EP2447986B1 - Resin encapsulation molding method and apparatus for electrical circuit component - Google Patents

Resin encapsulation molding method and apparatus for electrical circuit component Download PDF

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Publication number
EP2447986B1
EP2447986B1 EP11186409.6A EP11186409A EP2447986B1 EP 2447986 B1 EP2447986 B1 EP 2447986B1 EP 11186409 A EP11186409 A EP 11186409A EP 2447986 B1 EP2447986 B1 EP 2447986B1
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EP
European Patent Office
Prior art keywords
mold
resin
connection terminal
external connection
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP11186409.6A
Other languages
German (de)
English (en)
French (fr)
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EP2447986A1 (en
Inventor
Yukitomo Tane
Yuichi Koba
Yukihiro Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
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Towa Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a resin encapsulation method for an electrical circuit component and a resin encapsulation apparatus for an electrical circuit component.
  • the present invention particularly relates to a resin encapsulation method for an electrical circuit component to encapsulate, with a resin material, electrical circuit components that include a resin molded connector part and a substrate and a metal external connection terminal, and to mold the encapsulating resin material and a resin encapsulation apparatus for an electrical circuit component used in the method.
  • an electronic control device to be equipped in a vehicle for example, an electronic control device for an engine may be mounted within an engine room, and a control device for an automatic transmission may be mounted on an automatic transmission.
  • a control device for an automatic transmission may be mounted on an automatic transmission.
  • Resin molding technologies such as transfer molding are employed as a technology of encapsulating the entire substrate with a resin material and molding the encapsulating resin material as above.
  • the entire substrate is attached onto a lead frame in advance, and the lead frame is then arranged within a cavity of a mold for transfer molding, thereby allowing the entire substrate to be arranged at a predetermined position in the cavity.
  • the lead frame enables that in encapsulating the entire substrate with a resin material and molding the encapsulating resin material, the entire substrate attached onto the lead frame is arranged at a predetermined position in a cavity of a mold for resin molding by means of that lead frame.
  • US 2003/0180985 discloses a resin molding method for a semiconductor device, in which method the respective cavities of upper and lower mold blocks face each other when clamped together, and a lead frame, a semiconductor chip connected to the lead frame and a nut, overlapping and provided on a terminal portion of the lead frame, are integrally molded with a seal resin that is injected into the cavities in the mold block, and upper and lower sides of the nut are formed to be resin-tight structures by pressure from elastic bodies.
  • US 5,384,286 discloses a method and apparatus for producing a semiconductor device using a heat-sinking frame and a lead frame.
  • the heat-sinking frame and lead frame are precisely positioned on a lower mold with co-operating positioning holes and pins with a space between the heat-sinking frame and the lead frame.
  • resin is injected into a cavity in the mold to encapsulate the lead frame (to which a semiconductor chip is attached) and the heat-sinking frame within one body.
  • EP 0,257,681 discloses another method for manufacturing an encapsulated semiconductor device.
  • correct positioning of the metallic plate supporting the semiconductor chips in the mold used for encapsulation achieved by using at least one pair of locating pins and by locators present in the mold referenced to the lead connected to the plate.
  • the ends of the locating pins are spaced, in the final phase of encapsulation, with respect to the surfaces of the plate, whereas in the initial phase they are directly connected to the metallic surfaces or indirectly connected through the interposition of insulating thicknesses.
  • W2010/038660 discloses a method and apparatus for resin encapsulation of an electronic component.
  • a top force and a bottom force of a resin sealing compression molding device are equipped, respectively, with cooling means.
  • a gate nozzle equipped with a cooling means is provided in the top force.
  • the bottom force is provided with a cavity in which the single sheet of substrate is loaded.
  • a predetermined quantity of liquid thermosetting resin material is supplied in to cavity through the gate nozzle.
  • a substrate is supplied between the top force and bottom force, which are then clamped. Consequently, an electronic component on the substrate is immersed in the liquid thermosetting resin material in the cavity.
  • the temperature of the liquid thermosetting resin material is controlled by the gate nozzle and the cooling means.
  • US2004/166605 discloses a method of manufacturing a semiconductor integrated circuit device.
  • the method utilises a mold which is provided with a plurality of air vents and moveable pins which include grooves in distal ends thereof and project into the air vents.
  • resin can be filled while leaking air inside the cavity through the grooves in the ends of the moveable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities of thicknesses of multi-cavity boards.
  • the method aims to prevent the occurrence of insufficient filling of resin in the cavity, the occurrence of leaking resin and/or defective welding.
  • a substrate which does not use the above-described lead frame has the following problems when the entire substrate is encapsulated with a resin material and the encapsulating resin material is molded.
  • an electronic control device which includes a resin molded connector part and a glass epoxy substrate and a metal external connection terminal to be connected to a battery equipment
  • the operation of arranging each of the components will be difficult and inefficient.
  • encapsulating the components with a resin material and molding the encapsulating resin material cannot be performed efficiently and reliably.
  • a resin molded connector part 1 is arranged in a cavity to be fitted with 3 provided in a mold surface of a mold for resin molding 2, and a glass epoxy substrate 4, a metal external connection terminal 5 and the like which are electrically connected to connector part 1 are arranged in a molding cavity 6 provided in the mold surface, if it is not ensured that each of the above-described components is arranged at a predetermined position in each cavity, then a failure will occur in mold matching of mold for resin molding 2 (mold clamping operation).
  • the present invention has been made to solve the problems above, and one object of the invention is to provide a resin encapsulation method for an electrical circuit component which prevents a resin flash from being formed by ensuring, without using a lead frame, that each component of electrical circuit components that include a resin molded connector part and a substrate and a metal external connection terminal electrically connected to the connector part is arranged at a predetermined position in a cavity of a mold for resin molding. Another object of the invention is to provide a resin encapsulation apparatus for an electrical circuit component used in such a resin encapsulation method for an electrical circuit component.
  • a resin encapsulation method for encapsulating with a resin material (R) a substrate and an external connection terminal and for integrally connecting a resin molded article with a resin encapsulated body, said resin encapsulated body comprising said substrate and said external connection terminal, said external connection terminal being electrically connected to said resin molded article, comprises the steps of providing a mold for resin molding comprising a top mold and a bottom mold; fitting said resin molded article into a cavity provided in a mold surface of said bottom mold and fitting said substrate and said external connection terminal into a molding cavity provided in the mold surface of said bottom mold, said resin molded article, on the one hand, and said substrate and said external connection terminal, on the other hand, being individually arranged in the cavity and the molding cavity respectively; guiding said article to a predetermined position in said cavity by means of a first guiding member provided at said bottom mold and guiding said substrate and said external connection terminal to a predetermined position in said molding cavity by means of a second guiding member provided at said bottom mold; using two
  • the step of clamping the mold for resin molding includes the step of bringing a pressing surface of a pressing member provided at the mold for resin molding into contact with a surface of the external connection terminal, by means of elastic force.
  • the invention provides a resin encapsulation apparatus for encapsulating with a resin material (R) a substrate and an external connection terminal and for integrally connecting a resin molded article with a resin encapsulated body, said resin encapsulated body comprising said substrate and said external connection terminal, said external connection terminal being electrically connected to said resin molded article, the apparatus being equipped with a mold for resin molding, a bottom mold with a cavity and a molding cavity and a top mold having a cavity and a molding cavity opposite to the cavity and the molding cavity of the bottom mold; said mold for resin molding comprising: the cavity between the bottom mold and the top mold to be fitted with said resin molded article; the molding cavity between the bottom mold and the top mold to be fitted with said substrate and said external connection terminal; a first guiding member to guide said article to a predetermined position in said cavity; a second guiding member to guide said substrate and said external connection terminal to a predetermined position in said molding cavity; and a pressing and supporting part including two fixing members provided at said bottom
  • the mold for resin molding includes a first pressing member having a pressing surface which comes into contact with a surface of the external connection terminal by means of elastic force.
  • the mold for resin molding includes a second pressing member having a pressing surface which comes into contact with a back surface of said external connection terminal by means of elastic force.
  • each component can be efficiently and reliably fitted into a predetermined cavity (the cavity, or the molding cavity) in the mold for resin molding because the article can be guided via the first guiding member to the cavity, and the substrate and the external connection terminal can be guided via the second guiding member to the molding cavity.
  • the external connection terminal is arranged at a predetermined position by causing the fixing member to support the external connection terminal, through guiding the external connection terminal to a predetermined position and through pressing the constricted portion formed on opposing lateral surfaces of the external connection terminal against the fixing member.
  • the constricted portion of the external connection terminal is supported by the fixing member, even if part of the encapsulating melted resin material flows out of the mold surface of the mold for resin molding to the outside of the cavity, the resin is prevented from adhering to the constricted portion. Therefore, it can be ensured that a resin flash is prevented from being formed on the constricted portion.
  • the pressing surface of the pressing member (the first pressing member, the second pressing member) provided at the mold for resin molding into contact with a surface of the external connection terminal, it can be further ensured that a resin flash is prevented from being formed on the front surface of the external connection terminal, as well as the back surface of the external connection terminal.
  • the resin encapsulation method for an electrical circuit component or the resin encapsulation apparatus for an electrical circuit component according to the present invention can ensure, without using a lead frame, that each component is fitted into a predetermined cavity even when each component of electrical circuit components that include a connector part (article) and a substrate and a metal external connection terminal electrically connected to the connector part is individually and directly fitted into a predetermined cavity (the cavity and the molding cavity respectively) in a mold for resin molding.
  • the resin encapsulation method for an electrical circuit component or the resin encapsulation apparatus for an electrical circuit component according to the present invention can efficiently and reliably prevent a resin flash from being formed through adhesion of part of a resin material to a constricted portion of or a surface of the external connection terminal which protrudes from the resin encapsulated body made into one piece with the connector part.
  • a resin encapsulation apparatus according to a first embodiment of the present invention will be hereinafter described with reference to Figs. 1-6 .
  • Fig. 1 shows the main parts of a resin encapsulation apparatus for an electrical circuit component according to the first embodiment of the present invention.
  • This resin encapsulation apparatus is equipped with a mold for resin molding 20 for encapsulating with a resin material and integrally molding electrical circuit components made up of a plurality of components that include an article (connector part) 10 and a glass epoxy substrate 40 and a metal external connection terminal 50 to be connected to a battery equipment which are electrically connected to the article.
  • a bottom mold 21 in mold for resin molding 20 has a mold surface in which a cavity 30 to be fitted with the lower half of resin molded article 10 and a molding cavity 60 to be fitted with the lower halves of glass epoxy substrate 40 and external connection terminal 50 are provided.
  • bottom mold 21 is provided with a guiding member 70 for guiding article 10 to a predetermined position in cavity 30 and a guiding member 80 for guiding glass epoxy substrate 40 and external connection terminal 50 to molding cavity 60.
  • Guiding member 70 has a tapered surface 71 formed thereon.
  • Guiding member 80 has a tapered surface 81 formed thereon.
  • guiding members 70 are arranged at two points in front of and at the rear of cavity 30, respectively, while guiding members 80 are arranged at two points on the right and left of external connection terminal 50 in a manner to adjoin opposing lateral surfaces of a tip end of external connection terminal 50, respectively.
  • bottom mold 21 is provided with a pressing and supporting part 90 to support external connection terminal 50.
  • Pressing and supporting part 90 presses a constricted portion 51, which is formed on each of the opposing lateral surfaces of external connection terminal 50, against a fixing member 91 provided at a predetermined position at bottom mold 21, thereby causing fixing member 91 to support external connection terminal 50.
  • fixing members 91 are arranged at two points on the right and left on bottom mold 21 corresponding to the positions of right and left constricted portions 51, respectively.
  • a top mold 22 is arranged opposite bottom mold 21, as shown in Fig. 1 (b) .
  • Bottom mold 21 and top mold 22 are arranged in a manner to enable opposing mold surfaces of bottom mold 21 and top mold 22 to be joined together (brought into contact) and separated from each other. It is noted that in a resin molding process, when a mold surface of a top mold and a mold surface of a bottom mold are joined together as shown in Fig. 1 (b) , it is called “mold clamping". On the other hand, when the mold surface of the top mold and the mold surface the bottom mold are separated from each other (see Fig. 2 ), it is called “mold opening".
  • a cavity 31 which is to be fitted with the upper half of article 10 is provided.
  • a molding cavity 61 which is to be fitted with the upper halves of substrate 40 and external connection terminal 50 is provided.
  • Pressing and supporting part 90 of external connection terminal 50 is provided so that when each component of the electrical circuit components is integrally resin encapsulated to mold a resin encapsulated body encapsulating an electrical circuit component, it is prevented that a resin lump (see resin lump 8a in Fig. 8 ) is formed through adhesion of part of an encapsulating melted resin material (flowable resin) to constricted portions 51 (see Fig. 6 ) formed on the opposing lateral surfaces of an external connection terminal 50a which will protrude from the resin encapsulated body.
  • pressing and supporting part 90 includes fixing member 91 provided on bottom mold 21 and a pushing-out member 92 for pushing external connection terminal 50 out toward fixing member 91.
  • fixing member 91 is provided at a position to be fitted to constricted portion 51 formed on each of the opposing lateral surfaces of external connection terminal 50.
  • fixing members 91 are provided at predetermined positions at two points on the right and left on bottom mold 21 in a manner to correspond to the respective positions of constricted portions 51 at two points on the right and left of external connection terminal 50.
  • Pushing-out member 92 is arranged at a portion of top mold 22 in the vicinity of the tip of external connection terminal 50 arranged on the mold surface of bottom mold 21.
  • pushing-out members 92 are arranged at positions at two points on the right and left on the top mold. Further, pushing-out member 92 is arranged to be able to move vertically in top mold 22. In a state just before bottom mold 21 and top mold 22 are clamped together, pushing pushing-out member 92 down results in that a bottom surface portion of pushing-out member 92 adjoins the tip end of external connection terminal 50, and a tapered surface 92a formed on the bottom surface portion pushes the tip end of external connection terminal 50 out toward fixing member 91.
  • cavity to be fitted with 30, 31 of mold for resin molding 20 is provided with a protrusion pin 23.
  • Molding cavity 60, 61 is provided with a protrusion pin 24.
  • the component fitted into cavity 30, 31 is held at a predetermined height (position) by causing a tip end portion of protrusion pin 23 to protrude into cavity 30, 31, while the component fitted into molding cavity 60, 61 is held at a predetermined height (position) by causing a tip end portion of protrusion pin 24 to protrude into molding cavity 60, 61.
  • protrusion pins 23, 24 can serve as a supporting pin for each component.
  • pushing-out member 92 of pressing and supporting parts 90 is shown as being arranged in a symmetrical pair (a multiple arrangement) on the top mold 22 at positions in front of right and left guiding members 80 provided at bottom mold 21.
  • the pushing-out member one (single) pushing-out member may be provided, which is configured such that pushing the pushing-out member down results in that a bottom surface portion of the pushing-out member adjoins the tip end of the external connection terminal, and a tapered surface formed on the bottom surface portion pushes the tip end of external connection terminal out toward the fixing member.
  • article (connector part) 10 is fitted into cavity 30 provided in the mold surface of bottom mold 21 of mold for resin molding 20, and glass epoxy substrate 40 and external connection terminal 50 are fitted into molding cavity 60 (the step of fitting a plurality of components).
  • a plurality of components may be introduced between opened top mold 22 and bottom mold 21 automatically with any suitable carrying device or manually.
  • the guiding member provided at the mold for resin molding guides the article to a predetermined position in the cavity and guides the substrate and the external connection terminal to the molding cavity (the step of assisting the fitting of a plurality of components). It is noted that this step may be performed simultaneously with the step of fitting a plurality of components.
  • Tapered surface 71 of guiding member 70 provided at bottom mold 21 fits article 10 into cavity 30 and guides the lower half of article 10 to a predetermined position in cavity 30.
  • Tapered surface 81 of guiding member 80 provided at bottom mold 21 fits external connection terminal 50 into molding cavity 60 and guides the lower half of external connection terminal 50 to a predetermined position in molding cavity 60.
  • glass epoxy substrate 40 is one in which it is integrally connected to external connection terminal 50, then the above-described step of assisting the fitting of external connection terminal 50 causes glass epoxy substrate 40 to have its lower half fitted into molding cavity 60.
  • glass epoxy substrate 40 and external connection terminal 50 are electrically connected but not made into one piece, then fitting article 10 into cavity 30 and fitting external connection terminal 50 into molding cavity 60 cause glass epoxy substrate 40 and external connection terminal 50 to sequentially have their respective lower halves fitted into molding cavity 60.
  • External connection terminal 50 is then guided to a predetermined position, and two constricted portions 51, 51 of external connection terminal 50 are pressed against two fixing members 91, 91 so that external connection terminal 50 is supported by fixing members 91, 91 (the step of pressing and supporting an external connection terminal).
  • two constricted portions 51, 51 of external connection terminal 50 are in a state of being fitted with two fixing members 91, 91 provided at mold for resin molding (bottom mold 21).
  • top mold 22 is lowered to a position H at which the mold surface of top mold 22 and the mold surface of bottom mold 21 are just before being joined together, i.e. mold clamping.
  • external connection terminal 50 is not under any mold clamping pressure applied by the top mold and the bottom mold.
  • pushing pushing-out member 92 down in this state results in that the bottom surface portion of the pushing-out member adjoins the tip end of external connection terminal 50, and tapered surface 92a formed on the bottom surface portion pushes external connection terminal 50 out toward fixing member 91, as shown in Fig. 5 (a) .
  • top mold 22 and the mold surface of bottom mold 21 are then joined together (the step of clamping molds).
  • Glass epoxy substrate 40 and external connection terminal 50 are then encapsulated with a resin material, and the resin material encapsulating glass epoxy substrate 40 and the like are molded (the step of resin encapsulating a substrate and an external connection terminal).
  • a thermosetting melted resin material (flowable resin) R is injected into molding cavity 60, 61 (see Fig. 1 (a) ) and fills molding cavity 60, 61.
  • the resin material encapsulates glass epoxy substrate 40 and external connection terminal 50 which are fitted into the molding cavity, and the encapsulating resin material is molded.
  • a resin encapsulated body (solidified resin) encapsulating glass epoxy substrate 40 and external connection terminal 50 is formed, and the resin encapsulated body and resin molded article (connector part) 10 are connected integrally together, so that a resin encapsulated article is formed.
  • top mold 22 and the mold surface of bottom mold 21 are then separated from each other (the step of opening molds).
  • the resin encapsulated article encapsulating an electrical circuit component is then removed from between top mold 22 and bottom mold 21 (the step of removing a product).
  • article (connector part) 10 and a resin encapsulated body 77 encapsulating the glass epoxy substrate and the external connection terminal are integrally connected together, so that they are made into one piece.
  • No resin lump or resin flash is formed on two constricted portions 51, 51 of and upper and lower surfaces of terminal 50a which protrudes from resin encapsulating molded body 77.
  • each component of electrical circuit components including connector part (article) 10 and glass epoxy substrate 40 and metal external connection terminal 50 which are electrically connected to the connector part are directly fitted into a predetermined cavity (cavity, molding cavity) of mold for resin molding 20, it is ensured, without use of a lead frame, that each component is fitted into a predetermined cavity and arranged at a predetermined position.
  • This allows to ensure that mold for resin molding 20 is clamped.
  • part of a melted resin material flows out of the mold surface of the mold for resin molding to the outside of the cavity.
  • a resin flash is efficiently and reliably prevented from being formed on constricted portion 51 of and a surface of terminal 50a which protrudes from the resin encapsulated body of the resin encapsulated article.
  • the resin encapsulation apparatus according to the second embodiment has a structure which can further ensure that a resin flash is prevented from being formed on a surface of terminal 50a protruding from resin encapsulated body 77. It is noted that to avoid redundancy in the description, same members as those of the above-described resin encapsulation apparatus have the same reference characters allotted in Fig. 7 .
  • the tip end of external connection terminal 50 which is not fitted into molding cavity 61, 60 of top mold 22 and bottom mold 21, will be sandwiched between the mold surface of the top mold and the mold surface of the bottom mold, under a mold clamping pressure.
  • the tip end of external connection terminal serves as terminal 50a for external connection which protrudes from resin encapsulated body 77 (see Fig. 6 ).
  • connection terminal 50 when the tip end of connection terminal 50 is under an appropriate mold clamping pressure applied by the top mold and the bottom mold, it can be prevented that a resin flash is formed through adhesion of part of a melted resin material (flowable resin) to a surface of terminal 50a.
  • external connection terminal 50 varies in thickness. For this reason, for example, when the external connection terminal has a thickness less than a predetermined thickness, in clamping the top mold and the bottom mold together, a gap may develop between the tip end of the external connection terminal and the mold surface of the top mold or the mold surface of the bottom mold. If so, this gap may cause a resin flash to be formed through adhesion of part of the molten resin material to a surface of terminal 50a.
  • a resin flash adhesion preventing part having a pressing member is provided so that in clamping top mold 22 and bottom mold 21 together, no gap develops between a surface of terminal 50a protruding from resin encapsulated body 77 and the mold surface of top mold 22 or the mold surface of bottom mold 21.
  • the resin flash adhesion preventing part 93 includes the pressing member 93a fitted into top mold 22 in a vertically movable manner and an elastic member 93b. Pressing member 93a is pushed out downward because of the elasticity of elastic member 93b. In clamping top mold 22 and bottom mold 21 together, a pressing surface 93c provided on the bottom end surface of pressing member 93a comes into contact with a surface (upper surface) of terminal 50a arranged on bottom mold 21, by means of elastic force.
  • Fig. 7 shows the resin encapsulation apparatus in which resin flash adhesion preventing part 93 is provided only at top mold 22, a resin flash adhesion preventing part having the same functions may also be provided at bottom mold 21.
  • pressing surfaces of the pressing members come into contact with the front surface (upper surface) and the back surface (lower surface) of terminal 50a, respectively, by means of elastic force.
  • pressing surface 93c of pressing member 93a comes into contact with a surface of terminal 50a by means of elastic force just before top mold 22 and bottom mold 21 are clamped together (the step of preventing adhesion of a resin flash).
  • thermosetting resin material is used as a resin material in each embodiment above
  • thermoplastic resin material may be employed.
  • resin materials in various shapes such as a granular resin material (granular resin), a liquid resin material (liquid resin), a powdered resin material having a prescribed particle size distribution (powdered resin), a powdery resin material (powdery resin), a pasty resin material (pasty resin), a tablet resin material (tablet resin), or the like can be employed.
  • epoxy resin epoxy resin
  • silicon-based resin material silicon resin
  • a technique for injecting flowable resin R into molding cavity 60, 61 and filling the molding cavity a known method of injecting and filling can be used.
  • a transfer molding, an injection molding, or the like can be used.
  • a resin tablet (epoxy-based resin material) supplied into a pot is heated to melt.
  • the melted resin material flowable resin
  • the melted resin material is injected via a resin path (a cull part, a runner, a gate) into molding cavity 60, 61 and fills the molding cavity.
  • a mold for resin molding (a top mold, a bottom mold) can be opened, thereby providing a resin encapsulated article encapsulating an electrical circuit component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
EP11186409.6A 2010-11-02 2011-10-24 Resin encapsulation molding method and apparatus for electrical circuit component Active EP2447986B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010245906A JP5385886B2 (ja) 2010-11-02 2010-11-02 電気回路部品の樹脂封止成形方法及び装置

Publications (2)

Publication Number Publication Date
EP2447986A1 EP2447986A1 (en) 2012-05-02
EP2447986B1 true EP2447986B1 (en) 2014-06-04

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EP11186409.6A Active EP2447986B1 (en) 2010-11-02 2011-10-24 Resin encapsulation molding method and apparatus for electrical circuit component

Country Status (4)

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EP (1) EP2447986B1 (ko)
JP (1) JP5385886B2 (ko)
KR (1) KR101311027B1 (ko)
CN (1) CN102463653B (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5748023B2 (ja) * 2012-03-16 2015-07-15 株式会社村田製作所 封止用樹脂シートの製造装置および封止用樹脂シートの製造方法
CN102738020A (zh) * 2012-06-26 2012-10-17 铜陵三佳山田科技有限公司 一种防止型芯孔处水平溢料的集成电路塑料封装模具
JP6804410B2 (ja) * 2017-08-09 2020-12-23 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置、成形対象物の成形型への受け渡し方法、及び樹脂成形品の製造方法
DE102019121229A1 (de) 2019-08-06 2021-02-11 Infineon Technologies Ag Elektronische Vorrichtungen mit elektrisch isolierten Lastelektroden
US11145966B2 (en) * 2019-08-28 2021-10-12 Pctel, Inc. Over-molded thin film antenna device
CN114889039A (zh) * 2022-04-19 2022-08-12 微智医疗器械有限公司 视网膜植入体柔性电极及其包胶模具、包胶方法
CN117207442A (zh) * 2023-11-09 2023-12-12 成都宝利根创科电子有限公司 一种端子模内成型方法

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Publication number Priority date Publication date Assignee Title
EP0257681A3 (en) * 1986-08-27 1990-02-07 STMicroelectronics S.r.l. Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby
JPH0831489B2 (ja) * 1987-07-20 1996-03-27 サンケン電気株式会社 樹脂封止型電気部品の製造方法
JPH05304226A (ja) * 1991-08-16 1993-11-16 Mitsubishi Electric Corp 半導体装置の製造方法および製造装置
JP3397741B2 (ja) * 2000-03-07 2003-04-21 Ｔｏｗａ株式会社 基板の位置決め機構及び位置決め方法
JP2003037241A (ja) 2001-07-24 2003-02-07 Hitachi Ltd 電気回路基板パッケージ品および電気回路基板パッケージ品の製造方法
JP2003282613A (ja) * 2002-03-20 2003-10-03 Mitsubishi Electric Corp 半導体装置の製造方法および樹脂封止装置
JP2004134591A (ja) * 2002-10-10 2004-04-30 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4153862B2 (ja) * 2003-10-24 2008-09-24 第一精工株式会社 半導体樹脂封止用金型
JP2007095804A (ja) * 2005-09-27 2007-04-12 Towa Corp 電子部品の樹脂封止成形方法及び装置
JP4084844B2 (ja) * 2005-09-27 2008-04-30 Ｔｏｗａ株式会社 電子部品の樹脂封止成形方法及び装置
JP2007281364A (ja) * 2006-04-11 2007-10-25 Towa Corp 電子部品の樹脂封止成形方法及び装置
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JP5056717B2 (ja) * 2008-10-16 2012-10-24 株式会社デンソー モールドパッケージの製造方法

Also Published As

Publication number Publication date
KR20120046684A (ko) 2012-05-10
EP2447986A1 (en) 2012-05-02
KR101311027B1 (ko) 2013-09-24
CN102463653B (zh) 2014-09-17
CN102463653A (zh) 2012-05-23
JP5385886B2 (ja) 2014-01-08
JP2012099628A (ja) 2012-05-24

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