Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
  • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
  • C03C27/06—Joining glass to glass by processes other than fusing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
  • H05B33/00—Electroluminescent light sources
  • H05B33/02—Details
  • H05B33/04—Sealing arrangements, e.g. against humidity
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/842—Containers
  • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/844—Encapsulations
  • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K50/00—Organic light-emitting devices
  • H10K50/80—Constructional details
  • H10K50/84—Passivation; Containers; Encapsulations
  • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants

Definitions

• the invention relates to a method for producing an organic optoelectronic component and to an organic optoelectronic component.
• OLED organic light-emitting diodes
• the oxygen- and / or moisture-sensitive components of an OLED can be arranged between two glass plates, which are connected by means of an adhesive circulating around the components, whereby an encapsulation is formed.
• the adhesive usually contains fillers in the form of beads or fibers which, for example, provide spacers ("spacers") for a defined distance between the two glass plates.
• the adhesive is typically not completely oxygen and water vapor tight, these gases may diffuse through the adhesive into the OLED over time.
• An object of at least one embodiment is to specify a method for producing an organic optoelectronic component.
• a task of At least one further embodiment is to specify an organic optoelectronic component.
• an organic optoelectronic component comprises in particular
• a first substrate having an active region and a first connection region surrounding the active region, an organic functional layer sequence being formed in the active region,
• a second substrate having a cover region above the active region and a second connection region surrounding the cover region above the first connection region
• the first connection layer is directly adjacent to the second connection region and from a first
• the second connection layer connects the first connection layer with the first connection region.
• a layer or an element is arranged or applied "on” or “above” another layer or another element can mean here and below that the one layer or the one element directly in direct mechanical and / or electrical contact is arranged on the other layer or the other element. Furthermore, it can also mean that the one layer or the one element indirectly on or above the another layer or the other element is arranged. In this case, further layers and / or elements can then be arranged between the one and the other layer or between the one and the other element.
• the second connection layer is applied on the first connection layer and on the first substrate in method step E, this may mean, in particular, that a part of the second connection layer is applied to the first connection layer and a further part of the second connection layer is applied to the first substrate be joined in process step F to the actual second connection layer.
• the second connection layer can in particular be applied directly and directly on the first connection layer and / or directly and directly on the first substrate in method step E.
• optical radiation may refer in particular to the property of converting electromagnetic radiation or light into an electrical voltage and / or an electric current and / or converting an electrical voltage and / or an electrical current into electromagnetic radiation or light
• the component can thus be embodied as an organic radiation-receiving or radiation-detecting component, such as an organic photodiode or solar cell
• an organic radiation-emitting component such as an organic light-emitting diode (OLED)
• Electromagnetic radiation equally mean in particular electromagnetic radiation having at least one wavelength or a wavelength range from an infrared to ultraviolet wavelength range
• the electromagnetic radiation comprises a visible, ie a near-infrared to blue wavelength range with one or more wavelengths between approximately 350 nm and approximately 1000 nm.
• the first connection layer of the first glass solder material is arranged, in comparison to a known OLED with a pure adhesive layer against a denser oxygen and moisture and water vapor encapsulation can be created.
• the second substrate or else the first and second substrate may comprise a glass, for example with a silicate glass, such as borosilicate glass or aluminosilicate glass, and / or quartz glass or another glass material suitable for organic components.
• the optoelectronic component can be designed as an organic light-emitting diode (OLED).
• OLED organic light-emitting diode
• the OLED may have a first electrode on the first substrate in the active region. Over the first electrode may be an active layer having one or more functional layers of organic materials.
• the functional layers can be used, for example, as electron-transport layers, hole-blocking layers, electroluminescent layers,
• Electron barrier layers and / or hole transport layers may be formed.
• a second electrode may be applied over the functional layers.
• electron and hole injection and recombination can generate electromagnetic radiation having a single wavelength or a range of wavelengths. In this case, a monochrome, a multicolored and / or a mixed-color luminous impression can be awakened in a viewer.
• first electrode and / or the second electrode may particularly preferably have a planar or alternatively structured pattern in first or second electrode subregions.
• first electrode may be designed in the form of first electrode strips arranged parallel to one another, and the second electrode as second electrode strips arranged perpendicularly parallel to one another and arranged parallel to one another. Overlaps of First and second electrode strips can thus be designed as separately controllable lighting areas.
• only the first or the second electrode can be structured.
• the first and / or the second electrode or electrode subregions are electrically conductively connected to first conductor tracks.
• an electrode or an electrode subarea can, for example, pass into a first conductor track or be carried out separately from a first conductor track and be electrically conductively connected thereto.
• Conductor tracks may be led out of the active region and the first connection region between the first substrate and the second connection layer, so that the organic functional layer sequence outside the first connection region can be electrically contacted.
• the organic optoelectronic component is designed as an OLED and in particular as a so-called “bottom emitter", that is to say that the radiation generated in the organic functional layer sequence is emitted by the first substrate
• the first substrate can advantageously have a transparency for have at least a portion of the electromagnetic radiation generated in the active layer.
• the first electrode may also have transparency for at least a portion of the electromagnetic radiation generated in the active layer.
• a transparent first electrode which may be embodied as an anode and thus serves as a hole-injecting material, may for example comprise a transparent electrically conductive oxide or consist of a transparent conductive oxide.
• transparent electrically conductive oxides transparent conductive oxides, in short "TCO" are transparent, conductive materials, usually metal oxides, such as, for example, zinc oxide, tin oxide, cadmium oxide, titanium oxide, indium oxide or particularly preferably indium tin oxide (ITO)
• Metal oxygen compounds such as ZnO, SnO 2 or In 2 O 3 also include metal ternary compounds such as Zn 2 SnO 4 , CdSnO 3, ZnSnO 3, MgIn 2 O 4 , GaIn 3, Zn 2 In 2 Os or In 4 Sn 3 ⁇ i 2 or mixtures of different transparent electrically conductive oxides to the group of TCOs.
• the TCOs do not necessarily have to correspond to a stoichiometric composition and can also be p- or n-doped.
• the functional layers may include organic polymers, organic oligomers, organic monomers, organic small, non-polymeric molecules ("small molecules"), or combinations thereof Suitable materials, as well as arrangements and structuring of the functional layer materials, are known to those skilled in the art and are therefore useful this point not further elaborated.
• the second electrode can be designed as a cathode and thus serve as an electron-injecting material.
• the cathode material may, inter alia, in particular
• the second electrode may also be transparent and / or the first electrode may be designed as a cathode and the second electrode as an anode.
• the OLED can also be designed as a "top emitter.”
• the organic Optoelectronic device simultaneously as bottom and top emitter and thus be made transparent.
• the active area can still have features and components for active or passive ads or
• the first glass solder material may preferably be a glassy, that is to say amorphous, or crystalline, meltable and curable material or composite with several
• the first glass solder material which may also be referred to as "glass frits" may comprise the actual material to be glazed and fillers, for example comprising a mixture of oxides selected from vanadium oxide, phosphorus oxide, titanium oxide, iron oxide, such as iron oxide. III oxide (Fe 2 ⁇ 03), tin oxide, boron oxide, lead oxide, aluminum oxide, alkaline earth metal oxides, silicon oxide, zinc oxide, bismuth oxide,
• the first glass solder material may also be free of lead compounds, if this is necessary for environmental and -compatible viewpoints.
• the first glass solder material can be applied in particular as a moldable glass solder material in a solvent-binder mixture in process step C.
• a solvent-binder mixture for example, a mixture of amyl acetate and nitrocellulose is suitable.
• Further examples and embodiments of glass solder materials, fillers and mixtures thereof are described in the publications US Pat. No. 6,936,963 B2 and US Pat. No. 6,998,776 B2, the disclosure content of which is hereby incorporated by reference.
• the application of the first glass solder material in method step C to the second connection region of the second substrate can be effected for example as a paste by screen printing, stencil printing or dispensing, so that a so-called glass solder bead with the first glass solder material surrounds the cover region and directly, ie directly and in direct mechanical contact , is applied.
• the still moldable first glass solder material can be dried in an oven by heat, debindered, sintered and glazed.
• a permanent and impermeable oxygen and moisture first bonding layer can be produced on the second substrate whose interface with the second substrate is also impermeable to oxygen and moisture.
• a first glass solder material with a matched to the second substrate temperature expansion coefficient can be fused with the second substrate without causing tension in the first connection layer and / or in the second substrate by known local fusion processes, for example by means of laser action.
• a cost-intensive and complex processing of the second substrate can also be omitted.
• the first connection layer may be formed with a first thickness, while the second connection layer is subsequently formed with a second thickness.
• the second thickness may be less than or equal to the first thickness be.
• the second thickness is formed compared to the first thickness, the lower the probability that oxygen and / or moisture in the active region with the organic optoelectronic
• the distance between the first and second substrate is decisively determined by the first connection layer, which means that the second thickness is less than or equal to one fifth and preferably less than or equal to one tenth of the first thickness.
• the first thickness may preferably have a first thickness of greater than or equal to 5 micrometers, particularly preferably greater than or equal to 10
• Micrometer and less than or equal to 20 microns.
• a distance between the first and second substrate of 10 micrometers or more is possible, which may be advantageous, for example, in the case of large-area organic optoelectronic components, since thereby deformations of the first and / or the second substrate due to pressure differences between the internal volume of the component with the layer sequence and the environment can be compensated.
• the second connection layer may have a second thickness, which is optimized in terms of its connection and adhesion properties.
• the second Connecting layer a second thickness greater than or equal to one or more atomic layers of the material of the second compound layer and less than or equal to a few microns, preferably less than or equal to 5 microns, in particular less than or equal to 2 microns and more preferably less than or equal to 1 micron.
• the second connection layer can be particularly preferably free from a spacer-defining filler ("spacer”) material.
• the second bonding layer may include an organic curable adhesive that may be cured after joining the first substrate to the second substrate in step F.
• “Curing” here and hereinafter may designate suitable reactions and mechanisms in the adhesive itself and at the respective interfaces of the adhesive with the first connection layer and the first substrate, by means of which a permanent connection of the first substrate to the second substrate is made possible
• the curing can be caused by a self-initiated reaction or by the supply of energy from the outside, in the second case, in particular by the application of heat or electromagnetic radiation, in particular in the form of ultraviolet or infrared
• the adhesive may in particular comprise an organic crosslinkable material or a plurality of such materials, for example siloxanes, epoxides, acrylates, methyl methacrylates, urethanes or derivatives thereof in the form of monomers, oligomers or polymers or widely It also mixtures, copolymers or compounds with it.
• the matrix material may comprise or be an epoxy resin and / or be curable by means
• the second connection layer may comprise or be a second glass solder material.
• the second glass solder material may have features, properties and combinations thereof as described in connection with the first glass solder material.
• the second interconnect layer may comprise an electromagnetic radiation absorbing material selected from one or more of rare earth transition metal metals, and more particularly of the metals iron, copper, vanadium, and neodymium.
• an electromagnetic radiation absorbing material selected from one or more of rare earth transition metal metals, and more particularly of the metals iron, copper, vanadium, and neodymium.
• the electromagnetic radiation absorptivity can be increased, thereby accelerating the curing of the second bonding layer.
• the first connection layer can be free of the absorbing materials or can have at least a lower concentration of these, so that a targeted absorption of irradiated electromagnetic radiation in the second connection layer can be achieved.
• absorbent materials in combination with a second bonding layer are made of a second glass solder material, since the absorptive properties can be used to achieve targeted local heating of the second bonding layer, ie of the second glass solder material, and thus improved glazing.
• the second glass solder material of the second bonding layer can be glazed. This can be done in particular by melting the second glass solder material by irradiation with ultraviolet or infrared light. This can for example be irradiated by means of a laser or other suitable radiation source on the second connection layer.
• the vitrification of the second glass solder material does not cause a large temperature increase of the further components of the organic optoelectronic component to be produced.
• the encapsulation of the organic optoelectronic layer sequence can be carried out at low temperature and without
• the thinner the second connecting layer the easier it is to melt and vitrify it, and the easier it is to produce a permanent connection of the second connecting layer to the first connecting layer and to the first substrate.
• the already vitrified first glass solder material of the first bonding layer can remain highly viscous and particularly preferably solid during the melting and vitrification of the second glass solder material, except in areas of the interface with the second glass solder material, so that the distance of the first
• Substrate can be defined to the second substrate substantially over the first thickness of the first interconnect layer.
• the first glass solder material may have a higher melting point than the second glass solder material.
• first and second glass solder materials can be used in terms of their compositions be different in particular with respect to their melting points.
• first connection layer can be planarized during or after method step D on a surface facing away from the second substrate. This can be done, for example, by etching and / or preferably by grinding the already glazed first glass solder material or alternatively or additionally also by a corresponding shaping process in the glazing process of the
• Process step D done in the oven.
• planarizing it may be possible, for example, to achieve adhesion of the first connection layer and the second connection layer to one another and to optimize the spacing of the first and second substrates from one another in the finished component.
• the first substrate in the first connection region can be provided with a depression.
• the depression can be designed such that it surrounds the active region.
• the recess can be provided for that after the method step F, the second connection layer is at least partially disposed in the recess. This may mean that the second connection layer is at least partially applied in the recess in method step E.
• the second connection layer can also be applied to the first connection layer and then be arranged at least partially in the recess in method step F when the first substrate is connected to the second substrate.
• the fact that the second connection layer is at least partially disposed in the recess may mean that the recess has a depth that is, for example, smaller than the second thickness of the second connection layer. In this case, the second connection layer may still protrude from the recess.
• the recess may then have a width that is independent of a width of the first
• Connection layer can be selected.
• the depth of the recess may be greater than or equal to the second thickness of the second connection layer, so that the second connection layer after method step F may be disposed entirely in the recess and thus completely surrounded by the first substrate and the first connection layer.
• the recess may have a width which is greater than or equal to a width of the first connection layer.
• the first connection layer can also extend into the recess and thus be arranged partially in the recess.
• an adhesive and / or a getter material can be arranged in the cover region of the second substrate.
• the getter material used may preferably be an oxidizable and / or moisture-binding material which reacts with oxygen and moisture and binds these harmful substances for the organic functional layer sequence, which can still diffuse, for example, in minute amounts through a second bonding layer of adhesive.
• Particularly easily oxidizing materials are metals from the group of alkali metals and alkaline earth metals and oxides with them, for example calcium oxide and / or barium oxide, used as chemisorbent materials.
• other metals such as titanium or oxidizable non-metallic materials are suitable.
• spicy-dried zeolites are also suitable as physisorbent materials.
• the getter material can be applied directly to the cover region of the second substrate or in a mixture of the getter material and adhesive, wherein the getter material can be dispersed in the adhesive, for example in particle form.
• the adhesive may comprise one of the adhesives described above in connection with the second tie layer.
• the adhesive may comprise an epoxide or be of an epoxy resin, which does not damage epoxides, for example, the cathode materials mentioned in connection with the embodiments of the organic functional layer sequence.
• the particles of the getter material are ground so finely that the particles can lead neither to mechanical damage to the organic functional layer sequence, for example the cathode, nor the second bonding layer between the first bonding layer and the first substrate can influence.
• the getter material and / or the adhesive can be applied before method step F and after vitrification of the first glass solder material in method step D.
• This can mean that the getter material and / or the adhesive are arranged on the side of the second substrate, on which the first connection layer is also arranged is, so that after the joining of the first and second substrates in the method step F, the getter material and / or the adhesive in the cavity enclosed by the first and second substrate and the first and second connection layer are arranged together with the organic layer sequence.
• the getter material and / or the adhesive may be arranged at a distance from the organic functional layer sequence so that there is still a remaining cavity between the first and second substrate, which may be filled with gas, for example.
• the distance may be adjustable mainly by the thickness of the getter material and the first thickness of the first connection layer.
• the second substrate may additionally have a cavity, that is to say a depression, in the covering region, in which the getter material and / or the adhesive is at least partially arranged and thus for example suitably spaced apart from the organic functional layer sequence.
• the getter material and / or the adhesive may fill the entire enclosed cavity around the organic functional layer sequence.
• the adhesive is arranged, for example, in the entire cavity, it can simultaneously form the second connecting layer. If monodisperse nanoparticles are used as getter material, then the second Bonding layer even be formed by a getter material adhesive mixture. The getter material concentration in the adhesive must then be so low that the getter material particles can not touch and form a diffusion channel.
• the organic functional layer sequence may be stacked in a plasma-enhanced chemical vapor deposition (PECVD) process.
• PECVD plasma-enhanced chemical vapor deposition
• SiN x silicon nitride
• SiO 2 silicon oxide
• Diffusion channels each of which could lead to a visible defect in the active surface of the organic functional layer sequence, are closed. however Even with a stack of NONONON there can still be single non-dense dot defects.
• an organic barrier layer-like functional layer sequence is additionally encapsulated with the above-described method by means of the second substrate and the first and second bonding layers, the diffusion path of water and oxygen can be extended to such an extent that the aging of the organic optoelectronic component by the action of water is so great is delayed, that the device can withstand a typical humidity test at a temperature of 60 0 C and 90% relative humidity 504 hours, without causing a water-related defect, which is about greater than 400 microns.
• the organic optoelectronic component can also have a combination of the getter material and the barrier layer.
• the first connection layer can thus also be formed and glazed on the first substrate. Characterized in that the organic functional layer sequence only after the vitrification of the first compound layer on the first substrate in the
• Process step D ' is applied, damage to the organic functional layer sequence by the method step D can be avoided.
• the organic optoelectronic component which can be produced in this way can have the following features:
• first substrate having an active region and a first connection region surrounding the active region, an organic functional layer sequence being formed in the active region, a second substrate having a cover region above the active region and a second connection region surrounding the cover region the first connection area and
• first and second connection layer Between the first and second connection region, a first and a second connection layer, wherein - The first connection layer is directly adjacent to the second connection region and from a first glass solder material and
• the second connection layer connects the first connection layer with the first connection region.
• Such an organic optoelectronic component has a reverse construction with regard to the spatial arrangement of the first and second connection layer relative to the organic functional layer sequence in comparison to the organic optoelectronic component described above.
• the method and the device manufacturable thereby may include one or more of the features, features, embodiments, and combinations thereof described above.
• an organic optoelectronic component having the properties and features described above can be produced, which is a sealing section, that is to say a first and a second
• Connecting layer between the first and the second substrate in the first and the second connection region having a variable and arbitrary proportion of the first and the second connection layer.
• the width and first thickness of the first connection layer as well as the width and second thickness of the second connection layer can be freely selectable in each case and also in the respective proportions in terms of material cost and density optimization.
• the second thickness of the second interconnect layer may be reduced as much as is required for a tight interconnection between the first and second substrates compared to the first interconnect layer thickness. The thinner the second Bonding layer is, the lower the risk that oxygen and / or moisture penetrates into the organic optoelectronic device and the higher this can be the achievable life of the device.
• FIGS 2 to 6 are schematic representations of organic optoelectronic devices according to further embodiments.
• identical or identically acting components may each be provided with the same reference numerals.
• the illustrated elements and their proportions with each other are basically not to be regarded as true to scale, but individual elements, such as layers, components, components and areas, for better representability and / or better understanding exaggerated thick or large dimensions.
• FIGS. 1A to 1H show a method for producing an organic optoelectronic component 100 according to one exemplary embodiment.
• a first substrate 1 is produced which has an active region 12 and a first connection region 11 surrounding it.
• the substrate 1 is made of glass in the embodiment shown.
• an organic functional layer sequence 3 is formed, which is embodied in the embodiment shown as an organic light-emitting diode (OLED).
• OLED organic light-emitting diode
• This comprises on the substrate 1 a first electrode 31, on which an active organic layer 30 comprising a plurality of organic functional
• the first electrode 31 and the second electrode 32 are formed as an anode and a cathode, respectively, which are suitable for injecting holes and electrons into the active layer 30.
• the active layer 30 comprises at least one electroluminescent layer capable of emitting electromagnetic radiation during operation by recombination of the injected electrons and holes.
• the active layer 30 may comprise further organic functional layers, such as at least one hole and / or an electron transport layer, and / or further features described in the general part.
• the organic functional layer sequence 3 can also be designed as a multilayer OLED having a plurality of electroluminescent layers arranged one above the other and further organic functional layers arranged between them.
• the functional layers of the active layer 30 may include organic materials in the form of polymers or small organic molecules as described in the general part.
• the first and second electrodes 31, 32 are each transparent in the embodiment shown and have, for example, a TCO and / or a metal as described in the general part.
• the organic optoelectronic component 100 which can be produced by the method described below is designed as a bottom emitter and as a top emitter, so that the electromagnetic radiation generated in operation in the active layer 30 both through the first substrate 1 and through the following described second substrate 2 can be radiated and the organic optoelectronic component 100 is formed as a transparent, double-sided emitting OLED.
• the organic functional layer 3 may also be formed as a radiation-detecting layer sequence, for example as an organic photodiode or solar cell, and / or have further organic electronic components such as thin-film transistors.
• a second substrate 2 made of glass which has a covering region 22 and a second connecting region 21 surrounding it.
• a first connection layer 4 with a first glass solder material is applied to the second connection region 21, wherein the first glass solder material is preferably lead-free and has materials and compositions as described in the general part.
• the first glass solder material is applied in the form of a so-called glass solder bead or paste in a moldable state, for example by dispensing, screen or stencil printing.
• the first bonding layer 4, the solvents added for application and not hardened binder, encloses the cover region 22 along the second connection region 21.
• the first connection layer 4 is glazed, which is indicated by the arrows 91.
• the first bonding layer 4 is dried together with the second substrate 2 in an oven by supplying heat, debindered, sintered and vitrified.
• the first connection layer 4 connects to the second substrate 2 in the second connection region 21, wherein the first glass solder material is adapted to the second substrate 2 by suitable additives
• Temperature expansion coefficient may have.
• Thickness and width of the first connection layer 4 are variably selectable and can already be set during the application of the first connection layer 4 without costly glass processing of the second substrate 2. Since the organic functional layer sequence 3 is not affected by the glazing process of the first glass solder material, the glazing 91 of the first bonding layer 4 can be performed under optimum conditions.
• the first connection layer 4 can also be irradiated with light in the ultraviolet to infrared
• the glazing 91 can be made under optimal conditions for a hermetically sealed connection of the first connection layer 4 to the second substrate 2, without having to take account of the organic functional layer sequence 3.
• the first connection layer 4 can be planarized on the surface facing away from the second substrate 2 after the glazing 91. This can be done for example by surface grinding. Alternatively, a planarizing shaping can already take place during or before vitrification 91 in the oven process.
• a second connection layer 5 is applied to the surface of the first connection layer 4 that faces away from the second substrate 2 and that surrounds the cover region 12.
• the second connection layer 5 in this case has a preferably filler-free organic curable adhesive, in particular an epoxy resin. While the first interconnect layer 4 has a first thickness selected with respect to the desired spacing of the first and second substrates 1 and 2 in the final organic optoelectronic device 100, the second
• Bonding layer 5 are applied with a second thickness, which is substantially less than the first thickness.
• the second thickness is less than or equal to one-fifth, and more preferably less than or equal to one-tenth of the first thickness.
• the second thickness of the second connection layer 5 can be reduced so far that just a dense bond between the first and second substrate 1, 2 is possible.
• the second connection layer 5 may for this purpose have a second thickness of a few atomic layers to a few micrometers. The thinner the second bonding layer 5 with the organic curable adhesive, the lower the diffusion rate of moisture and oxygen through the adhesive second connection layer 5 and the higher the lifetime of the thus produced organic optoelectronic device 100 may be.
• the second connection layer 5 can also be applied to the first connection region 11 of the first substrate 1 in method step E, as shown in FIG.
• the second substrate 2 is arranged above the first substrate 1 and connected thereto by means of the first and second connection layers 4, 5.
• Cover region 22 and the active region 12 and the first and second connection region 11, 21 are each arranged one above the other, so that the second connection layer 5 connects the first connection layer 4 with the first connection region 11 of the first substrate 1.
• the widths of the first and second connecting layers 4, 5 may be at least approximately the same, as indicated in FIG.
• the second connection layer 5 may, for example, also have a greater width than the first connection layer 4 and, for example, form an edge which encloses the interface between the first and second connection layers 4, 5.
• the second bonding layer 5 is cured by a further method step for producing the organic optoelectronic component 100 according to FIG. This can, as indicated in Figure IH by the arrows 92, by heat or radiation-induced crosslinking of the organic curable adhesive in the second connection layer 5 done.
• the adhesive can also be chemically initiated crosslinked and cured, for example, according to the principle of a multi-component adhesive.
• the energy and heat input to the organic functional layer sequence 3 during curing 92 of the second connection layer 5 is low enough, in order not to damage them, due to the small second thickness of the second connection layer 5.
• a second solder material may also be applied to the first bonding layer 4 and / or to the first bonding region 11 of the first substrate 1 as the second bonding layer 5.
• the aforementioned advantages also apply to the use of a second glass solder material instead of the adhesive.
• Bonding layer 5 are selectively melted and vitrified, wherein the respective heat input to the first substrate 1, the organic functional layer sequence 3 and the first bonding layer 4 can be kept low.
• the second glass solder material softens at lower temperatures than the first glass solder material.
• a small second thickness of the second bonding layer 5 is advantageous also in the case of the second solder glass material, because the thinner it is, the easier it is to be melted and vitrified. In this case, depending on the requirements, the second thickness of the second connecting layer 5 from a few atomic layers up to a few micrometers.
• the second bonding layer 5 may additionally comprise a material that can absorb electromagnetic radiation while the first bonding layer 4 is free of this material.
• the absorbent material preferably comprises a metal or a metal compound, preferably a metal oxide.
• it can be a rare earth metal or a transition metal, for example vanadium, iron, copper, chromium and / or neodymium or an oxide thereof.
• the method described herein can produce an organic optoelectronic device 100 in which the second thickness of the second interconnect layer 5 is significantly reduced compared to the total thickness of the first and second interconnect layers 4, 5 and the interconnection between the first and second substrate 1, 2 is largely formed by the oxygen and moisture impermeable first connecting layer 4 of the first glass solder material.
• the first connection layer 4 can also be applied in the first connection region 11 of the first substrate and subsequently glazed. In order not to damage the organic functional layer sequence 3 by the vitrification of the first bonding layer 4, this is applied only after vitrification.
• the method has the following steps in comparison with the previously described method: A) providing a first substrate 1 with an active region 12 and a first connection region 11 surrounding the active region 12,
• FIGS. 2 and 3 show organic optoelectronic components 200 and 300 in which the first substrate 1 in the first connection region 11 has a recess 10 surrounding the active region 12.
• the depression 10 has a depth which is smaller than the second thickness of the second connection layer 5.
• the depression 10 it is possible to further increase the tightness of the interface between the first substrate 1 and the second bonding layer 5 due to a longer permeation path for oxygen and moisture, wherein the width of the depression can be selected independently of the width of the first bonding layer.
• the proportion of the second connection layer 5, which directly adjoins the atmosphere surrounding the organic optoelectronic component 200, can be reduced.
• the depression 10 has a depth which is greater than the second thickness of the second connection layer 5.
• the first connection layer 4 also extends into the depression 10, as a result of which the second connection layer 5 is enclosed by the substrate 1 and the first connection layer 4 except for a gap in the edge region of the depression 10.
• FIGS. 4 to 6 show organic optoelectronic components 400, 500 and 600, which provide further additional measures for increasing the Have life of the components, which can be used with advantage with the combination of first and second bonding layer 4, 5 described here.
• an organic functional layer sequence 3 having a barrier layer 33 is provided.
• the barrier layer 33 comprises a stack of PECVD deposited silicon oxide and silicon nitride layers.
• the layer combination of SiN x (N) and SiO 2 (O) is repeated several times, preferably at least twice, so that individual diffusion channels, each of which could lead to a visible defect in the active surface of the organic functional layer sequence 3, are sealed.
• the organic optoelectronic component 400 can withstand a typical moisture test at a temperature of 60 ° C. and 90% relative humidity of 504 hours, without creating a water- or oxygen-related defect that is larger than 400 microns in a length dimension.
• the organic optoelectronic component 500 has, in the covering region 22 of the second substrate 2, a cavity 20, that is to say a depression, in which a getter material 6 is arranged.
• the getter material 6 comprises an oxygen and moisture binding material as described in the general part, preferably BaO and / or CaO.
• the getter material 6 can also be used without the cavity 20 in the cover region 22 be arranged of the second substrate 2.
• a lower external height of the organic optoelectronic component 500 can advantageously be achieved.
• the previously described organic optoelectronic components 100, 200, 300, 400 can also have a cavity 20 in the second substrate 2.
• the organic optoelectronic component 600 has a mixture of a getter material 6 and an adhesive around the organic functional layer sequence 3 in the entire cavity formed by the first and second substrates 1, 2 and the first and second connection layers 4, 5 7 on.
• the adhesive 7, which is preferably an epoxy resin, can simultaneously form the second bonding layer 5.
• the getter material 6 is dispersed in the form of finely ground particles in the adhesive 7, particularly preferably in the form of monodisperse nanoparticles.

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