US20130310297A1 - Polymer-cleaning composition - Google Patents
Polymer-cleaning composition Download PDFInfo
- Publication number
- US20130310297A1 US20130310297A1 US13/877,548 US201113877548A US2013310297A1 US 20130310297 A1 US20130310297 A1 US 20130310297A1 US 201113877548 A US201113877548 A US 201113877548A US 2013310297 A1 US2013310297 A1 US 2013310297A1
- Authority
- US
- United States
- Prior art keywords
- dmso
- amine
- composition
- composition according
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 119
- 238000004140 cleaning Methods 0.000 title claims abstract description 27
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims abstract description 218
- 229920000642 polymer Polymers 0.000 claims abstract description 30
- 239000004814 polyurethane Substances 0.000 claims abstract description 28
- 229920002635 polyurethane Polymers 0.000 claims abstract description 20
- 229920003023 plastic Polymers 0.000 claims abstract description 5
- 239000004033 plastic Substances 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 47
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 46
- 150000001412 amines Chemical class 0.000 claims description 39
- 239000002904 solvent Substances 0.000 claims description 24
- 239000000654 additive Substances 0.000 claims description 20
- 230000000996 additive effect Effects 0.000 claims description 16
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 16
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 12
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 8
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 6
- 229940102253 isopropanolamine Drugs 0.000 claims description 6
- 150000003141 primary amines Chemical class 0.000 claims description 6
- 150000001298 alcohols Chemical class 0.000 claims description 5
- 150000002170 ethers Chemical class 0.000 claims description 5
- 150000003335 secondary amines Chemical class 0.000 claims description 5
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 4
- VHYUNSUGCNKWSO-UHFFFAOYSA-N 3-propan-2-yloxypropan-1-amine Chemical compound CC(C)OCCCN VHYUNSUGCNKWSO-UHFFFAOYSA-N 0.000 claims description 4
- 238000005260 corrosion Methods 0.000 claims description 4
- 230000007797 corrosion Effects 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 4
- FAXDZWQIWUSWJH-UHFFFAOYSA-N 3-methoxypropan-1-amine Chemical compound COCCCN FAXDZWQIWUSWJH-UHFFFAOYSA-N 0.000 claims description 3
- 101100456571 Mus musculus Med12 gene Proteins 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- HVOBSBRYQIYZNY-UHFFFAOYSA-N 2-[2-(2-aminoethylamino)ethylamino]ethanol Chemical compound NCCNCCNCCO HVOBSBRYQIYZNY-UHFFFAOYSA-N 0.000 claims description 2
- DCZMLYRQHBZWLZ-UHFFFAOYSA-N 2-[2-(3-aminopropoxy)ethoxy]ethanol Chemical compound NCCCOCCOCCO DCZMLYRQHBZWLZ-UHFFFAOYSA-N 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 2
- 150000001408 amides Chemical class 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 150000003949 imides Chemical class 0.000 claims description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 2
- 125000002560 nitrile group Chemical group 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000004634 thermosetting polymer Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 57
- 238000004090 dissolution Methods 0.000 description 19
- 238000002425 crystallisation Methods 0.000 description 7
- 230000008025 crystallization Effects 0.000 description 7
- 238000007654 immersion Methods 0.000 description 6
- 239000011877 solvent mixture Substances 0.000 description 6
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 4
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 231100000331 toxic Toxicity 0.000 description 3
- 230000002588 toxic effect Effects 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- ZWKKRUNHAVNSFW-UHFFFAOYSA-N dimethyl 2-methylpentanedioate Chemical compound COC(=O)CCC(C)C(=O)OC ZWKKRUNHAVNSFW-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 238000007922 dissolution test Methods 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- -1 hydroxyethyl groups Chemical group 0.000 description 2
- 231100001231 less toxic Toxicity 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- WVUYYXUATWMVIT-UHFFFAOYSA-N 1-bromo-4-ethoxybenzene Chemical compound CCOC1=CC=C(Br)C=C1 WVUYYXUATWMVIT-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000011054 acetic acid Nutrition 0.000 description 1
- 125000005262 alkoxyamine group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 235000019568 aromas Nutrition 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D11/00—Special methods for preparing compositions containing mixtures of detergents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2093—Esters; Carbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3445—Organic compounds containing sulfur containing sulfino groups, e.g. dimethyl sulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines
Definitions
- solvents are most commonly organic solvents, some of which are foul-smelling, more or less toxic and damaging to the environment, but also especially toxic and harmful to the users responsible for cleaning said polymer residues.
- DMF dimethylformamide
- a first objective of the present invention is to provide novel polymer-residue-cleaning products, formulations and compositions which are less toxic and less harmful than the solvents used today, or even residue-cleaning products, formulations and compositions which are not toxic and not harmful to the environment and to users.
- Another objective of the present invention is to provide polymer-residue-cleaning products, formulations and compositions which are more efficient than the solvents known and used today.
- composition comprising:
- composition comprising:
- Yet another aspect of the present invention relates to process for partially or totally dissolving a polymer, comprising bringing the polymer into contact with the composition, wherein the composition comprises:
- Another aspect of the present invention relates to a process for cleaning polymer residues present on devices used in the transformation of plastics, comprising bringing said device soiled with said polymer residues into contact with at least one composition at a temperature of ranging from ambient temperature to 90° C., wherein said composition comprises:
- composition of the invention comprises, and according to a preferred aspect consists of, DMSO and at least one amine, with optionally water and/or at least one additive.
- composition comprising, and preferably consisting of:
- composition according to the invention comprises, and preferably consists of:
- the amine(s) present in the composition of the invention can be of any type known to those skilled in the art. However, primary, secondary or tertiary amines with a molecular weight of less than 500 daltons, preferably less than 300 daltons, or preferably even less than 200 daltons, more particularly preferably less than 100 daltons, are preferred. Primary or secondary amines are preferred, primary amines being most particularly preferred.
- Amines comprising a single amine function are preferred. Amines also comprising at least one oxygen atom, and preferably one or two oxygen atoms, are also preferred.
- amines comprising one or two groups chosen from hydroxyalkyl and alkoxyalkyl, where alkyl represents methyl, ethyl, propyl or butyl, are still further preferred. Most particularly preferred are amines comprising one or two hydroxyethyl groups and/or a methoxy group. Amines bearing one or two hydroxyethyl groups are the most preferred.
- the amines which can be advantageously used in the compositions according to the invention are chosen from alkylalcanolamines, alkyldialcanolamines and alkoxyamines.
- MEoA monoethanolamine
- DEoA diethanolamine
- PoA propanolamine
- BiPoA butyl-iso-propanolamine
- iPoA iso-propanolamine
- 2-[2-(3-aminopropoxy)ethoxy]ethanol N-2-hydroxyethyldiethylenetriamine
- MoPA
- compositions according to the invention comprise at least one amine chosen from monoethanolamine (MEoA), diethanolamine (DEoA), propanolamine (PoA) and (3-methoxy)propylamine (MoPA), more preferably from monoethanolamine (MEoA) and diethanolamine (DEoA).
- the presence of an amount of water in the compositions of the invention has proved to be advantageous for enabling even more efficient dissolution of polymer residues.
- compositions of the invention has the additional advantage of lowering the crystallization point of said compositions.
- the present invention relates to a composition
- a composition comprising, and preferably consisting of:
- the present invention relates to a composition
- a composition comprising, and preferably consisting of:
- compositions according to the present invention can comprise one or more additives commonly used in the field. These additives advantageously do not have specific or intrinsic polymer-cleaning or polymer-dissolving properties.
- additives which can be present in the compositions according to the invention, mention may be made, by way of nonlimiting examples, of corrosion inhibitors, antioxidants, dyes, aromas and other odor-masking agents, stabilizers, wetting agents, and the like.
- corrosion inhibitors mention may be made of catechol, sodium tolyltriazolate and morpholine, for example.
- a particularly preferred composition for cleaning polymer residues according to the present invention comprises, and preferably consists of, from 80% to 90% of DMSO, from 2% to 9% of MEoA and from 5% to 15%, for example approximately 8%, of water.
- This composition can also comprise from a few ppm by weight to 1% of a corrosion inhibitor.
- compositions of the present invention can comprise, instead of the DMSO, a mixture of DMSO and at least one other non-nitrogenous solvent.
- non-nitrogenous solvents mention may be made, by way of nonlimiting examples, of alcohols, ethers, esters, and other nonnitrogenous solvents compatible with the compositions such as they have just been described.
- nonnitrogenous additional solvents that can form a mixture with DMSO present in the compositions of the present invention
- alkyl denotes a linear or branched hydrocarbon-based chain comprising from 1 to 6 carbon atoms.
- These esters advantageously originate from linear-chain or branched-chain monocarboxylic and/or dicarboxylic acids comprising from 3 to 30 carbon atoms.
- the invention relates to a composition
- a composition comprising, and preferably consisting of:
- the invention relates to a composition
- a composition comprising, and preferably consisting of:
- compositions of the invention can be prepared according to any method known in the field, and for example by simple mixing of the various ingredients in any order. However, it is preferred to add the amines to the DMSO/water mixture, when said water is present in the composition.
- the optional additives are advantageously added to the final mixture of DMSO/amine(s) and optionally water.
- a subject of the present invention is the use of at least one of the compositions such as they have just been defined, for partially or totally dissolving polymers, and in particular for cleaning polymer residues.
- cleaning polymer residues is intended to mean the partial or total dissolution of polymers with the compositions of the present invention.
- the polymers which can thus be partially or totally dissolved are of any type, thermoplastic and thermosetting, in particular thermoplastic.
- the polymers targeted in the use of the present invention are, for example, chosen, in a nonlimiting manner, from fluoropolymers, such as poly(vinyl difluoride) or PVDF, nitrogenous polycondensates, such as those bearing amide, imide, amido-amide, urethane or nitrile groups, sulfur-containing polycondensates, such as those bearing sulfone groups, and the like.
- fluoropolymers such as poly(vinyl difluoride) or PVDF
- nitrogenous polycondensates such as those bearing amide, imide, amido-amide, urethane or nitrile groups
- sulfur-containing polycondensates such as those bearing sulfone groups, and the like.
- compositions of the invention are particularly suitable for cleaning polymers chosen from polyurethanes, polyamides, polyamide-imides, polyethersulfones, polyacrylonitriles, and the like, and more particularly suitable for dissolving, for cleaning, polyurethanes.
- compositions of the invention are most particularly effective for cleaning polyurethane residues for which the solvent of choice to date was DMF, which is now prohibited, in particular by the European guidelines.
- the compositions of the present invention are used in a temperature range from ambient temperature to 90° C.
- the efficiency of the compositions according to the invention decreases rapidly when the temperature decreases, and, below ambient temperature, the time required for efficient cleaning can prove to be relatively long.
- the cleaning composition can generate unpleasant vapors, but it is possible to work in a ventilated or closed chamber, thus making it possible to work at the boiling point of the cleaning composition.
- compositions according to the invention at a temperature of between 30° C. and 70° C., for example between 50° C. and 65° C.
- the present invention relates to a process for cleaning polymer residues present on devices used in the transformation of plastics as previously defined, said process comprising at least one step of bringing the said device soiled with said polymer residues into contact with at least one composition according to the present invention, under the temperature conditions indicated above.
- bringing into contact is intended to mean partial or total immersion of the device to be cleaned, with or without agitation, or spraying the device to be cleaned with a cleaning composition at various pressures, for example by means of a spray gun or brush, and the like.
- the bringing into contact can simply be wiping with a cloth, a sponge or any other absorbing/desorbing material soaked in the cleaning composition.
- the bringing into contact defined above can optionally be accompanied by physical cleaning, for example using tools, such as spatulas, scrapers, and the like.
- Example 1 Dissolution of Polyurethane (PU) using DMF and DMSO
- the reference solvent is DMF.
- DMF dimethyl methacrylate
- the tests are in this case carried out in 20 ml glass flasks. 10 ml of the cleaning composition (e.g., DMF or DMSO alone) preheated in an incubator to approximately 60° C. are placed in each flask. A sample of polyurethane (PU) having a parallelepipedal shape (approximately 10 ⁇ 5 ⁇ 2 mm) is then placed in each flask. The flasks are closed and left, without agitation, in an incubator at 60° C.
- the cleaning composition e.g., DMF or DMSO alone
- a sample of polyurethane (PU) having a parallelepipedal shape approximately 10 ⁇ 5 ⁇ 2 mm
- Example 2 Dissolution of Polyurethane (PU) in a DMSO/Nonnitrogenous Solvent Mixture
- Example 3 Dissolution of Polyurethane (PU) in a DMSO/MEoA Mixture
- a DMSO/MEoA mixture is therefore much more efficient than DMF alone.
- Example 4 Dissolution of Polyurethane (PU) in a DMSO/MEoA Mixture, With and Without the Addition of Water
- the PU After 4 h at 60° C., the PU is completely dissolved in the DMSO/MEoA/water mixture, whereas it is not dissolved in the DMSO/MEoA (95.5%/4.5%) mixture.
- a DMSO/MEoA/water mixture is therefore much more efficient than a DMSO/MEoA mixture.
- Example 5 Influence of the Proportion of Nitrogenous Solvent in the DMSO on the Dissolution of Polyurethane (PU)
- PU-sample dissolution tests are carried out while varying the concentration of MEoA in the DMSO, from 1% to 5%.
- the DMSO+1% MEoA mixture is more efficient than DMF alone, since flakes of PU in suspension in the mixture have already begun to be seen after 1 hour at 60°, whereas no effect (other than swelling of the sample) is observed in either DMF or DMSO.
- the crystallization point of DMSO is 18.5° C., which often poses storage and handling problems during winter.
- the crystallization point of a DMSO (95%)+MEoA (5%) mixture is approximately 15° C. This crystallization point can be further enhanced by adding water to the composition.
- a test is carried out by adding 8% by weight of water to DMSO, and then the MEoA is added (5% by weight in the above mixture). The crystallization point of this mixture is measured at ⁇ 2.9° C., whereas a DMSO/water (92%/8%) mixture has a crystallization point close to 0° C.
- dissolution tests are carried out on this DMSO/MEoA/water (i.e. 87.6%/4.8%/7.6%) mixture.
- Example 7 Influence of the Water Content on the Dissolution of Polyurethane (PU) in a DMSO/MEoA/Water Mixture
- Example 8 Dissolution of Polyurethane (PU) in a DMSO/Nonnitrogenous Solvent/MEoA/Water Mixture
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Abstract
Description
- These cleaning operations aimed at removing the polymer residues are most commonly carried out today by bringing said residues into contact with one or more solvents or mixtures of solvents.
- These solvents are most commonly organic solvents, some of which are foul-smelling, more or less toxic and damaging to the environment, but also especially toxic and harmful to the users responsible for cleaning said polymer residues.
- Many of these solvents are today banned, or are going to be banned, either by government directives, or directly through the determination of the manufacturers themselves, worried about preserving the health of their employees.
- For example, it is known that molds used for manufacturing polyurethane objects are generally cleaned with dimethylformamide (DMF) which is today considered to be harmful and toxic.
- Thus, a first objective of the present invention is to provide novel polymer-residue-cleaning products, formulations and compositions which are less toxic and less harmful than the solvents used today, or even residue-cleaning products, formulations and compositions which are not toxic and not harmful to the environment and to users.
- Another objective of the present invention is to provide polymer-residue-cleaning products, formulations and compositions which are more efficient than the solvents known and used today.
- Other further objectives will emerge during the description of the present invention which follows.
- One aspect of the present invention relates to a composition comprising:
-
- from 40% to 95% of dimethyl sulfoxide (DMSO);
- from 1% to 60% of at least one amine;
- from 0% to 30% of water; and
- from 0% to 10% of at least one additive.
- Another aspect of the present invention relates to a composition comprising:
-
- from 40% to 95% of a mixture of dimethyl sulfoxide (DMSO) and at least one non-nitrogenous solvent chosen from alcohols, ethers, and esters;
- from 1% to 60% of at least one amine;
- from 0% to 30% of water; and
- from 0% to 10% of at least one additive.
- Yet another aspect of the present invention relates to process for partially or totally dissolving a polymer, comprising bringing the polymer into contact with the composition, wherein the composition comprises:
-
- from 40% to 95% of dimethyl sulfoxide (DMSO);
- from 1% to 60% of at least one amine;
- from 0% to 30% of water; and
- from 0% to 10% of at least one additive.
- Another aspect of the present invention relates to a process for cleaning polymer residues present on devices used in the transformation of plastics, comprising bringing said device soiled with said polymer residues into contact with at least one composition at a temperature of ranging from ambient temperature to 90° C., wherein said composition comprises:
-
- from 40% to 95% of dimethyl sulfoxide (DMSO);
- from 1% to 30% of at least one amine;
- from 0% to 30% of water; and
- from 0% to 10% of at least one additive.
- It has now been found that it is possible at least partially, or even completely, to achieve the abovementioned objectives by using, as polymer-cleaning composition, a mixture comprising dimethyl sulfoxide (DMSO) and at least one amine.
- The composition of the invention comprises, and according to a preferred aspect consists of, DMSO and at least one amine, with optionally water and/or at least one additive.
- More specifically, the present invention relates to a composition comprising, and preferably consisting of:
-
- from 40% to 95% of dimethyl sulfoxide (DMSO);
- from 1% to 60% of at least one amine;
- from 0% to 30% of water; and
- from 0% to 10% of at least one additive.
- In the description of this invention, all the percentages are expressed by weight, unless otherwise explicitly mentioned.
- DMSO is a solvent considered to be nonharmful and nontoxic. In addition, it can be available in various degrees of purity. DMSO of high purity has virtually no odor, or at the very least no nauseating odor. According to one variant, the DMSO used can be advantageously odorized with at least one odorant.
- According to one preferred embodiment, the composition according to the invention comprises, and preferably consists of:
-
- from 50% to 95%, preferably from 60% to 97%, of dimethyl sulfoxide (DMSO);
- from 1% to 30%, preferably from 2% to 20%, of at least one amine;
- from 0% to 30% of water, preferably from 0% to 15%; and
- from 0% to 10%, preferably from 0% to 5%, of at least one additive.
- The amine(s) present in the composition of the invention can be of any type known to those skilled in the art. However, primary, secondary or tertiary amines with a molecular weight of less than 500 daltons, preferably less than 300 daltons, or preferably even less than 200 daltons, more particularly preferably less than 100 daltons, are preferred. Primary or secondary amines are preferred, primary amines being most particularly preferred.
- Amines comprising a single amine function are preferred. Amines also comprising at least one oxygen atom, and preferably one or two oxygen atoms, are also preferred.
- In at least one embodiment, amines comprising one or two groups chosen from hydroxyalkyl and alkoxyalkyl, where alkyl represents methyl, ethyl, propyl or butyl, are still further preferred. Most particularly preferred are amines comprising one or two hydroxyethyl groups and/or a methoxy group. Amines bearing one or two hydroxyethyl groups are the most preferred.
- By way of nonlimiting examples, the amines which can be advantageously used in the compositions according to the invention are chosen from alkylalcanolamines, alkyldialcanolamines and alkoxyamines.
- According to one embodiment, and among the amines which are usable in the compositions of the invention, mention may be made, by way of nonlimiting examples, of monoethanolamine (MEoA), diethanolamine (DEoA), propanolamine (PoA), butyl-iso-propanolamine (BiPoA), iso-propanolamine (iPoA), 2-[2-(3-aminopropoxy)ethoxy]ethanol, N-2-hydroxyethyldiethylenetriamine, (3-methoxy)propylamine (MoPA), 3-isopropoxypropylamine (IPOPA) and triethylamine (TEA).
- According to one most particularly preferred aspect, the compositions according to the invention comprise at least one amine chosen from monoethanolamine (MEoA), diethanolamine (DEoA), propanolamine (PoA) and (3-methoxy)propylamine (MoPA), more preferably from monoethanolamine (MEoA) and diethanolamine (DEoA).
- In addition to the DMSO and at least one amine, such as they have just been defined, the presence of an amount of water in the compositions of the invention has proved to be advantageous for enabling even more efficient dissolution of polymer residues.
- Moreover, the presence of water in the compositions of the invention has the additional advantage of lowering the crystallization point of said compositions.
- Thus, and according to yet another aspect, the present invention relates to a composition comprising, and preferably consisting of:
-
- from 40% to 95% of dimethyl sulfoxide (DMSO);
- from 1% to 60% of at least one amine;
- from 1% to 30% of water; and
- from 0% to 10% of at least one additive.
- In one preferred embodiment, the present invention relates to a composition comprising, and preferably consisting of:
-
- from 50% to 95%, preferably from 60% to 97%, of dimethyl sulfoxide (DMSO);
- from 1% to 30%, preferably from 2% to 20%, of at least one amine;
- from 1% to 30% of water, preferably from 1% to 15%; and
- from 0% to 10%, preferably from 0% to 5%, of at least one additive.
- Finally, the compositions according to the present invention can comprise one or more additives commonly used in the field. These additives advantageously do not have specific or intrinsic polymer-cleaning or polymer-dissolving properties. Among the additives which can be present in the compositions according to the invention, mention may be made, by way of nonlimiting examples, of corrosion inhibitors, antioxidants, dyes, aromas and other odor-masking agents, stabilizers, wetting agents, and the like.
- Among the corrosion inhibitors, mention may be made of catechol, sodium tolyltriazolate and morpholine, for example.
- A particularly preferred composition for cleaning polymer residues according to the present invention comprises, and preferably consists of, from 80% to 90% of DMSO, from 2% to 9% of MEoA and from 5% to 15%, for example approximately 8%, of water. This composition can also comprise from a few ppm by weight to 1% of a corrosion inhibitor.
- According to yet another aspect, the compositions of the present invention can comprise, instead of the DMSO, a mixture of DMSO and at least one other non-nitrogenous solvent. Among the non-nitrogenous solvents, mention may be made, by way of nonlimiting examples, of alcohols, ethers, esters, and other nonnitrogenous solvents compatible with the compositions such as they have just been described.
- Among the nonnitrogenous additional solvents that can form a mixture with DMSO present in the compositions of the present invention, preference is given to monofunctional and/or difunctional esters, and more particularly alkyl esters, where “alkyl” denotes a linear or branched hydrocarbon-based chain comprising from 1 to 6 carbon atoms. These esters advantageously originate from linear-chain or branched-chain monocarboxylic and/or dicarboxylic acids comprising from 3 to 30 carbon atoms.
- Most particularly preferred are methyl, ethyl, propyl and butyl esters of formic acid, acetic acid, propionic acid, butyric acid, maleic acid, succinic acid, glutaric acid, 2-methylglutaric acid, and the like, and also mixtures thereof in any proportions.
- Thus, in one preferred embodiment, the invention relates to a composition comprising, and preferably consisting of:
-
- from 50% to 95%, preferably from 60% to 97%, of a dimethyl sulfoxide (DMSO)/non-nitrogenous solvent mixture, said non-nitrogenous solvent being chosen from alcohols, ethers and esters;
- from 1% to 30%, preferably from 2% to 20%, of at least one amine;
- from 0% to 30% of water, preferably from 0% to 15%; and
- from 0% to 10%, preferably from 0% to 5%, of at least one additive.
- According to another preferred embodiment, the invention relates to a composition comprising, and preferably consisting of:
-
- from 50% to 95%, preferably from 60% to 97%, of a dimethyl sulfoxide (DMSO)/non-nitrogenous solvent mixture, said non-nitrogenous solvent being chosen from alcohols, ethers and esters;
- from 1% to 30%, preferably from 2% to 20%, of at least one amine;
- from 1% to 30% of water, preferably from 1% to 15%; and
- from 0% to 10%, preferably from 0% to 5%, of at least one additive.
- In the compositions according to the invention which comprise a DMSO/non-nitrogenous solvent mixture, preference is given to those for which the DMSO/non-nitrogenous solvent weight ratio is between 99/1 and 30/70, preferably between 90/10 and 40/60, for example the weight ratio is approximately 50/50.
- The compositions of the invention can be prepared according to any method known in the field, and for example by simple mixing of the various ingredients in any order. However, it is preferred to add the amines to the DMSO/water mixture, when said water is present in the composition. The optional additives are advantageously added to the final mixture of DMSO/amine(s) and optionally water.
- According to another aspect, a subject of the present invention is the use of at least one of the compositions such as they have just been defined, for partially or totally dissolving polymers, and in particular for cleaning polymer residues.
- The term “cleaning polymer residues” is intended to mean the partial or total dissolution of polymers with the compositions of the present invention.
- The polymers which can thus be partially or totally dissolved are of any type, thermoplastic and thermosetting, in particular thermoplastic.
- The polymers targeted in the use of the present invention are, for example, chosen, in a nonlimiting manner, from fluoropolymers, such as poly(vinyl difluoride) or PVDF, nitrogenous polycondensates, such as those bearing amide, imide, amido-amide, urethane or nitrile groups, sulfur-containing polycondensates, such as those bearing sulfone groups, and the like.
- The compositions of the invention are particularly suitable for cleaning polymers chosen from polyurethanes, polyamides, polyamide-imides, polyethersulfones, polyacrylonitriles, and the like, and more particularly suitable for dissolving, for cleaning, polyurethanes.
- The compositions of the invention are most particularly effective for cleaning polyurethane residues for which the solvent of choice to date was DMF, which is now prohibited, in particular by the European guidelines.
- For cleaning polymer residues, the compositions of the present invention are used in a temperature range from ambient temperature to 90° C. The efficiency of the compositions according to the invention decreases rapidly when the temperature decreases, and, below ambient temperature, the time required for efficient cleaning can prove to be relatively long. Above 90° C., the cleaning composition can generate unpleasant vapors, but it is possible to work in a ventilated or closed chamber, thus making it possible to work at the boiling point of the cleaning composition.
- However, it is preferred to use the compositions according to the invention at a temperature of between 30° C. and 70° C., for example between 50° C. and 65° C.
- According to yet another aspect, the present invention relates to a process for cleaning polymer residues present on devices used in the transformation of plastics as previously defined, said process comprising at least one step of bringing the said device soiled with said polymer residues into contact with at least one composition according to the present invention, under the temperature conditions indicated above.
- The term “bringing into contact” is intended to mean partial or total immersion of the device to be cleaned, with or without agitation, or spraying the device to be cleaned with a cleaning composition at various pressures, for example by means of a spray gun or brush, and the like. As a variant, the bringing into contact can simply be wiping with a cloth, a sponge or any other absorbing/desorbing material soaked in the cleaning composition.
- The bringing into contact defined above can optionally be accompanied by physical cleaning, for example using tools, such as spatulas, scrapers, and the like.
- The present invention is now illustrated by means of the examples which follow, which are in no way limiting in nature, and which consequently cannot be understood to be capable of restricting the scope of the invention as claimed.
- Polyurethane residues originating from shoe sole molds were used to carry out the tests illustrating the invention.
- The reference solvent is DMF. To clean the molds, the molds are usually immersed for a few hours in a bath of DMF brought to 60° C.
- The tests are in this case carried out in 20 ml glass flasks. 10 ml of the cleaning composition (e.g., DMF or DMSO alone) preheated in an incubator to approximately 60° C. are placed in each flask. A sample of polyurethane (PU) having a parallelepipedal shape (approximately 10×5×2 mm) is then placed in each flask. The flasks are closed and left, without agitation, in an incubator at 60° C.
- Swelling of the samples is first of all observed after approximately 2 to 3 minutes of immersion. After 25 minutes, the PU is not dissolved in either the DMF or the DMSO. The difference in efficiency between the DMF and the DMSO is observed in the time: after 18 hours at 60° C., the PU begins to become soluble in the DMF, whereas nothing happens in the DMSO. DMF is therefore more effective than DMSO alone.
- The same protocol as in example 1 is repeated using a mixture of DMSO (95.5%) and diacetone alcohol (4.5%). As in DMSO, swelling of the PU is observed in the DMSO/diacetone alcohol mixture, but no dissolution, even after 18 hours of immersion of the sample.
- A comparable test was carried out with a DMSO/hexylene glycol mixture. Likewise, it is observed that the hexylene glycol provides no additional efficiency. This mixture acts like DMSO and is less efficient than DMF.
- The addition of a non-nitrogenous, oxygen-containing solvent to DMSO does not make it possible to improve the efficiency of DMSO alone and remains a less effective solution than dissolution with DMF.
- The same protocol as in example 1 is repeated using a mixture of DMSO (95.5%) and monoethanolamine (4.5%), with immersion for 18 hours at 60° C.
- It is observed, surprisingly, that the PU sample is completely dissolved in the DMSO/MEoA mixture, whereas, in DMF, the sample barely begins to dissolve.
- A DMSO/MEoA mixture is therefore much more efficient than DMF alone.
- The same protocol as in example 1 is repeated while comparing a DMSO/MEoA (95.5%/4.5%) composition and a DMSO/MEoA/water (87.5%/4.5%/8%) composition.
- After 4 h at 60° C., the PU is completely dissolved in the DMSO/MEoA/water mixture, whereas it is not dissolved in the DMSO/MEoA (95.5%/4.5%) mixture.
- A DMSO/MEoA/water mixture is therefore much more efficient than a DMSO/MEoA mixture.
- Still according to the protocol described in example 1, PU-sample dissolution tests are carried out while varying the concentration of MEoA in the DMSO, from 1% to 5%.
- It is observed that the greater the amount of MEoA in the DMSO, the faster the dissolution of the PU.
- In addition, the DMSO+1% MEoA mixture is more efficient than DMF alone, since flakes of PU in suspension in the mixture have already begun to be seen after 1 hour at 60°, whereas no effect (other than swelling of the sample) is observed in either DMF or DMSO.
- After 48 hours at 60° C., the PU is completely dissolved in the DMSO+1% MEoA mixture. The addition of MEoA to DMSO (from 1% to 5%) clearly increases the dissolution of PU compared with DMSO alone. The DMSO+MEoA mixture is more efficient than DMF.
- The crystallization point of DMSO is 18.5° C., which often poses storage and handling problems during winter.
- The crystallization point of a DMSO (95%)+MEoA (5%) mixture is approximately 15° C. This crystallization point can be further enhanced by adding water to the composition.
- A test is carried out by adding 8% by weight of water to DMSO, and then the MEoA is added (5% by weight in the above mixture). The crystallization point of this mixture is measured at −2.9° C., whereas a DMSO/water (92%/8%) mixture has a crystallization point close to 0° C.
- According to the protocol of the example, dissolution tests are carried out on this DMSO/MEoA/water (i.e. 87.6%/4.8%/7.6%) mixture.
- After 3 hours at 60° C., the PU sample is completely dissolved in this mixture, whereas it is only beginning to be dissolved in the DMSO/MEoA (95%/5%) mixture and no dissolution is observed in DMF: the addition of water to the DMSO/MEoA mixture accelerates the dissolution of PU.
- The same protocol as example 1 is repeated while comparing DMSO/MEoA/water compositions with varying water contents.
- After 7 hours at 60° C., the results are the following:
-
- 91.5% DMSO/4.5% MEoA/4% water: polymer not completely dissolved;
- 87.5% DMSO/4.5% MEoA/8% water: polymer completely dissolved;
- 80.5% DMSO/4.5% MEoA/15% water: very beginning of dissolution of the polymer;
- 70.5% DMSO/4.5% MEoA/25% water: no dissolution of the polymer;
- 45.5% DMSO/4.5% MEoA/50% water: no dissolution of the polymer.
- It can therefore be concluded that a water content up to 15% significantly improves the dissolving efficiency of the DMSO/MEoA/water compositions.
- The same protocol as in example 1 is repeated using a mixture of DMSO (50% by weight) and dimethyl glutarate (50% by weight). As in DMSO, swelling of the PU is observed in the DMSO/dimethyl 2-methylglutarate mixture, but no dissolution, even after 18 hours of immersion of the sample.
- A comparable test was carried out with a DMSO/dimethyl 2-methylglutarate/MEoA/water (44.5%-44.5%-3%-8% by weight) mixture. After 18 hours of immersion of the PU sample, the latter is completely dissolved.
- The addition of MEoA and of water, under the conditions of the invention, to a DMSO/nonnitrogenous solvent mixture makes it possible to clearly improve the effectiveness compared with the DMSO/nonnitrogenous solvent mixture alone.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014125531A (en) * | 2012-12-26 | 2014-07-07 | Kaneko Kagaku:Kk | Solvent composition for resin removal |
US9994802B2 (en) | 2014-04-09 | 2018-06-12 | Wacker Chemie Ag | Cleaning industrial plant components to remove metal halides |
Families Citing this family (3)
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JP6122333B2 (en) * | 2013-04-12 | 2017-04-26 | コーデックケミカル株式会社 | Cleaning composition, cleaning agent containing the composition, and cleaning method using them |
CN106434044A (en) * | 2015-08-06 | 2017-02-22 | 盛德罗宝节能材料科技股份有限公司 | Polyurethane contamination cleaning agent for surface of decoration and thermal insulation integrated plate |
JP7513879B2 (en) | 2020-09-15 | 2024-07-10 | 横浜ゴム株式会社 | Method and apparatus for manufacturing bead ring, and method for manufacturing tire |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020037820A1 (en) * | 2000-07-10 | 2002-03-28 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
US20050202987A1 (en) * | 2000-07-10 | 2005-09-15 | Small Robert J. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6492311B2 (en) * | 1990-11-05 | 2002-12-10 | Ekc Technology, Inc. | Ethyenediaminetetraacetic acid or its ammonium salt semiconductor process residue removal composition and process |
US6475966B1 (en) * | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
US6916772B2 (en) * | 2001-07-13 | 2005-07-12 | Ekc Technology, Inc. | Sulfoxide pyrolid(in)one alkanolamine cleaner composition |
US20030104960A1 (en) * | 2001-11-30 | 2003-06-05 | Opre James E. | Liquid cleaning composition for polymer reactor scale |
US7442675B2 (en) * | 2003-06-18 | 2008-10-28 | Tokyo Ohka Kogyo Co., Ltd. | Cleaning composition and method of cleaning semiconductor substrate |
US20070243773A1 (en) * | 2005-10-28 | 2007-10-18 | Phenis Michael T | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
US20100104824A1 (en) * | 2006-10-23 | 2010-04-29 | Phenis Michael T | Dynamic multi-purpose composition for the removal of photoresists |
US8309502B2 (en) * | 2009-03-27 | 2012-11-13 | Eastman Chemical Company | Compositions and methods for removing organic substances |
-
2010
- 2010-10-05 FR FR1058050A patent/FR2965567B1/en active Active
-
2011
- 2011-10-04 EP EP11779790.2A patent/EP2625258B1/en active Active
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- 2011-10-04 KR KR1020157014417A patent/KR101660199B1/en active IP Right Grant
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020037820A1 (en) * | 2000-07-10 | 2002-03-28 | Ekc Technology, Inc. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
US20050202987A1 (en) * | 2000-07-10 | 2005-09-15 | Small Robert J. | Compositions for cleaning organic and plasma etched residues for semiconductor devices |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014125531A (en) * | 2012-12-26 | 2014-07-07 | Kaneko Kagaku:Kk | Solvent composition for resin removal |
US9994802B2 (en) | 2014-04-09 | 2018-06-12 | Wacker Chemie Ag | Cleaning industrial plant components to remove metal halides |
Also Published As
Publication number | Publication date |
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CN103119148A (en) | 2013-05-22 |
KR20150070414A (en) | 2015-06-24 |
JP2014500161A (en) | 2014-01-09 |
CN103119148B (en) | 2016-04-06 |
AU2011311433B2 (en) | 2015-09-17 |
SI2625258T1 (en) | 2019-07-31 |
EP2625258B1 (en) | 2019-01-16 |
PL2625258T3 (en) | 2019-05-31 |
AU2011311433A1 (en) | 2013-06-20 |
CA2809850A1 (en) | 2012-04-12 |
FR2965567A1 (en) | 2012-04-06 |
TR201903049T4 (en) | 2019-03-21 |
CA2809850C (en) | 2017-07-25 |
KR20130060323A (en) | 2013-06-07 |
US9212340B2 (en) | 2015-12-15 |
BR112013008332A2 (en) | 2016-06-14 |
JP5823524B2 (en) | 2015-11-25 |
EP2625258A1 (en) | 2013-08-14 |
KR101660199B1 (en) | 2016-09-26 |
FR2965567B1 (en) | 2013-12-27 |
WO2012045971A1 (en) | 2012-04-12 |
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