EP2286175A4 - Interferometrische defektdetektion und klassifikation - Google Patents

Interferometrische defektdetektion und klassifikation Download PDF

Info

Publication number
EP2286175A4
EP2286175A4 EP09759262.0A EP09759262A EP2286175A4 EP 2286175 A4 EP2286175 A4 EP 2286175A4 EP 09759262 A EP09759262 A EP 09759262A EP 2286175 A4 EP2286175 A4 EP 2286175A4
Authority
EP
European Patent Office
Prior art keywords
classification
defect detection
interferometric defect
interferometric
detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09759262.0A
Other languages
English (en)
French (fr)
Other versions
EP2286175A1 (de
Inventor
Hwan J. Jeong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/190,144 external-priority patent/US7864334B2/en
Application filed by Individual filed Critical Individual
Publication of EP2286175A1 publication Critical patent/EP2286175A1/de
Publication of EP2286175A4 publication Critical patent/EP2286175A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)
EP09759262.0A 2008-06-03 2009-06-02 Interferometrische defektdetektion und klassifikation Withdrawn EP2286175A4 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US13072908P 2008-06-03 2008-06-03
US13561608P 2008-07-22 2008-07-22
US12/190,144 US7864334B2 (en) 2008-06-03 2008-08-12 Interferometric defect detection
US18950908P 2008-08-20 2008-08-20
US18950808P 2008-08-20 2008-08-20
US18951008P 2008-08-20 2008-08-20
US21051309P 2009-03-19 2009-03-19
PCT/US2009/045999 WO2009149103A1 (en) 2008-06-03 2009-06-02 Interferometric defect detection and classification

Publications (2)

Publication Number Publication Date
EP2286175A1 EP2286175A1 (de) 2011-02-23
EP2286175A4 true EP2286175A4 (de) 2017-04-12

Family

ID=41398482

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09759262.0A Withdrawn EP2286175A4 (de) 2008-06-03 2009-06-02 Interferometrische defektdetektion und klassifikation

Country Status (5)

Country Link
EP (1) EP2286175A4 (de)
JP (1) JP5444334B2 (de)
KR (1) KR101556430B1 (de)
CN (1) CN102089616B (de)
WO (1) WO2009149103A1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421469B (zh) * 2010-03-10 2014-01-01 Ind Tech Res Inst 表面量測裝置及其之量測方法及校正方法
EP2384692B1 (de) * 2010-05-07 2020-09-09 Rowiak GmbH Anordnung und Verfahren zur Interferometrie
EP2738602B1 (de) 2011-07-25 2019-10-09 Citizen Watch Co., Ltd. Optische vorrichtung, projektor, herstellungsverfahren und herstellungsunterstützungsvorrichtung
CN102435547B (zh) * 2011-09-15 2014-02-05 上海华力微电子有限公司 敏感光阻耐受程度检测方法及晶圆缺陷检验方法
CN103018202B (zh) * 2011-09-22 2014-10-01 中国科学院微电子研究所 一种集成电路缺陷的光学检测方法和装置
US8964088B2 (en) 2011-09-28 2015-02-24 Semiconductor Components Industries, Llc Time-delay-and-integrate image sensors having variable intergration times
WO2013172103A1 (ja) * 2012-05-16 2013-11-21 株式会社 日立ハイテクノロジーズ 検査装置
JP6025419B2 (ja) 2012-06-27 2016-11-16 株式会社ニューフレアテクノロジー 検査方法および検査装置
KR101354729B1 (ko) * 2012-08-23 2014-01-27 앰코 테크놀로지 코리아 주식회사 반도체 디바이스의 오정렬 값 측정 방법 및 이것이 적용된 반도체 디바이스
JP6001383B2 (ja) * 2012-08-28 2016-10-05 株式会社日立ハイテクノロジーズ 欠陥検査方法及びそれを用いた装置
JP5993691B2 (ja) 2012-09-28 2016-09-14 株式会社日立ハイテクノロジーズ 欠陥検査装置及び欠陥検査方法
JP5946751B2 (ja) * 2012-11-08 2016-07-06 株式会社日立ハイテクノロジーズ 欠陥検出方法及びその装置並びに欠陥観察方法及びその装置
KR101336946B1 (ko) 2012-11-27 2013-12-04 한국기초과학지원연구원 발열 분포 측정을 이용한 불량 분석 장치 및 방법
JP5786270B2 (ja) * 2013-03-06 2015-09-30 株式会社東京精密 ２色干渉計測装置
CN104180765B (zh) * 2013-05-28 2017-03-15 甘志银 化学气相沉积设备中实时测量衬底翘曲的方法及装置
US9995850B2 (en) 2013-06-06 2018-06-12 Kla-Tencor Corporation System, method and apparatus for polarization control
US9189705B2 (en) * 2013-08-08 2015-11-17 JSMSW Technology LLC Phase-controlled model-based overlay measurement systems and methods
JP6433268B2 (ja) 2014-03-31 2018-12-05 国立大学法人 東京大学 検査システムおよび検査方法
JP6316068B2 (ja) 2014-03-31 2018-04-25 国立大学法人 東京大学 検査システムおよび検査方法
US9891078B2 (en) * 2014-07-14 2018-02-13 Zygo Corporation Interferometric encoders using spectral analysis
JP5843179B1 (ja) * 2014-09-19 2016-01-13 レーザーテック株式会社 検査装置、及び波面収差補正方法
CN104297744B (zh) * 2014-10-16 2016-12-07 西安理工大学 偏振激光雷达的偏振标定与补偿装置及标定与补偿方法
WO2016084239A1 (ja) * 2014-11-28 2016-06-02 株式会社東京精密 ２色干渉計測装置
WO2016106379A1 (en) * 2014-12-22 2016-06-30 California Institute Of Technology Epi-illumination fourier ptychographic imaging for thick samples
TWI574334B (zh) * 2015-03-17 2017-03-11 陳勇吉 檢測晶圓的方法
CN104729712B (zh) * 2015-03-30 2017-08-04 中国资源卫星应用中心 一种星载大气探测傅里叶变换光谱仪数据预处理方法
JP2017129500A (ja) * 2016-01-21 2017-07-27 株式会社ブイ・テクノロジー 位相シフト量測定装置
KR102483787B1 (ko) * 2016-02-25 2023-01-04 에스케이하이닉스 주식회사 반도체 장치의 결함 모델링 장치 및 방법, 이를 위한 컴퓨터 프로그램과, 이를 이용한 반도체 장치의 결함 검사 시스템
KR102179989B1 (ko) * 2016-04-13 2020-11-17 케이엘에이 코포레이션 전기적 설계 의도에 기초한 결함 분류 시스템 및 방법
IL245932A (en) * 2016-05-30 2017-10-31 Elbit Systems Land & C4I Ltd System and methods for determining the authenticity of an object that includes a reference image acquisition and a user unit
JP6705356B2 (ja) * 2016-10-12 2020-06-03 住友電気工業株式会社 光ファイバ特性評価方法および光ファイバ特性評価装置
US10234402B2 (en) * 2017-01-05 2019-03-19 Kla-Tencor Corporation Systems and methods for defect material classification
CN110709778B (zh) * 2017-06-02 2021-12-21 Asml荷兰有限公司 量测设备
CN107504919B (zh) * 2017-09-14 2019-08-16 深圳大学 基于相位映射的折叠相位三维数字成像方法及装置
US10522376B2 (en) * 2017-10-20 2019-12-31 Kla-Tencor Corporation Multi-step image alignment method for large offset die-die inspection
CN108280824B (zh) * 2018-01-18 2022-06-14 电子科技大学 基于图像配准及融合的激光剪切散斑干涉缺陷检测系统
CN108195849A (zh) * 2018-01-23 2018-06-22 南京理工大学 基于短相干动态泰曼干涉仪的位相缺陷检测系统及方法
NL2020622B1 (en) * 2018-01-24 2019-07-30 Lllumina Cambridge Ltd Reduced dimensionality structured illumination microscopy with patterned arrays of nanowells
NL2020623B1 (en) * 2018-01-24 2019-07-30 Illumina Inc Structured illumination microscopy with line scanning
CN108550138A (zh) * 2018-03-14 2018-09-18 浙江大学山东工业技术研究院 基于频率域滤波增强的耐火砖表面划痕识别方法
WO2019239618A1 (ja) * 2018-06-11 2019-12-19 株式会社島津製作所 欠陥検出方法及び装置
CN108961234A (zh) * 2018-06-29 2018-12-07 中国科学院光电技术研究所 一种基于多波长迭代算法的透射性元件缺陷检测装置及方法
CN108802056B (zh) * 2018-08-23 2024-02-06 中国工程物理研究院激光聚变研究中心 光学元件位相型缺陷测量装置及检测方法
US10816464B2 (en) * 2019-01-23 2020-10-27 Applied Materials, Inc. Imaging reflectometer
US11294162B2 (en) * 2019-02-07 2022-04-05 Nanotronics Imaging, Inc. Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel
US10948423B2 (en) * 2019-02-17 2021-03-16 Kla Corporation Sensitive particle detection with spatially-varying polarization rotator and polarizer
JPWO2020196442A1 (de) * 2019-03-28 2020-10-01
CN109994398A (zh) * 2019-04-18 2019-07-09 上海华力微电子有限公司 一种晶圆缺陷扫描对比方法
KR102166495B1 (ko) * 2019-05-27 2020-10-15 김은근 델타봇 타입의 전동 현미경 스테이지
CN110553580B (zh) * 2019-06-04 2022-05-20 南京英特飞光电技术有限公司 一种倾斜入射相移干涉仪和直角棱镜大面测量方法
CN111208089B (zh) * 2020-01-13 2020-09-15 中国科学院上海光学精密机械研究所 长距离端面粗糙晶体体内缺陷测量装置和方法
JP2023514421A (ja) * 2020-02-24 2023-04-05 ノヴァ リミテッド 光計測システムおよび方法
US11544838B2 (en) * 2020-03-21 2023-01-03 Kla Corporation Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging
KR102265540B1 (ko) * 2020-04-27 2021-06-17 주식회사 에프에스티 초점 보정 장치, 초점 보정 방법 및 결함 검출 시스템
CN115917438A (zh) * 2020-08-19 2023-04-04 Asml荷兰有限公司 用于从原始图像自动选择高品质图像的设备和方法
CN112098421B (zh) * 2020-09-15 2022-06-28 上海微电子装备（集团）股份有限公司 暗场检测装置
CN113465722B (zh) * 2021-07-14 2022-06-07 安徽至博光电科技股份有限公司 一种低成本测振系统及振动测量方法
CN113390467B (zh) * 2021-07-14 2022-05-03 安徽至博光电科技股份有限公司 测振测温装置及其信号处理方法
CN113533351B (zh) * 2021-08-20 2023-12-22 合肥御微半导体技术有限公司 一种面板缺陷检测装置及检测方法
CN114820617B (zh) * 2022-06-29 2022-09-20 苏州大学 基于四焦距相位相干机器视觉的晶体缺陷检测方法和系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7209239B2 (en) * 2002-10-02 2007-04-24 Kla-Tencor Technologies Corporation System and method for coherent optical inspection
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6501551B1 (en) * 1991-04-29 2002-12-31 Massachusetts Institute Of Technology Fiber optic imaging endoscope interferometer with at least one faraday rotator
JP2005003689A (ja) * 1994-10-07 2005-01-06 Renesas Technology Corp 被検査対象物上のパターンの欠陥検査方法及びその装置
US6288780B1 (en) * 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
JPH09281051A (ja) * 1996-04-17 1997-10-31 Nikon Corp 検査装置
US6259055B1 (en) * 1998-10-26 2001-07-10 Lsp Technologies, Inc. Apodizers for laser peening systems
JP3881125B2 (ja) * 1999-02-17 2007-02-14 レーザーテック株式会社 段差測定装置並びにこの段差測定装置を用いたエッチングモニタ装置及びエッチング方法
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US6992290B2 (en) * 2001-01-10 2006-01-31 Ebara Corporation Electron beam inspection system and inspection method and method of manufacturing devices using the system
JP4220287B2 (ja) * 2003-03-31 2009-02-04 株式会社東芝 パターン欠陥検査装置
US7138629B2 (en) * 2003-04-22 2006-11-21 Ebara Corporation Testing apparatus using charged particles and device manufacturing method using the testing apparatus
WO2006105259A2 (en) * 2004-07-30 2006-10-05 Novalux, Inc. System and method for driving semiconductor laser sources for displays
US7616323B2 (en) 2005-01-20 2009-11-10 Zygo Corporation Interferometer with multiple modes of operation for determining characteristics of an object surface
US7864334B2 (en) 2008-06-03 2011-01-04 Jzw Llc Interferometric defect detection

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7209239B2 (en) * 2002-10-02 2007-04-24 Kla-Tencor Technologies Corporation System and method for coherent optical inspection
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009149103A1 *

Also Published As

Publication number Publication date
KR101556430B1 (ko) 2015-10-01
JP5444334B2 (ja) 2014-03-19
CN102089616B (zh) 2013-03-13
KR20110031306A (ko) 2011-03-25
JP2011523711A (ja) 2011-08-18
CN102089616A (zh) 2011-06-08
EP2286175A1 (de) 2011-02-23
WO2009149103A1 (en) 2009-12-10

Similar Documents

Publication Publication Date Title
EP2286175A4 (de) Interferometrische defektdetektion und klassifikation
HK1217764A1 (zh) 粒子檢測
EP3069301A4 (de) Gesichtsdetektion und -erkennung
EP2430446A4 (de) Verfahren und zusammensetzungen für den nachweis von analyten
GB2470520B (en) Dynamic object classification
HK1208265A1 (en) Detection of the characteristic of particles
EP2485640A4 (de) Sep-klassifizierung/-erkennung in der zeitdomäne
EP2257636A4 (de) Epithelialschichtdetektor und entsprechende verfahren
EP2160590A4 (de) Verbessertes interferometrisches nachweissystem und -verfahren
EP2264446A4 (de) Vorrichtung zur erkennung periodischer defekte und verfahren dafür
EP2185725A4 (de) Zusammensetzungen und verfahren für den nachweis und die quantifizierung von analyten
EP2351512A4 (de) Positionserkennungssystem und positionserkennungsverfahren
GB0915116D0 (en) Methods for allergen detection
EP2257831A4 (de) Erkennung bewegter elemente
EP2464041A4 (de) Detektionsvorrichtung und verfahren dafür
EP2384494A4 (de) Systeme und verfahren zur erfassung von verdeckten objekten
EP2209903A4 (de) Nachweis und analyse eines promoters
GB0814947D0 (en) Flaw detection
EP2504686A4 (de) Vorrichtungen und verfahren für optische erkennung
SG10201701286YA (en) Cancer detection methods and techniques
EP2242858A4 (de) Isotherme detektionsverfahren und ihre verwendungen
TWI365991B (en) Testing and classifying machine
TWI367030B (en) Movement detector and movement detection method
GB0819445D0 (en) Fingerprint detection
AU2009903098A0 (en) Nanoparticles for the capture and detection of analytes

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20101229

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20170313

RIC1 Information provided on ipc code assigned before grant

Ipc: G01B 9/02 20060101AFI20170307BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20190125

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20190305