1) BR112013026477B1 (ru)
CA (1) CA2833063C (ru)
DE (1) DE102011017162A1 (ru)
MY (1) MY158914A (ru)
RU (1) RU2568426C2 (ru)
SA (1) SA112330448B1 (ru)
WO (1) WO2012139728A1 (ru)

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KR101918847B1 (ko) * 2017-04-20 2018-11-14 전자부품연구원 주형을 이용한 일체형 히트싱크 제조방법
USD954332S1 (en) * 2019-12-27 2022-06-07 Eaton Intelligent Power Limited LED light fixture
CN113063104A (zh) 2019-12-31 2021-07-02 伊顿智能动力有限公司 不使用散热器的热管理危险场所led灯具、组件和方法
US12078306B2 (en) 2021-07-09 2024-09-03 Eaton Intelligent Power Limited Linear LED luminaire housing for use in harsh and hazardous locations
USD1016361S1 (en) 2021-07-09 2024-02-27 Eaton Intelligent Power Limited Linear luminaire
CN113790404B (zh) * 2021-09-16 2024-05-07 浙江朗普电气科技有限公司 一种led灯具的防爆光源组件

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DE102011017162A1 (de) 2012-10-18
JP2014515191A (ja) 2014-06-26
CN103562630A (zh) 2014-02-05
AU2012242213A1 (en) 2013-11-07
US9541272B2 (en) 2017-01-10
CN103562630B (zh) 2016-03-30
CA2833063A1 (en) 2012-10-18
KR20140002022A (ko) 2014-01-07
AU2012242213B2 (en) 2014-09-25
EP2697565A1 (de) 2014-02-19
RU2568426C2 (ru) 2015-11-20
CA2833063C (en) 2016-08-23
BR112013026477B1 (pt) 2020-02-27
SA112330448B1 (ar) 2017-02-15
MY158914A (en) 2016-11-30
US20140204570A1 (en) 2014-07-24
WO2012139728A1 (de) 2012-10-18
BR112013026477A2 (pt) 2016-12-27
KR101666707B1 (ko) 2016-10-17
KR20150129038A (ko) 2015-11-18
KR101692664B1 (ko) 2017-01-03
JP5952473B2 (ja) 2016-07-13
RU2013147916A (ru) 2015-05-20
JP2015222832A (ja) 2015-12-10

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