EP2198196B1 - Lamp - Google Patents
Lamp Download PDFInfo
- Publication number
- EP2198196B1 EP2198196B1 EP08801964.1A EP08801964A EP2198196B1 EP 2198196 B1 EP2198196 B1 EP 2198196B1 EP 08801964 A EP08801964 A EP 08801964A EP 2198196 B1 EP2198196 B1 EP 2198196B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lamp
- heat
- base
- socket
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a lamp, a lamp and a system of lamp and lamp.
- thermoelectric cooling or air cooling with a fan, such.
- air cooling with a fan
- the US 5,214,354 A shows a control module for controlling the illumination functions of a light bulb and a method for manufacturing the control module.
- the lamp has a housing and at least one directly or indirectly connected heat source.
- the lamp further has a base for connection or for engagement with a lamp socket, the socket additionally having at least one heat-conducting surface which does not represent electrical contact, and at least one heat source is thermally conductively connected to at least one heat-dissipating surface which does not represent any electrical contact.
- thermal conductivity is meant in particular a compound which has a coefficient of thermal conductivity of at least 5 W / (m ⁇ K), especially higher than about 15 W / (m ⁇ K), as is typical for Cr-Ni steel. Also included are the thermal conductivities of thermally conductive pastes, films and Glue. The thermal conductivity makes it possible to dissipate a significant amount of heat from the heat source.
- This device does not require voluminous or complex active elements.
- the heat source is generally a heat-emitting element and may in particular comprise a light source and / or a driver circuit.
- the light source may in particular comprise at least one light-emitting diode and / or one discharge lamp.
- a discharge lamp a compact fluorescent lamp, in particular an electrodeless compact fluorescent lamp (RCFL) or a high intensity discharge lamp (HID) is preferred.
- RCFL electrodeless compact fluorescent lamp
- HID high intensity discharge lamp
- z As single-color or white LEDs, are understood, but also groups or clusters of LEDs, which together give an additive color mixing. Examples of LED clusters are clusters of the primary colors R, G and B, in particular of the type RGGB. Also included are chains of interconnected LEDs.
- the base of the bayonet type wherein it frontally (ie to the socket facing the (lower) side) protrudes and on which laterally electrical contacts are formed.
- the electrical contacts are typically electrically isolated from the remainder of the socket.
- the base can be used outside the electrical contacts completely as a heat dissipation surface.
- the heat dissipation surface may include one or more localized zones.
- the electrical contacts are ironing contacts, which are located on laterally extending from the base webs; in particular if the contacts are arranged on the front side.
- the electrical contacts are preferably arranged radially symmetrically around the base. Two or four electrical contacts are preferred, but the arrangement is not limited thereto.
- the base can also be designed as a screw base, for example, with a centrally directed downward heat dissipation surface.
- a lamp may be preferred in which the socket comprises at least one locking piece for a ball detent.
- a socket which has at least one laterally arranged electrical contact.
- the base may have at least one end face, in particular center, arranged electrical contact.
- a lamp is then particularly preferred in which the at least one electrical contact arranged on the underside simultaneously constitutes a heat dissipation surface.
- the base may be a socket according to the so-called Gardena principle or construction.
- a lamp in which there is a heat-conducting element for the heat-conductive connection between the at least one heat source and the at least one heat-dissipating surface.
- the heat-conducting element has a good thermal conductivity A material, in particular one, whose thermal conductivity coefficient is at least about 5 W / (m ⁇ K), in particular more than about 15 W / (m ⁇ K), as is typical for Cr-Ni steel, and more preferably greater than about 50 W / (m ⁇ K), and more preferably greater than 300 W / (m ⁇ K), e.g. B. comprising copper.
- a heat conducting element comprising a metal line.
- a heat-conducting element which has a heat pipe may also be preferred.
- the heat-conducting element comprises the socket, which may have, for example, metallic inner surfaces.
- At least one heat dissipation surface is an electrical contact at the same time.
- a lamp may also be preferred in which at least one heat source is applied to a circuit board and the circuit board is mounted directly on the base or on a heat-dissipating housing. This shortens the heat transport path and enhances heat dissipation.
- the board then preferably has a metal core or a backside metal surface for uniform heat distribution.
- a lamp may also be preferred, in which at least one heat source, eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.
- at least one heat source eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.
- the height of the pedestal is not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.
- At least one heat dissipation surface is at least partially covered with a thermally conductive film.
- a lamp according to one of the preceding claims which additionally has a cylindrical extension on the base, in which an electronic and / or electrical circuit, or a part thereof, is housed.
- the object is also achieved by a lamp socket for receiving a lamp as described above or by a lamp with such a lamp holder.
- the heat dissipation surfaces with a cooling element for. B. a cooling plate or cooling fins of the lamp, are thermally conductively connected.
- the object is also achieved by means of a system with a lamp as described above and a lamp as described above.
- a heat bonding agent is present between the lamp and socket, e.g. Example by means of a thermally conductive paste or in the form of a thermally conductive foil.
- the film is preferably easily deformable with high elasticity to increase the contact surface or plastically deformable.
- the heat-bonding agent may be formed as part of the base or as a separate component.
- a system is preferred in which the base of the lamp and the socket at least partially have a shape deviation.
- FIG. 1 shows a lamp 1, which is accommodated in a lamp 2.
- the lamp 1 has a partially translucent housing 14, which comprises a plurality of light-emitting diodes 3, which are mounted on a circuit board 4 (also called lighting module).
- a base 5 of the lamp 1 is inserted into a socket 6 of the lamp 2 and thus connected to it electrically and mechanically.
- each of the light-emitting diodes 3 is connected to a heat-conducting element 7, via which the waste heat is dissipated through the base 5 into the socket.
- the base 5 a plurality of heat dissipation surfaces 7a, which correspond to the outer surfaces or lower sides of the heat-conducting elements 7, optionally with an additional layer, for. B. of thermally conductive paste or foil.
- the heat dissipation surfaces 7a are in good thermal contact with a corresponding thermally conductive zone or multiple zones of the socket. In or from the version 6, the heat is passed on to a cooling zone 8.
- the heat-conducting element 7 in each case comprises a heat pipe ("heat pipe"); the socket can have corresponding heat pipes (not shown), which conduct the heat to the cooling zone 8.
- electrical or electronic control components which emit heat may also be connected to the socket via heat-conducting elements 7.
- the heat conducting elements are not formed as heat pipes, but have a good heat conducting material, such as copper, silver or gold.
- a common heat dissipation surface may be provided for some or all of the heat-conducting elements 7.
- FIG. 2 shows an alternative embodiment of a system of lamp 9 and lamp 10, in which now the lamp 9 has a single light emitting diode 3, which is mounted on the board 4 and whose heat is conducted via a copper bolt 11 to the cooling surface 8 of the lamp 10.
- the copper bolt 11 is connected to the cooling surface 8, z.
- B. a cooling plate, connected by spring contact; its bottom corresponds to the heat dissipation surface 11a.
- the base here comprises a cylindrical extension 12 ("backpack"), in which an electronic and / or electrical circuit, or a part thereof, is housed.
- a ballast in particular a smoothing capacitor is at least partially included; This also applies when using a fluorescent lamp instead of the LED 3.
- the version which is not shown here for clarity, in this case has a corresponding recess.
- the backpack 12 is designed to heat storage thermally conductive.
- the backpack 12 also has the electrical or electromechanical contacting and a heat-conducting connection to the lamp or its socket 10.
- FIG. 3 shows one too FIG. 2 similar embodiment of a lamp 13, but in which now several LEDs 3 arranged symmetrically about a longitudinal axis A ("LED ring") and are connected directly to the heat-conducting cooling zone 15 of the lamp.
- the direct arrangement of the cooling zone 15 at the bottom of the housing 2 results in a particularly large cooling surface and a short distance to the heat sources 3.
- the backpack 16 has here the electrical or electromechanical contact with the socket 14 of the lamp and can parts of the Driver electronics or an electrical record.
- the heat-conducting elements are present as prestressed copper bolts 11.
- FIG. 4 shows a base 17 or the backpack as a base part of a lamp with the matching version 18 of a lamp, which a receptacle 19 for receiving the base 17 and the lamp has.
- locking balls 20 are present, which hold in fitted socket 17 at this existing locking pieces 21 in the form of protrusions in the socket 18 and in these impressions.
- fitted socket 17 are also electrical contacts 22 of the socket 18 and electrical contacts 23 of the base 17 in electrical contact, thus supplying the lamp with power.
- a heat conductor 24 of the lamp is inserted into a recess of a relatively wider heat conductor 25 of the holder 18.
- the associated contact surface corresponds to the heat dissipation surface 24a.
- a foil 26 made of heat-conducting metal is present between the heat conductors 24, 25.
- the heat conductors 24,25 are each formed as heat pipes.
- the heat conductors 24, 25 may be designed as electrical conductors.
- the socket may be formed such that a voltage at a first voltage level, for. B. 230 V, is provided and at the bottom or frontal contact, which is formed here by the heat conductor 25, voltage at a second voltage level, for.
- a voltage at a first voltage level for. B. 230 V
- the socket 18 without change for lamps with a power supply to the first voltage level with lateral contacts 23 and alternatively for lamps with a power supply to the second voltage level with lower contacts 24 may be suitable.
- FIG. 5 shows a further, novel lamp 27, which is fitted into a socket 28 of a lamp.
- a translucent piston 29 is supported by the lamp housing 30.
- the base 31 of the lamp 27 cooperates with the socket 28 of the lamp.
- the base 31 is of the bayonet type, which has a height h1 at the region engaging or cooperating with the socket 28 and is equipped with base webs 32 which are lateral with respect to a longitudinal axis A.
- the base 31 and the socket 28 may differ at least in sections from their, here cylindrical, basic shape at the contact area, z. B. be configured slightly conical or elliptical.
- the height h1 here is less than 5 mm.
- FIG. 6 shows the housing 30 and the base 31 from FIG. 5 from diagonally down with higher accuracy.
- a by the height h1 from the bottom 33 of the actual base 31 protruding bayonet closure element 34 has the webs 32 laterally disposed on its underside.
- the webs 32 have frontally each have a bracket contact 35 for electrical contacting of the lamp.
- the bayonet closure element 34 can also be considered as a backpack of height h1.
- the Bügelessor 35 are electrically isolated from the rest of the base 31.
- the bottom 33 of the base 31 represents the main heat dissipation surface of the lamp.
- FIG. 7 shows another novel lamp with bayonet lock.
- the contacts 36 are no longer arranged on the webs 32 of the bayonet closure element 34, but on the front-side bottom 33 of the base 31.
- the socket not shown
- these lamp contacts 36 with corresponding Contacts on the socket in contacting agreement.
- the underside 33 of the base 31 represents the main heat dissipation surface of the lamp.
- compact fluorescent lamps and / or light-emitting diodes can be used as light sources; however, other suitable light sources may be used.
- the driver circuit is not limited to a particular embodiment, and may include any suitable electrical and / or electronic elements. For example, an arrangement of LEDs connected in antiparallel is particularly preferred.
- the driver circuit can also comprise, for example, a simple rectifier, in which the light-emitting diode, the light-emitting diode cluster or the LED chain are preferably arranged in a branch of the rectifier.
- the driver preferably includes a current limiter, e.g. B. a resistor or a current regulator.
- the driver may include a switched-mode power supply, preferably a so-called flyback converter.
- the board may comprise a substrate of, for example, PCB, FR4 or MC-PCB.
- the base preferably has a very low overall height for insertion into a corresponding socket. This can preferably, in particular without a backpack measured to 15 mm in height. In the event that a backpack is used, a greater height may be advantageous because the backpack is sunk as a base part in the recess provided for the socket.
- the number and / or arrangement of the contacts of both the lamp and the socket may be associated with coding information, e.g. B. with respect to the lamp type or a voltage class.
- heat pipes but also other metallic sauceableitium
- the heat sinks may also comprise non-metallic conductive elements, e.g. B. electrically conductive ceramics.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Description
Die Erfindung betrifft eine Lampe, eine Leuchte und ein System aus Lampe und Leuchte.The invention relates to a lamp, a lamp and a system of lamp and lamp.
Zur Abführung von in einer Lampe erzeugten Wärme sind verschiedene Methoden wie eine thermoelektrische Kühlung oder eine Luftkühlung mit einem Lüfter, wie z. B. in
Die
Es ist daher die Aufgabe der Erfindung, eine Möglichkeit vorzusehen, die verbesserte thermische Eigenschaften von Leuchtmitteln, insbesondere Lampen und Leuchten, aufweist und gleichzeitig vergleichsweise einfach implementierbar und platzsparend ist.It is therefore the object of the invention to provide a possibility which has improved thermal properties of light sources, in particular lamps and lights, and at the same time is relatively easy to implement and save space.
Diese Aufgabe wird mittels einer Lampe nach Anspruch 1, einer Leuchte nach Anspruch 11 und eines Systems nach Anspruch 13 gelöst.This object is achieved by means of a lamp according to claim 1, a luminaire according to
Die Lampe weist ein Gehäuse und mindestens eine damit direkt oder indirekt verbundene Wärmequelle auf. Die Lampe weist ferner einen Sockel zur Verbindung bzw. zum Eingriff mit einer Lampenfassung auf, wobei der Sockel zusätzlich mindestens eine keinen elektrischen Kontakt darstellende Wärmeableitfläche aufweist und mindestens eine Wärmequelle mit mindestens einer dieser keinen elektrischen Kontakt darstellenden Wärmeableitflächen wärmeleitfähig verbunden ist.The lamp has a housing and at least one directly or indirectly connected heat source. The lamp further has a base for connection or for engagement with a lamp socket, the socket additionally having at least one heat-conducting surface which does not represent electrical contact, and at least one heat source is thermally conductively connected to at least one heat-dissipating surface which does not represent any electrical contact.
Unter wärmeleitfähig wird insbesondere eine Verbindung verstanden, welche einen Wärmeleitfähigkeitskoeffizienten von mindestens 5 W/(m·K), speziell von höher als ca. 15 W/(m·K), wie er für Cr-Ni-Stahl typisch ist. Umfasst sind auch die Wärmeleitfähigkeiten thermisch leitfähiger Pasten, Folien und Kleber. Die Wärmeleitfähigkeit ermöglicht es, eine signifikante Wärmemenge von der Wärmequelle abzuleiten.By thermal conductivity is meant in particular a compound which has a coefficient of thermal conductivity of at least 5 W / (m · K), especially higher than about 15 W / (m · K), as is typical for Cr-Ni steel. Also included are the thermal conductivities of thermally conductive pastes, films and Glue. The thermal conductivity makes it possible to dissipate a significant amount of heat from the heat source.
Dadurch wird eine Lampe ermöglicht, bei der die in der Lampe erzeugte Wärme effizient über eine "Sockel/Fassung-Verbindung" auf die Leuchte bzw. Leuchtvorrichtung übertragen werden kann, an der die Lampe während des Betriebs angeschlossen ist. Diese Vorrichtung kommt ohne voluminöse oder aufwändige aktive Elemente aus.This enables a lamp in which the heat generated in the lamp can be efficiently transmitted via a "socket / socket connection" to the lamp or lighting device to which the lamp is connected during operation. This device does not require voluminous or complex active elements.
Die Wärmequelle ist allgemein ein Wärme abgebendes Element und kann insbesondere eine Lichtquelle und / oder eine Treiberschaltung umfassen.The heat source is generally a heat-emitting element and may in particular comprise a light source and / or a driver circuit.
Die Lichtquelle kann insbesondere mindestens eine Leuchtdiode und / oder eine Entladungslampe umfassen. Im Fall einer Entladungslampe wird eine Kompaktleuchtstofflampe, insbesondere eine elektrodenlose Kompaktleuchtstofflampe (RCFL) oder eine High Intensity Discharge Lampe (HID) bevorzugt. Unter Leuchtdiode können hier einzelne Leuchtdioden, z. B. einfarbige oder weisse LEDs, verstanden werden, aber auch Gruppen bzw. Cluster von LEDs, die zusammen eine additive Farbmischung ergeben. Beispielse für LED-Cluster sind Cluster aus den Grundfarben R, G und B, insbesondere der Art RGGB. Auch umfasst sind Ketten aus zusammengeschalteten LEDs.The light source may in particular comprise at least one light-emitting diode and / or one discharge lamp. In the case of a discharge lamp, a compact fluorescent lamp, in particular an electrodeless compact fluorescent lamp (RCFL) or a high intensity discharge lamp (HID) is preferred. Under light emitting diodes here, z. As single-color or white LEDs, are understood, but also groups or clusters of LEDs, which together give an additive color mixing. Examples of LED clusters are clusters of the primary colors R, G and B, in particular of the type RGGB. Also included are chains of interconnected LEDs.
Vorzugsweise ist der Sockel vom Bajonett-Typ, wobei er stirnseitig (also zu der der Fassung zugewandten (unteren) Seite) hervorragt und an welchem seitlich elektrische Kontakte ausgebildet sind. Die elektrischen Kontakte sind typischerweise vom übrigen Sockel elektrisch isoliert. Der Sockel kann außerhalb der elektrischen Kontakte vollständig als Wärmeableitfläche dienen. Es kann aber auch bevorzugt sein, wenn nur eine Unterseite (die der Fassung gegenüberliegt) oder nur Seitenflächen des Sockels als Wärmeableitfläche dienen. Ferner kann die Wärmeableitfläche eine oder mehrere lokal begrenzte Zonen umfassen.Preferably, the base of the bayonet type, wherein it frontally (ie to the socket facing the (lower) side) protrudes and on which laterally electrical contacts are formed. The electrical contacts are typically electrically isolated from the remainder of the socket. The base can be used outside the electrical contacts completely as a heat dissipation surface. However, it may also be preferred if only one underside (which is opposite the socket) or only side surfaces of the socket serve as a heat dissipation surface. Furthermore, the heat dissipation surface may include one or more localized zones.
Es wird zur verlässlichen elektrischen Kontaktierung bevorzugt, wenn die elektrischen Kontakte Bügelkontakte sind, die sich an seitlich vom Sockel erstreckenden Stegen befinden; insbesondere falls die Kontakte stirnseitig angeordnet sind.It is preferred for reliable electrical contact when the electrical contacts are ironing contacts, which are located on laterally extending from the base webs; in particular if the contacts are arranged on the front side.
Die elektrischen Kontakte sind vorzugsweise radialsymmetrisch um den Sockel herum angeordnet. Bevorzugt werden zwei oder vier elektrische Kontakte, die Anordnung ist aber nicht darauf beschränkt.The electrical contacts are preferably arranged radially symmetrically around the base. Two or four electrical contacts are preferred, but the arrangement is not limited thereto.
Der Sockel kann alternativ aber auch als Schraubsockel ausgeführt sein, beispielsweise mit einer mittig nach unten gerichteten Wärmeableitfläche.Alternatively, the base can also be designed as a screw base, for example, with a centrally directed downward heat dissipation surface.
Alternativ kann eine Lampe bevorzugt sein, bei welcher der Sockel mindestens ein Arretierungsstück bzw. Arretierungsgegenstück für eine Kugelarretierung umfasst.Alternatively, a lamp may be preferred in which the socket comprises at least one locking piece for a ball detent.
Bevorzugt wird ferner ein Sockel, der mindestens einen seitlich angeordneten elektrischen Kontakt aufweist.Furthermore, a socket is preferred which has at least one laterally arranged electrical contact.
Alternativ oder zusätzlich kann der Sockel mindestens einen stirnseitig, insbesondere mittig, angeordneten elektrischen Kontakt aufweist.Alternatively or additionally, the base may have at least one end face, in particular center, arranged electrical contact.
Besonders bevorzugt wird dann eine Lampe, bei welcher der mindestens eine unterseitig angeordnete elektrische Kontakt gleichzeitig eine Wärmeableitfläche darstellt.A lamp is then particularly preferred in which the at least one electrical contact arranged on the underside simultaneously constitutes a heat dissipation surface.
Alternativ kann der Sockel ein Sockel nach dem sog. Gardena-Prinzip bzw. -Aufbau sein.Alternatively, the base may be a socket according to the so-called Gardena principle or construction.
Bevorzugt wird allgemein eine Lampe, bei der zur wärmeleitfähigen Verbindung zwischen der mindestens einen Wärmequelle und der mindestens einen Wärmeableitfläche ein Wärmeleitelement vorhanden ist. Das Wärmeleitelement weist ein gut wärmeleitfähiges Material auf, insbesondere eines, dessen einen Wärmeleitfähigkeitskoeffizienten mindestens ca. 5 W/(m·K) beträgt, insbesondere mehr als ca. 15 W/(m·K), wie er für Cr-Ni-Stahl typisch ist, und noch bevorzugter von mehr als ca. 50 W/(m·K) und speziell bevorzugt von mehr als 300 W/(m·K), z. B. umfassend Kupfer.In general, a lamp is preferred in which there is a heat-conducting element for the heat-conductive connection between the at least one heat source and the at least one heat-dissipating surface. The heat-conducting element has a good thermal conductivity A material, in particular one, whose thermal conductivity coefficient is at least about 5 W / (m · K), in particular more than about 15 W / (m · K), as is typical for Cr-Ni steel, and more preferably greater than about 50 W / (m · K), and more preferably greater than 300 W / (m · K), e.g. B. comprising copper.
Bevorzugt wird dann ein Wärmeleitelement, das eine Metallleitung umfasst.Preferred is then a heat conducting element comprising a metal line.
Bevorzugt kann zur besonders hohen Wärmeableitung aber auch ein Wärmeleitelement sein, das ein Wärmerohr aufweist.However, for a particularly high heat dissipation, a heat-conducting element which has a heat pipe may also be preferred.
Alternativ oder zusätzlich umfasst das Wärmeleitelement die Fassung, die beispielsweise metallische Innenflächen aufweisen kann.Alternatively or additionally, the heat-conducting element comprises the socket, which may have, for example, metallic inner surfaces.
Allgemein kann es bevorzugt sein, wenn mindestens eine Wärmeableitfläche gleichzeitig ein elektrischer Kontakt ist.In general, it may be preferred if at least one heat dissipation surface is an electrical contact at the same time.
Zur effektiven Wärmeableitung kann aber auch eine Lampe bevorzugt sein, bei der mindestens eine Wärmequelle auf einer Platine aufgebracht ist und die Platine direkt am Sockel oder an einem wärmeableitenden Gehäuse angebracht ist. Dadurch wird der Wärmetransportweg verkürzt und die Wärmeabführ verstärkt. Die Platine weist dann vorzugsweise eine Metallkern oder eine rückseitige Metalloberfläche zur gleichmäßigen Wärmeverteilung auf.For effective heat dissipation, however, a lamp may also be preferred in which at least one heat source is applied to a circuit board and the circuit board is mounted directly on the base or on a heat-dissipating housing. This shortens the heat transport path and enhances heat dissipation. The board then preferably has a metal core or a backside metal surface for uniform heat distribution.
Zur direkten und besonders effektiven Wärmeableitung kann a-ber auch eine Lampe bevorzugt sein, bei der mindestens eine Wärmequelle, z. B. eine LED, eine Leuchtstoffröhre oder eine Treiberelektronik, direkt am wärmeleitenden Gehäuse oder am Sockel angebracht ist, z. B. mittels eines wärmeleitfähigen Klebstoffs.For direct and particularly effective heat dissipation, a lamp may also be preferred, in which at least one heat source, eg. As an LED, a fluorescent tube or driver electronics, is attached directly to the heat-conducting housing or the base, z. B. by means of a thermally conductive adhesive.
Ferner bevorzugt wird eine Lampe, bei der die Höhe des Sockels nicht mehr als 15 mm beträgt, vorzugsweise weniger als 9 mm, noch bevorzugter weniger als 5 mm.Further preferred is a lamp in which the height of the pedestal is not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.
Zum effektiven Wärmeübertrag zwischen Lampe und Fassung ist vorzugsweise mindestens eine Wärmeableitfläche zumindest teilweise mit einer wärmeleitfähigen Folie bedeckt.For effective heat transfer between the lamp and socket, preferably at least one heat dissipation surface is at least partially covered with a thermally conductive film.
Bevorzugt wird zudem eine Lampe nach einem der vorhergehenden Ansprüche, die zusätzlich eine zylindrische Verlängerung am Sockel aufweist, in welcher eine elektronische und / oder elektrische Schaltung, oder ein Teil davon, untergebracht ist.Also preferred is a lamp according to one of the preceding claims, which additionally has a cylindrical extension on the base, in which an electronic and / or electrical circuit, or a part thereof, is housed.
Die Aufgabe wird auch durch eine Lampenfassung zur Aufnahme einer Lampe wie oben beschrieben bzw. durch eine Leuchte mit einer solchen Lampenfassung gelöst.The object is also achieved by a lamp socket for receiving a lamp as described above or by a lamp with such a lamp holder.
Bevorzugt wird eine Leuchte mit Wärmeableitflächen, welche bei eingesetzter Lampe mit den Wärmeableitflächen der Lampe in thermischem Kontakt stehen.Preference is given to a lamp with heat dissipation surfaces, which are in thermal contact with the heat dissipation surfaces of the lamp when the lamp is inserted.
Bevorzugt sind die Wärmeableitflächen mit einem Kühlelement, z. B. einem Kühlblech oder Kühlrippen der Leuchte, wärmeleitend verbunden sind.Preferably, the heat dissipation surfaces with a cooling element, for. B. a cooling plate or cooling fins of the lamp, are thermally conductively connected.
Die Aufgabe wird auch gelöst mittels eines Systems mit einer Lampe wie oben beschrieben und einer Leuchte wie oben beschrieben.The object is also achieved by means of a system with a lamp as described above and a lamp as described above.
Vorzugsweise ist zwischen Lampe und Fassung ein Wärmeanbindungsmittel vorhanden, z. B. mittels einer wärmeleitenden Paste oder in Form einer wärmeleitfähigen Folie. Die Folie ist vorzugsweise leicht verformbar mit hoher Elastizität zur Vergrößerung der Kontaktfläche oder plastisch verforbar. Das Wärmeanbindungsmittel kann als Teil des Sockels oder als separates Bauteil ausgebildet sein.Preferably, a heat bonding agent is present between the lamp and socket, e.g. Example by means of a thermally conductive paste or in the form of a thermally conductive foil. The film is preferably easily deformable with high elasticity to increase the contact surface or plastically deformable. The heat-bonding agent may be formed as part of the base or as a separate component.
Zur festen Passung wird ein System bevorzugt, bei dem der Sockel der Lampe und die Fassung zumindest abschnittsweise eine Formabweichung aufweisen.For a tight fit, a system is preferred in which the base of the lamp and the socket at least partially have a shape deviation.
Die Erfindung wird in den folgenden Ausführungsbeispielen schematisch genauer ausgeführt. Dabei können gleiche oder gleichwirkende Elemente mit gleichen Bezugsziffern versehen sein. Es sollte klar sein, dass die Erfindung nicht auf die gezeigten Ausführungsformen beschränkt ist.
- FIG 1
- zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß einer ersten Ausführungsform;
- FIG 2
- zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß einer weiteren Ausführungsform;
- FIG 3
- zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;
- FIG 4
- zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;
- FIG 5
- zeigt als Querschnitt in Seitenansicht eine Skizze einer Leuchte mit einer Lampe gemäß noch einer weiteren Ausführungsform;
- FIG 6
- zeigt in Ansicht von schräg unten ein Lampengehäuse für eine Lampe mit einem neuartigen Bajonettverschluss;
- FIG 7
- zeigt in Ansicht von schräg unten ein Lampengehäuse für eine Lampe mit einem neuartigen Bajonettverschluss nach einer weiteren Ausführungsform.
- FIG. 1
- shows a cross-sectional side view of a sketch of a lamp with a lamp according to a first embodiment;
- FIG. 2
- shows a cross-sectional side view of a sketch of a lamp with a lamp according to another embodiment;
- FIG. 3
- shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;
- FIG. 4
- shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;
- FIG. 5
- shows a cross-sectional side view of a sketch of a lamp with a lamp according to yet another embodiment;
- FIG. 6
- shows in oblique view from below a lamp housing for a lamp with a novel bayonet closure;
- FIG. 7
- shows in oblique view from below a lamp housing for a lamp with a novel bayonet lock according to another embodiment.
Zur Ableitung der von den Leuchtdioden 3 beim Betrieb erzeugten Abwärme ist jede der Leuchtdioden 3 mit einem Wärmeleitelement 7 verbunden, über das die Abwärme durch den Sockel 5 in die Fassung abgeleitet wird. Dazu weist der Sockel 5 mehrere Wärmeableitflächen 7a auf, welche den Außenflächen bzw. Unterseiten der Wärmeleitelemente 7 entsprechen, ggf. mit einer zusätzlichen Schicht, z. B. aus wärmeleitfähiger Paste oder Folie. Die Wärmeableitflächen 7a stehen mit einer entsprechenden wärmeleitfahigen Zone bzw. mehreren Zonen der Fassung in gutem thermischen Kontakt. In bzw. von der Fassung 6 wird die Wärme weiter zu einer Kühlzone 8 geleitet.To derive the waste heat generated by the light-emitting
In dem gezeigten Ausführungsbeispiel umfasst das Wärmeleitelement 7 jeweils ein Wärmerohr ("Heat-Pipe"); die Fassung kann entsprechende Wärmerohre aufweisen (ohne Abb.), welche die Wärme zur Kühlzone 8 leiten.In the embodiment shown, the heat-conducting
Zusätzlich können auch elektrische oder elektronische Steuerkomponenten, welche eine Wärme abgeben, mit der Fassung über Wärmeleitelemente 7 verbunden sein.In addition, electrical or electronic control components which emit heat may also be connected to the socket via heat-conducting
Alternativ sind die Wärmeleitelemente nicht als Wärmerohre ausgebildet, sondern weisen ein gut wärmeleitendes Material auf, wie Kupfer, Silber oder Gold.Alternatively, the heat conducting elements are not formed as heat pipes, but have a good heat conducting material, such as copper, silver or gold.
Alternativ kann eine gemeinsame Wärmeableitfläche für einige oder alle Wärmeleitelemente 7 vorgesehen sein.Alternatively, a common heat dissipation surface may be provided for some or all of the heat-conducting
Der Sockel umfasst hier eine zylindrische Verlängerung 12 ("Rucksack"), in welcher eine elektronische und / oder elektrische Schaltung, oder ein Teil davon, untergebracht ist. Im Rucksack ist vorzugsweise eine Vorschaltelektronik, insbesondere ein Glättungskondensator zumindest teilweise aufgenommen; dies gilt auch bei Verwendung einer Leuchtstofflampe statt der LED 3. Die Fassung, welche zur besseren Übersichtlichkeit hier nicht dargestellt ist, weist in diesem Fall eine entsprechende Ausnehmung auf. Der Rucksack 12 ist zur Wärmespeicherung wärmeleitend ausgelegt. Der Rucksack 12 weist ferner die elektrische bzw. elektromechanische Kontaktierung und eine wärmeleitende Verbindung zur Leuchte bzw. deren Fassung 10 auf.The base here comprises a cylindrical extension 12 ("backpack"), in which an electronic and / or electrical circuit, or a part thereof, is housed. In the backpack preferably a ballast, in particular a smoothing capacitor is at least partially included; This also applies when using a fluorescent lamp instead of the
Zur Wärmeableitung wird ein Wärmeleiter 24 der Lampe in eine Aussparung eines relativ breiteren Wärmeleiters 25 der Fassung 18 eingesteckt. Die zugehörige Kontaktfläche entspricht der Wärmeableitfläche 24a. Zur verbesserten Wärmeübertragung zwischen Sockel 17 und Fassung 18 ist zwischen den Wärmeleitern 24, 25 eine Folie 26 aus wärmeleitendem Metall vorhanden. Die Wärmeleiter 24,25 sind jeweils als Wärmerohre ausgebildet. Die Wärmeleiter 24,25 können als elektrische Leiter ausgebildet sein.For heat dissipation, a
In einer Variante kann die Fassung so ausgebildet sein, dass über die seitlichen Kontakte 22 eine Spannung auf einem ersten Spannungsniveau, z. B. 230 V, bereitgestellt wird und am unteren bzw. stirnseitigen Kontakt, der hier durch den Wärmeleiter 25 gebildet wird, Spannung auf einem zweiten Spannungsniveau, z. B. 24 V. Dadurch kann die Fassung 18 ohne Änderung für Lampen mit einer Spannungsversorgung auf dem ersten Spannungsniveau mit seitlichen Kontakten 23 und alternativ für Lampen mit einer Spannungsversorgung auf dem zweiten Spannungsniveau mit unteren Kontakten 24 geeignet sein.In a variant, the socket may be formed such that a voltage at a first voltage level, for. B. 230 V, is provided and at the bottom or frontal contact, which is formed here by the
Der Sockel 31 ist vom Bajonett-Typ, welcher an der mit der Fassung 28 eingreifenden bzw. zusammenwirkenden Bereich eine Höhe h1 aufweist und mit bezüglich einer Längsachse A seitlichen Sockelstegen 32 ausgerüstet ist.The
Mittels Drehung der Lampe 27 in der bzw. die Fassung 28 wird die Lampe 27 fest gegen die Fassung 28 gedrückt. Um die Pressung zu verstärken, können der Sockel 31 und die Fassung 28 zumindest abschnittsweise von ihrer, hier zylindrischen, Grundform am Kontaktbereich abweichen, z. B. leicht konisch oder elliptisch ausgestaltet sein. Die Höhe h1 beträgt hier weniger als 5 mm.By means of rotation of the
Selbstverständlich ist die Erfindung nicht auf die gezeigten Ausführungsformen oder deren beschriebene Elemente beschränkt.Of course, the invention is not limited to the embodiments shown or the elements described.
So sind als Lichtquellen beispielsweise Kompaktleuchtstofflampen und / oder Leuchtdioden einsetzbar; jedoch können auch andere geeignete Lichtquellen verwendet werden.For example, compact fluorescent lamps and / or light-emitting diodes can be used as light sources; however, other suitable light sources may be used.
Die Treiberschaltung ist nicht auf eine besondere Ausführungform beschränkt, und kann beliebige geeignete elektrische und / oder elektronische Elemente enthalten. Besonders bevorzugt wird beispielsweise ein Anordnung antiparallel geschalteter LEDs. Auch kann die Treiberschaltung beispielsweise einen einfachen Gleichrichter umfassen, bei dem bevorzugt die Leuchtdiode, das Leuchtdiodencluster oder die LED-Kette in einem Ast des Gleichrichters angeordnet sind. Auch umfasst der Treiber bevorzugt einen Strombegrenzer, z. B. eine Widerstand oder einen Stromregler. Auch kann der Treiber ein Schaltnetzteil umfassen, vorzugsweise einen sog. Flyback-Converter.The driver circuit is not limited to a particular embodiment, and may include any suitable electrical and / or electronic elements. For example, an arrangement of LEDs connected in antiparallel is particularly preferred. The driver circuit can also comprise, for example, a simple rectifier, in which the light-emitting diode, the light-emitting diode cluster or the LED chain are preferably arranged in a branch of the rectifier. Also, the driver preferably includes a current limiter, e.g. B. a resistor or a current regulator. Also, the driver may include a switched-mode power supply, preferably a so-called flyback converter.
Die Platine kann ein Substrat aus beispielsweise PCB, FR4 oder MC-PCB aufweisen.The board may comprise a substrate of, for example, PCB, FR4 or MC-PCB.
Der Sockel weist vorzugsweise eine sehr geringer Bauhöhe zur Einsetzung in eine entsprechende Fassung auf. Diese kann vorzugsweise, insbesondere ohne Rucksack gemessen, bis 15 mm Höhe aufweisen. Für den Fall, dass ein Rucksack verwendet wird, kann auch eine größere Höhe vorteilhaft sein, da der Rucksack als Sockelteil in der vorgesehenen Aussparung der Fassung versenkt wird.The base preferably has a very low overall height for insertion into a corresponding socket. This can preferably, in particular without a backpack measured to 15 mm in height. In the event that a backpack is used, a greater height may be advantageous because the backpack is sunk as a base part in the recess provided for the socket.
Die Anzahl und / oder Anordnung der Kontakte sowohl der Lampe als auch der Fassung kann einer Kodierinformation zuugeordnet sein, z. B. bezüglich des Lampentyps oder einer Spannungsklasse.The number and / or arrangement of the contacts of both the lamp and the socket may be associated with coding information, e.g. B. with respect to the lamp type or a voltage class.
Insbesondere die Wärmerohre ("Heat-Pipes"), aber auch andere metallische Wärmeableitelemente, können allgemein auch als elektrische Kontakte ausgebildet sein. Die Wärmeableitelemente können auch nichtmetallische leitende Elemente umfassen, z. B. elektrisch leitfähige Keramiken.In particular, the heat pipes ("heat pipes"), but also other metallic Wärmeableitelemente, can also be generally designed as electrical contacts. The heat sinks may also comprise non-metallic conductive elements, e.g. B. electrically conductive ceramics.
- 11
- Lampelamp
- 22
- Leuchtelamp
- 33
- Leuchtdiodeled
- 44
- Platinecircuit board
- 55
- Sockelbase
- 66
- Fassungversion
- 77
- Wärmerohrheat pipe
- 7a7a
- Wärmeableitflächeheat dissipation
- 88th
- Kühlelementcooling element
- 99
- Lampelamp
- 1010
- Leuchtelamp
- 1111
- Kupferbolzencopper bolts
- 11a11a
- Wärmeableitflächeheat dissipation
- 1212
- Rucksackbackpack
- 1313
- Lampelamp
- 1414
- Gehäusecasing
- 1515
- Kühlzonecooling zone
- 1616
- Rucksackbackpack
- 1717
- Sockelbase
- 1818
- Fassungversion
- 1919
- Aussparungrecess
- 2020
- Arretierkugelndetent balls
- 2121
- Arretierungsstücklocking piece
- 2222
- elektrischer Kontaktelectric contact
- 2323
- elektrischer Kontaktelectric contact
- 2424
- Wärmeleiterheat conductor
- 24a24a
- Wärmeableitflächeheat dissipation
- 2525
- Wärmeleiterheat conductor
- 2626
- Foliefoil
- 2727
- Lampelamp
- 2828
- Fassungversion
- 2929
- Kolbenpiston
- 3030
- Gehäusecasing
- 3131
- Sockelbase
- 3232
- Sockelstegsocket bar
- 3333
- Unterseite des SockelsBottom of the socket
- 3434
- BajonettverschlusselementBayonet coupling element
- 3535
- BügelkontaktIroning Contact
- 3636
- elektrischer Kontaktelectric contact
- AA
- Längsachselongitudinal axis
- h1h1
- Höhe des Eingriffsbereichs des SockelsHeight of the engagement area of the base
Claims (15)
- Lamp (1; 9; 13; 27) having at least one housing (14; 30) and a heat source connected thereto as well as a base (5; 17; 31) for connection to a lamp socket (6; 18; 28), wherein- the base (5; 17; 31) has at least one electrical contact (22; 35; 36),
characterised in that
the base additionally has at least one heat dissipation surface (7a; 11a; 24a; 33) which does not constitute an electrical contact, and
wherein the heat source comprising at least one light source (3) and/or driver circuit is thermally conductively connected to at least one of the heat dissipation surfaces (7a; 11a; 24a; 33) which do not constitute an electrical contact. - Lamp (27) according to claim 1, wherein- the base is a bayonet base (31), in which a bayonet locking element (34) projects at the end face, on which electrical contacts (35) are formed laterally, and wherein- an underside (33) of the bayonet socket (31) which is electrically insulated from the electrical contacts (35) constitutes a heat dissipation surface.
- Lamp according to claim 1, wherein- the base is a bayonet base (31) in which a bayonet locking element (34) protrudes at the front,- electrical contacts (36) are formed on an underside (33) of the bayonet socket (31) surrounding the bayonet locking element (34), and- the underside (33) of the bayonet socket (31) outside the electrical contacts (36) constitutes a heat dissipation surface electrically insulated with respect to the contacts (36) .
- Lamp (27) according to one of claims 2 to 3, the bayonet base (31) serving completely as a heat dissipation surface outside the electrical contacts (35; 36).
- Lamp according to claim 1, the base (17) comprising at least one locking piece (21) for a ball locking device, the base (17) having at least one laterally arranged electrical contact (23) and a heat dissipation surface (24) which is arranged on the end face and does not constitute an electrical contact.
- Lamp (1; 9; 13; 27) according to one of the preceding claims, the height (h1) of at least the part of the base (5; 17; 31) engaging with a socket being not more than 15 mm, preferably less than 9 mm, more preferably less than 5 mm.
- Lamp according to one of the preceding claims, wherein at least one heat dissipation surface (24a) is at least partially covered with a thermally conductive film (26).
- Lamp (9;13) according to one of the preceding claims, further comprising a cylindrical extension (12;16) at the base in which an electronic and/or electrical circuit, or part thereof, is accommodated.
- Lamp (9; 13) according to one of the preceding claims, wherein the at least one light source (3) and/or driver circuit is heat-conductively connected to the at least one heat dissipation surface (7a; 11a; 24a; 33) via at least one heat conducting element (7) in the form of at least one heat pipe.
- Lamp (9; 13) according to one of the preceding claims, wherein the at least one light source (3) and/or driver circuit is heat-conductively connected to the at least one heat-dissipating surface (7a; 11a; 24a; 33) via at least one heat-conducting element (7) made of a well heat-conducting metallic material.
- Luminaire (2; 10) having a lamp socket (6; 18; 28) for receiving a lamp (1; 9; 13; 27) according to one of the preceding claims with heat dissipation surfaces which do not constitute an electrical contact and which, when the lamp (1; 9; 13; 27) is inserted, are in thermal contact with the heat dissipation surfaces (7a; 11a; 24a; 33) of the lamp (1; 9; 13; 27), the heat dissipation surfaces of which are connected in a heat-conducting manner to a cooling element (8).
- Luminaire according to Claim 11, the heat dissipation surfaces of the luminaire (2; 10) being connected in a heat-conducting manner to the cooling element (8) via at least one heat pipe.
- System comprising a lamp (1; 9; 13; 27) according to one of claims 1 to 10 and a luminaire (2; 10) according to one of claims 11 to 12.
- System according to claim 13, wherein between the base (5; 17; 31) of the lamp (1; 9; 13; 27) and the socket (6; 18; 28) of the luminaire (2; 10) there is a heat-bonding means (26), wherein the heat-bonding means comprises a heat-conductive paste and/or a heat-conductive film (26).
- System according to one of claims 13 to 14, wherein the base (5; 17; 31; 36) of the lamp (1; 9; 13; 27) and the socket (6; 18; 28) of the luminaire (2; 10) have a shape deviation at least in sections.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007042978A DE102007042978A1 (en) | 2007-09-10 | 2007-09-10 | lamp |
PCT/EP2008/007392 WO2009033641A1 (en) | 2007-09-10 | 2008-09-10 | Lamp |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2198196A1 EP2198196A1 (en) | 2010-06-23 |
EP2198196B1 true EP2198196B1 (en) | 2019-08-14 |
Family
ID=40282401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08801964.1A Not-in-force EP2198196B1 (en) | 2007-09-10 | 2008-09-10 | Lamp |
Country Status (7)
Country | Link |
---|---|
US (1) | US8558437B2 (en) |
EP (1) | EP2198196B1 (en) |
KR (1) | KR101261096B1 (en) |
CN (1) | CN101802481B (en) |
DE (1) | DE102007042978A1 (en) |
TW (1) | TW200936948A (en) |
WO (1) | WO2009033641A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010099828A1 (en) * | 2009-03-05 | 2010-09-10 | Osram Gesellschaft mit beschränkter Haftung | Lighting device having a socket and bulb fitting |
ATE520930T1 (en) * | 2009-04-23 | 2011-09-15 | Cpumate Inc | HEAT DISSIPATION ARRANGEMENT OF AN LED LAMP HOLDER |
DE202009010577U1 (en) | 2009-08-05 | 2010-12-09 | Bjb Gmbh & Co. Kg | Lamp base and lamp socket |
SK50662009A3 (en) * | 2009-10-29 | 2011-06-06 | Otto Pokorn� | Compact arrangement of LED lamp and compact LED bulb |
DE102009047569A1 (en) * | 2009-12-07 | 2011-06-09 | Osram Gesellschaft mit beschränkter Haftung | Light i.e. LED, manufacturing method, involves providing integral part in contact with another integral part during arrangement of heat conductive elements, so that heat is discharged from driver circuit during actuation of light |
DE102010002378A1 (en) * | 2010-02-26 | 2011-09-01 | Osram Gesellschaft mit beschränkter Haftung | Lamp, in particular flat lamp, with a light source and an electronic control gear |
DE202010004087U1 (en) | 2010-03-24 | 2010-06-10 | Iventum Gmbh | lamp |
DE102010025084B4 (en) * | 2010-06-25 | 2012-05-24 | Bjb Gmbh & Co. Kg | Lamp socket and lamp base and arrangement thereof |
CN102478225A (en) * | 2010-11-23 | 2012-05-30 | 马士科技有限公司 | Heat conduction lamp holder and light-emitting diode (LED) lamp comprising same |
CN103078040B (en) * | 2011-08-22 | 2016-12-21 | Lg伊诺特有限公司 | Light emitting device packaging piece and electro-optical device |
CN103090338B (en) | 2011-11-03 | 2018-10-09 | 欧司朗股份有限公司 | Actuator assembly and its manufacturing method |
US20180156403A1 (en) * | 2016-12-02 | 2018-06-07 | Alan Millan | Thermoelectric lamp |
DE102017214659A1 (en) * | 2017-08-22 | 2019-02-28 | Osram Gmbh | LIGHT MODULE, LIGHTING SYSTEM; SET OF ILLUMINATED MODULES AND HEADLIGHTS |
EP3672363B1 (en) * | 2018-12-17 | 2021-05-05 | Electrolux Appliances Aktiebolag | Induction cooking hob with illumination equipment |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4350931A (en) * | 1981-01-08 | 1982-09-21 | Niskin Shale J | Light saver device |
DE3111803A1 (en) * | 1981-03-25 | 1982-10-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 8000 München | Reading luminaire |
NL8401878A (en) * | 1984-06-14 | 1986-01-02 | Philips Nv | ELECTRESSLESS LOW PRESSURE DISCHARGE LAMP. |
US5214354A (en) * | 1990-09-25 | 1993-05-25 | Beacon Light Products, Inc. | Electronic control module (ECM) for controlling lighting functions of a lamp bulb and method of manufacture |
US5458505A (en) * | 1994-02-03 | 1995-10-17 | Prager; Jay H. | Lamp cooling system |
JP4290887B2 (en) * | 1998-09-17 | 2009-07-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | LED bulb |
US6433478B1 (en) * | 1999-11-09 | 2002-08-13 | Matsushita Electric Industrial Co., Ltd. | High frequency electrodeless compact fluorescent lamp |
US6746885B2 (en) | 2001-08-24 | 2004-06-08 | Densen Cao | Method for making a semiconductor light source |
US7258464B2 (en) * | 2002-12-18 | 2007-08-21 | General Electric Company | Integral ballast lamp thermal management method and apparatus |
DE10316512A1 (en) * | 2003-04-09 | 2004-10-21 | Werma Signaltechnik Gmbh + Co. Kg | signaller |
DE102005053469A1 (en) * | 2005-07-13 | 2007-02-08 | Perkinelmer Optoelectronics Gmbh & Co.Kg | Flashlamp cartridge has multiple electrical cartridge terminals used for electrically connecting with respect to socket |
US7771095B2 (en) * | 2005-10-26 | 2010-08-10 | Abl Ip Holding, Llc | Lamp thermal management system |
-
2007
- 2007-09-10 DE DE102007042978A patent/DE102007042978A1/en not_active Withdrawn
-
2008
- 2008-08-22 TW TW097132044A patent/TW200936948A/en unknown
- 2008-09-10 US US12/677,330 patent/US8558437B2/en active Active
- 2008-09-10 KR KR1020107004857A patent/KR101261096B1/en active IP Right Grant
- 2008-09-10 CN CN2008801063265A patent/CN101802481B/en active Active
- 2008-09-10 EP EP08801964.1A patent/EP2198196B1/en not_active Not-in-force
- 2008-09-10 WO PCT/EP2008/007392 patent/WO2009033641A1/en active Application Filing
Non-Patent Citations (1)
Title |
---|
None * |
Also Published As
Publication number | Publication date |
---|---|
CN101802481B (en) | 2013-03-27 |
WO2009033641A1 (en) | 2009-03-19 |
CN101802481A (en) | 2010-08-11 |
EP2198196A1 (en) | 2010-06-23 |
TW200936948A (en) | 2009-09-01 |
US20100207500A1 (en) | 2010-08-19 |
KR101261096B1 (en) | 2013-05-06 |
KR20100059841A (en) | 2010-06-04 |
DE102007042978A1 (en) | 2009-03-12 |
US8558437B2 (en) | 2013-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2198196B1 (en) | Lamp | |
EP3167224B1 (en) | Semiconductor lamp | |
EP2396590B1 (en) | Lighting device | |
DE102010030702A1 (en) | Semiconductor lamp | |
DE102008016458A1 (en) | Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive | |
EP2815177B1 (en) | Lighting module | |
DE102009035515A1 (en) | Lighting device and method for producing a lighting device | |
EP2507548B1 (en) | Retrofit led lamp | |
DE102010052020B4 (en) | Lighting and / or display device | |
DE202010009679U1 (en) | An LED lighting device | |
DE112011106000T5 (en) | Thermal management for LEDs | |
EP2459927A1 (en) | Lighting device and method for assembling a lighting device | |
EP2443390B1 (en) | Heatsink for semiconductor lighting element | |
DE102009022071A1 (en) | Heat sink for a lighting device | |
DE102013201952A1 (en) | Semiconductor light-emitting module has substrate whose front side is arranged with semiconductor light sources that are laterally surrounded with circumferential side wall | |
EP2171352B1 (en) | Lamp | |
WO2011157635A1 (en) | Explosion-proof luminaire | |
DE202007014421U1 (en) | lighting device | |
DE60303655T2 (en) | Positioning and supply module for light emitting diode | |
DE102017109836B4 (en) | Lamp with heat sink | |
DE102009024904A1 (en) | Heat sink for semiconductor light elements | |
DE102013201955B4 (en) | Semiconductor lighting device with heat pipe | |
DE102012211143A1 (en) | Carrier e.g. circuit board, for e.g. organic LED of headlight for automobile, has guidance bodies linked with components at front side and exposed with respect to carrier at rear side, where bodies are projected over carrier at rear side | |
DE102010000738A1 (en) | LED lamp with pin base for halogen lamps (bipin) | |
DE102021131126A1 (en) | Lamp assembly and method of making a lamp assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20100330 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20110426 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM AG |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM GMBH |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: OSRAM GMBH |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LEDVANCE GMBH |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 502008016872 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: F21K0007000000 Ipc: F21V0023060000 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21V 29/00 20150101ALI20190228BHEP Ipc: F21V 29/70 20150101ALI20190228BHEP Ipc: F21V 23/06 20060101AFI20190228BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
INTG | Intention to grant announced |
Effective date: 20190415 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP Ref country code: AT Ref legal event code: REF Ref document number: 1167464 Country of ref document: AT Kind code of ref document: T Effective date: 20190815 |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502008016872 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20190814 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20191114 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20191114 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20191216 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20191115 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20191214 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R119 Ref document number: 502008016872 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20200224 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG2D | Information on lapse in contracting state deleted |
Ref country code: IS |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190910 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190910 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190930 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190930 Ref country code: DE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20200401 |
|
26N | No opposition filed |
Effective date: 20200603 |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20190930 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190930 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20191114 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20191014 Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20191114 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MM01 Ref document number: 1167464 Country of ref document: AT Kind code of ref document: T Effective date: 20190910 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190910 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190814 Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20080910 |