EP2171352B1 - Lamp - Google Patents

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Publication number
EP2171352B1
EP2171352B1 EP07787773.6A EP07787773A EP2171352B1 EP 2171352 B1 EP2171352 B1 EP 2171352B1 EP 07787773 A EP07787773 A EP 07787773A EP 2171352 B1 EP2171352 B1 EP 2171352B1
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EP
European Patent Office
Prior art keywords
heat sink
lighting device
lighting unit
light
lighting
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EP07787773.6A
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German (de)
French (fr)
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EP2171352A1 (en
Inventor
Harald Dellian
Stefan Otzen
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Ledvance GmbH
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Ledvance GmbH
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/026—Fastening of transformers or ballasts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light source.
  • LEDs Light-emitting diodes develop a high level of heat in high-current applications, which significantly reduces their service life and, in addition, limits the possible uses of light-emitting diodes.
  • the heat acts on the supply circuit board, which ensures the operation of the light-emitting diodes, and thus thermally loads them as well as the components arranged thereon.
  • the US 2006/0 098 440 A1 provides a direct thermal path from the LEDs to a socket with a heat sink located between the LEDs and the supplier board.
  • the object of the invention is to avoid the abovementioned disadvantages and, in particular, to provide a luminous means that enables the use of light-emitting diodes in handy and heat-resistant luminous means.
  • This solution enables efficient heat dissipation from the at least one lighting unit via the heat sink, wherein the power supply board for operating the at least one light unit is advantageously designed separately and thus thermally relieved of the strong heat of at least one light emitting diode.
  • a development consists in that the heat sink has at least one holding means for the supply board.
  • the heat sink can have a mechanical support for the supply board and thus ensure that the supply board is arranged at a distance from the at least one lighting unit.
  • a mechanical support can be realized for example in the form of notches on or in the heat sink.
  • the mechanical support is designed as a clamping construction such that only a small surface of the heat sink is in direct contact with the supply board and therefore only little to almost no heat can be dissipated from the heat sink to the supply board.
  • the at least one lighting unit is arranged on a circuit board.
  • multiple light units of different types and characteristics can be arranged on the board, so that the luminosity of the lamp accordingly mixes and / or amplified.
  • the board of the light source is a double-sided board whose bottom is thermally coupled to the heat sink.
  • the underside of the board may have at least one copper surface which is in direct contact with the heat sink.
  • this is an electrical insulation between the top and bottom through the board (plastic) itself.
  • the lighting means has a socket which is thermally coupled to the heat sink.
  • a position of the at least one lighting unit in the lighting means is adjustable.
  • a transparent plastic piston with predetermined optical properties can be arranged above the at least one lighting unit, so that the light emitted by the at least one lighting unit with a specific emission characteristic leaves the lighting means.
  • the design of the heat sink allows, for example, a positioning of the at least one light source within the plastic piston.
  • the heat sink is made in one piece or in several parts.
  • the heat sink may be designed as a cooling lug and / or comprise one or more cooling vanes.
  • the heat sink may comprise at least one holding means.
  • a flexible embodiment of the heat sink enables the versatile implementation of the advantages described herein. Due to the effective thermal relief of the at least one lighting unit, it is possible to extend the life of the lamp or to increase its maximum light output.
  • the heat sink has a holding device for at least one optical system.
  • the optical system may include a lens for diffusing the light to a bulb.
  • the lens can be used for targeted dispersion of light.
  • the optical system is preferably arranged above the at least one lighting unit.
  • Fig.1 shows the representation of a schematic decomposition of a light source.
  • a lighting unit, in Fig.1 designed as a light-emitting diode 101 is arranged on a double-sided circuit board 102.
  • the underside of the board 102 has a large copper surface and is thermally conductively connected to a heat sink 103.
  • the light-emitting diode 101 emits light through a preferably at least partially transparent or frosted piston 108, which preferably comprises plastic or glass.
  • the heat generated by the light emitting diode 101 is at least partially dissipated to the heat sink 103.
  • the heat sink 103 includes a plurality of cooling vanes 104, which are preferably fixedly connected to the heat sink 103 and made of a thermally conductive material.
  • the cooling vanes 104 may be made of the same material as the heat sink 103.
  • a supply board 106 includes, for example, the power supply for the light emitting diode 101 and is spaced therefrom.
  • the cooling lugs 104 have mechanical holding means 107 for fixing the supply board 106.
  • the mechanical retention means 107 may be implemented by engaging the cooling vanes 104 into notches on the supply board 106. After engagement with these notches, the cooling lugs 104 may include bends (e.g., tapers) that allow for clamping support of the supply board 106.
  • bends e.g., tapers
  • cooling lugs 104 have thermal contacts 109, which produce a thermal connection with a socket 105 and thus enable heat dissipation from the light-emitting diode 101 to the socket 105.
  • the heat sink 103 includes cooling vanes 104 for mechanical support and / or locking of the supply circuit board 106.
  • the cooling vanes 104 or additional cooling vanes or supports 110 can be used to mechanically fix the circuit board 102.
  • the circuit board 102 can be exchanged.
  • any number of light emitting diodes may be disposed on a circuit board 102 to be replaced since the power board 106 preferably includes a power source.
  • Fig.2 shows enlarged the heat sink 103 with the cooling vanes 104 according to Fig.1 ,
  • the heat sink 103 has three cooling vanes 104 and three fastening means 110.
  • the heat sink 103 is made of several parts of the same thermally conductive material.
  • the fastening means 110 are provided for fixing the circuit board 102.
  • the cooling vanes 104 have holding means 107 for fixing the supply circuit board 106. Furthermore, the cooling vanes 104 show thermal contacts 109 for engagement in the socket 105.
  • Figure 3 shows a section through the bulb in an assembled state.
  • the explanations to the reference numerals correspond to those to Fig.1 and to Fig.2 ,

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

Die Erfindung betrifft ein Leuchtmittel.The invention relates to a light source.

Leuchtdioden (LEDs) entwickeln in Hochstromanwendungen eine starke Wärme, die deren Lebensdauer deutlich reduziert und darüber hinaus Einsatzmöglichkeiten von Leuchtdioden einschränkt.Light-emitting diodes (LEDs) develop a high level of heat in high-current applications, which significantly reduces their service life and, in addition, limits the possible uses of light-emitting diodes.

Um die Wärme geeignet abzuleiten können große Kühlkörper eingesetzt werden. Dies führt jedoch im Zusammenhang mit den kleinen und leichten Leuchtdioden zu verhältnismäßig großen und unhandlichen Leuchtmitteln.To dissipate the heat suitable large heat sink can be used. However, this leads in connection with the small and light LEDs to relatively large and bulky bulbs.

In WO 2005/060309 wird Vorgeschlagen, einen Anteil der von Leuchtdioden erzeugten Wärme über eine Fassung eines Leuchtmittels abzuleiten.In WO 2005/060309 It is proposed to derive a portion of the heat generated by LEDs over a socket of a light source.

Hierbei ist es jedoch Von Nachteil, dass die Wärme auf die Versorgungsplatine, die den Betrieb der Leuchtdioden sicherstellt, einwirkt und somit diese wie auch die darauf angeordneten Bauteile entsprechend thermisch belastet.However, it is disadvantageous here that the heat acts on the supply circuit board, which ensures the operation of the light-emitting diodes, and thus thermally loads them as well as the components arranged thereon.

Die US 2006/0 098 440 A1 stellt einen direkten thermischen Pfad von den LEDs zu einer Fassung bereit, wobei ein Kühlkörper zwischen den LEDs und der Versorgerplatine angeordnet ist.The US 2006/0 098 440 A1 provides a direct thermal path from the LEDs to a socket with a heat sink located between the LEDs and the supplier board.

Die Aufgabe der Erfindung besteht darin, die vorstehend genannten Nachteile zu Vermeiden und insbesondere ein Leuchtmittel anzugeben, dass den Einsatz von Leuchtdioden in handlichen und wärmebeständigen Leuchtmitteln ermöglicht.The object of the invention is to avoid the abovementioned disadvantages and, in particular, to provide a luminous means that enables the use of light-emitting diodes in handy and heat-resistant luminous means.

Diese Aufgabe wird gemäß den Merkmalen der unabhängigen Patentansprüche gelöst. Weiterbildungen der Erfindung ergeben sich auch aus den abhängigen Ansprüchen.This object is achieved according to the features of the independent claims. Further developments of the invention will become apparent from the dependent claims.

Zur Lösung der Aufgabe wird ein Leuchtmittel angegeben umfassend:

  • mindestens eine Leuchteinheit;
  • einen Kühlkörper, wobei der Kühlkörper derart angeordnet ist, dass Wärme von der mindestens einen Leuchteinheit ableitbar ist;
  • eine Versorgungsplatine, die separat von der Leuchteinheit ausgeführt ist.
To solve the problem, a light source is specified comprising:
  • at least one lighting unit;
  • a heat sink, wherein the heat sink is arranged such that heat can be derived from the at least one lighting unit;
  • a power board that is separate from the light unit.

Diese Lösung ermöglicht eine effiziente Wärmeableitung von der mindestens einen Leuchteinheit über den Kühlkörper, wobei die Versorgungsplatine zum Betrieb der mindestens einen Leuchteinheit vorteilhaft separat ausgeführt und somit thermisch von der starken Wärme der mindestens einen Leuchtdiode entlastet wird.This solution enables efficient heat dissipation from the at least one lighting unit via the heat sink, wherein the power supply board for operating the at least one light unit is advantageously designed separately and thus thermally relieved of the strong heat of at least one light emitting diode.

Eine Weiterbildung besteht darin, dass der Kühlkörper mindestens ein Haltemittel für die Versorgungsplatine aufweist.A development consists in that the heat sink has at least one holding means for the supply board.

Insofern kann der Kühlkörper eine mechanische Halterung für die Versorgungsplatine aufweisen und somit sicherstellen, dass die Versorgungsplatine von der mindestens einen Leuchteinheit beabstandet angeordnet ist. Eine derartige mechanische Halterung kann beispielsweise realisiert sein in Form von Einkerbungen an oder in dem Kühlkörper. Vorteilhaft ist die mechanische Halterung ausgeführt als eine Klemmkonstruktion derart, dass nur eine geringe Oberfläche des Kühlkörpers mit der Versorgungsplatine in direktem Kontakt steht und daher nur wenig bis kaum Wärme von dem Kühlkörper an die Versorgungsplatine ableitbar ist.In this respect, the heat sink can have a mechanical support for the supply board and thus ensure that the supply board is arranged at a distance from the at least one lighting unit. Such a mechanical support can be realized for example in the form of notches on or in the heat sink. Advantageously, the mechanical support is designed as a clamping construction such that only a small surface of the heat sink is in direct contact with the supply board and therefore only little to almost no heat can be dissipated from the heat sink to the supply board.

Eine andere Weiterbildung ist es, dass die mindestens eine Leuchteinheit auf einer Platine angeordnet ist.Another development is that the at least one lighting unit is arranged on a circuit board.

Insbesondere können mehrere Leuchteinheiten unterschiedlicher Art und Ausprägung (z.B. Technologie, Größe oder Farbe) auf der Platine angeordnet sein, so dass sich die Leuchtkraft des Leuchtmittels entsprechend mischt und/oder verstärkt.In particular, multiple light units of different types and characteristics (eg technology, size or color) can be arranged on the board, so that the luminosity of the lamp accordingly mixes and / or amplified.

Als eine zusätzliche Weiterbildung ist die Platine des Leuchtmittels eine doppelseitige Platine, deren Unterseite thermisch mit dem Kühlkörper gekoppelt ist. Insbesondere kann die Unterseite der Platine mindestens eine Kupferfläche aufweisen, die in direktem Kontakt mit dem Kühlkörper steht.As an additional development, the board of the light source is a double-sided board whose bottom is thermally coupled to the heat sink. In particular, the underside of the board may have at least one copper surface which is in direct contact with the heat sink.

Vorteilhaft erfolgt hierbei eine elektrische Isolation zwischen Ober- und Unterseite durch die Platine (Kunststoff) selbst.Advantageously, this is an electrical insulation between the top and bottom through the board (plastic) itself.

Eine Ausgestaltung ist es, dass das Leuchtmittel eine Fassung aufweist, die thermisch mit dem Kühlkörper gekoppelt ist.One embodiment is that the lighting means has a socket which is thermally coupled to the heat sink.

Durch die thermische Kopplung mit der Fassung ist eine effiziente Ableitung der Wärme von der mindestens einen Leuchteinheit über den Kühlkörper bis hin zu der Fassung und darüber hinaus möglich.Due to the thermal coupling with the socket, an efficient dissipation of the heat from the at least one lighting unit via the heat sink to the socket and beyond is possible.

Auch ist es eine Ausgestaltung, dass anhand des Kühlkörpers eine Position der mindestens einen Leuchteinheit in dem Leuchtmittel einstellbar ist.It is also an embodiment that on the basis of the heat sink, a position of the at least one lighting unit in the lighting means is adjustable.

Dies ist von Vorteil, um insbesondere optische Abstrahlcharakteristika des Leuchtmittels zu optimieren. So kann über der mindestens einen Leuchteinheit ein durchsichtiger Plastikkolben mit vorgegebenen optischen Eigenschaften angeordnet sein, so dass das von der mindestens einen Leuchteinheit emittierte Licht mit einer bestimmten Abstrahlcharakteristik das Leuchtmittel verlässt. Der Auslegung des Kühlkörpers ermöglicht dabei beispielsweise eine Positionierung des mindestens einen Leuchtmittels innerhalb des Plastikkolbens.This is advantageous in order to optimize in particular optical emission characteristics of the luminous means. Thus, a transparent plastic piston with predetermined optical properties can be arranged above the at least one lighting unit, so that the light emitted by the at least one lighting unit with a specific emission characteristic leaves the lighting means. The design of the heat sink allows, for example, a positioning of the at least one light source within the plastic piston.

Eine weitere Ausgestaltung besteht darin, dass der Kühlkörper einteilig oder mehrteilig ausgeführt ist. Insbesondere kann der Kühlkörper als eine Kühlfahne ausgestaltet sein und/oder eine oder mehrere Kühlfahnen umfassen. Zusätzlich kann der Kühlkörper mindestens ein Haltemittel umfassen.A further embodiment is that the heat sink is made in one piece or in several parts. In particular, the heat sink may be designed as a cooling lug and / or comprise one or more cooling vanes. In addition, the heat sink may comprise at least one holding means.

Demgemäß ermöglicht eine flexible Ausgestaltung des Kühlkörpers die vielfältige Umsetzung der hierin beschriebenen Vorteile. Aufgrund der effektiven thermischen Entlastung der mindestens einen Leuchteinheit ist es möglich, die Lebensdauer des Leuchtmittels zu verlängern bzw. dessen maximale Lichtleistung zu erhöhen.Accordingly, a flexible embodiment of the heat sink enables the versatile implementation of the advantages described herein. Due to the effective thermal relief of the at least one lighting unit, it is possible to extend the life of the lamp or to increase its maximum light output.

Eine andere Ausgestaltung ist es, dass die mindestens eine Leuchteinheit mindestens eine der folgenden Komponenten umfasst:

  • eine Leuchtdiode;
  • eine Lampe.
Another embodiment is that the at least one lighting unit comprises at least one of the following components:
  • a light emitting diode;
  • a lamp.

Hierbei können auch Kombinationen unterschiedlicher Arten, z.B. Größen, Farben, Technologien von Leuchteinheiten vorgesehen sein.In this case, combinations of different types, e.g. Sizes, colors, technologies of lighting units be provided.

Eine zusätzliche Ausgestaltung ist es, dass der Kühlkörper eine Haltevorrichtung für mindestens ein optisches System aufweist. Insbesondere kann das optische System eine Linse zur Zerstreuung des Lichts auf einen Kolben aufweist. Bevorzugt kann die Linse zur gezielten Zerstreuung des Lichts eingesetzt werden. Dabei ist vorzugsweise das optische System oberhalb der mindestens einen Leuchteinheit angeordnet.An additional embodiment is that the heat sink has a holding device for at least one optical system. In particular, the optical system may include a lens for diffusing the light to a bulb. Preferably, the lens can be used for targeted dispersion of light. In this case, the optical system is preferably arranged above the at least one lighting unit.

Ausführungsbeispiele der Erfindung werden nachfolgend anhand der Zeichnungen dargestellt und erläutert.Embodiments of the invention are illustrated and explained below with reference to the drawings.

Es zeigen:

Fig.1
eine schematische Zerlegung eines Leuchtmittels umfassend eine Leuchtdiode und Mittel zur Wärmeableitung;
Fig.2
den Kühlkörper aus Fig.1 in der Vergrößerung;
Fig.3
eine Schnittdarstellung durch das zusammengebaute Leuchtmittel.
Show it:
Fig.1
a schematic decomposition of a luminous means comprising a light emitting diode and means for heat dissipation;
Fig.2
the heat sink off Fig.1 in the enlargement;
Figure 3
a sectional view through the assembled bulbs.

Fig.1 zeigt die Darstellung einer schematischen Zerlegung eines Leuchtmittels. Fig.1 shows the representation of a schematic decomposition of a light source.

Eine Leuchteinheit, in Fig.1 ausgebildet als Leuchtdiode 101 ist auf einer doppelseitigen Platine 102 angeordnet. Die Unterseite der Platine 102 weist eine große Kupferfläche auf und ist thermisch leitend mit einem Kühlkörper 103 verbunden.A lighting unit, in Fig.1 designed as a light-emitting diode 101 is arranged on a double-sided circuit board 102. The underside of the board 102 has a large copper surface and is thermally conductively connected to a heat sink 103.

Die Leuchtdiode 101 emittiert Licht durch einen vorzugsweise zumindest teilweise durchsichtigen oder mattierten Kolben 108, der vorzugsweise Plastik oder Glas umfasst.The light-emitting diode 101 emits light through a preferably at least partially transparent or frosted piston 108, which preferably comprises plastic or glass.

Die von der Leuchtdiode 101 erzeugt Wärme wird zumindest teilweise auf den Kühlkörper 103 abgeleitet. Der Kühlkörper 103 umfasst mehrere Kühlfahnen 104, die vorzugsweise fest mit dem Kühlkörper 103 verbunden und aus einem wärmeleitfähigen Material sind. Insbesondere können die Kühlfahnen 104 aus demselben Material wie der Kühlkörper 103 sein.The heat generated by the light emitting diode 101 is at least partially dissipated to the heat sink 103. The heat sink 103 includes a plurality of cooling vanes 104, which are preferably fixedly connected to the heat sink 103 and made of a thermally conductive material. In particular, the cooling vanes 104 may be made of the same material as the heat sink 103.

Eine Versorgungsplatine 106 umfasst beispielsweise die Stromversorgung für die Leuchtdiode 101 und ist von dieser beabstandet ausgeführt. Die Kühlfahnen 104 weisen mechanische Haltemittel 107 zur Befestigung der Versorgungsplatine 106 auf.A supply board 106 includes, for example, the power supply for the light emitting diode 101 and is spaced therefrom. The cooling lugs 104 have mechanical holding means 107 for fixing the supply board 106.

Die mechanischen Haltemittel 107 können beispielsweise realisiert sein durch Eingriff der Kühlfahnen 104 in dafür vorgesehene Kerben der Versorgungsplatine 106. Nach dem Eingriff in diese Kerben können die Kühlfahnen 104 Biegungen (z.B. Verjüngungen) aufweisen, die eine Klemmhalterung der Versorgungsplatine 106 ermöglichen.For example, the mechanical retention means 107 may be implemented by engaging the cooling vanes 104 into notches on the supply board 106. After engagement with these notches, the cooling lugs 104 may include bends (e.g., tapers) that allow for clamping support of the supply board 106.

Im weiteren Verlauf weisen die Kühlfahnen 104 thermische Kontakte 109 auf, die eine thermische Verbindung mit einer Fassung 105 herstellen und somit eine Wärmeableitung von der Leuchtdiode 101 hin zur Fassung 105 ermöglichen.In the further course, the cooling lugs 104 have thermal contacts 109, which produce a thermal connection with a socket 105 and thus enable heat dissipation from the light-emitting diode 101 to the socket 105.

Somit wird vorteilhaft erreicht, dass die Wärme von der Leuchtdiode 101 nach außen, insbesondere in Richtung und/oder zur Fassung 105 geleitet wird. Weiterhin umfasst der Kühlkörper 103 Kühlfahnen 104 zur mechanischen Halterung und/oder Arretierung der Versorgungsplatine 106. Die Kühlfahnen 104 oder zusätzliche Kühlfahnen bzw. Halterungen 110 können eingesetzt werden um die Platine 102 mechanisch zu fixieren.Thus, it is advantageously achieved that the heat from the light-emitting diode 101 to the outside, in particular in the direction and / or the socket 105 is passed. Furthermore, the heat sink 103 includes cooling vanes 104 for mechanical support and / or locking of the supply circuit board 106. The cooling vanes 104 or additional cooling vanes or supports 110 can be used to mechanically fix the circuit board 102.

Auch ist es von Vorteil, dass anhand der hierin vorgeschlagenen Lösung ein Austausch oder eine Änderung der Leuchteinheit(en) 101 vereinfacht ist: Ohne Veränderung der Versorgungsplatine 106 kann die Platine 102 getauscht werden. Darüber hinaus können eine beliebige Anzahl von Leuchtdioden auf einer auszutauschenden Platine 102 angeordnet sein, da die Versorgungsplatine 106 vorzugsweise eine Stromquelle umfasst.It is also advantageous that an exchange or a change of the lighting unit (s) 101 is simplified on the basis of the solution proposed herein: Without changing the power supply board 106, the circuit board 102 can be exchanged. In addition, any number of light emitting diodes may be disposed on a circuit board 102 to be replaced since the power board 106 preferably includes a power source.

Anhand der effizienten Wärmeableitung ist neben der erhöhten Lebensdauer des Leuchtmittels eine höhere Lichtleistung erreichbar.Due to the efficient heat dissipation, a higher light output can be achieved in addition to the increased life of the light source.

Fig.2 zeigt vergrößert den Kühlkörper 103 mit den Kühlfahnen 104 gemäß Fig.1. Fig.2 shows enlarged the heat sink 103 with the cooling vanes 104 according to Fig.1 ,

Der Kühlkörper 103 weist drei Kühlfahnen 104 und drei Befestigungsmittel 110 auf. Dabei ist der Kühlkörper 103 mehrteilig aus dem gleichen thermisch leitenden Material ausgeführt.The heat sink 103 has three cooling vanes 104 and three fastening means 110. In this case, the heat sink 103 is made of several parts of the same thermally conductive material.

Die Befestigungsmittel 110 sind vorgesehen zur Fixierung der Platine 102. Die Kühlfahnen 104 weisen Haltemittel 107 zur Fixierung der Versorgungsplatine 106 auf. Weiterhin zeigen die Kühlfahnen 104 thermische Kontakte 109 zum Eingriff in die Fassung 105.The fastening means 110 are provided for fixing the circuit board 102. The cooling vanes 104 have holding means 107 for fixing the supply circuit board 106. Furthermore, the cooling vanes 104 show thermal contacts 109 for engagement in the socket 105.

Fig.3 zeigt einen Schnitt durch das Leuchtmittel in einem zusammengebauten Zustand. Die Erläuterungen zu den Bezugszeichen entsprechen denen zu Fig.1 und zu Fig.2. Figure 3 shows a section through the bulb in an assembled state. The explanations to the reference numerals correspond to those to Fig.1 and to Fig.2 ,

Claims (7)

  1. Lighting device comprising
    at least one lighting unit (101);
    - a heat sink (103), the heat sink (103) being arranged such that heat can be dissipated from the at least one lighting unit (101);
    - a supply board (106) which is implemented separately from the lighting unit (101),
    - the illuminant further comprising a socket (105) thermally coupled to the heat sink (103),
    wherein the lighting unit (101) comprises a light emitting diode disposed on a double sided circuit board the underside of which is thermally coupled to the heat sink (103),
    characterised in that
    the heat sink comprises cooling tabs (104) having thermal contacts (109) which establish a thermal connection with the socket.
  2. Lighting device according to claim 1, wherein the heat sink (103) has at least one retaining means (107) for the supply board.
  3. Lighting device according to claim 1, wherein the lower side of the circuit board has a copper surface which is thermally coupled to the heat sink.
  4. Lighting device according to one of the preceding claims, wherein a position of the at least one lighting unit (101) in the lighting device can be adjusted by means of the heat sink (103).
  5. Lighting device according to one of the preceding claims wherein the heat sink is made in one or more parts.
  6. Lighting device according to one of the preceding claims, wherein the heat sink comprises a holding device for at least one optical system.
  7. Lighting device as claimed in claim 6, wherein the optical system comprises a lens for diffusing the light onto a bulb.
EP07787773.6A 2007-07-20 2007-07-20 Lamp Active EP2171352B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/057521 WO2009012806A1 (en) 2007-07-20 2007-07-20 Lamp

Publications (2)

Publication Number Publication Date
EP2171352A1 EP2171352A1 (en) 2010-04-07
EP2171352B1 true EP2171352B1 (en) 2018-12-26

Family

ID=39233111

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Application Number Title Priority Date Filing Date
EP07787773.6A Active EP2171352B1 (en) 2007-07-20 2007-07-20 Lamp

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EP (1) EP2171352B1 (en)
CN (1) CN202040773U (en)
WO (1) WO2009012806A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009024907A1 (en) * 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for semiconductor light elements
DE102009024904A1 (en) 2009-06-15 2010-12-16 Osram Gesellschaft mit beschränkter Haftung Heat sink for semiconductor light elements
DE102010031066B4 (en) * 2010-05-21 2012-11-08 Trilux Gmbh & Co. Kg Heat dissipation device, in particular for a lamp
EP2663806B1 (en) 2011-01-14 2018-01-03 Philips Lighting Holding B.V. Lighting device
JP5988844B2 (en) * 2012-11-22 2016-09-07 日立アプライアンス株式会社 Lighting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6414801B1 (en) * 1999-01-14 2002-07-02 Truck-Lite Co., Inc. Catadioptric light emitting diode assembly
US7258464B2 (en) * 2002-12-18 2007-08-21 General Electric Company Integral ballast lamp thermal management method and apparatus
DE102004011974A1 (en) * 2004-03-10 2005-09-22 Conrad Electronic Gmbh Illuminant for a lighting device
WO2007034361A1 (en) * 2005-09-22 2007-03-29 Philips Intellectual Property & Standards Gmbh Led lighting module

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses

Also Published As

Publication number Publication date
WO2009012806A1 (en) 2009-01-29
EP2171352A1 (en) 2010-04-07
CN202040773U (en) 2011-11-16

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