EP2286175A4 - Interferometric defect detection and classification - Google Patents
Interferometric defect detection and classification Download PDFInfo
- Publication number
- EP2286175A4 EP2286175A4 EP09759262.0A EP09759262A EP2286175A4 EP 2286175 A4 EP2286175 A4 EP 2286175A4 EP 09759262 A EP09759262 A EP 09759262A EP 2286175 A4 EP2286175 A4 EP 2286175A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- classification
- defect detection
- interferometric defect
- interferometric
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
- G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13072908P | 2008-06-03 | 2008-06-03 | |
US13561608P | 2008-07-22 | 2008-07-22 | |
US12/190,144 US7864334B2 (en) | 2008-06-03 | 2008-08-12 | Interferometric defect detection |
US18951008P | 2008-08-20 | 2008-08-20 | |
US18950908P | 2008-08-20 | 2008-08-20 | |
US18950808P | 2008-08-20 | 2008-08-20 | |
US21051309P | 2009-03-19 | 2009-03-19 | |
PCT/US2009/045999 WO2009149103A1 (en) | 2008-06-03 | 2009-06-02 | Interferometric defect detection and classification |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2286175A1 EP2286175A1 (en) | 2011-02-23 |
EP2286175A4 true EP2286175A4 (en) | 2017-04-12 |
Family
ID=41398482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09759262.0A Withdrawn EP2286175A4 (en) | 2008-06-03 | 2009-06-02 | Interferometric defect detection and classification |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2286175A4 (en) |
JP (1) | JP5444334B2 (en) |
KR (1) | KR101556430B1 (en) |
CN (1) | CN102089616B (en) |
WO (1) | WO2009149103A1 (en) |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI421469B (en) * | 2010-03-10 | 2014-01-01 | Ind Tech Res Inst | Surface measure device, surface measure method thereof and correction method thereof |
EP2384692B1 (en) * | 2010-05-07 | 2020-09-09 | Rowiak GmbH | Method and device for interferometry |
EP2738602B1 (en) * | 2011-07-25 | 2019-10-09 | Citizen Watch Co., Ltd. | Optical device, projector, production method, and production support device |
CN102435547B (en) * | 2011-09-15 | 2014-02-05 | 上海华力微电子有限公司 | Sensitive photoresist tolerance degree detection method and wafer defect detection method |
CN103018202B (en) * | 2011-09-22 | 2014-10-01 | 中国科学院微电子研究所 | Integrated circuit defect optical detection method and device |
US8964088B2 (en) | 2011-09-28 | 2015-02-24 | Semiconductor Components Industries, Llc | Time-delay-and-integrate image sensors having variable intergration times |
US9535009B2 (en) | 2012-05-16 | 2017-01-03 | Hitachi High-Technologies Corporation | Inspection system |
JP6025419B2 (en) | 2012-06-27 | 2016-11-16 | 株式会社ニューフレアテクノロジー | Inspection method and inspection apparatus |
KR101354729B1 (en) * | 2012-08-23 | 2014-01-27 | 앰코 테크놀로지 코리아 주식회사 | Misalignment value measuring method of semiconductor device and semiconductor device adapted the same |
JP6001383B2 (en) * | 2012-08-28 | 2016-10-05 | 株式会社日立ハイテクノロジーズ | Defect inspection method and apparatus using the same |
JP5993691B2 (en) | 2012-09-28 | 2016-09-14 | 株式会社日立ハイテクノロジーズ | Defect inspection apparatus and defect inspection method |
JP5946751B2 (en) * | 2012-11-08 | 2016-07-06 | 株式会社日立ハイテクノロジーズ | Defect detection method and apparatus, and defect observation method and apparatus |
KR101336946B1 (en) | 2012-11-27 | 2013-12-04 | 한국기초과학지원연구원 | Failure analysis appratus and method using measurement of heat generation distribution |
JP5786270B2 (en) * | 2013-03-06 | 2015-09-30 | 株式会社東京精密 | Two-color interference measuring device |
CN104180765B (en) * | 2013-05-28 | 2017-03-15 | 甘志银 | The method and device of substrate warpage is measured in chemical vapor depsotition equipment in real time |
US9995850B2 (en) | 2013-06-06 | 2018-06-12 | Kla-Tencor Corporation | System, method and apparatus for polarization control |
US9189705B2 (en) * | 2013-08-08 | 2015-11-17 | JSMSW Technology LLC | Phase-controlled model-based overlay measurement systems and methods |
JP6433268B2 (en) * | 2014-03-31 | 2018-12-05 | 国立大学法人 東京大学 | Inspection system and inspection method |
JP6316068B2 (en) | 2014-03-31 | 2018-04-25 | 国立大学法人 東京大学 | Inspection system and inspection method |
CN106796098B (en) * | 2014-07-14 | 2020-03-24 | 齐戈股份有限公司 | Interferometric encoder using spectral analysis |
JP5843179B1 (en) * | 2014-09-19 | 2016-01-13 | レーザーテック株式会社 | Inspection apparatus and wavefront aberration correction method |
CN104297744B (en) * | 2014-10-16 | 2016-12-07 | 西安理工大学 | The polarizational labelling of polarization lidar and compensation device and demarcation and compensation method |
WO2016084239A1 (en) * | 2014-11-28 | 2016-06-02 | 株式会社東京精密 | Two-color interference measurement device |
WO2016106379A1 (en) * | 2014-12-22 | 2016-06-30 | California Institute Of Technology | Epi-illumination fourier ptychographic imaging for thick samples |
TWI574334B (en) * | 2015-03-17 | 2017-03-11 | 陳勇吉 | Method for wafer detection |
CN104729712B (en) * | 2015-03-30 | 2017-08-04 | 中国资源卫星应用中心 | A kind of spaceborne Spaceborne Fourier Transform Spectrometer for Atmospheric Sounding data preprocessing method |
JP2017129500A (en) * | 2016-01-21 | 2017-07-27 | 株式会社ブイ・テクノロジー | Phase shift amount measurement device |
KR102483787B1 (en) * | 2016-02-25 | 2023-01-04 | 에스케이하이닉스 주식회사 | Apparatus and Method for Modeling of Defect to Semiconductor Apparatus, and Computer Program Therefor, and System for Inspection of Defect to Semiconductor Apparatus |
CN108886007B (en) * | 2016-04-13 | 2020-03-27 | 科磊股份有限公司 | System and method for defect classification based on electrical design intent |
IL245932A (en) * | 2016-05-30 | 2017-10-31 | Elbit Systems Land & C4I Ltd | System for object authenticity detection including a reference image acquisition module and a user module and methods therefor |
JP6705356B2 (en) * | 2016-10-12 | 2020-06-03 | 住友電気工業株式会社 | Optical fiber characteristic evaluation method and optical fiber characteristic evaluation apparatus |
US10234402B2 (en) * | 2017-01-05 | 2019-03-19 | Kla-Tencor Corporation | Systems and methods for defect material classification |
WO2018219639A1 (en) | 2017-06-02 | 2018-12-06 | Asml Netherlands B.V. | Metrology apparatus |
CN107504919B (en) * | 2017-09-14 | 2019-08-16 | 深圳大学 | Wrapped phase three-dimension digital imaging method and device based on phase mapping |
US10522376B2 (en) * | 2017-10-20 | 2019-12-31 | Kla-Tencor Corporation | Multi-step image alignment method for large offset die-die inspection |
CN108280824B (en) * | 2018-01-18 | 2022-06-14 | 电子科技大学 | Laser shearing speckle interference defect detection system based on image registration and fusion |
CN108195849A (en) * | 2018-01-23 | 2018-06-22 | 南京理工大学 | Position phase defect detecting system and method based on the safe graceful interferometer of short relevant dynamic |
NL2020622B1 (en) | 2018-01-24 | 2019-07-30 | Lllumina Cambridge Ltd | Reduced dimensionality structured illumination microscopy with patterned arrays of nanowells |
NL2020623B1 (en) * | 2018-01-24 | 2019-07-30 | Illumina Inc | Structured illumination microscopy with line scanning |
CN108550138A (en) * | 2018-03-14 | 2018-09-18 | 浙江大学山东工业技术研究院 | Refractory brick surface scratch recognition methods based on frequency filtering enhancing |
EP3805735A4 (en) * | 2018-06-11 | 2021-07-21 | Shimadzu Corporation | Defect detection method and device |
CN108961234A (en) * | 2018-06-29 | 2018-12-07 | 中国科学院光电技术研究所 | A kind of transmissive elements defect detecting device and method based on multi-wavelength iterative algorithm |
CN108802056B (en) * | 2018-08-23 | 2024-02-06 | 中国工程物理研究院激光聚变研究中心 | Optical element phase type defect measuring device and detecting method |
US10816464B2 (en) * | 2019-01-23 | 2020-10-27 | Applied Materials, Inc. | Imaging reflectometer |
US11294162B2 (en) * | 2019-02-07 | 2022-04-05 | Nanotronics Imaging, Inc. | Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel |
US10948423B2 (en) | 2019-02-17 | 2021-03-16 | Kla Corporation | Sensitive particle detection with spatially-varying polarization rotator and polarizer |
DE112020001582T5 (en) * | 2019-03-28 | 2021-12-23 | Kyoto Electronics Manufacturing Co., Ltd. | Laser gas analyzer |
CN109994398A (en) * | 2019-04-18 | 2019-07-09 | 上海华力微电子有限公司 | A kind of wafer defect scanning control methods |
KR102166495B1 (en) * | 2019-05-27 | 2020-10-15 | 김은근 | Delta-bot type motorized microscope stage |
CN110553580B (en) * | 2019-06-04 | 2022-05-20 | 南京英特飞光电技术有限公司 | Oblique incidence phase shift interferometer and rectangular prism large surface measurement method |
CN111208089B (en) * | 2020-01-13 | 2020-09-15 | 中国科学院上海光学精密机械研究所 | Device and method for measuring defects in long-distance rough end face crystal body |
US11868054B2 (en) * | 2020-02-24 | 2024-01-09 | Nova Ltd. | Optical metrology system and method |
US11544838B2 (en) | 2020-03-21 | 2023-01-03 | Kla Corporation | Systems and methods of high-resolution review for semiconductor inspection in backend and wafer level packaging |
KR102265540B1 (en) * | 2020-04-27 | 2021-06-17 | 주식회사 에프에스티 | Device of adjusting the focus, method of adjusting the focus and defect-detecting system |
US20230298158A1 (en) * | 2020-08-19 | 2023-09-21 | Asml Netherlands B.V. | Apparatus and method for selecting high quality images from raw images automatically |
CN112098421B (en) * | 2020-09-15 | 2022-06-28 | 上海微电子装备(集团)股份有限公司 | Dark field detection device |
CN113390467B (en) * | 2021-07-14 | 2022-05-03 | 安徽至博光电科技股份有限公司 | Vibration and temperature measuring device and signal processing method thereof |
CN113465722B (en) * | 2021-07-14 | 2022-06-07 | 安徽至博光电科技股份有限公司 | Low-cost vibration measurement system and vibration measurement method |
CN113642422B (en) * | 2021-07-27 | 2024-05-24 | 东北电力大学 | Continuous Chinese sign language recognition method |
CN113533351B (en) * | 2021-08-20 | 2023-12-22 | 合肥御微半导体技术有限公司 | Panel defect detection device and detection method |
CN114820617B (en) * | 2022-06-29 | 2022-09-20 | 苏州大学 | Crystal defect detection method and system based on four-focus phase coherent machine vision |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7209239B2 (en) * | 2002-10-02 | 2007-04-24 | Kla-Tencor Technologies Corporation | System and method for coherent optical inspection |
US7295303B1 (en) * | 2004-03-25 | 2007-11-13 | Kla-Tencor Technologies Corporation | Methods and apparatus for inspecting a sample |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6501551B1 (en) * | 1991-04-29 | 2002-12-31 | Massachusetts Institute Of Technology | Fiber optic imaging endoscope interferometer with at least one faraday rotator |
JP2005003689A (en) * | 1994-10-07 | 2005-01-06 | Renesas Technology Corp | Method and apparatus for inspecting defect in pattern on object to be inspected |
US6288780B1 (en) * | 1995-06-06 | 2001-09-11 | Kla-Tencor Technologies Corp. | High throughput brightfield/darkfield wafer inspection system using advanced optical techniques |
JPH09281051A (en) * | 1996-04-17 | 1997-10-31 | Nikon Corp | Inspection apparatus |
US6259055B1 (en) * | 1998-10-26 | 2001-07-10 | Lsp Technologies, Inc. | Apodizers for laser peening systems |
JP3881125B2 (en) * | 1999-02-17 | 2007-02-14 | レーザーテック株式会社 | Level difference measuring apparatus and etching monitor apparatus and etching method using the level difference measuring apparatus |
US7317531B2 (en) * | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
WO2002056332A1 (en) * | 2001-01-10 | 2002-07-18 | Ebara Corporation | Inspection apparatus and inspection method with electron beam, and device manufacturing method comprising the inspection apparatus |
JP4220287B2 (en) * | 2003-03-31 | 2009-02-04 | 株式会社東芝 | Pattern defect inspection system |
US7138629B2 (en) * | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
US7357513B2 (en) * | 2004-07-30 | 2008-04-15 | Novalux, Inc. | System and method for driving semiconductor laser sources for displays |
EP2108919B1 (en) | 2005-01-20 | 2015-03-11 | Zygo Corporation | Interferometer for determining characteristics of an object surface |
US7864334B2 (en) | 2008-06-03 | 2011-01-04 | Jzw Llc | Interferometric defect detection |
-
2009
- 2009-06-02 KR KR1020117000031A patent/KR101556430B1/en not_active IP Right Cessation
- 2009-06-02 JP JP2011512587A patent/JP5444334B2/en not_active Expired - Fee Related
- 2009-06-02 CN CN200980121352.XA patent/CN102089616B/en not_active Expired - Fee Related
- 2009-06-02 WO PCT/US2009/045999 patent/WO2009149103A1/en active Application Filing
- 2009-06-02 EP EP09759262.0A patent/EP2286175A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7209239B2 (en) * | 2002-10-02 | 2007-04-24 | Kla-Tencor Technologies Corporation | System and method for coherent optical inspection |
US7295303B1 (en) * | 2004-03-25 | 2007-11-13 | Kla-Tencor Technologies Corporation | Methods and apparatus for inspecting a sample |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009149103A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102089616B (en) | 2013-03-13 |
CN102089616A (en) | 2011-06-08 |
EP2286175A1 (en) | 2011-02-23 |
JP5444334B2 (en) | 2014-03-19 |
KR101556430B1 (en) | 2015-10-01 |
JP2011523711A (en) | 2011-08-18 |
WO2009149103A1 (en) | 2009-12-10 |
KR20110031306A (en) | 2011-03-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2286175A4 (en) | Interferometric defect detection and classification | |
HK1217764A1 (en) | Particle detection | |
EP3069301A4 (en) | Face detection and recognition | |
EP2430446A4 (en) | Methods and compositions for analyte detection | |
HK1208265A1 (en) | Detection of the characteristic of particles | |
GB2492247B (en) | Dynamic object classification | |
EP2485640A4 (en) | Sensory-evoked potential (sep) classification/detection in the time domain | |
EP2257636A4 (en) | Epithelial layer detector and related methods | |
EP2264446A4 (en) | Periodic defect detecting device and method for the same | |
EP2185725A4 (en) | Compositions and methods for analyte detection and quantitation | |
EP2351512A4 (en) | Position detection system and position detection method | |
GB0915116D0 (en) | Methods for allergen detection | |
EP2257831A4 (en) | Moving-entity detection | |
EP2464041A4 (en) | Detection device and method thereof | |
EP2384494A4 (en) | Systems and methods for concealed object detection | |
EP2209903A4 (en) | Promoter detection and analysis | |
GB0814947D0 (en) | Flaw detection | |
EP2504686A4 (en) | Devices and methods for optical detection | |
SG10201701286YA (en) | Cancer detection methods and techniques | |
EP2242858A4 (en) | Isothermal detection methods and uses thereof | |
TWI365991B (en) | Testing and classifying machine | |
TWI367030B (en) | Movement detector and movement detection method | |
GB0819445D0 (en) | Fingerprint detection | |
AU2009903098A0 (en) | Nanoparticles for the capture and detection of analytes | |
AU2008903269A0 (en) | Particle detection |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20101229 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
DAX | Request for extension of the european patent (deleted) | ||
RA4 | Supplementary search report drawn up and despatched (corrected) |
Effective date: 20170313 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01B 9/02 20060101AFI20170307BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
17Q | First examination report despatched |
Effective date: 20190125 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20190305 |