Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
  • B08B5/04—Cleaning by suction, with or without auxiliary action
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
  • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
  • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
  • B65G1/02—Storage devices
  • B65G1/04—Storage devices mechanical
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
  • H01L21/6735—Closed carriers
  • H01L21/67389—Closed carriers characterised by atmosphere control
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
  • B08B9/08—Cleaning containers, e.g. tanks
  • B08B9/0821—Handling or manipulating containers, e.g. moving or rotating containers in cleaning devices, conveying to or from cleaning devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B08—CLEANING
  • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
  • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
  • B08B9/08—Cleaning containers, e.g. tanks
  • B08B9/20—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought
  • B08B9/42—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus being characterised by means for conveying or carrying containers therethrough
  • B08B9/44—Cleaning containers, e.g. tanks by using apparatus into or on to which containers, e.g. bottles, jars, cans are brought the apparatus being characterised by means for conveying or carrying containers therethrough the means being for loading or unloading the apparatus
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/6773—Conveying cassettes, containers or carriers

Definitions

• the present invention relates to the devices used for the cleaning and the depollution of the transport and storage boxes of semiconductor substrates or photomasks.
• substrates such as semiconductor wafers and / or masks are processed in process chambers. These treatments comprise various steps performed in different equipment, such as material deposition steps or etching steps for example. Between each step, the substrates are arranged in transport and storage boxes which themselves are moved between the different equipment of the semiconductor manufacturing plant. Wait times during transfers between equipment can be long, typically a few hours. The transport and storage boxes thus serve as means for storing the substrates during the waiting times.
• the batches of substrates are contained in mini-environments consisting of transport and storage boxes, such as, in particular, standard lateral or front-opening transport enclosures ("FOU P” for “Front Opening Universal Pod”). or standardized bottom-shelf storage and transport enclosures ("SMI F” for "Standard Mechanical InterFace”).
• transport and storage boxes such as, in particular, standard lateral or front-opening transport enclosures ("FOU P” for "Front Opening Universal Pod”). or standardized bottom-shelf storage and transport enclosures ("SMI F” for "Standard Mechanical InterFace”).
• AMC airborne particulate contamination
• AMC Airborne Molecular Contamination
• a depollution module usually comprises a side access door depollution chamber adapted to contain a single transport and storage box. The depollution using such a module can last several hours.
• a single module is therefore not able to handle under acceptable conditions the amount of transport and storage boxes implemented in a semiconductor manufacturing plant.
• One idea may be to multiply the modules in the semiconductor manufacturing plant, to reach the required flow rate of depollution of the transport and storage boxes. But the disadvantage is that it also multiplies the size of the depollution modules, including their footprint. In fact, these clean-up modules are located in the clean room of the semiconductor manufacturing plant, and the square meters of clean room have a high investment and operating cost. At the same time, the arrangement of the depollution modules must be compatible with the "OHT" transport system ("OHT" for "Overhead Host Transport” in English) in a semiconductor manufacturing plant.
• the present invention aims first of all to reduce the footprint of the pollution abatement means.
• the invention also aims to ensure the compatibility of the pollution control means with the standardized path of the box transport system (OHT) in a semiconductor manufacturing plant.
• OHT box transport system
• the present invention aims at guaranteeing the independence and the operating identity of the depollution modules.
• the objective is to gather and arrange several pollution control modules in the same compact treatment device.
• Another object of the invention is to meet environmental standards, including noise standards, as well as safety standards.
• the sound insulation means necessarily have a thermal insulation capacity, which promotes heating of the components of the treatment device, heating may damage these components. It is therefore necessary to provide means to avoid excessive heating, which is another object of the present invention.
• Another difficulty to ensure the permanent maintenance of a sufficient processing capacity, is to allow the individual maintenance of the depollution modules constituting the processing device, allowing maintenance of a module without affecting the operation of the other modules.
• the invention aims to minimize the production cost of such a processing device, including the cost of handling means of transport and storage boxes inside the device.
• the subject of the invention is a treatment device for transport and storage boxes, comprising a depollution module having:
• a depollution chamber with a lateral access door, able to contain a transport and storage box,
• control and control means for controlling the gaseous atmosphere in the pollution control chamber.
• the device according to the invention comprises:
• each depollution module comprises its own pumping means having at least one primary pump
• the primary pump is housed in a primary pumping compartment offset longitudinally relative to the pollution control chamber.
• each depollution module is independent of the other modules, a significant space saving is realized in vertical dimension and in transverse dimension, and the depollution modules are interchangeable with the use because their performances are identical.
• the primary pump is supported by the common frame with the interposition of elastic connection means avoiding the transmission of vibrations to the pollution control chamber.
• Such an arrangement may be particularly useful in this case of arrangement of vacuum pumps in the high stages of the treatment device, because the possible transmission of pump vibrations could give rise to resonance phenomena causing vibrations and defects in the pads. semiconductor contained in the transport and storage boxes.
• each primary pump comprises an air cooling system, with a cooling air intake at a first end of the pump and with a cooling air discharge at a second end of the pump,
• an intermediate vertical wall separates one from the other:
• a second zone of pumping compartments containing all the cooling air aspirations and having an upper ambient air inlet.
• the lateral access doors of the depollution modules are all oriented on the same access side and are each controlled by actuating means ensuring their opening and closing,
• a lateral transfer zone is provided according to the access side, and comprises a robot able to move the transport and storage boxes between a front loading and unloading station and the depollution chamber of each of the depollution modules.
• the transverse bulk of the processing device is limited to the width value of an enhanced pollution control module.
• the width of the lateral transfer zone comprising the robot. This transversal size defines the length occupied by the processing device along the path defined by the box transport system (OHT).
• the vertical occupancy of the processing device can be optimized according to the height available in the semiconductor manufacturing plant.
• each depollution module is a sliding access door which, in the open position, is offset laterally on the side of the primary pumping compartment, and which is controlled by a control actuator. sliding.
• the sliding character of the lateral access doors makes it possible to avoid any risk of deterioration of the robot and the doors, since the sliding of the doors takes place outside the lateral transfer zone occupied by the robot.
• the sliding movement of the door is carried out parallel to the lateral transfer zone, between the pollution control chamber and the primary pumping compartment, without increasing the size of the depollution module.
• the sliding access door is mounted to slide longitudinally on a frame itself pivotally mounted along a vertical pivot axis and pivotally biased by a pivot actuator.
• This arrangement makes it possible to ensure in a simple manner a good seal of the access door, and simultaneously makes it possible to reduce the friction of the joints, friction likely to release pollutant particles whose presence would be particularly harmful in a clean room of the factory. semiconductor manufacturing.
• each depollution chamber of the depollution modules comprises, opposite the access side, a maintenance door that an operator can open to provide individual maintenance of a depollution module.
• a maintenance door that an operator can open to provide individual maintenance of a depollution module.
• each depollution module comprises a safety device ensuring:
• a lateral transfer zone provided on the access side of the depollution modules, in line with the loading / unloading station,
• a robot placed in the lateral transfer zone, able to move the transport and storage boxes between the front loading and unloading station and the depollution chamber of each of the depollution modules.
• the general architecture of the processing device as defined above makes it possible to provide a particularly simple and inexpensive robot, for example a robot of a type comprising:
• the device comprises:
• a second loading-unloading station in line with the longitudinal row of columns of modules, and comprising means for longitudinal displacement and means of rotation of 90 ° of vertical axis.
• each loading-unloading station can advantageously include a security lock.
• each depollution module comprises its own control means
• control means are arranged in a control panel arranged laterally at the side of the primary pumping compartment,
• control means arranged laterally at the side of the primary pumping compartment make it possible to avoid any increase in the size of the depollution module. This provides a significant space saving.
• the depollution modules require the use of a primary pump and a secondary pump, allowing pumping in two successive stages, namely a primary pumping step during which the primary pump is connected to the chamber of depollution, and a vacuum pumping step pushed during which the secondary pump is interposed between the depollution chamber and the suction of the primary pump.
• each depollution module comprises a secondary pump housed below the depollution chamber.
• the secondary pumps are each associated with a permanent purge device and with a device selective connection which:
• each connects them to the respective primary pump of their depollution module during the high-vacuum pumping steps of the depollution chamber or during the waiting stages,
• the permanent purge and the presence of the common primary pump make it possible to keep the secondary pumps in permanent operation, avoiding any increase in concentration of the harmful gases which would lead to the degradation and the destruction of the secondary pumps.
• FIG. 1 schematically illustrates a processing device for transport and storage boxes, according to an embodiment of the present invention
• FIG. 2 is a view from above illustrating the general organization of a semiconductor manufacturing plant
• FIG. 3 schematically illustrates, in plan view, the positioning of a treatment device for transport and storage boxes, according to an embodiment of the present invention
• FIG. 4 is a schematic view illustrating the supply means and the pumping means associated with the depollution chamber of a depollution module according to one embodiment of the invention
• FIG. 5 is another block diagram of the supply and pumping means associated with the depollution chambers of a treatment device according to the present invention
• FIG. 6 is a schematic side view illustrating the general architecture of a treatment device for transport and storage boxes, according to one embodiment of the invention with four depollution modules;
• FIG. 7 is a schematic view from above of the processing device of FIG. 6;
• FIG. 8 is a top view illustrating the kinematic detail of the doors of a depollution chamber of the processing device of Figures 6 and 7;
• FIGS. 9 and 10 illustrate another embodiment of the movement kinematics of the doors of a depollution chamber of the treatment device of FIGS. 6 and 7;
• FIG. 1 1 is a schematic sectional side view illustrating the ventilation system of the primary pumps of the treatment device according to one embodiment of the present invention.
• FIG. 12 is a schematic sectional side view illustrating the general arrangement of the pump means of the processing device of Figures 6 and 7.
• FIG. 1 is firstly considered, illustrating a transport and storage box 1 defining a sealed non-sealed environment in the form of a volume 2 bounded by a wall 3 and having a leakage 4.
• the wall 3 is generally made in polycarbonate.
• a depollution chamber 5 has an interior volume 5a just a little larger than the volume of the transport and storage box 1.
• the depollution chamber 5 comprises a sealed peripheral wall 5b, with an access door 5c allowing the introduction and removal of the transport and storage box 1.
• the wall 5b of the depollution chamber 5 is for example stainless steel with a polished inner surface, capable of withstanding a vacuum of 1 atmosphere. The internal polishing prevents degassing of the peripheral wall 5b during vacuum depollution operations.
• An inlet 6 allows the introduction into the clearance chamber 5 of a gaseous flow from a source of process gas 13, while an outlet 7 connected to gas pumping means 8 makes it possible to do the same. empty inside the depollution chamber 5.
• the pumping means 8 comprise at least one primary pumping group 8a, and advantageously also a secondary pumping group 8b, for example of the turbomolecular, molecular or hybrid type.
• the depollution chamber 5 is associated with a pressure sensor 10, an isolation valve 12 connected in the pumping line in series with the pumping means 8, a source of treatment gas 13 connected to the inlet 6, a degassing flow sensor 11, control means 14, and a deformation sensor 15.
• the control means 14 may comprise a processor 14a associated with a memory 14b in which control programs are recorded.
• the processor 14a can receive information from the various sensors such as the pressure sensor 10, the deformation sensor 15, the degassing flow sensor 11.
• the processor 14a is connected in a manner known per se to various actuators for acting on the isolation valve 12, on the drive motors of the primary pump 8a and the secondary pump 8b, on a valve of flow control of gas flow of the gas introduction means 6, 13.
• the deformation sensor 15 comprises a laser transceiver which detects, through the window 9a, the distance which separates it from the wall 3 of the transport and storage box 1.
• the deformation sensor 15 can be used both to detect the deformation of the transport and storage box 1 during a depollution operation, and to detect the presence, absence, or correct positioning of a transport and storage box 1 in the depollution chamber 5.
• FIG. 2 is now considered, illustrating the general organization of a part of a semiconductor manufacturing plant 200.
• the semiconductor manufacturing plant 200 comprises a large number of workstations, which will be called "tools”.
• FIG. 2 illustrates a set of forty seven tools, such as tools 16 and 17, arranged in two zones or bays 18 and 19 of six rows. each, such as rows 18a and 18b.
• Each tool 16 or 17 comprises, on the same side, a first loading-unloading station 16a or 17a and a second loading-unloading station 16b or 17b.
• loading and unloading stations are aligned along a branch 20 of the OHT box transport system itself including guide rails, usually located at ceiling of the plant, and following a standardized path.
• the OHT box transport system comprises a branch 20 or 21 for each row 18a or 18b of tools 16, 17.
• the branches 20 and 21 are coupled in pairs in a so-called "intra bay” loop such as the loop 22, formed for example by the branches 20 and 21 of two successive rows 18a and 18b.
• An "extra bay” loop 122 develops between the two successive zones 18 and 19, and feeds the "intra bay” loops such as the loop 22.
• the OHT box transport system moves the transport and storage boxes 1, which contain the semiconductor wafers or masks to be treated, distributes the transport and storage boxes 1 to the tools 16 or 17 which perform the treatment provided on their contents, and takes the transport and storage boxes 1 after the treatment.
• a processing device 23 for the treatment of the transport and storage boxes 1 and / or their content structured and dimensioned so as to have a size of the same order of magnitude as the tools 16, 17 of a semiconductor manufacturing plant 200, and so as to be compatible with the OHT box transport system.
• processing device 23 can replace one of the tools 16, 17 as illustrated in FIG.
• the processing device 23 is arranged in the same row of tools 18a as the tools 16 and 17. It can be seen that the floor space of the treatment device 23 is similar to the floor space of the tool 16. distinguishes, in this processing device 23, two loading-unloading stations 23a and 23b able to cooperate with the branch 20 of the OHT box transport system. There is furthermore a first column of modules 23c and a second column of modules 23d which is optional.
• the processing device 23 may comprise several columns of modules, such as the column of modules 23c, each having a superposition of four depollution modules each consisting of a depollution chamber 5 associated with its introduction means. gas 6, 13, its pumping means 8 and its control means 14.
• FIGS. 6 and 7 are now considered, which illustrate, respectively in side view and in plan view, a processing device 23 according to the invention in an embodiment with a single column of modules 23c.
• the processing device 23 comprises, in this embodiment, four depollution modules 24, 25, 26 and 27, vertically superposed one above the other to form the column of modules 23c.
• Each depollution module comprises a depollution chamber 5, pumping means 8, and the various additional means illustrated in Figure 1 but not recalled in Figures 6 and 7 for ease of reading.
• the depollution chamber 5 of a module comprises a lateral access door 5c.
• all the lateral access doors 5c of the depollution modules 24-27 are oriented along the same access side (on the right in FIG. 7), and are each biased by actuating means. ensuring their opening and closing.
• the depollution chamber 5 comprises a maintenance door 5d, which an operator can open to provide individual maintenance of a depollution module.
• the pollution control chamber 5 is in line on the same stage with the pumping means 8, and in FIG. 7 the assembly is in line along the longitudinal direction II with one of the loading-unloading stations 23b.
• the assembly occupies half of the transverse bulk of the processing device 23, namely the left half in FIG. 7.
• the right half is occupied on the one hand by the second loading-unloading station 23a and by a lateral zone.
• 129 located on the access side of the depollution chambers 5 and containing a common robot transport boxes 29.
• the robot 29 is adapted to move the transport and storage boxes 1 between the one and the other of the loading-unloading stations 23a and 23b and the depollution chambers 5 of each of the depollution modules 24-27.
• the robot 29 comprises a support 29a with three upper lugs, such as the lugs 29b and 29c, arranged in a triangle in an arrangement corresponding to the standardized support points of a transport and storage box 1.
• the support 29a is mounted at the end of a radially extensible arm 29d, allowing it to move horizontally, and itself mounted on a carriage 29e with vertical displacement along a vertical guide 29f.
• the vertical guide 29f is itself mounted on a plate 29g, rotating along a vertical axis and with an amplitude of 90 °, carried by a lower carriage 29h itself mounted to slide longitudinally on a longitudinal guide 29i.
• the vertical guide 29f has a height such that it can bring the support 29a up to each of the depollution chambers 5 of the pollution control modules 24-27.
• the longitudinal guide 29i allows the longitudinal movement of the lower carriage 29h so as to bring the support 29a is opposite the loading-unloading station 23a, or facing the depollution chambers 5 of the pollution control modules 24-27.
• a transfer device For the transfer of a transport and storage box 1 between the robot 29 and the loading-unloading station 23b, a transfer device is provided which makes it possible, on the one hand, to move the box support linearly as illustrated by the arrow 30 between the loading-unloading station 23b and an intermediate station 31, then the 90 ° rotation of the intermediate station around a vertical axis, as illustrated by the arrow 30a. Then, the arm 29d of the robot 29 can take or put back the transport and storage box 1 on the intermediate station 31.
• the structure of the robot 29 is thus compatible, without complex modification, with the presence of two loading-unloading stations 23a and 23b.
• the loading of the transport and storage boxes 1 on the loading-unloading stations 23a and 23b can be performed either automatically by the robot 29 of the OHT box transport system of the factory, or manually by an operator. Automatic loading does not pose a security problem.
• the manual loading requires providing, at the loading-unloading stations 23a and 23b, two doors which are related to loading-loading locks. unloading: an external door on the operator side and an internal door on the robot side.
• the control and control device manages the security of the openings and closures of the two doors, not allowing the opening of the outer door when the inner door is open, and vice versa.
• FIG. 8 is now considered, illustrating a first embodiment for moving the access door 5c of the depollution chamber 5.
• the access door 5c driven by appropriate actuating means, is displaced in two perpendicular motions, namely a first transverse movement 32 horizontal of small amplitude, towards and away from the opening of the depollution chamber 5, and a second longitudinal movement 33, perpendicular to the first movement 32, to move the access door 5c horizontally from an engagement position facing the opening of the depollution chamber 5 and a position of opening completely away from the depollution chamber 5, next to the pumping means 8.
• the access door 5c does not interfere with the movement of the robot 29, does not disturb the access to the other depollution chambers 5 placed above or below, and does not increase the overall size of the treatment device 23.
• Figures 9 and 10 illustrate a preferred embodiment of the means for moving the access door 5c.
• Figure 9 illustrates the access door 5c in the closed state
• Figure 10 illustrates the access door 5c in the open state.
• the access door 5c In its longitudinal movement, the access door 5c is actuated by a sliding actuator 34, such as a pneumatic cylinder.
• the access door assembly 5c-pneumatic jack 34 is mounted on a frame 35 itself rotatably mounted about a rear vertical axis 36 and rotated by a pivoting actuator 37.
• the frame 35 can rotate between a closed position illustrated in Figure 9, wherein the access door 5c is pressed against the opening of the pollution control chamber 5, and an open position in which the frame 35 is away from the chamber depollution 5.
• the seals 38 and 39 provided on the access door 5c, can seal with the pollution control chamber 5 without being subjected to friction during the opening and closing operations.
• the maintenance door 5d is a swing door, the opening is manual.
• FIGS 9 and 10 illustrate another embodiment of the processing device 23 according to one embodiment of the invention.
• the pumping means 8 there is a primary pump 8a placed in a primary pumping chamber 8c, in horizontal alignment with the depollution chamber 5.
• a primary pump 8a placed in a primary pumping chamber 8c, in horizontal alignment with the depollution chamber 5.
• the door access port 5c On one side of the primary pumping compartment 8c moves the door access port 5c in its open position, as seen in FIG. 10.
• an electrical panel 8d Opposite the primary pumping compartment 8c is an electrical panel 8d containing the control means 14 of the depollution module 24.
• the control means 14 in Table 8d do not increase the vertical size of the depollution module 24-27, thus allowing the vertical stacking of four depollution modules 24-27 in the available height of a clean room. of semiconductor manufacturing plant 200.
• each depollution module 24-27 comprises its own pumping means 8 having at least one primary pump 8a.
• the primary pump 8a is housed in the primary pumping compartment 8c (FIGS. 9 and 10), which is offset longitudinally relative to the depollution chamber 5.
• the depollution chamber 5 is closer to the loading-unloading stations 23a-23b, the primary pumping compartment 8c can be deported away from the loading-unloading stations 23a-23b, so as to reduce the longitudinal stroke of the robot 29.
• the depollution modules 24-27 are supported by a common chassis 100.
• a separate chassis supports the robot 29 (not shown) and the loading-unloading stations 23a-23b. The whole is confined in a common rollover.
• the primary pump 8a of each of the depollution modules 24-27 is supported by the common frame 100 with the interposition of elastic connection means 101 preventing the transmission of vibrations to the depollution chamber 5.
• the chamber 5 is itself placed in a depollution frame 102, which also carries the sensors and actuators associated with the depollution chamber 5.
• the secondary pump 8b is advantageously placed below the depollution chamber 5, its suction inlet being directly connected inside the depollution chamber 5, its discharge outlet being connected by an intermediate pipe 48 to the suction inlet of the primary pump 8a. The same is true of the other decontamination modules 25-27.
• FIG. 3 a top view shows the column of modules 23c comprising, as illustrated in FIGS. 6 and 7, a superposition of four depollution modules 24-27. This provides four times the flow of a depollution module.
• FIG. 3 illustrates a second column of pollution control modules 23d, forming a second superposition of four depollution modules such as the modules 24-27 of FIGS. 6 and 7.
• the two columns of depollution modules 23c and 23d form a longitudinal row 28 of two columns 23c and 23d of pollution control modules superimposed one above the other, the row 28 of columns of modules developing along the longitudinal direction II perpendicular to the direction of movement of the branch 20 of the OHT box transport system.
• one also takes advantage of the available depth in the longitudinal direction I-I of the longitudinal row 28 of columns 23c, 23d of pollution control modules.
• FIG. 4 which schematically illustrates a possible functional arrangement of the pumping and supply means for the depollution chamber 5.
• the depollution chamber 5 is associated with two pressure gauges 13a and 13b. Gas sources (not shown) are controlled by the control device 14 (see FIG. 1) to introduce the gases at appropriate times during the process.
• the primary pump 8a is connected to the depollution chamber 5 by a primary pumping line 40 associated with a primary control valve 41, by driving the pumping gases through an outlet pipe 42 to the extraction system and / or gas treatment of the semiconductor manufacturing plant.
• the suction of the secondary pump 8b is connected to the depollution chamber 5 by a short secondary pumping line 43 provided with a secondary control valve 44, and its discharge takes place in a secondary discharge pipe 45 which itself it is connected on the one hand to a transfer line 46 by a valve 47, and on the other hand to an intermediate pipe 48 which leads to the suction of the primary pump 8a with the interposition of a valve 49.
• An inlet purge 50 continuously introduced into the secondary pump 8b a purge gas.
• the transfer line 46 is connected to a primary pump 51 (FIG. 5) of low flow rate, this pump being common to all the depollution modules 24-27.
• the secondary pump 8b is in permanent rotation, permanently supplied with purge gas by the purge inlet 50, supplied periodically with process gas from the depollution chamber 5, and discharging either into the transfer line 46 or into the the intermediate pipe 48.
• a first pre-emptying phase is carried out, by opening the primary control valve 41 to ensure the pumping by the only primary pump 8a, the secondary pump 8b being isolated by the secondary control valve 44 and the valve 49.
• the valve 47 is open so that the primary pump 51 common pumping discharge of the secondary pump 8b.
• a second emptying phase is carried out during which the primary control valve 41 is closed and the valves 44 and 49 are open, allowing the two pumps of the primary pumps to be summed in series. 8a and secondary 8b.
• the valve 47 is closed in order to avoid contamination of the common primary pump 51 by the gases pumped into the pollution control chamber 5. This ensures the most independent operation possible between the different depollution modules 24-27 .
• FIG. 5 which illustrates the common primary pump 51, connected by the transfer line 46 to all the secondary pumps 8b of the depollution modules 24-27 of the treatment device 23.
• FIG. 11 which illustrates the ventilation means for thermal cooling of the primary pumps, and the sound insulation means of the treatment device according to one embodiment of the invention are now considered.
• the primary pumps such as the primary pump 8a of the four depollution modules 24-27 of the treatment device of FIGS. 6 and 7 are diagrammatically illustrated.
• the primary pump 8a is housed in its primary pumping compartment 8c.
• the primary pumping compartments such as the compartment 8c of the four depollution modules 24-27 communicate with each other in the vertical direction, and they are each divided into two half-compartments, forming a common suction compartment 52 and a common discharge compartment 53 separated from each other by an intermediate wall 54 through which the primary pumps 8a.
• the primary pumps such as the primary pump 8a themselves each comprise an air cooling system, with a cooling air intake 55 at a first end of the pump and with a cooling air discharge 56 at a second. end of the pump.
• the intermediate vertical wall 54 separates a first zone of pumping compartments from each other, receiving all the cooling air discharges from the primary pumps and constituting the common discharge compartment 53, and a second zone of compartments. pump, containing all the cooling air aspirations of the primary pumps, and constituting the common suction compartment 52.
• the first pumping compartment area constituting the common discharge compartment 53 has a lower air outlet 57.
• the second pumping compartment area constituting the common suction compartment 52 has an upper ambient air inlet 58.
• the cooling air circulation of the primary pumps is as indicated by the arrows 59, 60, 61 and 62, from top to bottom through the primary pumps 8a.
• FIG. 11 also illustrates sound insulation means making it possible to reduce noise emissions towards the environment of the treatment device 23.
• all the primary pumping compartments are isolated by absorbing plates. 63 for sound insulation.
• the lower outlet 57 and the upper air inlet 58 are themselves equipped with baffles absorbing noise emissions.
• the primary pump 51 common is also placed in one of the primary pumping compartments, to ensure its cooling and sound isolation in the same way as the other primary pumps.
• a common control device manages the flow of the transport and storage boxes 1 to be processed according to the availability of the depollution chambers 5 and the processing requests of the production supervisor of the semiconductor production plant, and thus manages the loading-unloading stations 23a, 23b, the movement of the robot 29, and the launching of the processes in the depollution modules 24-27.
• the common control device includes communication means with the supervisor of the semiconductor production plant and with the OHT box transport system to enable automatic loading of the transport and storage boxes 1 at the loading stations. unloading 23a, 23b.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Engineering (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Cleaning Or Drying Semiconductors (AREA)
• Warehouses Or Storage Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=42701989

Family Applications (1)

Country Status (9)

Families Citing this family (10)

Family Cites Families (48)

• 2010
  • 2010-06-29 FR FR1055187A patent/FR2961946B1/fr active Active
• 2011
  • 2011-06-22 TW TW100121841A patent/TWI533948B/zh not_active IP Right Cessation
  • 2011-06-27 JP JP2013517235A patent/JP5814362B2/ja not_active Expired - Fee Related
  • 2011-06-27 WO PCT/EP2011/060749 patent/WO2012000950A1/fr active Application Filing
  • 2011-06-27 CN CN201180032234.9A patent/CN102985344B/zh not_active Expired - Fee Related
  • 2011-06-27 SG SG2012091625A patent/SG186713A1/en unknown
  • 2011-06-27 US US13/806,318 patent/US9403196B2/en active Active
  • 2011-06-27 EP EP11734040.6A patent/EP2588392A1/fr not_active Withdrawn
  • 2011-06-27 KR KR1020127034327A patent/KR20130095198A/ko active IP Right Grant
  • 2011-06-27 SG SG10201505061WA patent/SG10201505061WA/en unknown

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events