EP2443650A1 - Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten - Google Patents

Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten

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Publication number
EP2443650A1
EP2443650A1 EP10725447A EP10725447A EP2443650A1 EP 2443650 A1 EP2443650 A1 EP 2443650A1 EP 10725447 A EP10725447 A EP 10725447A EP 10725447 A EP10725447 A EP 10725447A EP 2443650 A1 EP2443650 A1 EP 2443650A1
Authority
EP
European Patent Office
Prior art keywords
metal oxide
semiconductive metal
semiconductive
precursor compound
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10725447A
Other languages
German (de)
English (en)
French (fr)
Inventor
Friederike Fleischhaker
Imme Domke
Andrey Karpov
Marcel Kastler
Veronika Wloka
Lothar Weber
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BASF SE
Original Assignee
BASF SE
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Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Priority to EP10725447A priority Critical patent/EP2443650A1/de
Publication of EP2443650A1 publication Critical patent/EP2443650A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02551—Group 12/16 materials
    • H01L21/02554—Oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/0257—Doping during depositing
    • H01L21/02573—Conductivity type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02601—Nanoparticles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02623—Liquid deposition
    • H01L21/02628—Liquid deposition using solutions

Definitions

  • the present invention relates to a method for producing a layer comprising at least one semiconducting metal oxide on a substrate, comprising at least the steps of (A) applying a porous layer of at least one semi-conductive metal oxide to a substrate, (B) treating the porous layer of step (A) with a solution containing at least one precursor compound of the semiconductive metal oxide so that the pores of the porous layer are at least partially filled with this solution, and (C) thermally treating the layer obtained in step (B) at a temperature of 10 to 200 0 C to convert the at least one precursor compound of the semiconducting metal oxide into the semiconductive metal oxide, wherein the at least one precursor compound of the at least one semiconductive metal oxide in step (B) is selected from the group consisting of carboxylates of mono-, di- or Polycarboxylic acids having at least three carbon atoms and / or derivatives of mono-, di- or polycarboxylic acids, alcoholates, hydroxides, semicarbazides, carbamates, hydroxamates,
  • the methods known from the prior art for applying semiconducting layers based on particulate systems to corresponding substrates generally have the disadvantage that initially porous layers are obtained in which intermediate spaces and few or poor connections exist between the individual nanoparticles are so that the mechanical and / or electrical properties of these semiconductive layers are not sufficient or still worthy of improvement.
  • the known from the prior art method for subsequent application of a solution of a zinc oxide precursor compound on this porous layer to close the pores at least partially or bring the particles into better contact with each other have the disadvantage that the precursor compounds used, for example Zinc acetate, can be transferred without residue in zinc oxide only at a relatively high temperature. A process which can be carried out at relatively low temperatures is necessary in order to be able to use heat-sensitive substrates, for example plastics.
  • Object of the present invention is to provide a method by which layers of semiconducting material can be treated on substrates with a precursor solution which can be decomposed at low temperatures, for example below 200 0 C, in corresponding metal oxides, so the interstices of the layers at least partially filled with metal oxide and to increase the contact areas between the individual particles. Furthermore, it is an object of the present invention to produce in this way corresponding semiconductive layers, which are characterized by a particularly high mechanical stability and particularly good electronic properties. It is intended to provide a method in which such a solution is applied to a previously prepared porous metal oxide layer, penetrates into the pores, and decomposes there by heating to the corresponding metal oxide. Furthermore, the method should be as simple as possible to carry out.
  • step (C) thermally treating the layer obtained in step (B) to convert the at least one precursor compound of the semiconductive metal oxide into the semiconductive metal oxide
  • the method according to the invention serves to produce a layer containing at least one semiconductive metal oxide on a substrate.
  • pores are understood to mean the depressions, cavities and interstices between the particles of at least one semiconductive metal oxide applied in step (A) of the process according to the invention.
  • the at least one semiconductive metal oxide in a preferred embodiment is selected from the group consisting of zinc oxide, tin oxide, alumina, gallium oxide, indium oxide, and mixtures thereof.
  • zinc oxide is used as the semiconductive metal oxide in the process according to the invention. Therefore, the present invention also relates to the process according to the invention, wherein the at least one semiconductive metal oxide is zinc oxide ZnO.
  • the layer produced on the substrate by the method according to the invention containing at least one semiconductive metal oxide generally has a thickness of 10 to 2000 nm, preferably 30 to 500 nm.
  • Step (A) of the method according to the invention comprises applying a porous layer of at least one semiconductive metal oxide to a substrate. Suitable semiconductive metal oxides and substrates are mentioned above.
  • step (A) all methods known to those skilled in the art for applying a porous layer of at least one semiconducting metal oxide to a substrate, for example application of solutions or dispersions to corresponding substrates, for example by spin coating, spray coating, Dip-coating, drop-casting or printing, such as. As ink-jet printing, flexo printing or gravure printing.
  • the at least one semiconductive metal oxide it is possible according to the invention for the at least one semiconductive metal oxide to be applied as such to the substrate.
  • solutions of corresponding precursor compounds of the at least one semiconductive metal oxide are applied to the substrate, and then converted into the semiconductive metal oxide.
  • the conversion of the precursor compounds into semiconducting metal oxides can be carried out by methods known to the person skilled in the art, for example by thermal treatment.
  • corresponding particulate semiconducting materials in particular semiconducting metal oxides, particularly preferably zinc oxide, can be applied in particle form to corresponding substrates, for example by application of a dispersion of these particles, for example by spin coating, spray coating, dip coating, drop casting or printing , such as Ink-jet printing, flexo printing or engraving printing.
  • the at least one semiconducting material is preferably applied in particulate form in step (A) of the process according to the invention.
  • the individual particles generally have a diameter of 3 nm to 1 .mu.m, preferably 5 nm to 100 nm.
  • the particles can be present on the substrate in any shape known to those skilled in the art, in particular as spherical particles and / or rod-shaped particles, and / or platelet-shaped particles.
  • the present invention therefore also relates to the process according to the invention, wherein the porous layer of at least one semiconductive metal oxide in step (A) comprises spherical particles and / or rod-shaped particles and / or platelet-shaped particles.
  • the at least one semiconducting metal oxide applied to a substrate in step (A) of the process according to the invention may optionally be doped with corresponding dopants, for example selected from the group consisting of Al 3+ , In 3+ , Ga 3+ , Sn 4+ and mixtures thereof ,
  • the present invention therefore also relates to the process according to the invention, wherein the at least one semiconductive metal oxide is doped with metal cations selected from the group consisting of Al 3+ , In 3+ , Ga 3+ , Sn 4+ and mixtures thereof.
  • These metal cations added for doping are incorporated into the crystal lattice of the at least one semiconductive metal oxide and impart n- or p-semiconducting character to the semiconductive metal oxide.
  • step (A) Methods for doping the layer applied in step (A) are known per se to the person skilled in the art.
  • the layer according to step (A) in which the layer according to step (A) is applied by applying a solution or dispersion of precursor compounds to the substrate and subsequent thermal treatment, corresponding precursor compounds of the doping agent can be added to this solution or dispersion.
  • step (A) of the process according to the invention is carried out by applying particles, the dopants can be introduced into the particles during production, for example by adding appropriate salts to the solutions or dispersions used in the preparation of the particles.
  • the precursor compounds of said dopants may be added in the form of metal oxides, metal hydroxides, metal alcoholates, metal nitrates or in the form of soluble complexes of the corresponding cations.
  • the dopants may be added to the particles in step (A) of the process according to the invention generally in an amount of 0.1-10 mol% based on Zn, preferably 0.1-5 mol% based on Zn.
  • Step (B) comprises treating the porous layer of step (A) with a solution containing at least one precursor compound of the semiconductive metal oxide such that the pores of the porous layer are at least partially filled with this solution.
  • a solution containing at least one precursor compound of the semiconductive metal oxide such that the pores of the porous layer are at least partially filled with this solution.
  • the at least one precursor compound of the at least one semiconducting metal oxide in step (B) is selected from the group consisting of carboxylates of mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of
  • Hydroxylamines oximes, oximes, urethanes, ammonia, amines, phosphines,
  • step (B) of the method according to the invention preference is given to using a solution of the corresponding precursor compound.
  • the solvent used is therefore preferably a solvent in which the precursor compounds used are soluble to at least 0.01% by weight, based on the total solution.
  • Particularly suitable solvents are, for example, selected from the group consisting of water, alcohol, for example methanol, ethanol, isopropanol, n-propanol, n-butanol, isobutanol, tert-butanol, ketones, for example acetone, ethers, for example diethyl ether, Methyl tert-butyl ether, tetrahydrofuran, dioxane, dimethoxyethane, esters and mixtures thereof.
  • preference is given to using aqueous, alcoholic or ethereal solutions; it is particularly preferable to use water as solvent in step (B).
  • Suitable carboxylates of the corresponding metal are, for example, compounds of the corresponding metal with mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of mono-, di- or polycarboxylic acids.
  • Derivatives of mono-, di- or polycarboxylic acids are understood according to the invention to mean the corresponding mono-, di- or polyesters or anhydrides or amides.
  • the metal atom present as the central atom in the carboxylate complexes can generally have the coordination numbers 3 to 6.
  • corresponding compounds of zinc are used in step (B) as preferred carboxylates.
  • zinc carboxylate complexes having the coordination numbers 3 to 6 are used according to the invention, at least one ligand on the zinc being selected from the group consisting of mono-, di- or polycarboxylic acids having at least three carbon atoms or derivatives of mono-, di- or Polycarboxylic acids comes.
  • the precursor compounds used are zinc carboxylates or derivatives thereof which are obtained at a temperature of
  • Decomposition of these precursor compounds is, for example, 50 ° C., with catalytic activation for example 20 ° C.
  • R 1 is hydrogen, linear or branched C 1 -C 12 -alkyl, linear or branched C 1 -C 12 -heteroalkyl, substituted or unsubstituted C 5 -C 6 -aryl, linear or branched, substituted or unsubstituted C 5 -C 6 -aralkyl, linear or branched, substituted or unsubstituted C 5 -C 6 -alkaryl, NR 6 R 7 with R 6 , R 7 independently of one another are si- (C 1 -C 6 -alkyl) 3 or the radical of the formula -O-C (O) -R 2 with the meanings given below for R 2 , in each case optionally substituted by functional groups having an electron donor character, for example hydroxyl, amino, alkylamino, amido, ether and / or oxo,
  • R 2 is linear or branched CrCl 2 -alkyl, preferably C 2 -C 2 alkyl, linear or branched d-Ci2 heteroalkyl, preferably C2-Ci2 heteroalkyl, substituted or unsubstituted C 5 -C 6 aryl, linear or branched, substituted or unsubstituted C 5 -C 6 -alkyl, linear or branched, substituted or unsubstituted C 5 -C 6 -alkaryl, each optionally substituted by functional groups having an electron-donating character, for example hydroxyl,
  • R 5 is selected from H, OH, OCH 3 , OC 2 H 5 , OSi (X 1 ) (3 - a -b) (X 2 ) a (X 3 ) b, CO 2 X 5 , OCO 2 X 5 from CO 2 X 5 ,
  • X 5 is selected from C 1 to C 4 alkyl, preferably from methyl, ethyl or tert-butyl
  • Butyl most preferably ethyl or tert-butyl
  • a, b are independently 0, 1, 2 or 3 and the sum of a and b is 3 or less
  • X 1 , X 2 , X 3 , X 4 are independently selected from H, Ci to C 10 alkyl, preferably H and Ci to C 4 alkyl, particularly preferably H, methyl and ethyl d is an integer value of 1 to 100,
  • X 6 is selected from H, C 1 to C 10 alkyl, preferably from H and C 1 to C 4 alkyl, particularly preferably selected from methyl or ethyl,
  • a preferred example of a zinc carboxylate which is used as precursor compound in step (B) of the process according to the invention is the compound of the formula (II) Zn [(EtOC (O) CH 2 C (O) CH 2 COO) 2 ] ,
  • the compound of the formula (III) can likewise be prepared by processes known to the person skilled in the art, for example by reacting an equimolar amount of 3-oxoglutaric acid monoethyl ester and zinc bis [bis (trimethylsilyl) amide] in benzene or toluene at room temperature.
  • step (B) of the process according to the invention is the compound of the formula (IV)
  • a zinc carboxylate is the compound of formula (IVa) Zn [(NH 2 CH 2 COO) 2 (H 2 O)], having electron donating functionality
  • metal alcoholates as precursor compounds in which the metal atom has the coordination number 3 to 6.
  • zinc oxide used as the semiconducting metal oxide
  • zinc alkoxide complexes having coordination numbers 3 to 6 are used in which at least one ligand is an alcoholate.
  • These coordination numbers present according to the invention are realized in the precursor compounds used according to the invention by additions of identical or different molecules to one another.
  • this preferred precursor compound can be prepared by all processes known to the person skilled in the art, for example reaction of zinc nitrate with sodium hydroxide solution and subsequent treatment with ammonia, for example described in S. Meiers et al, J. Am. Chem. Soc., 130 (57J, 2008, 17603-17609.
  • the at least one precursor compound used is the abovementioned inorganic complex [(OH) x (NH 3 ) y Zn] z , which is obtained by direct reaction of zinc oxide or zinc hydroxide with Ammonia, for example, described in European Patent Application 09 158 896.2, is obtained.
  • the present invention particularly also relates to the process according to the invention, wherein in step (B) as at least one precursor compound of the at least one metal oxide [(OH) x (NH 3 ) y Zn] z with x, y and z is independently 0.01 to 10, so that said complex is electrically neutral charged, and this is particularly preferably obtained by reacting zinc oxide or zinc hydroxide with ammonia is used.
  • the amount of precursor compound applied to the porous layer produced in step (A) in step (B) of the method of the invention is determined by one skilled in the art such that depending on the thickness of the layer obtained in step (A) Porosity, the size of the pores, etc., as much of the corresponding precursor compound is present in the pores, that form at least connecting points of semiconducting metal oxide between the individual particles. While the particles applied in step (A) generally only touch tangentially, in step (B) of the method according to the invention, larger connections are formed between the individual particles.
  • the present invention also relates to the process according to the invention, wherein the treatment of the porous layer from step (A) in step (B) is effected by spin coating, spray coating, dip coating, drop casting or printing.
  • Step (B) according to the invention can be carried out continuously or batchwise.
  • dopants are used in steps (A) and (B), these being the same or different. It is also possible according to the invention that dopants are used only in step (A) or only in (B). If dopants are used only in step (A), they are preferably present in the layer of at least one semiconductive metal oxide produced in step (A). If dopants are used only in step (B), they are preferably present in the pores or interstices at least partially filled in step (B). After step (B) of the process according to the invention, a substrate is generally obtained which is coated with a porous layer of at least one semiconductive metal oxide, the pores of this layer being at least partially filled with a solution containing at least one precursor compound of the semiconducting metal oxide.
  • Step (C) of the process of the present invention comprises thermally treating the layer obtained in step (B) to convert the at least one precursor compound of the semiconductive metal oxide to the semiconductive metal oxide.
  • step (C) of the process according to the invention is carried out in a preferred embodiment of the process according to the invention at a temperature of 10 to 200 0 C, preferably 20 to 150 0 C, more preferably 30 to 130 0 C, most preferably 40 to 100 0 C.
  • step (C) of the process according to the invention a substrate coated with at least one semiconductive metal oxide is obtained at low, plastic-compatible temperatures, the pores of which are at least partially filled with semiconductive metal oxide. Furthermore, the particles which are preferably applied in step (A) are joined together in step (C) so that a larger contact area is created between the individual particles. This process can be described as “welding” or “filming”. Instead of the tangential contact points present after step (A) between the particles, there are larger connection points between the particles after step (C).
  • Dielectrics can be any of a variety of organic, inorganic or organic-inorganic hybrid materials.
  • Gate, source and drain contact materials are conductive materials (e.g., Al, Au, Ag, Ti / Au, Cr / Au, ITO, Si, PEDOT / PSS, etc.).
  • Suitable substrates are in particular also polymeric and flexible materials with low decomposition temperature, as well as other temperature-labile substrates, without being limited thereto.
  • Substrate, gate, source and drain contact materials as well as dielectrics are not subject to primary restrictions and can be selected according to the chemical / physical compatibility, the processing process and the desired application.
  • the present invention therefore also relates to the use of a substrate according to the invention in electronic components, for example TFTs, and their application in CMOS circuits and other electronic circuits, RFID tags, Displays, etc. Due to the processability from solution at plastic-compatible temperatures, component manufacturing on flexible, bendable substrates is possible.
  • This solution is ber Mountaint Ü in a 250-ml four-necked flask and 16 h at 60 0 C and stirred for 250 rpm. The mixture is then removed and transferred to an 11-glass bottle. ZnO settles on the bottom overnight, so that the supernatant methanol can be sucked off. The product is washed four times with 500 ml of methanol. During each wash, the ZnO is thoroughly mixed with fresh methanol for 40 minutes on the magnetic stirrer. After the last washing, the methanol is sucked off as much as possible and the ZnO is redispersed with 200 ml of dichloromethane. The solution is then adjusted by dilution to a content of 4% by weight of zinc oxide. Take part of the solution containing 2.344 g of zinc oxide. While stirring at room temperature on a magnetic stirrer 0.52 g of 3-Oxoglutarklamonoethlyester be added slowly.
  • Example 3 Use of the solution of Example 2 as a precursor compound for filling in the interstices and for better bonding of ZnO nanorods in a TFT with a semiconducting ZnO nanorod layer
  • a Si dot i ert substrate having SiO 2 -Dielektrikumstik (layer thickness: 200 nm) and a produced by spin-coating ZnO nanorods layer of Example 1 (film thickness: 70 nm, nanorod diameter: -10 nm, nanorods Length: -50 nm) is flooded with the solution from Example 2 and this at 3000 revolutions / min 30 s spun on. Subsequently, the sample is heated at 150 ° C. for 20 minutes. Source / drain contacts (channel width / length ratio: 20) are generated by thermal evaporation of aluminum.
  • FIGS. 1 and 2 Representative output curves (AK) and transfer curves (TK) of the manufactured TFTs are shown in FIGS. 1 and 2.
  • VD voltage between source and drain
  • VG voltage between source and drain
  • ID current between source and drain
  • VT threshold voltage 30 V.
  • VT threshold voltage 30 V.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
EP10725447A 2009-06-16 2010-06-15 Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten Withdrawn EP2443650A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10725447A EP2443650A1 (de) 2009-06-16 2010-06-15 Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09162783 2009-06-16
EP10725447A EP2443650A1 (de) 2009-06-16 2010-06-15 Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten
PCT/EP2010/058391 WO2010146053A1 (de) 2009-06-16 2010-06-15 Thermolabile vorläufer-verbindungen zur verbesserung der interpartikulären kontaktstellen und zum auffüllen der zwischenräume in halbleitenden metalloxidpartikelschichten

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EP2443650A1 true EP2443650A1 (de) 2012-04-25

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US (1) US9129801B2 (enExample)
EP (1) EP2443650A1 (enExample)
JP (1) JP5634511B2 (enExample)
KR (1) KR20120039638A (enExample)
CN (1) CN102460641A (enExample)
WO (1) WO2010146053A1 (enExample)

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US9129801B2 (en) 2015-09-08
JP5634511B2 (ja) 2014-12-03
KR20120039638A (ko) 2012-04-25
WO2010146053A1 (de) 2010-12-23
JP2012530033A (ja) 2012-11-29
CN102460641A (zh) 2012-05-16

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