EP2279376A1 - Lamp unit - Google Patents

Lamp unit

Info

Publication number
EP2279376A1
EP2279376A1 EP20090753783 EP09753783A EP2279376A1 EP 2279376 A1 EP2279376 A1 EP 2279376A1 EP 20090753783 EP20090753783 EP 20090753783 EP 09753783 A EP09753783 A EP 09753783A EP 2279376 A1 EP2279376 A1 EP 2279376A1
Authority
EP
European Patent Office
Prior art keywords
filler
unit according
light unit
heat
device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20090753783
Other languages
German (de)
French (fr)
Inventor
Harald Dellian
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OSRAM GmbH
Original Assignee
OSRAM GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Priority to DE102008025735.4A priority Critical patent/DE102008025735C5/en
Application filed by OSRAM GmbH filed Critical OSRAM GmbH
Priority to PCT/EP2009/055601 priority patent/WO2009144128A1/en
Publication of EP2279376A1 publication Critical patent/EP2279376A1/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40904209&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2279376(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application status is Withdrawn legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02WCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00Technologies for solid waste management
    • Y02W30/50Reuse, recycling or recovery technologies
    • Y02W30/82Recycling of waste of electrical or electronic equipment [WEEE]
    • Y02W30/823Technologies specific to particular WEEE categories
    • Y02W30/828Lighting equipment or discharge tubes
    • Y02W30/829Lighting devices made of waste or recyclable material

Abstract

A lamp unit is indicated, comprising a socket, an LED module, a device for heat conduction thermally coupled to the socket, a filler material for heat distribution that is thermally coupled at least partially to the LED module and at least partially to the device for heat conduction.

Description

Be s honor nce

light unit

The invention relates to a light-emitting unit, in particular an LED retrofit lamp.

Retrofit lamps are increasingly replacing conventional light bulbs with lamps in particular higher performance. In this case also, the reacted in the retrofit lamps electric power, which in particular to problems in the dissipation of heat from LED modules and of ballasts, which are used to drive the LED modules, leads increases.

For removing heat of electronic ballasts (EBs), it is known to use thermally conductive and electrically insulating filler such as sand or tar. In particular, such heat conduction in Halotronic transformers is known.

It is the object to avoid the aforementioned disadvantages of the present invention, and particularly a way to dissipate heat from heat sources of a lighting unit with heat-sensitive heat sources provide, in particular for

Heat dissipation of lighting modules and electronic modules for example with an LED retrofit lamp.

This object is achieved according to the features of the independent claims. Further developments of the invention arise from the dependent claims.

To achieve the object, a lamp unit is provided, which comprises: - a base, - an LED module, - a device for heat conduction, which is thermally coupled to the base;

- a filler for Wärmverteilung, the at least partially thermally connected to the LED module and at least partially thermally with the device for

Heat conduction is coupled.

The light unit is in particular a retrofit lamp unit with a piston similar or equal to a known shape or contour, for example in the form of a conventional incandescent lamp, wherein the light unit is suitable for use in the conventional lamp holders. The light-emitting unit preferably includes an LED module with a corresponding control (electronic ballast). The LED module comprises at least one light emitting diode. In general, it is in the light unit to how any lamps that can be operated in a socket.

In a development of the filler at least partially comprises a thermally conductive material.

Another development is that the filler comprises sand and / or tar.

Further, it is a further development, that the device for conducting heat comprises at least one probe at least partially protrudes into the filler and / or is at least partially thermally coupled with the filler.

In the context of an additional development, the probe being adapted and arranged to better conduct heat to the base than the mechanical contact to the socket. It is also a further development, the at least one probe is elongate executed in parallel with a neck of the lighting unit and substantially.

It is also a further development, the at least one probe is performed semi-circular and / or cylindrical.

Further, it is a further development, the at least one probe having a tapered edge for engaging the filler. In particular, this facilitates insertion of the probe at an assembly of the light unit.

Another development is that the device for conducting heat comprises a means to limit a space for the filler and to reduce weight.

This enables efficient saving filler and / or weight are reduced.

In the context of an additional development, the device comprises semi-circular for heat conduction and / or cylindrical cold surfaces.

Another development is that the device for conducting heat comprises a holding means for a PCB.

Further, it is a further development, that the circuit board comprises components of an electronic ballast.

It is also a further development, that the holding means has a predetermined electrical isolation of the device for the circuit board to the heat conduction.

Further, it is a further development that the LED module comprises at least one light emitting diode. It is also a further development, that the filler comprises a granular and in particular at least partially reusable filler.

Embodiments of the invention are schematically shown below based on the drawings and explained. Show it:

Fig.l is a sketch of a light source according to an embodiment as a retrofit lamp;

2 shows a sketch of a cooling unit as

Sectional side view;

3 shows a cooling unit according to another embodiment;

4 shows a lighting unit according to a further

Embodiment as a sectional side view.

Fig.l shows a lighting unit 1 with a piston 2, for example made of glass or plastic, in which an LED module 3 is arranged.

The LED module 3 is attached to a holding means 4, for example in the form of a board. The circuit board 4 is thereby so in the piston 2, that it is held with its edge from the piston. By means of the LED module 3 light is emitted in an upper hemisphere of the piston 2 and further to the outside. The piston 2 can be designed clear or milky (opaque).

An upper surface of the board 4 completes an associated the LED module subspace of the piston 2 against one of its bottom associated partial space of the piston. 2 Below the board 4, ie in the direction of the base 5, the piston 2 is at least partially filled with a filler. 6 The filler 6 can be a single filler or a mixture of several fillers or for the same filler with different

Material properties, for example different particle size, etc.

A lower bordering on the base 5 of the piston 2 is configured in the form of a neck. 7

The lighting unit 1 further comprises a device for heat conduction, which projects into the piston 2 and is thermally coupled to the base. 5 In the illustrated case, the device for conducting heat comprises a means for

Limitation to a space for the filler 6 in the form of a closure plate. 8 The end plate 8 is arranged in the embodiment shown at the lower end of the piston 2 or the neck. 7 Through the board 4 and the closure plate 8, the space for the filler 6 (above and below) is limited. The corresponding lateral confinement is achieved by the portion of the piston 2 and the neck 7, the in each case between the two end members, namely, the upper closure element in the form of the circuit board 4 and the lower

Final element in the form of the end plate 8, is located.

Piston side, the apparatus for heat pipe 4 on two semi-cylindrical shell-shaped heat conductor 9, 10, extending from the end plate 8 from vertically upwards through the neck 7 of the piston 2 therethrough and to the flared portion of the piston. 2

In an alternative embodiment, the heat conductor can be designed as a one-piece cylindrical tube section. Between the heat conductors 9, 10 is the end plate 8, a holder 11 for mounting and supply of an electrical circuit board or circuit, in particular a ballast for receiving a printed circuit board or of such an electronic ballast 12th

By the height of the thermal conductor 9, 10, the dimensioning of the galvanic separation to the circuit board 4 is determined decisively. are base: at the

End plate 8, and passed therethrough, thermal coupling elements 13 provided for the thermal coupling, the thermal conductor 9, 10 to the base 5. This thermal coupling elements 13 can be used as a single heat coupling member or in one piece with the

for example, be such thermal conductors 9, 10 run, that the heat conductors are 9, 10 through the end plate 8 to the thermal contact with the base.

During operation of the lighting unit 1, both the LED module 3 and the electronic ballast 12 are heated by the electrical power output. This heat is delivered to the filler 6 that is located between the two covering elements 4. 8 The filler 6 passes the heat to the thermal conductor 9, 10, which in turn transfer the heat to the base. 5 By means of the filler 6 is obtained a fast and efficient heat transfer from the light-emitting unit. 1

Without the heat conductor 9, 10, the filler 6 would distribute the heat evenly only in the lamp 1, the heat generated could then be submitted via cooling fins. Therefore, the use of the thermal conductor 9, 10, which are used in the filler is advantageous. The internal heat sink includes the end plate 8, the heat conductors 9, 10, the holding means 11 for the board and the thermal coupling elements 13 in the direction of the base 5 and thus closes off the space in which the filler is located. 6 On the opposite side of the

End plate 8 are preferably metal surfaces on the base. 5

The thermal conductor 9, 10 are advantageously arranged geometrically semicircular. Also, a cylindrical shape, the thermal conductor 9, 10 favorable. The length of the heat conductor is as large as possible to achieve a large thermal effect using a correspondingly large transition area. Preferably, the length of the heat conductor 9 10 extends up to the area of ​​the galvanic isolation of the electrical components of the ballast 12, preferably 10, the length of the heat conductor 9, about two thirds of the length of the lamp neck 7. The piston-side (upper) ends of the heat conductor 9 , 10 are preferably made pointed so that they can be inserted into the filler (spade effect).

Alternatively, the inner cooling surfaces can be used for the board holder (the Vorschaltergerät).

By the end plate 8 the electrical leads are guided, which are preferably electrically isolated and therefore do not constitute real heat conductor for the light unit. 1

2 shows a device 14 for heat conduction based on the representation according to Fig.l. The apparatus 14 includes the heat conductors 9, 10 which are mounted on the plastic end plate 8 and extending substantially vertically upwards in the direction of the piston (see Fig.l) extend. Further shown are the provided between the heat conductors 9, 10 holder means 11 for the circuit board 12 of an electric ballast and that is leading down towards the base thermal coupling elements. 13

3 shows an alternative embodiment of an apparatus 15 for conducting heat, in which, in contrast to the embodiment according to Figure 2, the heat coupling member 16 or the thermal coupling elements 16 are not arranged obliquely exposed, but directly on the

Underside of the end plate 8 are guided resting laterally to the base. 5 In contrast to Figure 2, a direct contact at the edge of the base is thus established. Again, the thermal coupling elements 16 can be present as separately manufactured components, or parts of a thermal conductor 9, 10 to be.

4 shows another embodiment of a light unit 17 similar to the lighting unit 1 of Fig.l in which the end plate is not arranged 8 at the bottom of the piston 2 and the neck 7, but with respect to a height position, for example centrally in the neck 7 of the piston 2 is.

This embodiment has compared to the first embodiment according to Fig.l the advantage that less filler is required 6, and thus the weight and cost can be saved.

The thermal conductor 9, 10 are passed through the end plate 8, said plate 19 now is preferably divided into two parts due to the reduced overall height of the circuit board 19 of the electronic ballast. Accordingly are located on the end plate 8, two board holder 18 for receiving a corresponding portion of the circuit board 19 for the electronic ballast. In order to provide a good heat dissipation from the lamp 1, there are the components with the highest heat development (loss-most elements of the electronic, drivers) on that part of the circuit board 19, which is located in the space for the filler. 6

LIST OF REFERENCE NUMBERS

1 light unit

2 plunger (eg glass or plastic)

3 LED module

4 holding means, circuit board

5 socket

6 filler

7 cervical

8 endplate

9 heat conductor

10 heat conductor

11 holders

12 ballast or board of the ballast

13 thermal coupling element

14. An apparatus for heat conduction

15 A device for heat conduction

16 thermal coupling element

17 light unit

18 board holder

19 board

Claims

claims
1. lighting unit (1) comprising
- a base (5), - an LED module (3),
is coupled to a device for conducting heat (14, 15) thermally connected to the base (5) -;
- a filler (6) for Wärmverteilung, the at least partially thermally connected to the LED module (3) and at least partially thermally coupled to said device for conducting heat (14, 15), characterized in that the device (for conduction 14, 15 ) at least one probe (9, 10) which at least partially (in the filler 6) protrudes and / or at least partially with the
Filler (6) is thermally coupled.
2. Light unit according to claim 1, wherein the filler
(6) at least partially comprises a thermally conduct Knitting material.
3. Light unit according to one of the preceding claims, wherein the filler comprises (6) sand and / or tar.
4 wherein the at least one probe (9, 10) dissipates heat lamp unit according to claim 3, to the base (5).
5. lighting unit is designed according to one of claims 3 or 4, wherein the at least one probe (9, 10) elongated and substantially parallel to a neck (7) of the lighting unit (1).
6. Light unit according to one of claims 4 to 5, wherein the at least one probe (9, 10) is made semi-circular and / or cylindrical.
7. Light unit according to one of claims 4 to 6, wherein the at least one probe (9, 10) has a tapered edge for engaging the filler (6).
has 8. Light unit according to one of the preceding claims, wherein the device for conducting heat (14, 15) means (8) for defining a space for the filler (6) or to weight reduction.
9. Light unit according to one of the preceding claims, comprising wherein said device for conducting heat (14, 15) semi-circular and / or cylindrical cold surfaces.
10. Light unit according to one of the preceding claims, wherein the device for conducting heat (14, 15)
Holding means (11, 18) for a board (12, 19).
11. Light unit according to claim 10, wherein the board (12, 19) comprises components of an electronic ballast.
12. Light unit according to one of claims 11 or 11, wherein the retaining means (11, 18) for the board (12, 19) a predetermined electrical isolation of the
An apparatus for heat pipe (14, 15).
13. Light unit according to one of the preceding claims, wherein the LED module (3) comprises at least one light emitting diode.
14. Light unit according to one of the preceding claims, wherein the filler (6) comprises a granular and in particular at least partially reusable filler.
EP20090753783 2008-05-29 2009-05-08 Lamp unit Withdrawn EP2279376A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102008025735.4A DE102008025735C5 (en) 2008-05-29 2008-05-29 light unit
PCT/EP2009/055601 WO2009144128A1 (en) 2008-05-29 2009-05-08 Lamp unit

Publications (1)

Publication Number Publication Date
EP2279376A1 true EP2279376A1 (en) 2011-02-02

Family

ID=40904209

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20090753783 Withdrawn EP2279376A1 (en) 2008-05-29 2009-05-08 Lamp unit

Country Status (4)

Country Link
EP (1) EP2279376A1 (en)
DE (1) DE102008025735C5 (en)
TW (1) TW200949154A (en)
WO (1) WO2009144128A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2485164B (en) * 2010-11-03 2017-08-02 Thorpe F W Plc Improvements in or relating to luminaires
DE202011101257U1 (en) * 2011-05-23 2012-05-30 Promotec Gmbh Light-bulbs

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20040120148A1 (en) * 2002-12-18 2004-06-24 Morris Garron K. Integral ballast lamp thermal management method and apparatus
EP1881259A1 (en) * 2006-07-17 2008-01-23 Liquidleds Lighting Co., Ltd. High power LED lamp with heat dissipation enhancement

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US6794801B2 (en) 2001-10-31 2004-09-21 Toshiba Lighting & Technology Corporation Compact selfballasted fluorescent lamp and luminaire
DE10230103B4 (en) 2002-07-04 2012-10-31 Tridonic Ag Power supply for light-emitting diodes
US6787999B2 (en) 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
CN100530857C (en) 2004-11-16 2009-08-19 电灯专利信托有限公司 Energy-saving lamp socket assembly with ballast
DE202005006053U1 (en) 2005-04-15 2005-06-30 Wieland, Friedrich Wilhelm Energy-saving lamp comprises illuminating diodes arranged on plate made from a random base material and fed by a capacitive network part having storage capacitors and a phase controller
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DE202005008411U1 (en) 2005-05-30 2005-07-28 Huang, Hsien-Jung, Yung-Ho Cooling unit for LED-torch, has LED mounted on surface of light module, and cooling unit module with cooling vanes, and closed cavity that is filled with heat dissipating fluid e.g. highly purified water, and encloses lamp housing
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WO2008037940A1 (en) 2006-09-26 2008-04-03 Ghollam Tahmosybayat Lamp assembly
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DE102007017900A1 (en) 2007-04-13 2008-10-16 Noctron Holding S.A. Lamp
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Publication number Priority date Publication date Assignee Title
US20040120148A1 (en) * 2002-12-18 2004-06-24 Morris Garron K. Integral ballast lamp thermal management method and apparatus
EP1881259A1 (en) * 2006-07-17 2008-01-23 Liquidleds Lighting Co., Ltd. High power LED lamp with heat dissipation enhancement

Non-Patent Citations (1)

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Title
See also references of WO2009144128A1 *

Also Published As

Publication number Publication date
TW200949154A (en) 2009-12-01
WO2009144128A1 (en) 2009-12-03
DE102008025735A1 (en) 2009-12-17
DE102008025735C5 (en) 2018-03-01
DE102008025735B4 (en) 2011-07-28

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