EP2561117B1 - Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique - Google Patents
Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique Download PDFInfo
- Publication number
- EP2561117B1 EP2561117B1 EP11723649.7A EP11723649A EP2561117B1 EP 2561117 B1 EP2561117 B1 EP 2561117B1 EP 11723649 A EP11723649 A EP 11723649A EP 2561117 B1 EP2561117 B1 EP 2561117B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- metal
- treatment
- ions
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 139
- 229910052751 metal Inorganic materials 0.000 title claims description 67
- 239000002184 metal Substances 0.000 title claims description 67
- 238000000034 method Methods 0.000 title claims description 45
- 230000008569 process Effects 0.000 title claims description 26
- 238000000576 coating method Methods 0.000 title claims description 18
- 239000011248 coating agent Substances 0.000 title claims description 14
- 239000000463 material Substances 0.000 title claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 75
- 239000000243 solution Substances 0.000 claims description 67
- 239000010949 copper Substances 0.000 claims description 64
- 238000011282 treatment Methods 0.000 claims description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 54
- 230000001590 oxidative effect Effects 0.000 claims description 39
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 36
- 229910052759 nickel Inorganic materials 0.000 claims description 35
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 21
- 150000002500 ions Chemical group 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 20
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 17
- 229910021645 metal ion Inorganic materials 0.000 claims description 15
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 14
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 13
- 238000001465 metallisation Methods 0.000 claims description 13
- 229910001431 copper ion Inorganic materials 0.000 claims description 11
- 239000007800 oxidant agent Substances 0.000 claims description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 7
- 229910017604 nitric acid Inorganic materials 0.000 claims description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 230000001476 alcoholic effect Effects 0.000 claims description 5
- 239000012279 sodium borohydride Substances 0.000 claims description 5
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 claims description 4
- 239000012487 rinsing solution Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 claims description 3
- 229910001429 cobalt ion Inorganic materials 0.000 claims description 3
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 claims description 3
- 239000012028 Fenton's reagent Substances 0.000 claims description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 2
- 239000008139 complexing agent Substances 0.000 claims description 2
- MGZTXXNFBIUONY-UHFFFAOYSA-N hydrogen peroxide;iron(2+);sulfuric acid Chemical compound [Fe+2].OO.OS(O)(=O)=O MGZTXXNFBIUONY-UHFFFAOYSA-N 0.000 claims description 2
- 239000012286 potassium permanganate Substances 0.000 claims description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- 230000004913 activation Effects 0.000 description 62
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 33
- 125000004429 atom Chemical group 0.000 description 33
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 31
- 239000004417 polycarbonate Substances 0.000 description 31
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 30
- 230000003993 interaction Effects 0.000 description 30
- 239000003446 ligand Substances 0.000 description 29
- 238000000151 deposition Methods 0.000 description 25
- 229920001577 copolymer Polymers 0.000 description 22
- 230000008021 deposition Effects 0.000 description 22
- 239000000470 constituent Substances 0.000 description 18
- 239000004952 Polyamide Substances 0.000 description 16
- 239000007769 metal material Substances 0.000 description 16
- 229920002647 polyamide Polymers 0.000 description 16
- 229920000642 polymer Polymers 0.000 description 14
- -1 des ions Chemical class 0.000 description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 10
- 239000004743 Polypropylene Substances 0.000 description 10
- 229920000069 polyphenylene sulfide Polymers 0.000 description 10
- 150000001768 cations Chemical class 0.000 description 9
- 229920000515 polycarbonate Polymers 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000009920 chelation Effects 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 6
- 238000010668 complexation reaction Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000002923 metal particle Substances 0.000 description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 230000005587 bubbling Effects 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229940072033 potash Drugs 0.000 description 3
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 3
- 235000015320 potassium carbonate Nutrition 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004693 Polybenzimidazole Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- 239000002537 cosmetic Substances 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920013654 poly(arylene sulfone) Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004584 polyacrylic acid Substances 0.000 description 2
- 229920002480 polybenzimidazole Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920001021 polysulfide Polymers 0.000 description 2
- 239000005077 polysulfide Substances 0.000 description 2
- 150000008117 polysulfides Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 229920001959 vinylidene polymer Polymers 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000004801 Chlorinated PVC Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229920004142 LEXAN™ Polymers 0.000 description 1
- 229920006068 Minlon® Polymers 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- SCKXCAADGDQQCS-UHFFFAOYSA-N Performic acid Chemical compound OOC=O SCKXCAADGDQQCS-UHFFFAOYSA-N 0.000 description 1
- 229920002319 Poly(methyl acrylate) Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229920001153 Polydicyclopentadiene Polymers 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910002855 Sn-Pd Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- BAPJBEWLBFYGME-UHFFFAOYSA-N acrylic acid methyl ester Natural products COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000003416 augmentation Effects 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- BZDKYAZTCWRUDZ-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;prop-2-enenitrile;styrene Chemical compound C=CC=C.C=CC#N.COC(=O)C(C)=C.C=CC1=CC=CC=C1 BZDKYAZTCWRUDZ-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000011111 cardboard Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229920000457 chlorinated polyvinyl chloride Polymers 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000001761 ethyl methyl cellulose Substances 0.000 description 1
- 235000010944 ethyl methyl cellulose Nutrition 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 230000002538 fungal effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 231100000086 high toxicity Toxicity 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 229920012128 methyl methacrylate acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 235000010755 mineral Nutrition 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 125000006353 oxyethylene group Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000090 poly(aryl ether) Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920001652 poly(etherketoneketone) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 1
- 229920000867 polyelectrolyte Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1855—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1896—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by electrochemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D9/00—Electrolytic coating other than with metals
- C25D9/02—Electrolytic coating other than with metals with organic materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- the present invention relates to a method of coating a surface of a non-metallic material substrate with a metal layer to render it capable of being treated, thanks to the strong adhesion of the coating, by conventional metallization processes such as electroplating .
- Materials metallization processes involve depositing a thin layer of metal on the surface of a substrate.
- the interest of these processes is multiple: visual, decorative, conductive, reinforcement ... It is commonly used for parts used in the aerospace industry, automotive, cosmetics, household appliances, sanitary ware, connectors , microelectronics ...
- the step of activating the surface consists in depositing and maintaining on the surface of the non-metallic material metal particles or metal cations which will subsequently be reduced to form metal particles.
- This step requires the use of colloidal palladium / tin particles which react only on a certain type of polymer and which requires the use of large quantities of palladium.
- the stripping step of ABS panels is carried out with a solution of potassium permanganate and phosphoric acid and the step of forming the Sn / Pd colloid is carried out by successive applications of a solution of tin chloride and then of a solution of palladium chloride.
- the self-catalytic metal deposition step is a conventional copper deposition step.
- the conventional method of metallization of an ABS substrate is modified by replacement of the Sn / Pd colloid with an Ag / Sn colloid and after total elimination of Sn ions, the self-catalytic metal deposition step is a deposition step of nickel.
- the pickling step by conventional chromic solutions and rinsing treatment of the etched surface with a solution of adsorption enhancing products such as polyelectrolytes in the form of cationic polymers can be carried out.
- the activation step is a step of adsorption in which a colloidal preparation is used or formed by addition of stannous ions, which must then be completely removed to allow the smooth and uniform development of the metal layer during the electroless metal deposition step.
- US Patents 4,981,715 and US 4,701,351 describe a method of coating a substrate with a thin layer of a polymer, for example polyacrylic acid, capable of complexing a noble metal compound comprising a step of covering the substrate with a polymer capable of chelating metal ions, followed by a step of contacting the polymer with metal particles.
- the substrate is then subjected to the auto-catalytic metal deposition step.
- the metal cations used are
- the main drawback of this method is that it entails the need to manage the quality of an additional interface, namely that which is created between the substrate and the polymer layer capable of chelating a metal ion. Solutions are proposed for example for the irradiation treatment which also allows the regioselective attachment of this layer of polymer capable of chelating and thus the possibility of metallizing the substrate selectively.
- the present invention makes it possible to simplify the various steps of this method of coating non-metallic materials and to make it more environmentally friendly and less expensive, by developing a simpler coating process that does not use toxic and polluting reagents, without adding a step and an additional layer.
- Step g) is a self-catalytic deposition step also called electroless.
- step f) the atoms of at least one metal attached to the non-metallic material constituting the substrate are fixed by ligand-metal interactions.
- step d) of activation is performed by contact with a solution containing a single metal ion and its counterion.
- steps b) and c) are performed in a single step b ') and the treatment is an oxidative treatment.
- the metal of step f) and the metal of the ions of step g) are identical.
- steps f) and g) are performed in a single step f ').
- the surface of said substrate of non-metallic material must first be prepared in order to obtain a good adhesion of the metal layer on the surface.
- the surface of the substrate is cleaned of all its contaminants by simultaneously creating a hooking relief for the adhesion of the future coating during step b) of the process.
- the surface of the substrate may be treated in whole or in part using masking techniques well known to those skilled in the art such as the use of protective varnishes resistant to oxidation steps.
- step b) is implemented by physical processing.
- physical treatment is meant a treatment to remove the weak cohesion layers and increase the surface roughness.
- the physical treatment is selected from the group of impact treatments.
- steps b) or b ') or c) are carried out by oxidative treatment.
- oxidizing treatment any treatment that makes it possible to prepare the surface by increasing the roughness and therefore the specific surface area for step b) and creating functions capable of chelating and / or complexing metal cations for step c) .
- the oxidizing treatment is selected from the group of chemical oxidizing treatments.
- the oxidizing treatment is chosen from the group of electrochemical oxidizing treatments.
- the oxidizing treatment of step c) is selected from the group of physical oxidative treatments.
- the substrate may be a nanoparticle, a microparticle, a cosmetic stopper, an electronic element, a door handle, an electrical appliance, spectacles, a decorative object, a bodywork element, an element of cabin, airplane wing, a flexible driver or connector.
- Non-metallic materials are any material belonging to the family of organic materials, the family of mineral materials and the family of composite materials. Non-limiting examples include wood, paper, cardboard, ceramics, plastics, silicones, textiles and glass.
- the organic material is selected from plastics.
- metal layer is meant a thin layer, from a few nanometers to several hundred microns, a metal and / or a metal oxide deposited on the surface of a substrate.
- the non-metallic material is a polymer selected from the group consisting of natural, artificial, synthetic, thermoplastic, thermosetting, thermostable, elastomeric, one-dimensional and three-dimensional.
- the non-metallic material may further comprise at least one member selected from the group consisting of fillers, plasticizers and additives.
- the fillers are mineral fillers selected from the group consisting of silica, talc, fibers or glass beads.
- the fillers are organic fillers selected from the group consisting of cereal flour and cellulose pulp.
- the additives are used to improve a specific property of the non-metallic material such as its color, crosslinking, slipping, resistance to degradation, fire and / or bacterial and / or fungal attacks.
- the polymer is a thermoplastic (co) polymer selected from the group consisting of a polyolefin, a polyester, a polyether, a vinyl polymer, a vinylidene polymer, a styrenic polymer, a (meth) acrylic polymer, a polyamide , a fluoropolymer, a cellulosic polymer, a poly (arylenesulfone), a polysulfide, a poly (arylether) ketone, a polyamide-imide, a poly (ether) imide, a polybenzimidazole, a poly (indene / coumarone), a poly (paraxylylene), alone, in a mixture, in copolymers or in combination.
- a thermoplastic (co) polymer selected from the group consisting of a polyolefin, a polyester, a polyether, a vinyl polymer, a vinylidene polymer, a styrenic poly
- the polyolefins may be chosen from the group comprising a polyethylene, a polypropylene, an ethylene / propylene copolymer, a polybutylene, a polymethylpentene, an ethylene / vinyl acetate copolymer, an ethylene / vinyl alcohol copolymer or an ethylene / methyl acrylate copolymer, alone. , in a mixture, in copolymers or in combination.
- the polyesters may be selected from the group consisting of polyethylene terephthalate, modified or unmodified by glycol, polybutylene terephthalate, polyactide, polycarbonate, alone, in admixture, copolymers or in combination.
- the polyethers may be chosen from the group comprising a poly (oxymethylene), a poly (oxyethylene), a poly (oxypropylene), a poly (phenylene ether), alone, in a mixture, in copolymers or in combination.
- the vinyl polymers may be selected from the group consisting of optionally chlorinated polyvinyl chloride, polyvinyl alcohol, polyvinyl acetate, polyvinyl acetal, polyvinyl formaldehyde , a polyvinyl fluoride, polyvinyl chloride / vinyl acetate, whether alone, in admixture, in copolymers or in combination.
- the vinylidene polymers may be selected from the group consisting of polyvinylidene chloride, polyvinylidene fluoride, alone, as a mixture, copolymer or combination.
- the styrenic polymers may be selected from the group consisting of polystyrene, poly (styrene / butadiene), poly (acrylonitrile / butadiene / styrene), poly (acrylonitrile / styrene), poly (acrylonitrile / ethylene / propylene / styrene) , a poly (acrylonitrile / styrene / acrylate), alone, as a mixture, copolymers or in combination.
- the (meth) acrylic polymers may be chosen from the group comprising a polyacrylonitrile, a poly (methyl acrylate), a poly (methyl methacrylate), alone, in a mixture, in copolymers or in combination.
- the polyamides may be chosen from the group comprising a poly (caprolactam), a poly (hexamethylene adipamide), a poly (lauroamide), a polyether-block-amide, a poly (metaxylylene adipamide) and a poly (metaphenylene isophthalamide), alone. , in a mixture, in copolymers or in combination.
- the fluorinated polymers may be chosen from the group comprising a polytetrafluoroethylene, a polychlorotrifluoroethylene, a perfluorinated poly (ethylene / propylene), a polyvinylidene fluoride, alone, in a mixture, in copolymers or in combination.
- the cellulosic polymers may be selected from the group consisting of cellulose acetate, cellulose nitrate, methylcellulose, carboxymethylcellulose, ethylmethylcellulose, alone, in admixture, copolymers or in combination.
- the poly (arylenesulfone) may be selected from the group consisting of a polysulfone, a polyethersulfone, a polyarylsulfone, alone, as a mixture, copolymers or in combination.
- the polysulfides may be poly (phenylene sulfide).
- the poly (aryl ether ketones) may be chosen from the group comprising a poly (ether ketone), a poly (ether ether ketone), a poly (ether ketone ketone), alone, as a mixture, by copolymers or in combination.
- the polymer is a thermosetting (co) polymer selected from the group comprising an aminoplast such as urea-formaldehyde, melanin-formaldehyde, melanin-formaldehyde / polyesters, alone, as copolymers, mixed or in combination, a polyurethane, an unsaturated polyester, a polysiloxane, a formophenolic resin, epoxide, allyl or vinylester, an alkyd, a polyurea, a polyisocyanurate, a poly (bismaleimide), a polybenzimidazole, a polydicyclopentadiene, alone, in copolymers, in admixture or combination.
- an aminoplast such as urea-formaldehyde, melanin-formaldehyde, melanin-formaldehyde / polyesters, alone, as copolymers, mixed or in combination
- a polyurethane an unsaturated polyester
- the (co) polymer is selected from the group consisting of acrylonitrile butadiene styrene (ABS), acrylonitrile butadiene styrene / polycarbonate (ABS / PC), methyl methacrylate acrylonitrile butadiene styrene (MABS), a polyamide (PA) such as nylon, polyamine, polyacrylic acid, polyaniline and polyethylene terephthalate (PET).
- ABS acrylonitrile butadiene styrene
- MABS methyl methacrylate acrylonitrile butadiene styrene
- PA polyamide
- nylon polyamine
- PET polyacrylic acid
- PET polyaniline
- PET polyethylene terephthalate
- the metal of the metal ion used in step d) is selected from copper, silver, nickel, platinum, palladium or cobalt ions.
- the metal of the metal ion used in step d) is selected from the group consisting of copper and nickel.
- the metal of the metal ion used in step d) is copper.
- the metal of the metal ions used in step g) or f ') is selected from the elements of groups IB and VIII of the Periodic Table.
- the metal of the metal ion used in step g) or f ') is selected from copper, silver, gold, nickel, platinum, palladium, iron or cobalt ions.
- the metal of the metal ion used in step g) or f ') is selected from the group consisting of copper and nickel.
- the metal of the metal ion used in step g) or f ') is copper.
- the metal of the metal ion used in step g) or f ') is nickel.
- the group of impact treatments includes sanding, shot blasting, microbilling and abrasive sanding.
- oxygen-rich groups such as carboxylic (-COOH), hydroxyl (-OH) and alkoxyl (-OR) groups.
- carbonyl (-C O)
- percarboxylic acid (-CO-O-OH) percarboxylic acid (-CO-O-OH)
- nitro (N O)
- amide (-CONH) capable of chemically binding the metal cations
- the chemical oxidizing treatment is chosen from the group comprising Fenton's reagent, alcoholic potash, a strong acid, sodium hydroxide, a strong oxidant, ozone, alone or in combination.
- the strong acid is selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, perchloric acid, acetic acid, oxalic acid, phosphorous acid , phosphoric acid, hypophosphorous acid alone or as a mixture.
- the strong oxidant is selected from the group consisting of KMnO 4 and KClO 3 , alone or as a mixture.
- the strong oxidant is KMnO 4 .
- oxidizing treatments are chosen according to the nature of the constituent materials of the substrates, in Table 1 below are illustrated by way of examples, various chemical oxidizing treatments applicable when the substrate is ABS or ABS / PC.
- Table 1 ⁇ / b> oxidizer Acid alone or in combination KMnO 4 H 3 PO 4 H 3 PO 2 H 3 PO 3 H 2 SO 4 C 2 H 2 O 4 H 2 PO 4 + C 2 H 2 O 4 H 3 PO 2 + C 2 H 2 O 4 H 3 PO 4 + H 2 SO 4 H 3 PO 2 + H 2 SO 4 HNO 3 + HCl HNO 3 HCl CH 3 COOH CH 3 COOH
- the solid acid mass ratios are between 5 and 100%.
- they are between 50 and 95%.
- the duration of the strong acid treatment is between 20 seconds and 5 hours.
- it is between 30 seconds and 3 hours.
- it is between 30 seconds and 20 minutes.
- the duration of the Fenton chemical reaction treatment is between 5 minutes and 5 hours.
- it is between 10 minutes and 3 hours.
- it is between 15 minutes and 2 hours.
- it is of the order of 25 minutes.
- the potassium hydroxide is diluted in a solution containing as solvent an alcohol selected from the group comprising methanol, ethanol, and propanol.
- said potassium hydroxide is diluted in a solution containing ethanol as the solvent.
- the concentration of potassium hydroxide in the alcoholic solution is between 0.1M and 10M.
- it is between 0.5M and 5M.
- it is of the order of 3.5M.
- the duration of the alcoholic potash treatment is between 5 minutes and 5 hours.
- it is between 1 minute and 3 hours.
- it is between 5 minutes and 1 hour.
- the mass ratios of sodium hydroxide are between 10 and 100%.
- they are between 15 and 70%.
- they are between 20 and 50%.
- the strong oxidant solution is neutral, acidic or basic.
- the strong oxidant solution is acidic.
- the strong oxidant is selected from the group consisting of KMnO 4 and KClO 3 , alone or as a mixture, in hydrochloric acid, in sulfuric acid, in nitric acid and in oxalic acid. , in phosphoric acid, in hydrophosphorous acid or in phosphorous acid.
- the concentration of KMnO 4 or KClO 3 is between 10mM and 1M.
- it is between 0.1M and 0.5M.
- it is of the order of 0.2M.
- the acid concentration is between 0.1M and 10M.
- it is between 0.5M and 5M.
- it is of the order of 3.5M.
- the duration of the treatment for a strong oxidant is between 1 minute and 3 hours.
- it is between 5 minutes and 1 hour.
- it is between 6 minutes and 30 minutes.
- it is of the order of 15 minutes.
- chemical oxidative treatment is an electrochemical treatment.
- the counter-ion of the at least one metal of step d) is selected from the group consisting of tetrafluoroborate, sulfate, bromide, fluoride, iodide, nitrate, phosphate and chloride ions.
- the solution of step d) containing at least one ion of at least one metal and its counterion is a basic solution.
- the basic solution has a pH greater than 7.
- it has a pH between 9 and 11.
- it has a pH of the order of 10.
- the duration of the treatment of step d) is between 30 seconds and 2 hours.
- it is between 1 minute and 1 hour.
- it is of the order of 15 minutes.
- the reducing solution of the reducing treatment in step f) is basic.
- the reducing solution comprises a reducing agent selected from the group consisting of sodium borohydride, dimethylamineborane or hydrazine solutions.
- the reducing agent is a solution of sodium borohydride.
- the sodium borohydride solution has a neutral or basic pH.
- the dimethylamineborane solution has a basic pH.
- the pH is basic
- the sodium hydroxide in solution is used as the solvent.
- the concentration of sodium hydroxide is between 10 -4 M and 5M.
- it is between 0.05M and 1M.
- it is of the order of 0.1M.
- the concentration of reducing agent in the reducing solution of step f) is between 10 -4 M and 5M.
- it is between 0.01M and 1M.
- it is of the order of 0.3M.
- the reduction step is carried out at a temperature between 10 ° C and 90 ° C.
- it is carried out at a temperature of between 30 ° C and 70 ° C.
- it is carried out at a temperature of the order of 50 ° C.
- the duration of the reduction step is between 30 seconds and 1 hour.
- it is between 1 minute and 30 minutes.
- it is between 2 minutes and 20 minutes.
- the solution of step f ') comprises metal ions, a metal ion complexing agent, a reducing agent and a pH regulator.
- said solution of step f ') is an aqueous solution.
- the solution of step f ') is an electroless bath solution containing a metal cation chosen from: Ag + , Ag 2+ , Ag 3+ , Au + , Au 3+ , Co 2+ , Cu + , Cu 2+ , Fe 2+ , Ni 2+ , Pd + and Pt + .
- a metal cation chosen from: Ag + , Ag 2+ , Ag 3+ , Au + , Au 3+ , Co 2+ , Cu + , Cu 2+ , Fe 2+ , Ni 2+ , Pd + and Pt + .
- the solution of step f ') is an electroless bath solution containing a metal cation chosen from: Co 2+ , Cu + , Cu 2+ , Ni 2+ , and Pt + .
- the solution of step g) containing ions of at least one metal is an aqueous solution.
- said solution of step g) is an electroless bath solution containing a metal cation chosen from: Ag + , Ag 2+ , Ag 3+ , Au + , Au 3+ , Co 2+ , Cu + , Cu 2+ , Fe 2+ , Ni 2+ , Pd + and Pt + .
- a metal cation chosen from: Ag + , Ag 2+ , Ag 3+ , Au + , Au 3+ , Co 2+ , Cu + , Cu 2+ , Fe 2+ , Ni 2+ , Pd + and Pt + .
- the solution of step g) is an electroless bath solution containing a metal cation chosen from: Co 2+ , Cu + , Cu 2+ , Ni 2+ , and Pt + .
- the solution of step g) is an electroless bath solution containing a metal cation selected from: Cu 2+ and Ni 2+ .
- the duration of step g) is between 1 minute and 1 hour.
- the surface of the substrate and / or the substrate is / are subjected to one or more rinses with at least one rinsing solution.
- the rinsing solutions are the same or different.
- the rinse solution is selected from the group consisting of water, distilled water, deionized water, or an aqueous solution containing a detergent.
- the detergent contained in an aqueous solution is chosen from the group comprising TDF4 and sodium hydroxide.
- the concentration of sodium hydroxide is between 0.01M and 1M.
- the rinse solution is agitated upon contact with the surface of the substrate and / or the substrate.
- the stirring is carried out using an agitator, a recirculation pump, a bubbling air or a gas, an ultrasonic bath or a homogenizer.
- the duration of each rinsing step is between 1 second to 30 minutes.
- it is between 5 seconds to 20 minutes.
- the contacting of the surface of the substrate and / or the substrate with the solutions of the different steps can be done by immersion in a bath or by spraying and / or showering.
- the homogenization of said bath is carried out using an agitator, a recirculation pump, a bubbling air or a gas, an ultrasonic bath or a homogenizer.
- the invention also relates to the substrate obtained according to the method of the invention for which the surface of said substrate of non-metallic material is coated with a metal layer.
- the invention relates to a substrate made of ABS, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the ABS constituting the substrate, said activation layer being covered with a layer of copper deposited by autocatalytic deposition.
- the invention relates to a substrate made of ABS, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded to a metal-ligand interaction with the constituent ABS of the substrate, said layer activation being coated with a copper layer deposited by autocatalytic deposition.
- the invention relates to a substrate made of ABS / PC, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded metal-ligand interaction with the ABS / PC constituting the substrate, said activation layer being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of ABS / PC, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent ABS / PC. of the substrate, said activation layer being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a PA substrate, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the PA constituting the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a PA substrate whose surface is coated with an activation layer made of nickel, the atoms of which are bonded to a metal-ligand interaction with the PA constituting the substrate, said activation layer being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of PC, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the constituent PC of the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of PC, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PC of the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of MABS, the surface of which is coated with an activation layer made of copper whose atoms are bonded by metal-ligand interaction to the MABS constituting the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate consisting of MABS, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the MABS constituting the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of PP, the surface of which is coated with an activation layer made of copper whose atoms are bonded by metal-ligand interaction to the constituent PP of the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate consisting of PP, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PP of the substrate, said layer of activation being covered with a layer of copper or deposited by autocatalytic deposit
- the invention relates to a substrate consisting of PPS, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction with the PPS constituting the substrate, said layer of activation being covered with a layer of copper or deposited by autocatalytic deposit
- the invention relates to a substrate consisting of PPS, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PPS of the substrate, said layer of activation being covered with a layer of copper deposited by autocatalytic deposition
- the invention relates to a substrate made of ABS, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the ABS constituting the substrate, said activation layer being coated with a nickel layer deposited by autocatalytic deposition.
- the invention relates to a substrate made of ABS, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the ABS constituting the substrate, said activation layer being coated with a nickel layer deposited by autocatalytic deposition.
- the invention relates to a substrate made of ABS / PC, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the constituent ABS / PC. of the substrate, said activation layer being covered with a layer of nickel deposited by autocatalytic deposition
- the invention relates to a substrate made of ABS / PC, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent ABS / PC. of the substrate, said activation layer being covered with a layer of nickel deposited by autocatalytic deposition
- the invention relates to a PA substrate, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the PA constituting the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a PA substrate whose surface is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PA of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate made of PC, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction to the constituent PC of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate made of PC, the surface of which is coated with an activation layer made of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PC of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate made of MABS, the surface of which is coated with an activation layer made of copper whose atoms are bonded by metal-ligand interaction to the MABS constituting the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate consisting of MABS, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the MABS constituting the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate made of PP, the surface of which is coated with an activation layer made of copper whose atoms are bonded by metal-ligand interaction to the constituent PP of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate made of PP, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PP of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate consisting of PPS, the surface of which is coated with an activation layer made of copper, the atoms of which are bonded by metal-ligand interaction with the PPS constituting the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention relates to a substrate consisting of PPS, the surface of which is coated with an activation layer consisting of nickel, the atoms of which are bonded by metal-ligand interaction to the constituent PPS of the substrate, said layer of activation being coated with a nickel layer deposited by autocatalytic deposit
- the invention also relates to a method according to the invention further comprising a metallization step.
- the metallization treatment is an electroplating treatment.
- ABS acrylonitrile butadiene styrene
- PC acrylonitrile butadiene styrene / polycarbonate
- This method of coating with a copper layer a substrate of non-metallic material is carried out in 4 steps (chemical oxidizing treatment with nitric acid / chelation and / or complexation / reduction / bath Electroless).
- ABS acrylonitrile butadiene styrene
- ABS / PC acrylonitrile butadiene styrene / polycarbonate
- Copper sulphate (23.7 g) is solubilized in a solution of water (1000 ml) and ammonia (30 ml). In this bath are immersed parts that have undergone the chemical oxidizing treatment of step 1.1 for 15 minutes. The ABS parts are then rinsed in 0.2 M sodium hydroxide solution.
- NaBH 4 sodium borohydride (0.316 g, 0.8 X 10 -2 mol) is dissolved in 25 ml of a 0.1 M sodium hydroxide solution (NaOH). This solution is heated to 80 ° C. using a bain-marie and the samples are immersed in it. After 12 minutes, the samples were rinsed with MilliQ water before being dried.
- a solution is prepared containing 100 ml of the solution M Copper® 85 B. Then, 40 ml of the solution M Copper® 85 A, then 30 ml of the solution M Copper® 85 D, then 2 ml of the solution M Copper® 85 g and finally 5 ml of formaldehyde 37% are added. The level of the solution is completed to reach 1 liter of solution. The bath is heated to 60 ° C. with mechanical stirring. The ABS plates are then introduced.
- the pieces will be covered with the chemical copper metal film after 3 minutes of immersion.
- the copper layer is visible to the naked eye.
- the Electroless bath is a prepared solution containing: 40 ml of PegCopper 100 solution, 100 ml of PegCopper 200 solution, 30 ml of PegCopper 400 and 2 ml of PegCopper 500 (products marketed by PEGASTECH) ). 3.5 ml of PegCopper 600 are then added. The level is completed to reach 1 liter with water and the mixture is brought to 50 ° C. under bubbling. The parts to be treated are then introduced.
- the pieces will be covered with the chemical copper metal film after 3 minutes of immersion.
- the copper layer is visible to the naked eye.
- the coating process is carried out with a substrate made of Minlon ® polyamide.
- step I.2 copper ions are chelated on the surface of the substrate.
- the chelated copper ions are reduced on the surface of the substrate
- the polyamide substrate is covered with a chemical copper metal film.
- the copper layer is visible to the naked eye.
- the coating process is carried out with a Lexan® polycarbonate substrate.
- the polycarbonate substrate is immersed in a solution containing a mixture of strong acids (34% nitric acid and 66% sulfuric acid) at 25 ° C. for 5 minutes and then in a concentrated sulfuric acid bath at 25 ° C. for 3 minutes. . The whole is neutralized in a 5N potassium hydroxide solution at 65 ° C. for 5 minutes. The polycarbonate substrate is then rinsed with water.
- a mixture of strong acids (34% nitric acid and 66% sulfuric acid) at 25 ° C. for 5 minutes and then in a concentrated sulfuric acid bath at 25 ° C. for 3 minutes. .
- the whole is neutralized in a 5N potassium hydroxide solution at 65 ° C. for 5 minutes.
- the polycarbonate substrate is then rinsed with water.
- step 1.2 copper ions are chelated on the surface of the substrate.
- the copper ions are chelated reduced on the surface of the substrate
- step I.4. or I.5. the polycarbonate substrate is covered with a chemical copper metal film.
- the copper layer is visible to the naked eye.
- Adhesion tests according to the NF ISO 2409 / NF T30-038 standard and corrosion tests according to DIN ISO 9227 were carried out on the substrates obtained in Examples 1 to 3, and the performances are in accordance with the requirements of these tests. and comparable to performanes obtained with substrates obtained according to the methods of the prior art.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28290610P | 2010-04-19 | 2010-04-19 | |
| FR1001663A FR2958944B1 (fr) | 2010-04-19 | 2010-04-19 | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| PCT/IB2011/051691 WO2011132144A1 (fr) | 2010-04-19 | 2011-04-19 | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2561117A1 EP2561117A1 (fr) | 2013-02-27 |
| EP2561117B1 true EP2561117B1 (fr) | 2016-03-30 |
Family
ID=43034368
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP11723649.7A Active EP2561117B1 (fr) | 2010-04-19 | 2011-04-19 | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8962086B2 (ko) |
| EP (1) | EP2561117B1 (ko) |
| JP (1) | JP5947284B2 (ko) |
| KR (1) | KR101812641B1 (ko) |
| CN (1) | CN102933745B (ko) |
| ES (1) | ES2576278T3 (ko) |
| FR (1) | FR2958944B1 (ko) |
| PL (1) | PL2561117T3 (ko) |
| PT (1) | PT2561117E (ko) |
| WO (1) | WO2011132144A1 (ko) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| CN103436164B (zh) * | 2013-09-03 | 2015-12-02 | 丽水学院 | 用于abs工程塑料表面处理的混合溶液及处理方法 |
| KR101662759B1 (ko) * | 2015-01-09 | 2016-10-10 | 건국대학교 글로컬산학협력단 | 무전해 도금법 및 전해 도금법을 연속 적용한 금속 도금 섬유의 제조방법, 상기 방법에 의해 제조된 금속 도금 섬유 및 상기 섬유를 적용한 필터 |
| EP3216756A1 (en) * | 2016-03-08 | 2017-09-13 | ATOTECH Deutschland GmbH | Method for recovering phosphoric acid from a spent phosphoric acid / alkali metal permanganate salt etching solution |
| FR3050215B1 (fr) * | 2016-04-15 | 2018-04-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de modification d'une surface en oxyde conducteur de l'electricite, utilisation pour l'electrodeposition de cuivre sur cette derniere |
| CN108624907A (zh) * | 2018-04-26 | 2018-10-09 | 复旦大学 | 非金属基体高效催化电极及其制备方法 |
| US20220154343A1 (en) * | 2019-04-04 | 2022-05-19 | Atotech Deutschland Gmbh | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
| US20220338480A1 (en) * | 2019-08-09 | 2022-10-27 | Jnt Technologies, Llc | Antimicrobial common touch surfaces |
| CN113564569B (zh) * | 2021-03-18 | 2023-10-31 | 麦德美科技（苏州）有限公司 | Lcp塑料的化学粗化及金属化工艺方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3553085A (en) * | 1967-11-28 | 1971-01-05 | Schering Ag | Method of preparing surfaces of plastic for electro-deposition |
| US3598630A (en) | 1967-12-22 | 1971-08-10 | Gen Motors Corp | Method of conditioning the surface of acrylonitrile-butadiene-styrene |
| US4701351A (en) * | 1986-06-16 | 1987-10-20 | International Business Machines Corporation | Seeding process for electroless metal deposition |
| FI95816C (fi) * | 1989-05-04 | 1996-03-25 | Ad Tech Holdings Ltd | Antimikrobinen esine ja menetelmä sen valmistamiseksi |
| US4981715A (en) | 1989-08-10 | 1991-01-01 | Microelectronics And Computer Technology Corporation | Method of patterning electroless plated metal on a polymer substrate |
| US5160600A (en) * | 1990-03-05 | 1992-11-03 | Patel Gordhanbai N | Chromic acid free etching of polymers for electroless plating |
| JPH0715114A (ja) * | 1993-06-25 | 1995-01-17 | Hitachi Ltd | プリント回路板のパターン形成用表面処理槽 |
| JP3535418B2 (ja) * | 1999-07-14 | 2004-06-07 | 富士通株式会社 | 導体パターン形成方法 |
| DE10054544A1 (de) * | 2000-11-01 | 2002-05-08 | Atotech Deutschland Gmbh | Verfahren zum chemischen Metallisieren von Oberflächen |
| JP4670064B2 (ja) * | 2001-02-07 | 2011-04-13 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与方法 |
| JP2003041375A (ja) * | 2001-07-31 | 2003-02-13 | Okuno Chem Ind Co Ltd | 無電解めっき用触媒付与方法 |
| US6916542B2 (en) * | 2001-10-22 | 2005-07-12 | Ppg Industries Ohio, Inc. | Coated articles having a protective coating and cathode targets for making the coated articles |
| JP2004203014A (ja) * | 2002-10-31 | 2004-07-22 | Toyoda Gosei Co Ltd | めっき製品 |
| CN1329554C (zh) | 2004-01-13 | 2007-08-01 | 长沙力元新材料股份有限公司 | 非金属基材表面化学镀覆金属的方法及其采用的前处理体系 |
| WO2007122869A1 (ja) | 2006-04-18 | 2007-11-01 | Okuno Chemical Industries Co., Ltd. | 樹脂成形体に対するエッチング処理用組成物 |
| CN100545305C (zh) | 2007-05-29 | 2009-09-30 | 南京工业大学 | 非金属基体化学镀的一种活化工艺 |
| ATE445667T1 (de) | 2007-08-10 | 2009-10-15 | Enthone | Chromfreie beize für kunststoffoberflächen |
| CN101381865B (zh) | 2008-10-23 | 2011-06-01 | 中国人民解放军第二炮兵工程学院 | 一种羧甲基纤维素钠螯合吸附镍的塑料基体表面无钯活化方法 |
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
-
2010
- 2010-04-19 FR FR1001663A patent/FR2958944B1/fr active Active
-
2011
- 2011-04-19 PL PL11723649.7T patent/PL2561117T3/pl unknown
- 2011-04-19 EP EP11723649.7A patent/EP2561117B1/fr active Active
- 2011-04-19 JP JP2013505589A patent/JP5947284B2/ja active Active
- 2011-04-19 ES ES11723649.7T patent/ES2576278T3/es active Active
- 2011-04-19 US US13/089,740 patent/US8962086B2/en active Active
- 2011-04-19 KR KR1020127030299A patent/KR101812641B1/ko active IP Right Grant
- 2011-04-19 CN CN201180019757.XA patent/CN102933745B/zh active Active
- 2011-04-19 PT PT117236497T patent/PT2561117E/pt unknown
- 2011-04-19 WO PCT/IB2011/051691 patent/WO2011132144A1/fr active Application Filing
-
2014
- 2014-12-24 US US14/582,228 patent/US9249512B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9249512B2 (en) | 2016-02-02 |
| PL2561117T3 (pl) | 2016-09-30 |
| CN102933745A (zh) | 2013-02-13 |
| FR2958944A1 (fr) | 2011-10-21 |
| FR2958944B1 (fr) | 2014-11-28 |
| KR101812641B1 (ko) | 2017-12-27 |
| ES2576278T3 (es) | 2016-07-06 |
| EP2561117A1 (fr) | 2013-02-27 |
| KR20130101978A (ko) | 2013-09-16 |
| US8962086B2 (en) | 2015-02-24 |
| JP2013525606A (ja) | 2013-06-20 |
| US20150111050A1 (en) | 2015-04-23 |
| CN102933745B (zh) | 2016-07-06 |
| PT2561117E (pt) | 2016-06-17 |
| US20110256413A1 (en) | 2011-10-20 |
| JP5947284B2 (ja) | 2016-07-06 |
| WO2011132144A1 (fr) | 2011-10-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2561117B1 (fr) | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique | |
| EP2510133B1 (fr) | Procédé de préparation d'un substrat en polymère métallisé | |
| US20060042954A1 (en) | Method for plating resin material | |
| CN101195911B (zh) | 在具有塑料表面的基底上形成涂布金属层的预处理溶液和方法 | |
| KR102366687B1 (ko) | 무전해 도금의 전처리용 조성물, 무전해 도금의 전처리 방법, 무전해 도금 방법 | |
| JP5269306B2 (ja) | 誘電体の金属化 | |
| EP2937447A1 (en) | Conductive coating film forming bath | |
| EP3070185B1 (en) | Conductive film-forming bath | |
| US20060000720A1 (en) | Method for pretreating a surface of a non-conducting material to be plated | |
| JP2011062674A (ja) | ポリマー層の形成方法 | |
| CH710579A1 (fr) | Procédé de placage autocatalytique d'un métal précieux. | |
| RU2063461C1 (ru) | Способ получения никелевого покрытия на материалах из углеродных волокон | |
| JP2005068497A (ja) | めっき素材及びめっき被覆部材とそれらの製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20121029 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| DAX | Request for extension of the european patent (deleted) | ||
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 602011024629 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: C23C0018220000 Ipc: C25D0005560000 |
|
| 17Q | First examination report despatched |
Effective date: 20150527 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: C25D 5/56 20060101AFI20150611BHEP Ipc: C23C 18/20 20060101ALI20150611BHEP Ipc: C23C 18/16 20060101ALI20150611BHEP Ipc: C23C 18/38 20060101ALI20150611BHEP Ipc: C23C 18/22 20060101ALI20150611BHEP |
|
| GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
| INTG | Intention to grant announced |
Effective date: 20150929 |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: GILBERT, FRIDA Inventor name: ROUSSEL, SEBASTIEN |
|
| GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
| GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
| AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
| REG | Reference to a national code |
Ref country code: AT Ref legal event code: REF Ref document number: 785499 Country of ref document: AT Kind code of ref document: T Effective date: 20160415 |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: FRENCH |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 602011024629 Country of ref document: DE |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 6 |
|
| REG | Reference to a national code |
Ref country code: RO Ref legal event code: EPE |
|
| REG | Reference to a national code |
Ref country code: PT Ref legal event code: SC4A Free format text: AVAILABILITY OF NATIONAL TRANSLATION Effective date: 20160609 |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: FG2A Ref document number: 2576278 Country of ref document: ES Kind code of ref document: T3 Effective date: 20160706 |
|
| REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160701 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160630 |
|
| REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20160330 |
|
| REG | Reference to a national code |
Ref country code: AT Ref legal event code: MK05 Ref document number: 785499 Country of ref document: AT Kind code of ref document: T Effective date: 20160330 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160430 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160730 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 602011024629 Country of ref document: DE |
|
| REG | Reference to a national code |
Ref country code: IE Ref legal event code: MM4A |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160430 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160430 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
| 26N | No opposition filed |
Effective date: 20170103 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 7 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160419 |
|
| REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 8 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20110419 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20160419 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20160330 |
|
| REG | Reference to a national code |
Ref country code: GB Ref legal event code: 732E Free format text: REGISTERED BETWEEN 20190801 AND 20190807 |
|
| REG | Reference to a national code |
Ref country code: SK Ref legal event code: PC4A Ref document number: E 22083 Country of ref document: SK Owner name: ATOTECH DEUTSCHLAND GMBH, BERLIN, DE Free format text: FORMER OWNER: PEGASTECH, GIF-SUR-YVETTE, FR Effective date: 20200217 Ref country code: SK Ref legal event code: TE4A Ref document number: E 22083 Country of ref document: SK Owner name: PEGASTECH, GIF-SUR-YVETTE, FR Effective date: 20200217 |
|
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R081 Ref document number: 602011024629 Country of ref document: DE Owner name: ATOTECH DEUTSCHLAND GMBH, DE Free format text: FORMER OWNER: PEGASTECH, ORSAY, FR |
|
| REG | Reference to a national code |
Ref country code: ES Ref legal event code: PC2A Owner name: ATOTECH DEUTSCHLAND GMBH Effective date: 20201127 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: PT Payment date: 20230406 Year of fee payment: 13 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: TR Payment date: 20230417 Year of fee payment: 13 Ref country code: SK Payment date: 20230413 Year of fee payment: 13 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20230419 Year of fee payment: 13 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: PL Payment date: 20240327 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240429 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: ES Payment date: 20240514 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: CZ Payment date: 20240405 Year of fee payment: 14 |
|
| PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: RO Payment date: 20240411 Year of fee payment: 14 Ref country code: IT Payment date: 20240423 Year of fee payment: 14 Ref country code: FR Payment date: 20240430 Year of fee payment: 14 |