EP2508633A4 - COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR - Google Patents

COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR

Info

Publication number
EP2508633A4
EP2508633A4 EP20100834576 EP10834576A EP2508633A4 EP 2508633 A4 EP2508633 A4 EP 2508633A4 EP 20100834576 EP20100834576 EP 20100834576 EP 10834576 A EP10834576 A EP 10834576A EP 2508633 A4 EP2508633 A4 EP 2508633A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy sheet
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20100834576
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2508633A1 (en
Inventor
Hiroshi Kaneko
Koji Sato
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2508633A1 publication Critical patent/EP2508633A1/en
Publication of EP2508633A4 publication Critical patent/EP2508633A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP20100834576 2009-12-02 2010-12-01 COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR Withdrawn EP2508633A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009274995 2009-12-02
PCT/JP2010/071499 WO2011068126A1 (ja) 2009-12-02 2010-12-01 銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
EP2508633A1 EP2508633A1 (en) 2012-10-10
EP2508633A4 true EP2508633A4 (en) 2014-07-23

Family

ID=44114972

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100834576 Withdrawn EP2508633A4 (en) 2009-12-02 2010-12-01 COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR

Country Status (5)

Country Link
EP (1) EP2508633A4 (ja)
JP (2) JP5400877B2 (ja)
KR (1) KR101747475B1 (ja)
CN (1) CN102666889A (ja)
WO (1) WO2011068126A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101503185B1 (ko) * 2010-08-27 2015-03-16 후루카와 덴키 고교 가부시키가이샤 구리합금 판재 및 그 제조방법
JP5039863B1 (ja) 2011-10-21 2012-10-03 Ｊｘ日鉱日石金属株式会社 コルソン合金及びその製造方法
JP6639908B2 (ja) * 2013-09-06 2020-02-05 古河電気工業株式会社 銅合金線材及びその製造方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
JP6504868B2 (ja) * 2015-03-19 2019-04-24 Ｊｘ金属株式会社 圧延銅箔及びその製造方法、銅張積層板、並びにフレキシブルプリント基板及び電子機器
JP6310538B1 (ja) * 2016-12-14 2018-04-11 古河電気工業株式会社 銅合金線棒材およびその製造方法
CN110998814B (zh) * 2017-08-09 2021-04-23 日铁化学材料株式会社 半导体装置用Cu合金接合线
CN108315579B (zh) * 2018-03-06 2019-12-06 北京科技大学 织构稀土CuNiSiCr合金材料及制备工艺和应用
JP6713074B1 (ja) * 2019-04-16 2020-06-24 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
CN112030030B (zh) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 一种高强高导铜合金线材及其制备方法
CN115094258B (zh) * 2022-07-13 2023-02-17 浙江惟精新材料股份有限公司 一种高强高塑高折弯Cu-Ni-Si-Co合金及其制备方法和应用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2007092135A (ja) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
WO2008099892A1 (ja) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho 強度と成形性に優れる電気電子部品用銅合金板
EP1967596A1 (en) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
EP1997920A2 (en) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2248922A1 (en) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same
EP2298945A1 (en) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185847A (ja) * 1986-02-12 1987-08-14 Furukawa Electric Co Ltd:The 熱・電気高伝導用高力銅合金とその製造法
JP3510469B2 (ja) * 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP2000080428A (ja) * 1998-08-31 2000-03-21 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
JP4809602B2 (ja) 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4166197B2 (ja) 2004-06-30 2008-10-15 日鉱金属株式会社 ＢａｄＷａｙの曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP4584692B2 (ja) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
JP5002768B2 (ja) * 2006-03-30 2012-08-15 Ｄｏｗａメタルテック株式会社 曲げ加工性に優れた高導電性銅基合金およびその製造法
JP5028657B2 (ja) 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 異方性の少ない高強度銅合金板材およびその製造法
US20080190523A1 (en) 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4981748B2 (ja) 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
RU2413021C1 (ru) * 2007-09-28 2011-02-27 Джей Экс Ниппон Майнинг Энд Метлз Корпорейшн МЕДНЫЙ СПЛАВ Cu-Ni-Si-Co ДЛЯ МАТЕРИАЛОВ ЭЛЕКТРОННОЙ ТЕХНИКИ И СПОСОБ ЕГО ПРОИЗВОДСТВА
JP4596490B2 (ja) 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
KR20120104553A (ko) * 2009-12-02 2012-09-21 후루카와 덴키 고교 가부시키가이샤 저영율을 갖는 구리합금판재 및 그 제조법
JP5476149B2 (ja) * 2010-02-10 2014-04-23 株式会社神戸製鋼所 強度異方性が小さく曲げ加工性に優れた銅合金

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2007092135A (ja) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
EP1967596A1 (en) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
WO2008099892A1 (ja) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho 強度と成形性に優れる電気電子部品用銅合金板
EP1997920A2 (en) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Copper alloy for electric and electronic equipments
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2298945A1 (en) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Copper alloy sheet material and manufacturing method thereof
EP2248922A1 (en) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Copper alloy sheet and method for producing same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011068126A1 *

Also Published As

Publication number Publication date
EP2508633A1 (en) 2012-10-10
JP2014029031A (ja) 2014-02-13
WO2011068126A1 (ja) 2011-06-09
JP5400877B2 (ja) 2014-01-29
JPWO2011068126A1 (ja) 2013-04-18
CN102666889A (zh) 2012-09-12
KR101747475B1 (ko) 2017-06-14
KR20120087985A (ko) 2012-08-07
JP5503791B2 (ja) 2014-05-28

Similar Documents

Publication Publication Date Title
EP2508635A4 (en) COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR
EP2508633A4 (en) COPPER ALLOY FILM AND MANUFACTURING METHOD THEREFOR
EP2610359A4 (en) Copper alloy sheet and method for producing same
EP2377958A4 (en) HIGH-FIXED AND HIGHLY CONDUCTIVE COPPER ALLOY CABINET AND METHOD FOR THE PRODUCTION THEREOF
EP2554693A4 (en) CU-NI-SI-CO COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THEREOF
GB0817169D0 (en) Improved process for forming aluminium alloy sheet components
TWI561559B (en) Process for producing hydrogenated polygermasilane and polygermasilane
EP2610358A4 (en) Copper alloy sheet and manufacturing method for same
EP2330224A4 (en) HIGH PURITY COPPER AND PROCESS FOR THE ELECTROLYTIC PRODUCTION OF HIGH PURITY COPPER
EP2431150A4 (en) TRANSMISSION PLATE AND METHOD FOR THE PRODUCTION THEREOF
EP2570505A4 (en) COPPER ALLOY FOR AN ELECTRONIC DEVICE, METHOD FOR PRODUCING THE COPPER ALLOY FOR AN ELECTRONIC DEVICE AND ROLLED COPPER ALLOY MATERIAL FOR AN ELECTRONIC DEVICE
EP2653574A4 (en) COPPER ALLOY AND METHOD OF MANUFACTURING THE SAME
EP2298945A4 (en) COPPER ALLOY SHEET MATERIAL AND METHOD OF MANUFACTURING THE SAME
EP2455220A4 (en) LAMINATE AND METHOD FOR ITS PRODUCTION
EP2479212A4 (en) ELECTROLYTEMULSION AND MANUFACTURING METHOD THEREFOR
ZA201203935B (en) Method for producing low aluminium titanium-aluminium alloys
EP2592166A4 (en) NI-CONTAINING STEEL PLATE AND METHOD FOR THE PRODUCTION THEREOF
EP2759612A4 (en) COPPER ALLOY SHEET AND PROCESS FOR PRODUCING COPPER ALLOY SHEET
EP2484787A4 (en) COPPER ALLOY ON CU-NI-SI-CO BASE FOR ELECTRONIC MATERIAL AND METHOD OF MANUFACTURING THEREOF
EP2471610A4 (en) FORM PRESSING
EP2578709A4 (en) CU-CO-SI COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
EP2386666A4 (en) HIGH-FIXED AND HIGHLY CONDUCTIVE COPPER ALLOY CABINET AND METHOD FOR THE PRODUCTION THEREOF
EP2505274A4 (en) PROCESS FOR PRODUCING MAGNESIUM ALLOY SHEET AND MAGNESIUM ALLOY COIL MATERIAL
EP2455501A4 (en) METHOD FOR THE PRODUCTION OF ALLOY BLOCKS
EP2570506A4 (en) COPPER ALLOY FOR AN ELECTRONIC DEVICE, METHOD FOR PRODUCING THE COPPER ALLOY FOR AN ELECTRONIC DEVICE AND ROLLED COPPER ALLOY MATERIAL FOR AN ELECTRONIC DEVICE

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120628

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20140623

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 9/06 20060101AFI20140616BHEP

Ipc: C22F 1/08 20060101ALI20140616BHEP

Ipc: H01B 5/02 20060101ALI20140616BHEP

Ipc: C22F 1/00 20060101ALI20140616BHEP

Ipc: C22C 9/05 20060101ALI20140616BHEP

Ipc: H01B 1/02 20060101ALI20140616BHEP

Ipc: C22C 9/04 20060101ALI20140616BHEP

Ipc: C22C 9/10 20060101ALI20140616BHEP

Ipc: C22C 9/02 20060101ALI20140616BHEP

Ipc: C22C 9/00 20060101ALI20140616BHEP

17Q First examination report despatched

Effective date: 20150522

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160903