EP2279376A1 - Leuchteinheit - Google Patents
LeuchteinheitInfo
- Publication number
- EP2279376A1 EP2279376A1 EP09753783A EP09753783A EP2279376A1 EP 2279376 A1 EP2279376 A1 EP 2279376A1 EP 09753783 A EP09753783 A EP 09753783A EP 09753783 A EP09753783 A EP 09753783A EP 2279376 A1 EP2279376 A1 EP 2279376A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lighting unit
- filler
- unit according
- heat
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Definitions
- the invention relates to a lighting unit, in particular a LED retrofit lamp.
- Retrofit lamps are increasingly displacing conventional light bulbs, especially for higher power lamps. This also increases the converted in the retrofit lamps electrical power, which in particular leads to problems in the heat dissipation of LED modules and ballasts, which are used to drive the LED modules.
- thermally conductive and electrically insulating fillers such as sand or tar.
- heat conduction is known in Halotronictrafos.
- Heat dissipation of lighting modules and electronic components for example in the case of a LED retrofit lamp.
- a lighting unit which comprises: a base, an LED module, a heat conduction device thermally coupled to the pedestal;
- a filler for heat distribution at least partially thermally with the LED module and at least partially thermally with the device for
- the lighting unit is in particular a retrofit lighting unit with a piston similar or equal to a known shape or contour, e.g. in the form of a conventional incandescent lamp, wherein the lighting unit is suitable for use in conventional lamp holders.
- the lighting unit preferably has an LED module with a corresponding control (an electronic ballast).
- the LED module comprises at least one light emitting diode.
- the lighting unit is any lamp that can be operated in a socket.
- the filler at least partially comprises a thermally conductive material.
- the filler comprises sand and / or tar.
- the device for heat conduction has at least one probe which projects at least partially into the filler and / or is at least partially thermally coupled to the filler.
- the probe is set up and arranged to dissipate heat to the base better than the mechanical contact with the socket. It is also a development that the at least one probe is elongate and substantially parallel to a neck of the lighting unit.
- the at least one probe is designed semicircular and / or cylindrical.
- the at least one probe has a pointed edge for engagement in the filler. This facilitates in particular introduction of the probe during assembly of the lighting unit.
- the device for heat conduction has a means for limiting a space for the filler or to reduce weight.
- filler can be efficiently saved and / or weight can be reduced.
- the device for heat conduction to semicircular and / or cylindrical cooling surfaces.
- the device for heat conduction has a holding means for a circuit board.
- the board comprises components of an electronic ballast.
- the holding means for the board has a predetermined electrical isolation from the device for heat conduction.
- the LED module comprises at least one light-emitting diode. It is also a development that the filler comprises a granular and in particular at least partially recyclable filler.
- FIG. 1 shows a sketch of a luminous means according to an embodiment as a retrofit lamp
- FIG. 3 shows a cooling unit according to another embodiment
- Embodiment as a sectional view in side view.
- Fig.l shows a lighting unit 1 with a piston 2, for example made of glass or plastic, in which an LED module 3 is arranged.
- the LED module 3 is connected to a holding means 4 e.g. attached in the form of a circuit board.
- the board 4 lies in the piston 2 so that it is held with its edge by the piston.
- light is emitted into an upper hemisphere of the piston 2 and further outwards.
- the piston 2 can be clear or milky (opaque).
- An upper side of the board 4 terminates a sub-chamber of the piston 2 belonging to the LED module against a subspace of the piston 2 associated with its underside.
- the piston 2 is at least partially filled with a filler 6.
- the filler 6 may be a unitary filler or a mixture of multiple fillers or of the same filler with different filler 6
- Material properties for example different particle size etc.
- a lower, adjacent to the base 5 part of the piston 2 is designed in the form of a neck 7.
- the lighting unit 1 further comprises a device for heat conduction, which projects into the piston 2 and is thermally coupled to the base 5.
- the device for heat conduction has in the case shown a means for
- the end plate 8 is arranged in the embodiment shown at the lower end of the piston 2 and the neck 7.
- the space for the filler 6 top and bottom is limited.
- the corresponding lateral boundary is achieved by the portion of the piston 2 and the neck 7, respectively, between the two end elements, namely the upper end element in the form of the board 4 and the lower
- End element in the form of the end plate 8 is located.
- the device for heat conduction 4 On the piston side, the device for heat conduction 4, two half-cylindrical shell-shaped heat conductors 9, 10 extending from the end plate 8 from vertically upwardly through the neck 7 of the piston 2 and extend to the flared portion of the piston 2.
- the heat conductor can also be designed as a one-piece cylinder tube section. Between the heat conductors 9, 10 is the end plate 8, a holder 11 for attachment and supply of an electrical circuit board or circuit, in particular a ballast, or for receiving a circuit board of such electronic ballast 12th
- heat coupling elements 13 are provided for thermal coupling of the heat conductors 9, 10 to the base 5. These heat coupling elements 13 may as a single heat coupling element or integrally with the
- Heat conductors 9, 10 be executed, for example, such that the heat conductors 9, 10 are passed through the end plate 8 through to thermal contact with the base.
- both the LED module 3 and the electronic ballast 12 are heated by the electrical power output. This heat is released to the filler 6, which is located between the two cover elements 4, 8. The filler 6 forwards the heat to the heat conductors 9, 10, which in turn transport the heat to the base 5. By means of the filler 6, a faster and more efficient heat transfer from the lighting unit 1 is achieved.
- the internal heat sink comprises the end plate 8, the heat conductors 9, 10, the holding means 11 for the board and the heat-coupling elements 13 in the direction of the base 5 and thus also closes off the space in which the filler 6 is located.
- End plate 8 are preferably metal surfaces on the base 5.
- the heat conductors 9, 10 are advantageously arranged in a semicircular geometry. Also, a cylindrical shape of the heat conductors 9, 10 is favorable.
- the length of the heat conductor is as large as possible in order to achieve a large thermal effect based on a correspondingly large transition area.
- the length of the heat conductors 9, 10 extends to the area of electrical isolation of electrical components of the ballast 12.
- the length of the heat conductors 9, 10 is about two-thirds of the length of the lamp neck 7.
- the piston-side (upper) ends of the heat conductors. 9 , 10 are preferably pointed, so that they can be inserted into the filler (spade effect).
- the internal cooling surfaces can also be used for the board holder (for the ballast device).
- the device 14 shows a device 14 for heat conduction based on the representation according to Fig.l.
- the device 14 comprises the heat conductors 9, 10, which are mounted on the plastic end plate 8 and extending substantially vertically upwards in the direction of the piston (see Fig.l). Further shown are the between the Heat conductors 9, 10 provided holder means 11 for the board 12 of an electric ballast and the downwards ie leading towards the base heat coupling elements 13th
- FIG. 3 shows an alternative embodiment of a device 15 for heat conduction, in which, in contrast to the embodiment according to Figure 2, the heat coupling element 16 and the heat coupling elements 16 are not arranged obliquely exposed, but directly on the
- the heat coupling elements 16 may be present as separately manufactured components, or parts of a heat conductor 9, 10 be.
- FIG. 4 shows a further embodiment of a lighting unit 17 similar to the lighting unit 1 of Fig.l, wherein the end plate 8 is not arranged at the bottom of the piston 2 and the neck 7, but with respect to a height position, for example, centrally in the neck 7 of the piston 2 is.
- This embodiment has the advantage over the first embodiment according to Fig.l that less filler 6 is necessary and thus weight and cost can be saved.
- the heat conductors 9, 10 are passed through the end plate 8, wherein now this board 19 is preferably divided into two parts due to the reduced height for the board 19 of the electronic ballast. Accordingly, located on the end plate 8, two board holder 18 for receiving a corresponding part of the board 19 for the electronic ballast. In order to provide a good heat dissipation from the lamp 1, the components with the highest heat development (most lossy elements of electronics, drivers) are on that part of the board 19, which is located in the space for the filler 6.
- pistons for example glass or plastic
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008025735.4A DE102008025735C5 (de) | 2008-05-29 | 2008-05-29 | Leuchteinheit |
PCT/EP2009/055601 WO2009144128A1 (de) | 2008-05-29 | 2009-05-08 | Leuchteinheit |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2279376A1 true EP2279376A1 (de) | 2011-02-02 |
Family
ID=40904209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09753783A Withdrawn EP2279376A1 (de) | 2008-05-29 | 2009-05-08 | Leuchteinheit |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2279376A1 (de) |
DE (1) | DE102008025735C5 (de) |
TW (1) | TW200949154A (de) |
WO (1) | WO2009144128A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2485164B (en) * | 2010-11-03 | 2017-08-02 | Thorpe F W Plc | Improvements in or relating to luminaires |
DE202011101257U1 (de) * | 2011-05-23 | 2012-05-30 | Promotec Gmbh | Leuchtdioden-Leuchtmittel |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040120148A1 (en) * | 2002-12-18 | 2004-06-24 | Morris Garron K. | Integral ballast lamp thermal management method and apparatus |
EP1881259A1 (de) * | 2006-07-17 | 2008-01-23 | Liquidleds Lighting Co., Ltd. | Hochleistungs-LED-Lampe mit verstärkter Wärmeableitung |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19528459C2 (de) | 1995-08-03 | 2001-08-23 | Garufo Gmbh | Kühlung für ein mit LED's bestücktes Leuchtaggregat |
US6794801B2 (en) | 2001-10-31 | 2004-09-21 | Toshiba Lighting & Technology Corporation | Compact selfballasted fluorescent lamp and luminaire |
DE10230103B4 (de) | 2002-07-04 | 2012-10-31 | Tridonic Ag | Stromversorgung für Lumineszenzdioden |
US6787999B2 (en) | 2002-10-03 | 2004-09-07 | Gelcore, Llc | LED-based modular lamp |
CN100530857C (zh) | 2004-11-16 | 2009-08-19 | 电灯专利信托有限公司 | 节能灯的带镇流器灯座组件 |
DE202005008411U1 (de) | 2005-05-30 | 2005-07-28 | Huang, Hsien-Jung, Yung-Ho | Kühlkörper für ein LED-Leuchtelement |
DE202005006053U1 (de) | 2005-04-15 | 2005-06-30 | Wieland, Friedrich Wilhelm | Energiesparlampe |
DE102005023940B3 (de) | 2005-05-20 | 2007-02-15 | Heraeus Noblelight Gmbh | Direktkühlung eines Amalgamdepots in einem Quecksilber-Niederdruck-Amalgamstrahler |
US7708452B2 (en) | 2006-06-08 | 2010-05-04 | Lighting Science Group Corporation | Lighting apparatus including flexible power supply |
WO2008037940A1 (en) | 2006-09-26 | 2008-04-03 | Ghollam Tahmosybayat | Lamp assembly |
DE202007003679U1 (de) | 2007-03-09 | 2007-05-16 | Hong Kuan Technology Co., Ltd., Sinjhuang City | Leuchtdiodenlampe |
DE102007017900A1 (de) | 2007-04-13 | 2008-10-16 | Noctron Holding S.A. | Leuchtmittel |
DE202007008258U1 (de) | 2007-04-30 | 2007-10-31 | Lumitech Produktion Und Entwicklung Gmbh | LED-Leuchtmittel |
-
2008
- 2008-05-29 DE DE102008025735.4A patent/DE102008025735C5/de active Active
-
2009
- 2009-05-08 EP EP09753783A patent/EP2279376A1/de not_active Withdrawn
- 2009-05-08 WO PCT/EP2009/055601 patent/WO2009144128A1/de active Application Filing
- 2009-05-27 TW TW98117596A patent/TW200949154A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040120148A1 (en) * | 2002-12-18 | 2004-06-24 | Morris Garron K. | Integral ballast lamp thermal management method and apparatus |
EP1881259A1 (de) * | 2006-07-17 | 2008-01-23 | Liquidleds Lighting Co., Ltd. | Hochleistungs-LED-Lampe mit verstärkter Wärmeableitung |
Non-Patent Citations (1)
Title |
---|
See also references of WO2009144128A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW200949154A (en) | 2009-12-01 |
DE102008025735C5 (de) | 2018-03-01 |
WO2009144128A1 (de) | 2009-12-03 |
DE102008025735B4 (de) | 2011-07-28 |
DE102008025735A1 (de) | 2009-12-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2198196B1 (de) | Lampe | |
EP2396590B1 (de) | Leuchtvorrichtung | |
EP2491295B1 (de) | Linienlampe | |
DE202008011979U1 (de) | Montageanordnung eines Leuchtkörpers | |
DE102010030702A1 (de) | Halbleiterlampe | |
EP2780956B1 (de) | Led-modul | |
DE10251955A1 (de) | Einbaumodul mit leistungsstarker LED, insbesondere für ein Kraftfahrzeug | |
DE202008006327U1 (de) | Lampe mit Wärmeaufbau sowie zugehörige Lampenabdeckung | |
DE202010006197U1 (de) | LED-Lampe | |
DE102009056115B4 (de) | Retrofit LED-Lampe mit doppelschichtigem Kühlkörper | |
DE102007040596B4 (de) | Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung | |
DE202010009679U1 (de) | Eine LED-Beleuchtungseinrichtung | |
WO2012016877A2 (de) | Led-lampe | |
DE202013000980U1 (de) | "LED-Retrofit-Lampe" | |
EP2171352B1 (de) | Leuchtmittel | |
DE102007037821A1 (de) | Leuchtmodul | |
DE102008025735B4 (de) | Leuchteinheit | |
DE102011006749A1 (de) | Lampenvorrichtung | |
DE102005060044A1 (de) | LED-Lampe mit hoher Lichtleistung | |
DE102017109836B4 (de) | Leuchtmittel mit Kühlkörper | |
DE102009054620A1 (de) | Lichtmodul zum Einbau in ein Leuchtaggregat | |
EP3578880A1 (de) | Betriebsgerät mit wärmeleitstruktur | |
DE102010047030A1 (de) | Lampe mit variablem Substrat als Untergrund für Lichtquelle | |
WO2011064180A1 (de) | Led-lampe mit stiftsockel für halogenlampen ('bipin') | |
WO2012041734A2 (de) | Modul für eine beleuchtungseinrichtung und beleuchtungseinrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20101020 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM AG |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM GMBH |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM GMBH |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21V 23/00 20060101ALI20140704BHEP Ipc: F21V 3/00 20060101ALI20140704BHEP Ipc: F21V 29/00 20060101ALI20140704BHEP Ipc: F21V 23/02 20060101ALI20140704BHEP Ipc: F21K 99/00 20100101AFI20140704BHEP Ipc: F21Y 101/02 20060101ALI20140704BHEP |
|
17Q | First examination report despatched |
Effective date: 20141015 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20141201 |