EP2588533A2 - Plateaux thermoformés pour circuits intégrés à base de compositions de polyphénylène-éther - Google Patents

Plateaux thermoformés pour circuits intégrés à base de compositions de polyphénylène-éther

Info

Publication number
EP2588533A2
EP2588533A2 EP11748493.1A EP11748493A EP2588533A2 EP 2588533 A2 EP2588533 A2 EP 2588533A2 EP 11748493 A EP11748493 A EP 11748493A EP 2588533 A2 EP2588533 A2 EP 2588533A2
Authority
EP
European Patent Office
Prior art keywords
tray
ppe
polymer compound
poly
thermoplastic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11748493.1A
Other languages
German (de)
English (en)
Inventor
Kurt S. Edwards
Chuan Tat Choo
Qiwei Lu
Kenneth Sienkowski
Kong Chin Chew
Vanessa Mirabile
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lubrizol Advanced Materials Inc
Original Assignee
Lubrizol Advanced Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lubrizol Advanced Materials Inc filed Critical Lubrizol Advanced Materials Inc
Publication of EP2588533A2 publication Critical patent/EP2588533A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
    • Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
    • Y10T428/1397—Single layer [continuous layer]

Definitions

  • waffle trays In waffle trays, and similar systems, each tray is formed with a series of depressions or pockets formed in a grid pattern. A component part is inserted into a pocket and transported therein. This system provides an efficient arrangement in which the components can be stored or manipulated by an automated assembly process.
  • the trays of the present invention are made from a thermoplastic polymer compound that has a specific gravity of less than 1.18 g/cc as measured according to ASTM D-792.
  • the specific gravity of the polymer compound, and so of the trays made from the polymer compound, as measured by ASTM D-792 is no more than 1.18, 1.16, 1.14 or even 1.12 g/cc.
  • the polymer compounds described herein may posses any combination of the characteristics described above, and in some embodiments possess all of the described characteristics.
  • Suitable copolymers include random copolymers containing such units in combination with, for example, 2,3,6-trimethyl-l ,4-phenylene ether units. Many suitable random copolymers, as well as homopolymers, are disclosed in the patent literature. Reference is made to U.S. Pat. Nos. 4,054,553, 4,092,294, 4,477,649, 4,477,651 and 4,517,341 , the disclosures of which are incorporated by reference herein.
  • Other useful polymers and polymer blends include: AccuguardTM PPE and AccutechTM PPE, available commercially from ACLO Compounders Inc.; AcnorTM PPE-PS blend, available from Aquafil Technopolymers SpA; any of the XyronTM line of materials including the PPE-PP, PPE-PS, PPE-PE-Nylon, and PPE- SP-PP blends, available from Asahi Kasei Corporation; AshleneTM PPE, PPE-PS, and PPE-PS-Nylong blends, available from Ashley Polymers, Inc.; BlendexTM PPE and PPE-PS-Nylong blends, available from Chemutra; NorpexTM PPE available from Custom Resins Group; DeltaTM PPE-PS and PPE-PS-Nylon blends available from Delta Polymers; LuranylTM PPE-PS available from Diamond Polymers, Inc.; EnComTM PPE-PS available from EnCom, Inc.; EnsingerTM PPE-PS available from Ensinger Inc.
  • the impact modifiers suitable for use in the present invention are not overly limited.
  • the impact modifier includes a styrenic block copolymer, an ethylene acrylate copolymer, or combinations thereof.
  • compositions of the present invention may further include additional useful additives, where such additives can be utilized in suitable amounts.
  • additional additives include fillers, reinforcing fillers, pigments, heat stabilizers, UV stabilizers, flame retardants, plasticizers, rheology modifiers, processing aids, lubricants, mold release agents, and combinations thereof.
  • Useful pigments include opacifying pigments such as titanium dioxide, zinc oxide, and titanate yellow.
  • Useful pigments also include tinting pigments such as carbon black, yellow oxides, brown oxides, raw and burnt sienna or umber, chromium oxide green, cadmium pigments, chromium pigments, and other mixed metal oxide and organic pigments.
  • the compositions of the present invention are substantially free to free of fluorine atoms, chlorine atoms, bromine atoms, iodine atoms, astatine atoms, or combinations thereof (including ions of said atoms). In some embodiments, the compositions of the present invention are substantially free to free of salts and/or other compounds containing fluorine, chlorine, bromine, iodine, and/or astatine atoms, and/or ions of one or more thereof. In some embodiments, the compositions of the present invention are substantially free to free of all halogens atoms, halogen-containing salts, and/or other halogen- containing compounds.
  • the impact modifier in Example 1 -2 is a 2: 1 mixture, on a weight basis, of the ethylene methyl acrylate copolymer and the linear styrene and ethylene/butylene tri-block copolymer. Both examples contain the same amount of release agent and antioxidant.
  • a set of polymers are prepared and tested. These examples are representative of the thermoplastic composition used in the preparation of the trays described here. These compositions contain a polymer component, a conductive filler component, and an impact modifier component.
  • the expression “substantially free of may mean that and amount that does not materially affect the basic and novel characteristics of the composition under consideration, in some embodiments it may also mean no more than 5%, 4%, 2%, 1%, 0.5% or even 0.1% by weight of the material is questions is present, in still other embodiments it may mean that less than 1 ,000 ppm, 500 ppm or even 100 ppm of the material in question is present.
  • the expression “consisting essentially of permits the inclusion of substances that do not materially affect the basic and novel characteristics of the composition under consideration.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Pallets (AREA)

Abstract

La présente invention concerne un plateau de support de composants, et plus particulièrement un plateau de support thermoformé pour composants de circuit intégré telles que des puces de circuit intégré. Les plateaux selon la présente invention présentent l'avantage d'être appropriés pour toutes les étapes du processus de fabrication de composants de circuit intégré, y compris une adaptabilité pour les étapes de transport, de tri, de stockage, de l'étuvage entre autres. Ainsi, les plateaux selon la présente invention réduisent la nécessité de transférer les composants de circuit intégré d'un plateau à un autre et donc réduisent le coût de fabrication et le risque d'endommagement des pièces. Les plateaux selon la présente invention sont particulièrement appropriés pour des applications à température moyenne.
EP11748493.1A 2010-07-01 2011-06-27 Plateaux thermoformés pour circuits intégrés à base de compositions de polyphénylène-éther Withdrawn EP2588533A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36052110P 2010-07-01 2010-07-01
PCT/US2011/041950 WO2012003148A2 (fr) 2010-07-01 2011-06-27 Plateaux thermoformés pour circuits intégrés à base de compositions de polyphénylène-éther

Publications (1)

Publication Number Publication Date
EP2588533A2 true EP2588533A2 (fr) 2013-05-08

Family

ID=44509595

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11748493.1A Withdrawn EP2588533A2 (fr) 2010-07-01 2011-06-27 Plateaux thermoformés pour circuits intégrés à base de compositions de polyphénylène-éther

Country Status (7)

Country Link
US (1) US20130142979A1 (fr)
EP (1) EP2588533A2 (fr)
JP (1) JP2013530898A (fr)
KR (1) KR20130040238A (fr)
CN (1) CN102971377A (fr)
SG (1) SG186420A1 (fr)
WO (1) WO2012003148A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020016627A1 (fr) 2018-07-16 2020-01-23 Bosch Car Multimedia Portugal, S.A. Plateau empilable de protection pour dispositifs sensibles à la décharge électrostatique utilisant des polymères à mémoire de forme et méthode de fabrication du plateau

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CN104559035B (zh) * 2015-01-26 2017-06-16 湖北工业大学 一种石墨烯/abs导电塑料及其爆破剥离制备方法和用途
US10273362B2 (en) * 2015-05-25 2019-04-30 Sabic Global Technologies B.V. Poly(phenylene ether) composition and article
US10557035B2 (en) 2015-08-20 2020-02-11 Sabic Global Technologies B.V. Resin composition for high frequency electronic components
EP3543291A1 (fr) * 2018-03-21 2019-09-25 SABIC Global Technologies B.V. Compositions thermoplastiques plaquables par laser ayant une bonne ininflammabilité, une propriété thermique élevée et une bonne ductilité et articles moulés ainsi fabriqués
CN109251507B (zh) * 2018-08-22 2021-04-02 东莞市国亨塑胶科技有限公司 一种晶圆用托盘的合金抗静电材料及其制备方法
WO2021163651A1 (fr) * 2020-02-14 2021-08-19 Sunna Chung Ensembles supports rigides ayant des matières collantes moulées sur ceux-ci

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020016627A1 (fr) 2018-07-16 2020-01-23 Bosch Car Multimedia Portugal, S.A. Plateau empilable de protection pour dispositifs sensibles à la décharge électrostatique utilisant des polymères à mémoire de forme et méthode de fabrication du plateau

Also Published As

Publication number Publication date
US20130142979A1 (en) 2013-06-06
WO2012003148A2 (fr) 2012-01-05
CN102971377A (zh) 2013-03-13
JP2013530898A (ja) 2013-08-01
SG186420A1 (en) 2013-01-30
KR20130040238A (ko) 2013-04-23
WO2012003148A3 (fr) 2012-05-31

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