EP2198196B1 - Lamp - Google Patents

Description

The invention relates to a lamp, a lamp and a system of lamp and lamp.

To dissipate heat generated in a lamp are various methods such as a thermoelectric cooling or air cooling with a fan, such. In US 2003/040200 A described. However, the previously known are either not very efficient or relatively expensive or bulky.

The US 5,214,354 A shows a control module for controlling the illumination functions of a light bulb and a method for manufacturing the control module.

It is therefore the object of the invention to provide a possibility which has improved thermal properties of light sources, in particular lamps and lights, and at the same time is relatively easy to implement and save space.

This object is achieved by means of a lamp according to claim 1, a luminaire according to claim 11 and a system according to claim 13.

The lamp has a housing and at least one directly or indirectly connected heat source. The lamp further has a base for connection or for engagement with a lamp socket, the socket additionally having at least one heat-conducting surface which does not represent electrical contact, and at least one heat source is thermally conductively connected to at least one heat-dissipating surface which does not represent any electrical contact.

By thermal conductivity is meant in particular a compound which has a coefficient of thermal conductivity of at least 5 W / (m · K), especially higher than about 15 W / (m · K), as is typical for Cr-Ni steel. Also included are the thermal conductivities of thermally conductive pastes, films and Glue. The thermal conductivity makes it possible to dissipate a significant amount of heat from the heat source.

This enables a lamp in which the heat generated in the lamp can be efficiently transmitted via a "socket / socket connection" to the lamp or lighting device to which the lamp is connected during operation. This device does not require voluminous or complex active elements.

The heat source is generally a heat-emitting element and may in particular comprise a light source and / or a driver circuit.

The light source may in particular comprise at least one light-emitting diode and / or one discharge lamp. In the case of a discharge lamp, a compact fluorescent lamp, in particular an electrodeless compact fluorescent lamp (RCFL) or a high intensity discharge lamp (HID) is preferred. Under light emitting diodes here, z. As single-color or white LEDs, are understood, but also groups or clusters of LEDs, which together give an additive color mixing. Examples of LED clusters are clusters of the primary colors R, G and B, in particular of the type RGGB. Also included are chains of interconnected LEDs.

Preferably, the base of the bayonet type, wherein it frontally (ie to the socket facing the (lower) side) protrudes and on which laterally electrical contacts are formed. The electrical contacts are typically electrically isolated from the remainder of the socket. The base can be used outside the electrical contacts completely as a heat dissipation surface. However, it may also be preferred if only one underside (which is opposite the socket) or only side surfaces of the socket serve as a heat dissipation surface. Furthermore, the heat dissipation surface may include one or more localized zones.

It is preferred for reliable electrical contact when the electrical contacts are ironing contacts, which are located on laterally extending from the base webs; in particular if the contacts are arranged on the front side.

The electrical contacts are preferably arranged radially symmetrically around the base. Two or four electrical contacts are preferred, but the arrangement is not limited thereto.

Alternatively, the base can also be designed as a screw base, for example, with a centrally directed downward heat dissipation surface.

Alternatively, a lamp may be preferred in which the socket comprises at least one locking piece for a ball detent.

Furthermore, a socket is preferred which has at least one laterally arranged electrical contact.

Alternatively or additionally, the base may have at least one end face, in particular center, arranged electrical contact.

A lamp is then particularly preferred in which the at least one electrical contact arranged on the underside simultaneously constitutes a heat dissipation surface.

Alternatively, the base may be a socket according to the so-called Gardena principle or construction.

In general, a lamp is preferred in which there is a heat-conducting element for the heat-conductive connection between the at least one heat source and the at least one heat-dissipating surface. The heat-conducting element has a good thermal conductivity A material, in particular one, whose thermal conductivity coefficient is at least about 5 W / (m · K), in particular more than about 15 W / (m · K), as is typical for Cr-Ni steel, and more preferably greater than about 50 W / (m · K), and more preferably greater than 300 W / (m · K), e.g. B. comprising copper.

Preferred is then a heat conducting element comprising a metal line.

However, for a particularly high heat dissipation, a heat-conducting element which has a heat pipe may also be preferred.

Alternatively or additionally, the heat-conducting element comprises the socket, which may have, for example, metallic inner surfaces.

In general, it may be preferred if at least one heat dissipation surface is an electrical contact at the same time.

For effective heat dissipation, however, a lamp may also be preferred in which at least one heat source is applied to a circuit board and the circuit board is mounted directly on the base or on a heat-dissipating housing. This shortens the heat transport path and enhances heat dissipation. The board then preferably has a metal core or a backside metal surface for uniform heat distribution.

For direct and particularly effective heat dissipation, a lamp may also be preferred, in which at least one heat source, eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.

Further preferred is a lamp in which the height of the pedestal is not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.

For effective heat transfer between the lamp and socket, preferably at least one heat dissipation surface is at least partially covered with a thermally conductive film.

Also preferred is a lamp according to one of the preceding claims, which additionally has a cylindrical extension on the base, in which an electronic and / or electrical circuit, or a part thereof, is housed.

The object is also achieved by a lamp socket for receiving a lamp as described above or by a lamp with such a lamp holder.

Preference is given to a lamp with heat dissipation surfaces, which are in thermal contact with the heat dissipation surfaces of the lamp when the lamp is inserted.

Preferably, the heat dissipation surfaces with a cooling element, for. B. a cooling plate or cooling fins of the lamp, are thermally conductively connected.

The object is also achieved by means of a system with a lamp as described above and a lamp as described above.

Preferably, a heat bonding agent is present between the lamp and socket, e.g. Example by means of a thermally conductive paste or in the form of a thermally conductive foil. The film is preferably easily deformable with high elasticity to increase the contact surface or plastically deformable. The heat-bonding agent may be formed as part of the base or as a separate component.

For a tight fit, a system is preferred in which the base of the lamp and the socket at least partially have a shape deviation.

FIG 1

zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß einer ersten Ausführungsform;

FIG 2

zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß einer weiteren Ausführungsform;

FIG 3

zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;

FIG 4

zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;

FIG 5

zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;

FIG 6

zeigt in Ansicht von schräg unten ein Lampengehäuse für eine Lampe mit einem neuartigen Bajonettverschluss;

FIG 7

zeigt in Ansicht von schräg unten ein Lampengehäuse für eine Lampe mit einem neuartigen Bajonettverschluss nach einer weiteren Ausführungsform.

The invention will be explained in more detail schematically in the following exemplary embodiments. The same or equivalent elements can be provided with the same reference numerals. It should be understood that the invention is not limited to the embodiments shown.

FIG. 1

shows a cross-sectional side view of a sketch of a lamp with a lamp according to a first embodiment;

FIG. 2

shows a cross-sectional side view of a sketch of a lamp with a lamp according to another embodiment;

FIG. 3

shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;

FIG. 4

shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;

FIG. 5

shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;

FIG. 6

shows in oblique view from below a lamp housing for a lamp with a novel bayonet closure;

FIG. 7

shows in oblique view from below a lamp housing for a lamp with a novel bayonet lock according to another embodiment.

FIG. 1 shows a lamp 1, which is accommodated in a lamp 2. The lamp 1 has a partially translucent housing 14, which comprises a plurality of light-emitting diodes 3, which are mounted on a circuit board 4 (also called lighting module). A base 5 of the lamp 1 is inserted into a socket 6 of the lamp 2 and thus connected to it electrically and mechanically.

To derive the waste heat generated by the light-emitting diodes 3 during operation, each of the light-emitting diodes 3 is connected to a heat-conducting element 7, via which the waste heat is dissipated through the base 5 into the socket. For this purpose, the base 5 a plurality of heat dissipation surfaces 7a, which correspond to the outer surfaces or lower sides of the heat-conducting elements 7, optionally with an additional layer, for. B. of thermally conductive paste or foil. The heat dissipation surfaces 7a are in good thermal contact with a corresponding thermally conductive zone or multiple zones of the socket. In or from the version 6, the heat is passed on to a cooling zone 8.

In the embodiment shown, the heat-conducting element 7 in each case comprises a heat pipe ("heat pipe"); the socket can have corresponding heat pipes (not shown), which conduct the heat to the cooling zone 8.

In addition, electrical or electronic control components which emit heat may also be connected to the socket via heat-conducting elements 7.

Alternatively, the heat conducting elements are not formed as heat pipes, but have a good heat conducting material, such as copper, silver or gold.

Alternatively, a common heat dissipation surface may be provided for some or all of the heat-conducting elements 7.

FIG. 2 shows an alternative embodiment of a system of lamp 9 and lamp 10, in which now the lamp 9 has a single light emitting diode 3, which is mounted on the board 4 and whose heat is conducted via a copper bolt 11 to the cooling surface 8 of the lamp 10. The copper bolt 11 is connected to the cooling surface 8, z. B. a cooling plate, connected by spring contact; its bottom corresponds to the heat dissipation surface 11a.

The base here comprises a cylindrical extension 12 ("backpack"), in which an electronic and / or electrical circuit, or a part thereof, is housed. In the backpack preferably a ballast, in particular a smoothing capacitor is at least partially included; This also applies when using a fluorescent lamp instead of the LED 3. The version, which is not shown here for clarity, in this case has a corresponding recess. The backpack 12 is designed to heat storage thermally conductive. The backpack 12 also has the electrical or electromechanical contacting and a heat-conducting connection to the lamp or its socket 10.

FIG. 3 shows one too FIG. 2 similar embodiment of a lamp 13, but in which now several LEDs 3 arranged symmetrically about a longitudinal axis A ("LED ring") and are connected directly to the heat-conducting cooling zone 15 of the lamp. The direct arrangement of the cooling zone 15 at the bottom of the housing 2 results in a particularly large cooling surface and a short distance to the heat sources 3. The backpack 16 has here the electrical or electromechanical contact with the socket 14 of the lamp and can parts of the Driver electronics or an electrical record. The heat-conducting elements are present as prestressed copper bolts 11.

FIG. 4 shows a base 17 or the backpack as a base part of a lamp with the matching version 18 of a lamp, which a receptacle 19 for receiving the base 17 and the lamp has. In the receptacle 19 locking balls 20 are present, which hold in fitted socket 17 at this existing locking pieces 21 in the form of protrusions in the socket 18 and in these impressions. When fitted socket 17 are also electrical contacts 22 of the socket 18 and electrical contacts 23 of the base 17 in electrical contact, thus supplying the lamp with power.

For heat dissipation, a heat conductor 24 of the lamp is inserted into a recess of a relatively wider heat conductor 25 of the holder 18. The associated contact surface corresponds to the heat dissipation surface 24a. For improved heat transfer between the base 17 and socket 18, a foil 26 made of heat-conducting metal is present between the heat conductors 24, 25. The heat conductors 24,25 are each formed as heat pipes. The heat conductors 24, 25 may be designed as electrical conductors.

In a variant, the socket may be formed such that a voltage at a first voltage level, for. B. 230 V, is provided and at the bottom or frontal contact, which is formed here by the heat conductor 25, voltage at a second voltage level, for. Thus, the socket 18 without change for lamps with a power supply to the first voltage level with lateral contacts 23 and alternatively for lamps with a power supply to the second voltage level with lower contacts 24 may be suitable.

FIG. 5 shows a further, novel lamp 27, which is fitted into a socket 28 of a lamp. A translucent piston 29 is supported by the lamp housing 30. The base 31 of the lamp 27 cooperates with the socket 28 of the lamp.

The base 31 is of the bayonet type, which has a height h1 at the region engaging or cooperating with the socket 28 and is equipped with base webs 32 which are lateral with respect to a longitudinal axis A.

By means of rotation of the lamp 27 in or the socket 28, the lamp 27 is pressed firmly against the socket 28. To reinforce the pressure, the base 31 and the socket 28 may differ at least in sections from their, here cylindrical, basic shape at the contact area, z. B. be configured slightly conical or elliptical. The height h1 here is less than 5 mm.

FIG. 6 shows the housing 30 and the base 31 from FIG. 5 from diagonally down with higher accuracy. A by the height h1 from the bottom 33 of the actual base 31 protruding bayonet closure element 34 has the webs 32 laterally disposed on its underside. The webs 32 have frontally each have a bracket contact 35 for electrical contacting of the lamp. The bayonet closure element 34 can also be considered as a backpack of height h1. The Bügelkontakte 35 are electrically isolated from the rest of the base 31. Here, the bottom 33 of the base 31 represents the main heat dissipation surface of the lamp.

FIG. 7 shows another novel lamp with bayonet lock. In contrast to the embodiment according to FIG. 6 the contacts 36 are no longer arranged on the webs 32 of the bayonet closure element 34, but on the front-side bottom 33 of the base 31. By appropriate design of the socket (not shown), with complete locking of the lamp in the socket, these lamp contacts 36 with corresponding Contacts on the socket in contacting agreement. Here too, the underside 33 of the base 31 represents the main heat dissipation surface of the lamp.

Of course, the invention is not limited to the embodiments shown or the elements described.

For example, compact fluorescent lamps and / or light-emitting diodes can be used as light sources; however, other suitable light sources may be used.

The driver circuit is not limited to a particular embodiment, and may include any suitable electrical and / or electronic elements. For example, an arrangement of LEDs connected in antiparallel is particularly preferred. The driver circuit can also comprise, for example, a simple rectifier, in which the light-emitting diode, the light-emitting diode cluster or the LED chain are preferably arranged in a branch of the rectifier. Also, the driver preferably includes a current limiter, e.g. B. a resistor or a current regulator. Also, the driver may include a switched-mode power supply, preferably a so-called flyback converter.

The board may comprise a substrate of, for example, PCB, FR4 or MC-PCB.

The base preferably has a very low overall height for insertion into a corresponding socket. This can preferably, in particular without a backpack measured to 15 mm in height. In the event that a backpack is used, a greater height may be advantageous because the backpack is sunk as a base part in the recess provided for the socket.

The number and / or arrangement of the contacts of both the lamp and the socket may be associated with coding information, e.g. B. with respect to the lamp type or a voltage class.

In particular, the heat pipes ("heat pipes"), but also other metallic Wärmeableitelemente, can also be generally designed as electrical contacts. The heat sinks may also comprise non-metallic conductive elements, e.g. B. electrically conductive ceramics.

LIST OF REFERENCE NUMBERS

1

lamp

2

lamp

3

led

4

circuit board

5

base

6

version

7

heat pipe

7a

heat dissipation

8th

cooling element

9

lamp

10

lamp

11

copper bolts

11a

heat dissipation

12

backpack

13

lamp

14

casing

15

cooling zone

16

backpack

17

base

18

version

19

recess

20

detent balls

21

locking piece

22

electric contact

23

electric contact

24

heat conductor

24a

heat dissipation

25

heat conductor

26

foil

27

lamp

28

version

29

piston

30

casing

31

base

32

socket bar

33

Bottom of the socket

34

Bayonet coupling element

35

Ironing Contact

36

electric contact

A

longitudinal axis

h1

Height of the engagement area of the base

Claims (15)

1. Lamp (1; 9; 13; 27) having at least one housing (14; 30) and a heat source connected thereto as well as a base (5; 17; 31) for connection to a lamp socket (6; 18; 28), wherein

   - the base (5; 17; 31) has at least one electrical contact (22; 35; 36),
   characterised in that
   the base additionally has at least one heat dissipation surface (7a; 11a; 24a; 33) which does not constitute an electrical contact, and
   wherein the heat source comprising at least one light source (3) and/or driver circuit is thermally conductively connected to at least one of the heat dissipation surfaces (7a; 11a; 24a; 33) which do not constitute an electrical contact.
2. Lamp (27) according to claim 1, wherein

   - the base is a bayonet base (31), in which a bayonet locking element (34) projects at the end face, on which electrical contacts (35) are formed laterally, and wherein

   - an underside (33) of the bayonet socket (31) which is electrically insulated from the electrical contacts (35) constitutes a heat dissipation surface.
3. Lamp according to claim 1, wherein

   - the base is a bayonet base (31) in which a bayonet locking element (34) protrudes at the front,

   - electrical contacts (36) are formed on an underside (33) of the bayonet socket (31) surrounding the bayonet locking element (34), and

   - the underside (33) of the bayonet socket (31) outside the electrical contacts (36) constitutes a heat dissipation surface electrically insulated with respect to the contacts (36) .
4. Lamp (27) according to one of claims 2 to 3, the bayonet base (31) serving completely as a heat dissipation surface outside the electrical contacts (35; 36).
5. Lamp according to claim 1, the base (17) comprising at least one locking piece (21) for a ball locking device, the base (17) having at least one laterally arranged electrical contact (23) and a heat dissipation surface (24) which is arranged on the end face and does not constitute an electrical contact.
6. Lamp (1; 9; 13; 27) according to one of the preceding claims, the height (h1) of at least the part of the base (5; 17; 31) engaging with a socket being not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.
7. Lamp according to one of the preceding claims, wherein at least one heat dissipation surface (24a) is at least partially covered with a thermally conductive film (26).
8. Lamp (9;13) according to one of the preceding claims, further comprising a cylindrical extension (12;16) at the base in which an electronic and/or electrical circuit, or part thereof, is accommodated.
9. Lamp (9; 13) according to one of the preceding claims, wherein the at least one light source (3) and/or driver circuit is heat-conductively connected to the at least one heat dissipation surface (7a; 11a; 24a; 33) via at least one heat conducting element (7) in the form of at least one heat pipe.
10. Lamp (9; 13) according to one of the preceding claims, wherein the at least one light source (3) and/or driver circuit is heat-conductively connected to the at least one heat-dissipating surface (7a; 11a; 24a; 33) via at least one heat-conducting element (7) made of a well heat-conducting metallic material.
11. Luminaire (2; 10) having a lamp socket (6; 18; 28) for receiving a lamp (1; 9; 13; 27) according to one of the preceding claims with heat dissipation surfaces which do not constitute an electrical contact and which, when the lamp (1; 9; 13; 27) is inserted, are in thermal contact with the heat dissipation surfaces (7a; 11a; 24a; 33) of the lamp (1; 9; 13; 27), the heat dissipation surfaces of which are connected in a heat-conducting manner to a cooling element (8).
12. Luminaire according to Claim 11, the heat dissipation surfaces of the luminaire (2; 10) being connected in a heat-conducting manner to the cooling element (8) via at least one heat pipe.
13. System comprising a lamp (1; 9; 13; 27) according to one of claims 1 to 10 and a luminaire (2; 10) according to one of claims 11 to 12.
14. System according to claim 13, wherein between the base (5; 17; 31) of the lamp (1; 9; 13; 27) and the socket (6; 18; 28) of the luminaire (2; 10) there is a heat-bonding means (26), wherein the heat-bonding means comprises a heat-conductive paste and/or a heat-conductive film (26).
15. System according to one of claims 13 to 14, wherein the base (5; 17; 31; 36) of the lamp (1; 9; 13; 27) and the socket (6; 18; 28) of the luminaire (2; 10) have a shape deviation at least in sections.

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