WO2012041734A2

WO2012041734A2 - Module for a lighting device and lighting device

Info

Publication number: WO2012041734A2
Application number: PCT/EP2011/066232
Authority: WO
Inventors: Martin Moeck
Original assignee: Osram Ag
Priority date: 2010-09-30
Filing date: 2011-09-19
Publication date: 2012-04-05
Also published as: WO2012041734A3; DE102010047158A1

Abstract

The invention relates to a module (100) for a lighting device (1000), comprising a plate-like first element (1) having a first main area (11) and a second main area (12) opposite the first main area (11), wherein the first main area (11) is reflective and at least one cooling fin (3) extending away from the first element (1) is disposed on the second main area (12) and is thermally connected to the first element (1). The module (100) further comprises a plate-like second element (2) disposed on the first element (1) at a connecting edge (10) of the first element (1) and thermally connected to the first element (1), enclosing an angle (91) of less than 180° with the first main area (11) of the first element (1). The invention further relates to a lighting device (1000) having a plurality of modules (100).

Description

description

Module for a lighting device and

Beieuchtungseinrichtung

A module for a lighting device and a lighting device are specified.

This patent application claims the priority of German Patent Application 10 2010 047 158.8, the disclosure of which is hereby incorporated by reference.

Light sources that have light-emitting diodes (LEDs) represent an alternative or a substitute for incandescent, low-voltage, halogen and compact fluorescent lamps, which are used for interior lighting. Furthermore, such LED light sources can also be used as a replacement for

Mercury vapor lamps and sodium vapor lamps are used. Be LED light sources instead of the known

Used light sources, it is usually necessary that the LED light sources have light intensities or luminous flux, which are corresponding to those of the respective light sources to be replaced. Typically, therefore, light fluxes of more than about 400 lumens are needed.

Known LED light sources that fit into existing lamp sockets or lamp terminals, so-called LED retrofits, typically have three to six permanently mounted LEDs. However, their luminous flux is not enough to

For example, to replace high-pressure lamps or 50 W low-voltage halogen lamps. The limiting factor for

Interior LED retrofits usually lies in the small size of the known inefficient lamps to be replaced. There are currently hardly any LED retrofits for mefflziente outdoor lighting.

In order to increase the luminous flux, known LED retrofits are usually over-energized in order to achieve higher luminous fluxes.

However, the operating temperature increases and the LEDs lose their efficiency. Due to the increased temperature, the LEDs usually also drift in their color and in their brightness. In order to solve the problem of increased temperature or overheating, relatively heavy and massive heat sinks are usually used, but this further increases the size of the LED retrofits. However, due to the desire to incorporate known LED retrofits into existing lamp sockets, the LED retrofits typically have little or no convection cooling.

At least one object of certain embodiments is to provide a module for a lighting device. At least one object of further embodiments is to provide a lighting device with a plurality of modules.

These objects are achieved by objects having the features of the independent patent claims. advantageous

From embodiments and further developments of the subject matter are characterized in the dependent claims and continue to be apparent from the following description and the drawings.

According to at least one embodiment, a module for a lighting device has a plate-shaped first

Element having a first major surface and a second major surface opposite the first major surface. The first main surface may be reflective. On the second main surface, the module may comprise at least one cooling fin, which is thermally connected to the second main surface and thus to the first element.

According to another disclosed embodiment, the at least one cooling fin is lamellar or plate-shaped. The at least one cooling rib may in particular extend away from the second main surface of the first element. For this purpose, the cooling fin may enclose an angle with the second main surface, which may be, for example, a right angle.

According to another embodiment, the module may have a plate-shaped second element. The first and the second element may in particular be thermally connected to one another. Particularly preferably, the first element has a connecting edge, on which the second element

is arranged and at which the second element is connected to the first element. In particular, the first and the second element can be arranged at an angle to one another, that is to say inclined relative to one another. For this purpose, the second element with the first main surface of the first element may preferably include an angle which is smaller than 180 °. In other words, this may mean that the second element on the

Connecting edge of the first element is connected to the first element and is inclined to the first main surface of the first element. Alternatively, the second element may also include an angle greater than or equal to 180 ° with the first major surface of the first element.

According to at least one disclosed embodiment, a

Lighting device on a plurality of modules. In particular, in the illumination device, the respective first and second elements as well as the cooling fins of the individual modules of the plurality of modules can be arranged next to one another. In other words, this may mean that the cooling fins of the modules as well as the first elements and the second elements of the modules are respectively arranged on corresponding same sides of the illumination device.

The description of embodiments and features herein and in the following refers equally to the module and lighting device having the plurality of modules.

According to a further embodiment, the at least one cooling rib extends away from the connecting edge of the first element and runs along the second main surface of the first element. According to another embodiment, a module has an installation direction in which the at least one cooling rib is arranged at least partially vertically, so that a cooling medium, such as air, can flow along the at least one cooling rib and can absorb heat from the at least one cooling rib. Since the at least one cooling rib is in thermal contact with the first element and the first element is in thermal contact with the second element, heat can thus be emitted from the first and the second element via the cooling rib to the cooling medium, that is to say air. As the vertical direction can be referred to here and below a direction along which the cooling medium such as air can flow. If the coolant is, for example, ambient air, the vertical direction can at least essentially be

To correspond to the direction of gravity. According to another embodiment, a module has a module

at least two cooling fins, which are arranged side by side. As a result, an improvement in the cooling of the module can be achieved. Particularly preferably, the at least two cooling fins may be arranged parallel to each other.

Furthermore, it is also possible that the cooling ribs each have an edge with which the cooling ribs are arranged on the second main surface of the first element, wherein the edges are parallel to each other. In a direction perpendicular to the edges, the cooling fins may enclose an angle with each other which may be greater than or equal to 0 °. In a particularly preferred embodiment, a module has exactly two cooling fins.

According to another disclosed embodiment, the first

and / or the second element and / or the at least one

Cooling fin on a material that has a high thermal conductivity. For example, such a material may comprise or consist of copper and / or aluminum. Furthermore, such a material by a plastic or a ceramic material or combinations of the above

Be made of materials.

According to a further embodiment, the second element has a side facing away from the at least one cooling rib, which is designed to be reflective. The side facing away from the at least one cooling rib can in particular be the side of the second element adjoining the first main surface of the first element.

According to another embodiment, reflective surfaces, for example the reflective first, can be used

Main surface of the first element or the at least one Coolant rib side facing away from the second element, through

Polishing the surface and / or by a suitable

Coating diffused or glossy reflective.

The second element may be, for example, a circuit board in the form of a connection carrier which

For example, a basic body of an electric

having insulating material in or on the

electrical connection points, contact points and / or

Conductors are on or applied.

For example, the second element may be formed as a circuit board with electrical contacts for the electrical connection of a light-emitting semiconductor component. For this purpose, the second element can be embodied particularly preferably as a printed circuit board (PCB) or as a metal core printed circuit board (MCPCB).

According to another embodiment, a light-emitting semiconductor component is on the second element

arranged. In particular, the light emitting

Semiconductor device may be arranged on one side of the second element, which is adjacent to the reflective second main surface of the first element and which is disposed away from the at least one cooling fin. This makes it possible, for example, that light, the light

emitting semiconductor device is reflected from the main reflective surface of the first element.

Alternatively or additionally, a light-emitting semiconductor component can also be on a side of the second element which faces away from the first main surface of the first element be arranged. For example, has one

Lighting device on at least two modules, which are arranged side by side along the respective connecting line from the first to the second element, the light of the light-emitting semiconductor component of the one

Modules are radiated to the or at least in the direction of the reflective first major surface of the other module.

The light-emitting semiconductor component may be particularly suitable for light in a wavelength range of

ultraviolet radiation to infrared radiation, more preferably visible light. In this case, the light-emitting semiconductor component can emit monochromatic or mixed-colored light, for example, particularly preferably for illumination purposes, white light. The light-emitting semiconductor device can do so

For example, also have a dye that can convert at least a portion of the radiation generated by a semiconductor layer sequence or a semiconductor chip in light with a different wavelength, so that the semiconductor device can emit mixed-colored light. By a suitable combination of the same or different colored light

emitting semiconductor devices are high

Color rendering index and high brightness of the light source possible.

The light-emitting semiconductor component can in particular be designed as a semiconductor chip with an epitaxially grown

Semiconductor layer sequence may be formed or at least one semiconductor chip with an epitaxially grown

Have semiconductor layer sequence. The

Semiconductor layer sequence may comprise an arsenide, phosphide and / or nitride compound semiconductor material, the in terms of its composition and in terms of its layer structure according to the desired light is formed. The light-emitting semiconductor device can

be designed in particular as a light-emitting diode (LED). For this purpose, the light-emitting semiconductor component may have, for example, a housing body in which the epitaxially grown semiconductor layer sequence

or the semiconductor chip mounted and

optionally embedded in a potting material.

Alternatively, the light emitting

Semiconductor device also epitaxially grown

Semiconductor layer sequence may be mounted in the form of a semiconductor chip directly on the second element without a housing body.

According to a further disclosed embodiment, a

Lighting device with a plurality of modules at least one module with a light-emitting

Semiconductor device on. Such a module may also be referred to as a light emitting module. Furthermore, the lighting device and modules without light

having emitting semiconductor device, which particularly preferably have a reflective at least on one side of the second element. Such modules may also be referred to as reflector modules.

Furthermore, the illumination device can have a plurality of light-emitting modules. The light

emitting modules can be a plurality of light

have emitting semiconductor devices,

For example, each light-emitting module is a semiconductor light-emitting device, each having light of the same wavelengths or the same Wavelength range and thus radiate with a same color impression. Alternatively, the light-emitting semiconductor components of the plurality of light-emitting semiconductor components can also radiate different-colored light, so that the differently colored light of the plurality of light-emitting semiconductor components can lead to a mixed-color or multi-colored illumination impression for the illumination device.

According to another embodiment, the second element has a connection edge lying opposite the first element. This may mean in particular that the

Connecting edge of the first element, at the second

Element is arranged, and the connecting edge of the second element are arranged with respect to opposite edges of the second element. At the connecting edge of the second element may be arranged a reflecting element with a reflecting main surface.

Furthermore, the main reflecting surface may include an angle of more than 180 ° with the second element. This may mean, in particular, that the reflective element has a reflective main surface facing away from the second element. If the module has a light-emitting component on the second element, this may in particular also mean that the main reflecting surface of the reflective element emits light

Semiconductor device is turned away.

According to a further disclosed embodiment, a

Lighting device at least two modules, which are arranged one above the other along a connecting line from the first to the second element. In particular, one can the at least two modules that emit a light

Semiconductor device on the second element, emitting light in the direction of the other module. If the other module has a reflective element, the light emitted by one module can be reflected by the reflective element of the other module. By a suitable shape of the reflective element, in particular the

reflective main surface of the reflective element, so a radiation characteristic of the

Lighting device can be achieved in the desired manner.

According to a further disclosed embodiment, the modules of the lighting device are rotated against each other. Furthermore, the modules can also be arranged offset from one another. This can cause a radiation of light or a reflection of light in different directions

be enabled.

According to a preferred disclosed embodiment, the modules of a lighting device are arranged helically. In other words, this may mean that the modules are arranged in a helical manner and thus are in each case rotated relative to one another and staggered.

According to another disclosed embodiment, the

Lighting device on a cylindrical support member. The modules can each be arranged facing the holding element with the second main surface of the first element. In particular, the holding element may have openings through which the at least one cooling rib of each of the modules can project into the interior of the cylindrical holding element. As a result, it may be possible for the first and the second element and on the outside of the retaining element optionally, a reflective element of a module are arranged, while the at least one cooling rib is arranged in the interior of the retaining element. By the

cylindrical holding element and the cooling ribs of the individual modules arranged therein, a chimney effect can be generated by a cooling medium such as air can flow efficiently past the cooling fins and so effective cooling of the modules can be ensured.

The cylindrical holding element may, for example, have a circular, an elliptical or a polygonal cross section or combinations thereof.

Furthermore, the holding element can be a conical

have widening end portion. In other words, this may mean that the holding element has a cross-section which increases in at least one end region. As a result, the inflow and / or the outflow of air into the cylindrical holding element can be facilitated

or be increased, which may result in a further improvement of the cooling effect.

According to a further disclosed embodiment, a connection element is arranged in the interior of the holding element. The

Connection element, for example, as the holding element can be cylindrical. The holding element may have electrical leads and / or electrical connections and / or at least one electrical control element, by means of which the modules of the illumination device

can be electrically connected or electrically controlled. According to a further embodiment, the holding element or the connection element has a connection region, by means of which the illumination device is connected to an external device

electrical connection can be connected. In particular, the connection region can also serve for the mechanical fastening of the illumination device. For example, the

Connection area be designed such that the

Lighting device to a lamp base, such as a known lamp base such as a so-called E27 socket, connected and can be attached thereto.

As a result, it may be possible to connect the illumination device to existing connections or lamp sockets

connect so that the lighting device can be designed as a so-called retrofit lighting device.

By the inclination of the first element to the second element and optionally by the formation of

Reflector elements of the individual modules, by arranging a plurality of modules to each other, of which individual modules can be configured as light-emitting modules and other modules, for example, as reflective modules, a desired light distribution of the illumination device can be achieved. Due to the fact that all modules have at least one cooling rib, which is particularly preferably arranged inside the cylindrical holding element, effective cooling of the light emitting through the light can be achieved

Semiconductor devices generated heat can be achieved.

Further advantages and advantageous embodiments and forms

Further developments emerge from the following in

Compound described with Figures 1 to 8B

Execution forms. Show it:

1A to 1C show a schematic representation of a module according to an embodiment,

FIGS. 2 to 4 show a schematic representation of modules according to further exemplary embodiments,

Figures 5A to 5C are schematic representations of a

Lighting device according to another

Embodiment and

Figures 6 to 8B is a schematic representations of

Lighting devices according to others

Embodiments.

In the exemplary embodiments and figures, the same or equivalent components may each have the same

Be provided with reference numerals. The illustrated elements and their proportions with each other are basically not to be regarded as true to scale. Rather, individual elements such as layers, components, components and areas for exaggerated representability and / or better understanding can be shown exaggerated thick or large dimensions.

FIGS. 1A to 1C show an exemplary embodiment of a module 100 for a lighting device. In FIG. 1A, the module 100 is shown in a side view, while FIGS. 1B and 1C respectively show oblique views of the module 100 in the direction of the first main surface 11 and in FIG

Direction of the second major surface 12 show. The following Description refers equally to all figures 1A to IC.

The module 100 has a first element 1, which

is designed plate-shaped. The first element 1 is made of a heat-conducting material and preferably has copper and / or aluminum or is made thereof. The first element 1 has a first main surface 11 and a second main surface 12 opposite the first main surface 11. The first main surface 11 is designed to be reflective, for example by a reflective coating or by polishing the first main surface 11 of the first

Elements 1. The first element 1 further has a connecting edge 10 on which a second plate-shaped element 2 is arranged. The second element 2 is shown in FIG

Embodiment designed as a board having electrical conductor tracks and / or terminals for contacting a light-emitting semiconductor device 4, which is arranged on one side 21 of the second element 2. The module 100 shown in FIGS. 1A to 1C is thus designed as a light-emitting module. The second element 2 is arranged inclined to the first element 1. For this purpose, the second element 2 with the first main surface 11 of the first element 1 encloses an angle 91 which is smaller than 180 °. Thereby, light emitted from the semiconductor light-emitting device 4 toward the first main surface 11 of the first element 1 can be reflected therefrom.

The light-emitting semiconductor device 4 is as

epitaxially grown semiconductor layer sequence in the form of a semiconductor chip, which is directly on the second Element 2 is arranged and radiates the visible light during operation. For example, the light-emitting

Semiconductor component 4 but also as a light-emitting diode (LEDs) in the form of one or more semiconductor chips be mounted or in each case in a housing body, preferably a preformed housing body, mounted and electrically connected or are. The light

For example, emitting semiconductor device 4 may also include a converter element that can convert at least a portion of the light generated by the semiconductor chip into light having a different wavelength, such that light-emitting semiconductor device 4 may emit mixed-color, such as white, light.

Depending on the desired light that is to be radiated from the module 100, on the second element 2, a

Be arranged plurality of light-emitting semiconductor devices 4, which can emit light of the same wavelength or the same color impression or even different colored light.

The second element 2 is thermally connected to the first element 1, so that heat in the operation of the light

emissive semiconductor device 4 is formed, can be derived from the second element to the first element 1.

Furthermore, the first element 1 on the

reflective main surface 11 opposite second main surface 12 at least one cooling fin 3. In the illustrated embodiment, the module 100 in particular two cooling fins 3. The cooling fins 3 extend along the second major surface 12 of the first element 1 of FIG

Connecting edge 10 away and run along the entire Main surface 12. Furthermore, the cooling fins 3 extend away from the second main surface 12 of the first element 1. As a result, the cooling fins 3 have a large surface, which can be flowed around by a cooling medium such as air. The cooling fins 3, for example copper and / or

Aluminum are or are thermally connected to the first element 1, so that the light

Emissive semiconductor component 4 generated heat through the cooling fins 3 can be delivered to the cooling fins 3 surrounding cooling medium.

In particular, the module 100 can be an installation direction

in which the cooling fins 3 are vertically aligned as shown in Figs. 1B and 1C, that is

at least partially along the direction of gravity, so that ambient air, which is heated in the region of the cooling fins 3, can flow upward against the direction of gravity. The installation direction can be as shown

Embodiment be such that the first element is disposed below the second element 2, so that the light-emitting device 4 radiates from top to bottom. Alternatively, the mounting direction of the module 100 may also be such that the second element 2 is arranged below the first element 1 and the semiconductor device 4 emitting light emits light from the bottom upwards.

As an alternative to the embodiment shown as a light-emitting module, the module 100 can also not emit light

Have semiconductor device 4 and thus be formed as a reflector module.

Both in the embodiment as a light-emitting module and as a reflector module which can be connected to the first main surface 11th - Il ^¬

of the first element 1 adjacent side 21 of the second

Elements 2 and / or the side of the opposite side of the second element 2 may be reflective. In the following figures 2 to 7B are more

Embodiments of modules shown, the modifications of the embodiment according to Figures 1A to IC

represent. The modules of FIGS. 2 to 7B may have features of the module 100 as well as additionally or alternatively further features as described above in the general part.

Each of the modules 102, 103, 104 of FIGS. 2 to 4 has a comparison with the module 100 of FIGS. 1A to 1C

reflective element 5, which is arranged at a connecting edge 20 of the second element 2. The reflective elements 5 have a reflective main surface 51 facing away from the second element 2. In particular, the main reflecting surface 51 encloses an angle 92 greater than 180 ° with the second element 2, in particular with the side 21 of the second element 2 which adjoins the first main surface 11 of the first element 1. As can be seen from the exemplary embodiments of FIGS. 2 to 4, the reflector 5 can be curved both concavely and convexly. Alternatively, the reflector may also be designed as a planar element that is not curved.

Furthermore, the reflecting element 5 may also have a round shape instead of the two-part, bent shape shown in each case. The curvature of the reflective

Elements, in particular the reflective main surface 51, can thereby as in the embodiment shown

two-dimensional, alternatively, the curvature may also be three-dimensional. As related to the following Illustrated embodiments, the reflective is

Element 5 of a module corresponding to a desired

Abstrahlcharakteristik a lighting device formed with a plurality of modules.

FIGS. 5A to 5C show an exemplary embodiment of a lighting device 1000 with a plurality of modules 104. In Figs. 5A to 5C are various

Views of the lighting device 1000 shown.

The modules 104 are similar to the module 102 shown in FIG. In particular, the modules 104 are

arranged side by side, so that the respective cooling fins 3, the first elements 1, the second elements 2 and the reflective elements 5 are each arranged side by side. The modules 104 are rotated against each other and arranged offset.

In particular, in the embodiment shown, only the middle module 104 has a light-emitting

Semiconductor device 4 on. This means that the two outer modules 104 are designed as reflector modules, whereas the middle module 104 is designed as a light-emitting module. Light emitted from the semiconductor light-emitting device 4 may be emitted from the

reflective first major surfaces 11 of the first elements 1 of all modules 104 are reflected.

Due to the rotation and the height displacement of the modules 104 to each other, a close arrangement of the modules 104 can be achieved. Furthermore, the illumination device 1000 can further as light emitting modules and / or as Reflector modules have executed modules that can be arranged in a ring or helical.

FIG. 6 shows an example of an embodiment

Lighting device 1001 shown, which has a plurality of modules 105, which in the illustrated embodiment, purely by way of example similar to the modules 104 of

Lighting device 1000 are executed. In this case, the modules 105 are rotated relative to one another and offset so that a helical arrangement or a helical arrangement of the plurality of modules 105 results. As in the previous exemplary embodiment, in the exemplary embodiment of FIG. 6, every third module 105 has a light-emitting semiconductor component and is thus designed as a light-emitting module, with always two adjacent modules 105 as reflector modules

are formed. The light-emitting

Semiconductor devices of the various light-emitting modules may be the same or different with respect to the radiated light. Due to the helical or helical arrangement of the modules 105, an illumination device 101 emitting on all sides can be achieved. In particular, light emitted by a light-emitting semiconductor component of a module in the direction of a module 105 arranged thereunder can be reflected by its reflective element 5, whereby homogenization of the emission characteristic can be achieved. FIGS. 7A and 7B show an exemplary embodiment of a lighting device 1002. FIG. 7B shows an oblique view of the illumination device 1002, while FIG FIG. 7A shows a representation along a sectional plane

perpendicular to the cylinder axis of the elements 6 and 7 shows.

Compared to the illumination device 1001 of FIG. 6, the illumination device 1002 has a holding element 6, which has a cylindrical shape and on which the modules 106, which are designed purely by way of example in the exemplary embodiment shown similar to the modules 105, are arranged. For this purpose, the holding element 6 openings, for example

Slots, on (not shown) through which the cooling fins 6 of the modules 106 can protrude into the interior of the cylindrical support member 6. The modules 106 are thus each with the holding element 6 facing the second major surfaces 12 on

Holding element 6 is arranged and fixed. The arrangement of the cooling fins 3 within the cylindrical support member 6, a gain of the chimney effect is achieved, so that an effective flow through the interior of the support member 6 and thus effective cooling of the cooling fins 3 can be achieved by the air flowing through.

Within the running as a cylinder housing support member 6, a connecting element 7 is arranged, which is also cylindrical in the embodiment shown. The connection element 7 has electrical leads and / or electrical connections and / or at least one electrical control element for the plurality of modules 106, so that they can be electrically connected and activated by the connection element 7. Thus, the interior of the cylindrical support member 6 both for cooling by convection of the ambient air as well as the arrangement

electrical connections and / or electrical ballasts are used, so that the lighting device 1002 space-saving and can be produced with small dimensions. The Lighting device 1002 can be used in the arrangement direction as shown in Figure 7B or in a direction reversed to the direction of illumination. For electrical connection of the illumination device 1002 to an external power supply, the holding element 6 and / or the connection element 7 may have a connection region

(Not shown) .

FIGS. 8A and 8B show an exemplary embodiment of a further illumination device 1003. The

Lighting device 1003 has a plurality of

helically arranged modules having features according to the previous embodiments and / or according to the

Description in the general part, which are attached to the holding element 6 as in the previous embodiment and are not shown for clarity.

Compared to the previous embodiment, the holding element 6 has an end portion 61 which has a widening cross-section. In other words, the holding element 6 has a conically widening end region 61. From the end region protrudes the connecting element 7 with a connection portion 76, by means of which the

Connecting element 7 and thus the lighting device 3 to an existing lamp base 901, which is arranged for example on a wall or Deckenelement900, attached and can be electrically connected. By the conically widening end portion 61 of the support member 6 can improve the air supply or -ab-, depending on

Alignment or arrangement of

Lighting device 1003 on a floor or

Ceiling element 900, can be achieved. The lamp base 901 shown, for example, a so-common for light sources be named E27 socket. For this purpose, the connection region 76 can be designed accordingly, so that the

Lighting device 1003 is designed as a so-called retrofit lighting device.

Simulations of lighting equipment according to the

Embodiments of FIGS. 7A to 8B, which were implemented in both the arrangement direction shown and in a direction reverse thereto, have shown that in a room with three meter long sides for light-emitting semiconductor devices with a luminous flux of 80 lumens illumination with a luminosity in places more than 50 lux can be achieved. Due to the shown embodiments of the modules, in particular the

reflective elements of the modules, a predominant illumination of the walls can be achieved, while a direct light radiation to the floor of the room can be avoided. Other formations and arrangements of the modules also other radiation characteristics can be achieved.

Due to the modular structure of the described here

Illumination devices which, as an alternative to the exemplary embodiments shown, also different modules with and / or without reflective elements and / or light

may have emitting semiconductor devices, can be flexibly buildable and deployable lighting solution

be enabled, which has an effective convection cooling.

The invention is not limited by the description based on the embodiments of these. Rather, the invention includes every new feature and every combination of features, which in particular the combination of features in The patent claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given.

Claims

claims

A module (100) for a lighting device (1000), comprising:

- A plate-shaped first element (1) having a first main surface (11) and one of the first main surface (11) opposite the second main surface (12), wherein the first main surface (11) is formed reflective and on the second main surface (12) at least a cooling fin (3) extending from the first element (1),

arranged and thermally connected to the first element (1)

connected, and

- a plate-shaped second element (2), which on a

Connecting edge (10) of the first element (1) on the first element (1) and is thermally connected to the first element (1) and with the first main surface (11) of the first element (1) has an angle (91) of less than 180 °.

2. Module according to claim 1, wherein the at least one

Cooling fin (3) along the second main surface (12) of the first element (1) from the connecting edge (10) extends away.

3. Module according to claim 1 or 2, wherein on the second main surface (12) of the first element (1) at least two

Cooling ribs (3) are arranged.

4. Module according to one of the preceding claims, wherein the second element (2) has one of the at least one cooling rib (3) facing away from side (21), which is formed reflective.

5. Module according to one of the preceding claims, wherein the second element (2) is designed as a circuit board.

6. Module according to one of the preceding claims, wherein the second element (2) has one of the at least one cooling rib (3) facing away from side (21) on which a light

emitting semiconductor device (4) is arranged.

7. Module according to one of the preceding claims, wherein at one of the connecting edge (10) of the first element (1) opposite the connecting edge (20) of the second

Element (2) a reflective element (5) having a reflective main surface (51) is arranged, which with the second element (2) forms an angle (92) of more than 180 °.

8. Module according to the preceding claim, wherein the

reflective element (5) has a reflective major surface (51) facing away from the second element (2).

9. lighting device (1000) having a plurality of modules (100) according to any one of claims 1 to 8, wherein the respective first and second elements (1, 2) and the

Cooling ribs (3) of the modules (100) are each arranged side by side.

10. Lighting device according to claim 9, wherein the modules (100) offset from each other and are twisted.

11. Lighting device according to claim 9 or 10, wherein the modules (100) are arranged helically.

12. Lighting device according to one of claims 9 to 11, further comprising a cylindrical holding element (6), on which the modules (100) each with the second

Main surface (12) of the first element (1) facing the holding element (6) are arranged.

13. Lighting device according to claim 12, wherein the

Holding element (6) has a conically widening end portion (61).

14. Lighting device according to claim 12 or 13, wherein the holding element (6) inside a connection element (7) having electrical leads and / or electrical connections and / or at least one electrical control element for the plurality of modules (100).

15. Lighting device according to one of claims 12 to 14, wherein the holding element (6) or optionally the

Connection element (7) has a connection region (76) for

Connection and / or attachment of the illumination device (1000) in a lamp base (901).