EP2625258B1 - Composition de nettoyage de polymères - Google Patents
Composition de nettoyage de polymères Download PDFInfo
- Publication number
- EP2625258B1 EP2625258B1 EP11779790.2A EP11779790A EP2625258B1 EP 2625258 B1 EP2625258 B1 EP 2625258B1 EP 11779790 A EP11779790 A EP 11779790A EP 2625258 B1 EP2625258 B1 EP 2625258B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- dmso
- polymer
- meoa
- mixture
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 title claims description 91
- 238000004140 cleaning Methods 0.000 title claims description 36
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 177
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 229920000642 polymer Polymers 0.000 claims description 31
- 239000004814 polyurethane Substances 0.000 claims description 28
- 239000002904 solvent Substances 0.000 claims description 26
- 229920002635 polyurethane Polymers 0.000 claims description 20
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 14
- 229920003023 plastic Polymers 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000005260 corrosion Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 6
- 238000001125 extrusion Methods 0.000 claims description 6
- 239000003112 inhibitor Substances 0.000 claims description 6
- 230000009466 transformation Effects 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims description 2
- 150000002170 ethers Chemical class 0.000 claims description 2
- 229920002313 fluoropolymer Polymers 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims 1
- 239000004811 fluoropolymer Substances 0.000 claims 1
- 125000002560 nitrile group Chemical group 0.000 claims 1
- 239000004634 thermosetting polymer Substances 0.000 claims 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 57
- 238000004090 dissolution Methods 0.000 description 24
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 238000007654 immersion Methods 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 239000000908 ammonium hydroxide Substances 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 125000001453 quaternary ammonium group Chemical group 0.000 description 4
- 239000011877 solvent mixture Substances 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- AQYCMVICBNBXNA-UHFFFAOYSA-N 2-methylglutaric acid Chemical compound OC(=O)C(C)CCC(O)=O AQYCMVICBNBXNA-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- -1 dimethyl DMSO Chemical compound 0.000 description 2
- 238000007922 dissolution test Methods 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003903 lactic acid esters Chemical class 0.000 description 2
- 231100001231 less toxic Toxicity 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 150000003462 sulfoxides Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- NEDPPCHNEOMTJV-UHFFFAOYSA-N aldesulfone Chemical compound C1=CC(NCS(=O)O)=CC=C1S(=O)(=O)C1=CC=C(NCS(O)=O)C=C1 NEDPPCHNEOMTJV-UHFFFAOYSA-N 0.000 description 1
- 229950006704 aldesulfone Drugs 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BVEXVMARIREFTJ-TXMWGMRISA-N methyl (2r)-3-[(2s,6r,8s,11r)-2-[(e,2r)-4-[(2s,2'r,4r,4as,6r,8ar)-4-hydroxy-2-[(1s,3s)-1-hydroxy-3-[(2s,3r,6s)-3-methyl-1,7-dioxaspiro[5.5]undecan-2-yl]butyl]-3-methylidenespiro[4a,7,8,8a-tetrahydro-4h-pyrano[3,2-b]pyran-6,5'-oxolane]-2'-yl]but-3-en-2-yl] Chemical compound O1[C@H](C[C@@](C)(O)C(=O)OC)CC[C@@H](O)[C@@]21C=C(C)C[C@@H]([C@H](C)\C=C\[C@@H]1O[C@@]3(O[C@H]4[C@H](O)C(=C)[C@@H]([C@@H](O)C[C@H](C)[C@@H]5[C@@H](CC[C@@]6(OCCCC6)O5)C)O[C@@H]4CC3)CC1)O2 BVEXVMARIREFTJ-TXMWGMRISA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D11/00—Special methods for preparing compositions containing mixtures of detergents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3445—Organic compounds containing sulfur containing sulfino groups, e.g. dimethyl sulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines
Definitions
- the present invention relates to the field of plastics processing, more specifically the field of molding, injection molding, injection molding, extrusion molding, extrusion molding, and other processing techniques. plastics.
- the invention relates to the cleaning of various devices used in the plastics processing industries. These devices are for example molds, injection nozzles, extrusion screws, and, in general, all the parts, most often but not necessarily metal, which come into contact more or less prolonged with one or more plastics brought to higher or lower temperatures and cooled to allow their transformation.
- polymer residues of various shapes and sizes more or less important, can remain in contact with the mold.
- polymer residues can be torn off the molded object and adhere to the walls of the mold.
- the patent application US2010 / 0104824 discloses a stripping composition containing DMSO (dimethylsulfoxide), a quaternary ammonium hydroxide, an alkanolamine, optionally an additional solvent and a surfactant for cleaning polymeric residues from the electronic substrates.
- DMSO dimethylsulfoxide
- the patent application US2010 / 0242999 discloses a cleaning composition comprising an isophthalic acid sulphonate or isophthalic diester acid sulfonate, a glycol, optionally DMSO and amines for cleaning organic resins of inorganic substrates.
- the patent US6367486 discloses a cleaning composition comprising EDTA or its salt, optionally an amine or alkanolamine, optionally a solvent, optionally an ammonium salt, optionally a chelant and water for cleaning polymeric residues from electronic substrates.
- the patent application US2003 / 0130149 discloses a stripping composition comprising a pyrrolidone and / or a piperidone, an alkanolamine, a sulfoxide and / or a sulfoxone for cleaning the polymer residues of the electronic substrates.
- the patent application US2004 / 0259761 discloses a cleaning composition comprising a quaternary ammonium hydroxide, potassium hydroxide, a solvent such as an amine and / or DMSO, water and an anti-corrosive for cleaning polymer residues from substrates.
- the patent US6475966 discloses a cleaning composition comprising a solvent such as DMSO, a quaternary ammonium hydroxide and a hydroxylamine and optionally organic additives for cleaning polymeric substrate residues.
- the patent application US2003 / 0104960 discloses a composition comprising a dibasic acid diester, DMSO, a carbonate, a lactic acid ester and a tertiary amine for cleaning the polymeric residues.
- the patent application US2002 / 0037820 discloses a composition comprising one or more fluorinated compounds, one or more solvents such as sulfoxides or sulfones, water, optionally basic amines, cosolvents, corrosion inhibitors, chelating agents, surfactants, acids and bases, to strip photoresists and clean organic and inorganic compounds present on a semiconductor substrate.
- solvents such as sulfoxides or sulfones
- water optionally basic amines, cosolvents, corrosion inhibitors, chelating agents, surfactants, acids and bases
- DMF dimethylformamide
- compositions for removing the polymer layers during the preparation of printed circuits (“photoresist stripper" in English), the compositions necessarily containing a quaternary ammonium hydroxide.
- the document US 2003/0104960 A1 discloses a five-component composition capable of dissolving polymerization residues, the five components being dibasic acid esters, DMSO, a carbonate, a lactic acid ester and a tertiary amine with a boiling point between 130 ° C and 370 ° C under one (1) atmosphere.
- a first objective of the present invention is to propose new products, formulations, compositions, cleaning of polymer residues which are less toxic and less harmful than the solvents used today, or even products, formulations, compositions, cleaning of non-toxic and non-harmful residues for the environment and users.
- Another object of the present invention is to provide products, formulations, compositions, cleaning of polymer residues that are more effective than known solvents and used today.
- the present invention relates to a composition consisting of 80% to 90% dimethylsulfoxide (DMSO), 2% to 9% monoethanolamine (MEoA) and 5% to 15%, for example about 8% water, and optionally from a few ppm by weight to 1% of a corrosion inhibitor.
- DMSO dimethylsulfoxide
- MEoA monoethanolamine
- DMSO is a solvent considered to be non-harmful and non-toxic. In addition, it may be available in various degrees of purity, the high purity DMSO having virtually no odor, at least no foul odor. According to one variant, the DMSO used can advantageously be perfumed with at least one odorant.
- compositions of the invention In addition to DMSO and monoethanolamine, the presence of a quantity of water in the compositions of the invention has been found to be advantageous in allowing even more efficient dissolution of polymer residues.
- compositions of the invention has the additional advantage of lowering the crystallization point of said compositions.
- compositions according to the present invention may comprise a corrosion inhibitor as an additive.
- corrosion inhibitors mention may be made of catechol, sodium tolyltriazolate and morpholine, for example.
- compositions of the present invention may comprise, instead of DMSO, a mixture of DMSO and at least one other non-nitrogenous solvent.
- non-nitrogenous solvents mention may be made, by way of non-limiting examples, of alcohols, ethers, esters and other non-nitrogenous solvents compatible with the compositions as just described.
- the mono-functional and / or di-functional esters are preferred.
- alkyl denotes a hydrocarbon chain, linear or branched, comprising from 1 to 6 carbon atoms.
- These esters advantageously come from mono- and / or dicarboxylic acids containing from 3 to 30 carbon atoms, in a linear or branched chain.
- Methyl, ethyl, propyl and butyl esters of formic, acetic, propionic, butyric, maleic, succinic, glutaric, 2-methylglutaric and other acids and mixtures thereof in all proportions are particularly preferred.
- compositions of the invention may be prepared by any method known in the art, and for example by simply mixing the various ingredients in any order. However, it is preferred to add MEoA in the DMSO / water mixture. The corrosion inhibitor is advantageously added to the final mixture DMSO / MEoA and water.
- the subject of the present invention is the use of at least one of the compositions as they have just been defined, for the partial or total dissolution of polymers, and in particular for the cleaning of polymer residues. .
- cleaning polymer residues is meant the partial or total dissolution of polymers with the compositions of the present invention.
- the polymers that can be partially or completely dissolved are of all types, thermoplastic and thermosetting, in particular thermoplastics.
- the polymers contemplated in the use of the present invention are, for example, chosen from, in a nonlimiting manner, fluorinated polymers, such as polyvinyl difluoride or PVDF, nitrogen-containing polycondensates, such as those carrying amide groups, imide, amido-amide, urethane, nitrile, sulfur-containing polycondensates, such as those bearing sulfone groups, and the like.
- fluorinated polymers such as polyvinyl difluoride or PVDF
- nitrogen-containing polycondensates such as those carrying amide groups, imide, amido-amide, urethane, nitrile
- sulfur-containing polycondensates such as those bearing sulfone groups, and the like.
- compositions of the invention are particularly suitable for cleaning polymers chosen from polyurethanes, polyamides, polyamide-imides, polyether sulfones, polyacrylonitriles and the like, and more particularly suitable for dissolving and cleaning polyurethanes. .
- compositions of the invention are particularly effective for the cleaning of polyurethane residues for which the solvent of choice until now was DMF which is now proscribed, in particular by the European directives.
- the compositions of the present invention are carried out in a temperature range from room temperature to 90 ° C.
- the effectiveness of the compositions according to the invention decreases rapidly when the temperature decreases, and, below the ambient temperature, the time required for effective cleaning can be relatively long. Above 90 ° C, the cleaning composition can generate annoying vapors, but it is possible to work in ventilated or closed enclosure, thus allowing to work at the boiling temperature of the cleaning composition.
- compositions according to the invention at a temperature of between 30 ° C. and 70 ° C., for example between 50 ° C. and 65 ° C.
- the present invention relates to a method for cleaning polymer residues present on apparatus used in the transformation of plastics as defined above, said method comprising at least one step of contacting said apparatus contaminated with said polymer residues, with at least one composition according to the present invention, under the temperature conditions indicated above.
- contacting is meant a partial or total immersion of the apparatus to be cleaned, with or without agitation, a spraying of the apparatus to be cleaned with a cleaning composition at various pressures, for example by means of a brush, a spray gun, and others.
- the contacting can be simply wiping with a cloth, sponge or other absorbent / desorbent material soaked with the cleaning composition.
- the placing in contact defined above can optionally be accompanied by a physical cleaning, for example using tools, such as spatulas, scrapers, and others.
- the reference solvent is DMF; for cleaning the molds, they are usually immersed for a few hours in a DMF bath heated to 60 ° C.
- the tests are carried out here in 20 ml glass bottles. 10 ml of the cleaning composition (in this case DMF on the one hand and DMSO alone on the other hand) preheated in an oven at approximately 60 ° C. is introduced into each flask. A sample of polyurethane (PU) of parallelepipedal shape (about 10 ⁇ 5 ⁇ 2 mm) is then introduced into each bottle. The flasks are closed and left without stirring in the oven at 60 ° C.
- the cleaning composition in this case DMF on the one hand and DMSO alone on the other hand
- PU polyurethane
- the swelling of the samples is observed first after about 2 to 3 minutes of immersion. After 25 minutes, the PU is not dissolved in the DMF nor in the DMSO. The difference in efficacy between DMF and DMSO is observed over time: after 18 hours at 60 ° C, PU begins to solubilize in DMF while nothing happens in DMSO. DMF is therefore more efficient than DMSO alone.
- Example 2 The same protocol as in Example 1 is repeated using a mixture of DMSO (95.5%) and diacetone alcohol (4.5%). As in DMSO, the DMSO / diacetone alcohol mixture is observed to swell the PU, but no dissolution, even after 18 hours immersion of the sample.
- Example 2 The same protocol as in Example 1 is repeated using a mixture of DMSO (95.5%) and monoethanolamine (4.5%), immersion for 18 hours at 60 ° C.
- a DMSO / MEoA mixture is therefore clearly more effective than DMF alone.
- Example 2 The same protocol as in Example 1 is repeated by comparing a DMSO / MEoA composition (95.5% / 4.5%) and a DMSO / MEoA / Water composition (87.5% / 4.5% / 8%).
- the PU After 4h at 60 ° C, the PU is completely dissolved in the DMSO / MEoA / water mixture, while it is not dissolved in the DMSO / MEoA mixture (95.5% / 4.5%).
- a DMSO / MEoA / water mixture is therefore clearly more effective than a DMSO / MEoA mixture.
- the PU sample dissolution tests are carried out, by varying the concentration of MEoA in DMSO, by 1 to 5%.
- the DMSO + 1% MEoA mixture is more effective than the DMF alone, since already after 1 hour at 60 ° C, we start to see flakes of PU suspended in the mixture, whereas no effect (except swelling of the sample) is observed, neither the DMF nor in the DMSO.
- Example 6 Lowering of the crystallization point in the presence of water in cleaning compositions based on DMSO
- the crystallization point of DMSO is 18.5 ° C, which often poses storage and handling problems in winter.
- the crystallization point of a DMSO (95%) + MEA (5%) mixture is about 15 ° C. This crystallization point can be further lowered by adding water to the composition.
- a test is carried out by adding 8% by weight of water in DMSO, then the MEoA is added (5% by weight in the preceding mixture). The crystallization point of this mixture is measured at -2.9 ° C., whereas a DMSO / water mixture (92% / 8%) has a crystallization point close to 0 ° C.
- dissolution tests are carried out on this DMSO / MEoA / water mixture (ie 87.6% / 4.8% / 7.6%).
- the PU sample After 3 hours at 60 ° C, the PU sample is completely dissolved in this mixture, whereas it only begins to dissolve in the DMSO / MEoA mixture (95% / 5%) and no dissolution is still observed in DMF: the addition of water in the DMSO / MEA mixture accelerates the dissolution of the PU.
- Example 7 Influence of the Water Content on the Dissolution of Polyurethane (PU) in a DMSO / MEoA / Water Mixture
- Example 2 The same protocol as in Example 1 is repeated by comparing DMSO / MEoA / water compositions with variable water contents.
- Example 8 Dissolution of Polyurethane (PU) in a DMSO / non-nitrogen solvent / MEoA / water mixture
- Example 2 The same procedure as in Example 1 is repeated using a mixture of DMSO (50% by weight) and dimethyl glutarate (50% by weight). As in DMSO, dimethyl DMSO / 2-methylglutarate is observed to swell the PU, but no dissolution even after 18 hours immersion of the sample.
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Paints Or Removers (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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PL11779790T PL2625258T3 (pl) | 2010-10-05 | 2011-10-04 | Kompozycja do czyszczenia z polimerów |
SI201131683T SI2625258T1 (sl) | 2010-10-05 | 2011-10-04 | Sestavek za čiščenje polimerov |
Applications Claiming Priority (2)
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FR1058050A FR2965567B1 (fr) | 2010-10-05 | 2010-10-05 | Composition de nettoyage de polymeres |
PCT/FR2011/052309 WO2012045971A1 (fr) | 2010-10-05 | 2011-10-04 | Composition de nettoyage de polymères |
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EP2625258A1 EP2625258A1 (fr) | 2013-08-14 |
EP2625258B1 true EP2625258B1 (fr) | 2019-01-16 |
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EP11779790.2A Active EP2625258B1 (fr) | 2010-10-05 | 2011-10-04 | Composition de nettoyage de polymères |
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US (1) | US9212340B2 (ja) |
EP (1) | EP2625258B1 (ja) |
JP (1) | JP5823524B2 (ja) |
KR (2) | KR20130060323A (ja) |
CN (1) | CN103119148B (ja) |
AU (1) | AU2011311433B2 (ja) |
BR (1) | BR112013008332A2 (ja) |
CA (1) | CA2809850C (ja) |
FR (1) | FR2965567B1 (ja) |
PL (1) | PL2625258T3 (ja) |
SI (1) | SI2625258T1 (ja) |
TR (1) | TR201903049T4 (ja) |
WO (1) | WO2012045971A1 (ja) |
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JP5937504B2 (ja) * | 2012-12-26 | 2016-06-22 | 株式会社カネコ化学 | 樹脂除去用溶剤組成物 |
JP6122333B2 (ja) * | 2013-04-12 | 2017-04-26 | コーデックケミカル株式会社 | 洗浄剤組成物及び該組成物を含有する洗浄剤並びにそれらを用いた洗浄方法 |
DE102014206875A1 (de) * | 2014-04-09 | 2015-10-15 | Wacker Chemie Ag | Verfahren zur Reinigung von technischen Anlagenteilen von Metallhalogeniden |
CN106434044A (zh) * | 2015-08-06 | 2017-02-22 | 盛德罗宝节能材料科技股份有限公司 | 一种用于装饰保温一体化板表面的聚氨酯污染清洗剂 |
Citations (1)
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US20020037820A1 (en) * | 2000-07-10 | 2002-03-28 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
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US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
US6475966B1 (en) * | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
US7456140B2 (en) * | 2000-07-10 | 2008-11-25 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
KR20040032855A (ko) * | 2001-07-13 | 2004-04-17 | 이케이씨 테크놀로지, 인코포레이티드 | 술폭시드 피롤리드(인)온 알칸올아민 박리 및 세정 조성물 |
US20030104960A1 (en) * | 2001-11-30 | 2003-06-05 | Opre James E. | Liquid cleaning composition for polymer reactor scale |
US7442675B2 (en) * | 2003-06-18 | 2008-10-28 | Tokyo Ohka Kogyo Co., Ltd. | Cleaning composition and method of cleaning semiconductor substrate |
US20070243773A1 (en) * | 2005-10-28 | 2007-10-18 | Phenis Michael T | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
US20100104824A1 (en) * | 2006-10-23 | 2010-04-29 | Phenis Michael T | Dynamic multi-purpose composition for the removal of photoresists |
US8309502B2 (en) * | 2009-03-27 | 2012-11-13 | Eastman Chemical Company | Compositions and methods for removing organic substances |
-
2010
- 2010-10-05 FR FR1058050A patent/FR2965567B1/fr active Active
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2011
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- 2011-10-04 CN CN201180047709.1A patent/CN103119148B/zh active Active
- 2011-10-04 EP EP11779790.2A patent/EP2625258B1/fr active Active
- 2011-10-04 AU AU2011311433A patent/AU2011311433B2/en not_active Ceased
- 2011-10-04 TR TR2019/03049T patent/TR201903049T4/tr unknown
- 2011-10-04 PL PL11779790T patent/PL2625258T3/pl unknown
- 2011-10-04 US US13/877,548 patent/US9212340B2/en active Active
- 2011-10-04 KR KR1020137009532A patent/KR20130060323A/ko active Application Filing
- 2011-10-04 SI SI201131683T patent/SI2625258T1/sl unknown
- 2011-10-04 KR KR1020157014417A patent/KR101660199B1/ko active IP Right Grant
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US20020037820A1 (en) * | 2000-07-10 | 2002-03-28 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
Also Published As
Publication number | Publication date |
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CA2809850A1 (fr) | 2012-04-12 |
AU2011311433B2 (en) | 2015-09-17 |
CN103119148A (zh) | 2013-05-22 |
JP2014500161A (ja) | 2014-01-09 |
PL2625258T3 (pl) | 2019-05-31 |
KR101660199B1 (ko) | 2016-09-26 |
AU2011311433A1 (en) | 2013-06-20 |
BR112013008332A2 (pt) | 2016-06-14 |
CN103119148B (zh) | 2016-04-06 |
TR201903049T4 (tr) | 2019-03-21 |
FR2965567A1 (fr) | 2012-04-06 |
FR2965567B1 (fr) | 2013-12-27 |
KR20130060323A (ko) | 2013-06-07 |
CA2809850C (fr) | 2017-07-25 |
SI2625258T1 (sl) | 2019-07-31 |
KR20150070414A (ko) | 2015-06-24 |
US9212340B2 (en) | 2015-12-15 |
JP5823524B2 (ja) | 2015-11-25 |
US20130310297A1 (en) | 2013-11-21 |
EP2625258A1 (fr) | 2013-08-14 |
WO2012045971A1 (fr) | 2012-04-12 |
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