Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
  • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
  • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
  • H01L31/042—PV modules or arrays of single PV cells
  • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
  • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
  • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B38/00—Ancillary operations in connection with laminating processes
  • B32B38/04—Punching, slitting or perforating
  • B32B2038/047—Perforating
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/12—Photovoltaic modules
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B38/00—Ancillary operations in connection with laminating processes
  • B32B38/18—Handling of layers or the laminate
  • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
  • B32B38/1833—Positioning, e.g. registration or centering
  • B32B38/1841—Positioning, e.g. registration or centering during laying up
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0388—Other aspects of conductors
  • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/03—Conductive materials
  • H05K2201/0332—Structure of the conductor
  • H05K2201/0388—Other aspects of conductors
  • H05K2201/0397—Tab
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/15—Position of the PCB during processing
  • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
  • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49204—Contact or terminal manufacturing
  • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
  • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding

Definitions

• the invention relates to a method for producing a foil-like electrical connector for solar cells in order to interconnect them to modules, wherein the connector has a conductive and at least one insulating
• the invention relates to a method according to such
• the invention accordingly relates to the subject of electrical
• IBC Interdigitated Back Contact
• backside connectors for MWT cells that take the form of an interdigitated structure, i. have interlocking combs with wide copper tracks.
• This structure should be present on a so-called backsheet, namely formed on a large plastic film.
• the solar cells are then positioned according to the pick-and-place method in a matrix arrangement and then connected to the copper tracks via conductive adhesive.
• connection shield advantageously provides electrical isolation between the connection and the edges of the solar cells in regions other than the solder pads, thereby preventing the efficiency reducing electrical paths in the cells. Specifically, the connection shield prevents a solder from migrating to the front sides of the solar cells during soldering
• connection shield as a line cell spacer for mounting symmetry.
• the connection shield is a single-sided or double-sided band with or without an integral one
• connection shield is approx. 6.2 mm wide
• Polyester tape is that includes an acrylic-based adhesive.
• the known technical backsheet solutions have the disadvantage that usually the entire back of the module consists of a single sheet of sheet material, wherein the Folienmateria! a structured one
• Copper coating carries. It is very problematic to coat a monolithic piece of film with the typical dimensions of a cell module of about 10 cm -3 / cm 2 with copper and to structure this coating. In this case, a solder stop layer is either on the copper track or the lines too
• connections of the lines with the backsheet to a module are, as stated, effected by means of conductive adhesive whose specific resistances in principle do not reach the low values of solders.
• Another object of the invention is to provide a method for electrically connecting at least two solar cells to one another
• foil-like connector with defined width dimensions, matched to the respective solar cells.
• the object of the invention is achieved by a method according to the teaching of claim 1, comprising a film-type electrical connector according to the combination of features according to claim 12 and a method for electrically connecting at least two solar cells according to the teaching of claim 13, wherein the dependent claims at least expedient
• electrical connector for solar cells in order to interconnect these modules, starting from a connector having a conductive and at least one insulating surface layer.
• an insulating carrier film web is initially provided in a width which substantially corresponds to the width of the solar lines to be interconnected. This width dimension is definitely much smaller than the total area of a conventional standard solar module,
• a conductive film web is provided with a width matched to the carrier film, wherein an adjustment and transport perforation is likewise introduced into this conductive film web at the edge.
• comb structures are formed as later electrical connection fingers and this holding webs realized in the direction of Justage- and transport perforation, to ensure a positional securing of the comb structures for the subsequent exact positioning in the module formation,
• the conductive film web is positioned on the Relieffoiie, wherein the extensions engage in the respective Justage- and transport perforations.
• Film web preferably by fabric bond. Thereafter, a separation of the side edge strips and a severing of the holding webs is made. In the next step, an application, in particular lamination of an insulating cover sheet or in each case one edge strip provided cover film strip.
• the cover film or the cover film strips proceeding at the edges each have a width projection based on the composite carrier film / conductive film web.
• Cover strip is then folded, all the way down to the composite bottom for the purpose of edge isolation. It then takes place a fixing of the folded portions, again preferably by material bond.
• the composite thus created is then, forming a roll, wound up and used for later processing.
• Ausgestaltend the recesses and perforations can be generated by laser radiation or the like.
• the comb structures have a surface shape, which are adapted to the contact arrangement and the expected Strombever desk ⁇ issen the solar module.
• the surface shape may have a uniformly rectangular or else a conical shape.
• an adhesive layer is applied in order to ensure the above-mentioned fixing of the folded regions.
• Trennstelien After a certain, predetermined length of the composite, which corresponds to a number of x solar cells, Trennstelien be formed, wherein in
• the conductive film web is made of a copper material.
• the carrier film is wetted with an adhesive before being brought into contact with the conductive film web.
• This wetting may e.g. be made by spraying, wherein the then guided each other tracks are laminated and bonded under light pressure.
• cover film edges or the cover film strips can be cut from the outside in the direction of the center of the composite and severed in this respect, so that the folding can be done in sections and more easily.
• the wetting with flux and / or solder can be realized by means of a wave bath.
• a sheet-like electrical connector is produced according to the above-described method.
• Also according to the invention is a method for electrically connecting at least two solar cells to a solar module with the aid of the connector according to the invention as explained above.
• a roll work is carried out wherein x solar cells are connected to the unwound portion in a string by contacting the solder joints of the cells with the pads exposed through the punch holes in the support sheet by a soldering step. Subsequently, the thus produced string is rotated on a transparent plate material provided with an encapsulation material rotated by 180 ° with respect to a previous string, whereby a series connection of the strings takes place through the cross connectors provided.
• a film connector or film TAB wherein a use of film webs takes place, which have a width which approximately corresponds to that of a solar cell, for example 6
• the film connector is based on a plastic film, which is coated with a copper material and A further plastic film is provided as a cover layer, with the formation of a laminate
• the films are sequentially patterned, glued and wound up on a roll.
• a further feature of the invention is the special edge insulation of the Foiienverbinders by the second plastic film, the ais as cover sheet either over the entire surface or in narrow strips ais pure edge cover can be formed.
• FIG. 1 The figures show a basic sequence of the method for producing the foil-type electrical connector for solar cells (FIGS. 1 to 7), the series connection of two foil connectors with x solar cells according to FIG. 8, the connection of y strings with x solar cells via transverse connectors
• FIG. 11 shows an exemplary process sequence for the roll-to-roll production method of the film-type electrical connectors according to the invention according to FIG. 10.
• FIGS. 12a and 12b show a further development of the invention
• Fig. 13e shows basic embodiments of a punching tool for the
• Fig. 14 also shows in addition the use of a punch 4 for generating recesses in the cover sheet in the range later Lotstellen, the dimensions of which are larger than the dimensions of the recesses in the
• FIG. 1 a shows a plan view and FIG. 1 b shows a sectional view through a carrier foil 100 of thickness d 1 and the width B1.
• the width B1 is slightly larger than the edge length of the solar cells to be connected.
• Punching can be seen with a punching tool, not shown, wherein the punching tool simultaneously perforation holes 102 and 104 on the side strips 101 and 103 forms.
• the holes 105 can be made in the area of the later solder joints on the solar cells in a simuitic manner.
• the second process-relevant step is illustrated by FIGS. 2a to 2c.
• a copper foil is prepared as a conductive film web having the thickness d2 and the same width Bl as the plastic film 100 by rolling from a large supply sheet for structuring. With a punching tool, the copper foil 200 is processed. In this case, copper tracks 205a or 205b are produced according to FIG. 2c, but also separating lines are formed as punched gaps 205. It can thus be realized between the copper tracks, which belong to different comb structures 207 and 208, corresponding insulating regions. Likewise, the perforation holes 202 are created on the side panel 201. As shown, the perforation holes are present on both the upper side panel 201 and as perforation holes 204 on the lower side panel 203.
• Holding webs 208 to the two side strips 201 and 203 are left to fix the individual copper tracks in their original position.
• the copper tracks may be formed rectangular (205a), but also conical (205b), in order to take account of the increasing current at the end of the track.
• the copper foil 200 is filled with the plastic foil 100 with the aid of an adhesive 107 which has previously been applied to the surface of the plastic foil 100
• Plastic film with the perforation holes 202 and 204 are aligned by pins or extensions 401 of a conveyor belt 400 exactly to each other.
• Connector adjusted as precisely as the given tolerances allow the adjustment of the diameter of the perforation holes and the pins 401.
• the conveyor belt 400 moves in synchronism with the two sheets 100 and 200 under a heated roller or roller 402 or a correspondingly heated punch (not shown).
• the movement of the foils and thus the adjustment can be effected by a linear movement of the pins or, if a transport wheel is used, by a corresponding circumverale pin movement.
• the holding webs 208 can now be severed without the copper combs losing their relative position to one another,
• Copper gaps 209 between adjacent copper crests are formed at the cut edge as shown in E-F ( Figure 4b).
• the underside of the film 300 is wetted with an adhesive 309.
• an adhesive 309 In the form of small incisions 303 and 304 of length, at the two projecting edges 301 and 302 approximately in the middle of the periodic structure of the film connector according to the invention (B2-B3) / 2 of the projections 301 and 302 are formed.
• the folds 301 and 302 are then bonded to the underside of the Foiienverbunds the total thickness D.
• the punched holes 105 in the carrier fo 100 according to the first method step and the cuts 303 and 304 from the fifth method step can then be seen.
• the sectional view G-H reveals the cuts 304 and the severed Kupferhaltestege 208 and the copper gaps 209 formed next to them.
• the covering of the edges 208 can be seen by folding and gluing the edges 301 and 302 of the foil or film strips 300.
• the adhesive layers 107 and 307 are cured in the passage of the laminate through an oven or a so-called
• pre-lapping may be performed on the exposed copper surfaces in the punch holes 105, 108 and 109, e.g. by passing the composite over a solder wave in a wave soldering device, before then winding and roll forming (step O of Fig. 10) takes place.
• the film connector is provided with an interface at which the laminate can be separated and connected with cross connectors to the adjacent row of cells.
• Fig. 7 shows this by way of example. It can be seen there after x solar cells a broadening of the copper cross-track 210 by Q beyond the cell structure area with punching surfaces 108 in the carrier film 100, for example, represent the contacts to the comb 207 of polarity p, is inserted. In front of the next cell structure region, an equally wide projection of the copper track 211 with the punched holes 109 in the carrier foil adjoins this section.
• connection to the copper comb 206 is made to the polarity n at which the next chain of x solar cell structures begins.
• the endless belt can be separated at the interface 212 and soldered to x solar cells.
• the next row of x solar cells is then placed by rotation 180 ° next to the previously prepared row (see Fig. 8) so that the p-contacts 109 and the n-contacts 108 come to lie one below the other.
• a further embodiment of the invention provides that the cover film 300 does not completely cover the copper foil, but is formed only as two narrow strips, which are laminated on the two sides of the copper foil and folded over. As a result, the need for temperature-resistant plastic film and thus the cost of the method and the connector is reduced.
• the application of the film connector according to the invention is based on the method of "Tabbing &Stringing", ie x solar cells 400 are connected to a Foulen connector to a string by the solder joints 410 on the cells 400 with the through the punching surface 105, 108 and 109 in be soldered to the carrier foil exposed copper Kunststoffstelien.
• the solder for the solder joints can either be previously by a solder wave
• soldering is carried out with a known soldering, so for example. an infrared soldering, hotbar soldering, hotair soldering, an inductive soldering step or a so-called reflow soldering.
• FIG. 10 schematically illustrates the sequence of the steps.
• a first station A the unwinding of the carrier film 100 takes place from a supply roll, the carrier film having a width Bl and a thickness d 1.
• step B a first punch (S1) for forming the perforation holes 102 and 104 and the contacts 105 to the copper strip 206 and 207 and a second punch (S2) for the punch holes 108 and 109 in the protrusions for the cross connections for each x Zeil Design Schlstatten intended.
• section C wetting of the upper side of the carrier film 100 with adhesive 107 takes place, if the carrier film 100 does not already have a temperature-sensitive and pressure-activated layer of a binder.
• section D an unwinding of the copper foil 200 from a corresponding Vorratsroile is shown.
• the copper roll has the width Bl and a thickness d2.
• section E a punch 3 for producing the perforation holes 200, 204 and 204 in the side edges 201 and 203 of the copper foil 200 and the dividing lines 205 between the copper tracks 206 and 207 is arranged.
• the connecting webs 208 to the side strips 201 and 203 are retained.
• section F a merging of the carrier film 100 and the
• Copper foil 200 using the perforation for the fine adjustment for the punched structures in both films realized to each other and there is a lamination by pressure using a symbolically shown roller.
• the protruding strips 301 and 302 are cut in the periodic spacing of a solar cell length by the cutting depth (B3-B2) / 2.
• section J a wetting of the underside of the cover film 300 with adhesive 309 takes place.
• section K a combination of the cover film or cover film edge strips 300 with the copper-plastic laminate 100/200 is carried out by pressing with a Waize. If the underside of the cover sheet 300 is already provided with an adhesive which can be activated under pressure and temperature, the step J can be omitted.
• the incised protruding edges 301 and 302 / are folded over to make the edge edges of the copper-plastic laminate 100/200 easier to be made by pressing with a roller or the like centered around the edge.
• a hardening of the adhesive layers 107 and 307 of the copper-plastic laminate is realized in a continuous furnace or a laminator.
• FIGS. 12a and 12b in order to avoid the above-described effect, punched out gusset regions 114 and 115 are provided in the film layers 100, 200 and 300.
• the detailed representation of a punching hole 114 according to FIG. 12b shows a bevelled corner or chamfer region 400 of a solar cell, which is partially recognizable in the punching hole 114, but does not interfere visually. The punching out of the region 114 of the film layers 100 and 200 takes place so far that at the sight of the
• Strips between the cells is visible, with back contact cells, the corresponding gaps between the cells are kept very narrow so that no visual impairment over a longer lifetime is to be feared.
• a lateral delimitation of the solder flow on the copper foil upper side is ensured by the optional use of the cover foil 300 by the edges of the openings 308 in the cover foil 300.
• the propagation of the solder 430 is symbolized by the arrow representations in FIG. 13d.
• the introduced recesses 222 in the conductive foil 200 may also be used to individually align the solar cells under the foil connector, i. the
• the solder joint thus receives a quasi mushroom shape, so that sets a better contact and beyond the shear strength, i. the mechanical strength of the
• the connector is not just a slim one
• Copper strip for each individual compound but represents an almost completely covered with copper foil web, which has approximately the width of a solar cell and the length of a module, so that all and in particular any number of contact points can be contacted on adjacent cells simultaneously.
• a significant advantage in handling is achieved because after positioning the cells only a part, namely the film connector must be placed on the cell row and soldered.
• the adjustment of the corresponding contacts in the connector to those on the cells is much easier for such a linear film element than for a very large sheet having the dimensions of the overall module.
• the preparation of the film connector can be carried out as described in a fully automated roll-to-roll process and thus be realized in large quantities and at low cost.
• the inventive concept of the 3-layered and glued around the edges film connector thus enables the fully automatic Moduiintegration of back contact solar cells with any number and arbitrarily arranged solder points in contrast to linear connections between two or three busbars on the front and back sides of Standarzelien.

Applications Claiming Priority (3)

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• 2010
  • 2010-01-07 DE DE102010004112A patent/DE102010004112A1/de not_active Withdrawn
  • 2010-05-19 WO PCT/EP2010/056899 patent/WO2011000629A2/de active Application Filing
  • 2010-05-19 KR KR1020127002397A patent/KR20120124052A/ko not_active Application Discontinuation
  • 2010-05-19 JP JP2012518056A patent/JP5409908B2/ja not_active Expired - Fee Related
  • 2010-05-19 CN CN201080038226.0A patent/CN102473794B/zh not_active Expired - Fee Related
  • 2010-05-19 EP EP10721480A patent/EP2449601A2/de not_active Withdrawn
  • 2010-05-19 US US13/381,263 patent/US9307650B2/en active Active

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