EP2556286B1 - Led module having a double diffuser - Google Patents
Led module having a double diffuser Download PDFInfo
- Publication number
- EP2556286B1 EP2556286B1 EP11712252.3A EP11712252A EP2556286B1 EP 2556286 B1 EP2556286 B1 EP 2556286B1 EP 11712252 A EP11712252 A EP 11712252A EP 2556286 B1 EP2556286 B1 EP 2556286B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- led
- diffuser element
- lamp according
- led lamp
- retrofit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 238000001228 spectrum Methods 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 9
- 229920003023 plastic Polymers 0.000 claims description 9
- 238000000295 emission spectrum Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/10—Refractors for light sources comprising photoluminescent material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a retrofit LED lamp, which are designed as a replacement of halogen lamps or incandescent lamps.
- LEDs are usually manufactured as LED modules. It is to think of LED modules, consisting of at least one blue LED, which generates white light arranged by arranged on the LED wavelength conversion means. By means of RGB LED modules, any desired color can be generated, wherein a setting and a dimming via a PWM control of the individual color channels can be realized.
- LED lamps can be used in the form of so-called retrofit LED lamps.
- the LED lamp has the form and function, for example, of a conventional light bulb, but it comprises one or more LEDs or one or more LED modules as the light source.
- the retrofit LED lamp also has its own driver circuit, which, starting from, for example, adapts the supply current to the operating conditions of the LEDs from a mains voltage supplied via the base.
- the LED retrofit bulbs like conventional bulbs can be screwed into ordinary lamp sockets and operated by means of the supplied mains current.
- LED light sources are from the pamphlets EP 2 109 158 A1 .
- WO 2008/144672 A1 US2009 / 0086492 .
- the known optical elements used for light mixing are diffusers, lenses, reflectors, etc., and their combinations.
- a diffuser for example, as the upper part of an LED lamp with the proposed solution results in the problem that negative shading effects can result in an edge region of the upper part designed as a diffuser.
- this edge region of the diffuser-shaped upper part is viewed with the human eye, it may disadvantageously be the case that spatially separated spectra or colors can not be seen as the mixed spectrum of the at least two LED chips but as a type of backlit lampshade ,
- the invention generally proposes to provide an at least two-shell diffuser element with a primary diffuser element and a shell acting as a secondary diffuser.
- the LED module can have at least two LED chips with different emission spectra.
- At least one LED chip can produce white, greenish white or green light under phosphor conversion.
- At least one LED chip produces monochromatic light, for example in the red spectrum.
- One or both diffuser elements can be made of a plastic material and / or of glass.
- the first diffuser element may be hood-shaped.
- the first diffuser element can be designed such that the edge region of the hood at least laterally completely surrounds the LED chip (s).
- the wall thickness of the first diffuser element may be smaller in a region above the at least one LED chip than in the edge region of the hood-like diffuser element which diffuses diffusely laterally emitted light of the at least one LED chip.
- the first diffuser element can be mounted on the LED carrier or on an element arranged below the LED carrier, which is preferably heat-dissipating.
- the first diffuser element can be mounted mechanically, for example by latching.
- the first diffuser element may be spaced from the LED chip by at least 1 mm, preferably at least 2 mm.
- One or both diffuser elements may have a homogeneous or an inhomogeneous wall thickness between 0.1 mm and 5 mm, preferably between 1 mm and 3 mm.
- the first diffuser element may overlap with the side surfaces of the carrier for the at least one LED chip.
- Fig. 1a and 1b show an inventive embodiment of a retrofit LED lamp with an LED module. 7
- the bulb 1 has a conventional base 2, for example with an E14, E17 or E27 screw thread.
- a socket is conceivable that is designed for a low-voltage connection, such as a G4, G5 or G6 pin header.
- a BA9 or BA15 bayonet socket is conceivable.
- the bulb has a driver circuit 5.
- This can have any conceivable drive circuit for this application, as is known from the prior art.
- this can be followed by a DC-DC converter or other converter, which reduces the voltage or the current or the power.
- a switch can be used, which is switched by means of pulse width modulation (PWM).
- PWM pulse width modulation
- the LED module 7 can have one or more LEDs and / or OLEDs.
- fluorescent-converted blue LEDs can be used, RGB LED modules or their conceivable combinations.
- these are at least one blue LED, in which a part of the emitted blue light is converted into yellow, greenish yellow light by color conversion means such as phosphor.
- color conversion means such as phosphor.
- phosphor-converted green and / or greenish white LEDs is also conceivable.
- one or more red LEDs (or other monochromatic LEDs) are used in addition, which lead to a higher color rendering value and provide for a warmer light.
- the red LEDs can be arranged separately from the phosphor-converted blue LEDs, or they can be located next to them, so that also a part of their emitted red light is converted to phosphor.
- the LED module can be realized as a COB ("chip-on-board") module.
- the LED chips 20, 21 may be covered with a potting compound, which is formed dome-shaped (eg as a globe top).
- the LED module 7 now sits on an inner layer of a heat sink arrangement.
- the LED module and the inner layer 6 are connected flat.
- the inner layer in the region in which the LED module rests as flat as possible, so that the inner layer and the LED module have the highest possible contact surface, ie that they are connected over the entire surface.
- the inner layer may consist of an upper part 6 and a lower part 4.
- the inner layer may at least partially enclose the driver circuit 5.
- the lower part 4 has an advantageous manner an opening on the bottom, whereby the driver circuit can protrude or through which a conductor can protrude, which establishes an electrical contact with power supply.
- the upper part 6 also has a bulged outward shape, so that there is sufficient space on the inside for the driver circuit. On its outside, preferably in the middle of the bulge, it has a flat area on which the LED module 7 is mounted.
- the upper part 6 may thus have an approximately hemispherical shape, which is flattened on its upper side.
- the upper and lower parts 6 and 4 are connected as flat as possible and thus have a heat transfer between the parts and a strong mechanical fixation.
- a bayonet closure, a screw thread or a linear, conical or stepped connection can be used as the connection.
- a part is inserted into the other clip-like.
- the mounting of the LED module 7 on the inner layer is easier to perform because the upper side can be used separately from the lower side, and the driver circuit can be inserted more easily.
- the upper side 6 may additionally have optical means in the region of the LED module, such as a cavity in which the LED module is mounted. However, it is advantageous if the generated light can emerge at a large angle.
- the inner layer consists of an electrically conductive material such as metal, for example. Aluminum or plastic.
- the heat sink assembly further includes an outer layer surrounding the inner layer, the outer layer having as high a surface area as possible.
- This layer also consists of an upper part 8 and a lower part 3. These are vorzugseiwese connectable via a thread, whereby thus a high mechanical fixation and a high heat transfer is ensured by a large common surface between the parts.
- the outer view is preferably made of a non-conductive material such as plastic, or at least of a low-conductivity material having an insulating property. In addition, it has a lower thermal conductivity than the inner layer.
- the inner and the outer layer are at least partially flush with each other.
- both layers have the largest possible abutting surface, and thus the largest possible heat transfer between the two layers is guaranteed.
- the two lower parts 4 and 3 are also shaped so that they rest against each other as possible without an air gap. You can, for example, a have conical shape with low tolerances. It is also conceivable that in order to increase the abutting surfaces of the outer and inner layers, the layers have a mutually corresponding interlocking structure, such as ribs or corrugations.
- This space may include optical means such as a lens. Furthermore, it is possible that this space is at least partially filled, for example, with a transparent material, so that also heat dissipation between the two tops can be done.
- the lower part of the outer layer is connected to the lamp cap 2 so that both parts have a large common surface. Thus, a high heat transfer between the outer layer and the lamp cap is ensured.
- the outer layer is also at least partially, in particular in the region of the upper part 8, translucent or transparent, so that the light generated by the LED module 7 shines through.
- the upper part 8 can also have optical properties such as a lens, diffuser particles or the like.
- the lower part 3 has a thickness of at least 100 .mu.m, preferably of at least 200 .mu.m, and more preferably of at least 500 ⁇ m, but more preferably at least 1000 ⁇ m.
- the inner layer and the driver circuit there may be a gap between the inner layer and the driver circuit. This can be filled with air. It is also conceivable that he be filled with a potting compound. In this case, the potting compound can also represent a connection of all parts of the cooling arrangement, the lamp cap 2, as well as the driver circuit. Thus, a mechanical fixation and a heat transfer between the parts is favored.
- Contact between the inner and outer layers can also be made by making the inner layer a metal insert in an outer layer made by molding.
- a mechanical fixation can be made via standard methods such as ribs or cavities in metal use.
- the outer layer and the metal insert, i. the inner layer may also be joined by means of a bonding agent such as adhesive, grease, cement or an elastomer.
- a bonding agent such as adhesive, grease, cement or an elastomer.
- the use of plastic inserts is also conceivable.
- the inner layer may have at least partially an additional, third layer on its inner surface. This has insulating properties. Thus, the driver circuit can be further protected against short circuits. It is conceivable that this insulating layer in the area below the LED module has a recess, so that via the inner, conductive layer, an electrical connection between the driver circuit and the LED module can be made. However, it is also conceivable that the third layer is formed continuously and inner layer and the third layer in the region of the LED module are pierced to make contact with conductors.
- the LED module 7 may have a common board 30 on which at least 2 LED chips 20, 21 are applied.
- the LED chips 20, 21 preferably emit light with different spectra.
- the LED chip 20 can emit white light under phosphor conversion, while the LED chip or chips 21 can emit monochromatic light, for example in the reddish range.
- a particular embodiment relates to the fact that by appropriate individual control of the LED chips 20, 21 with different spectra, the mixing spectrum of the LED lamp, for example, color temperature of white light, is adjustable.
- the invention generally proposes to provide a diffuser element with at least two-shell structure with a primary diffuser element 10 and the upper part 8 acting as a secondary diffuser. If the invention is described in the context of the present description with reference to an example, candle-shaped retrofit LED lamp element, it is still clear that the invention can also be applied generally to LED modules, in particular those in which at least two LED chips with different emission spectrum are arranged at the same level.
- the primary diffuser element 10 hood-like enclose the LED chips 20, 21.
- This can be a rounded hood (for example with a U-shaped or box-shaped cross-section).
- the hood-shaped primary diffuser element 10 is formed such that the edge region of the hood at least laterally completely surrounds the LED chips 20, 21.
- the hood-shaped primary diffuser element 10 even further pulled down, namely on the heat sink body 6, on which in turn is mounted in thermal contact plate 30 of the LED module 7.
- Both the upper part 8 and the primary diffuser element 10 can be made of a plastic material, for example polycarbonate, polystyrene, polyester, polymethyl methacrylate (PMMA) or their copolymers.
- the diffuser elements may contain plastic particles, wherein the refractive indices of the particle core and the particle shell preferably do not match.
- the plastic particles can be distributed in a polymer matrix.
- the two diffuser elements can also be made of glass or glass-plastic mixtures.
- the secondary diffuser element (upper part) 8 is preferably spaced apart from the primary diffuser element 10 to form an air gap with an average minimum distance of, for example, at least 1 mm, preferably at least 3 mm.
- the primary diffuser element and the secondary diffuser element may be fabricated as an integral double-shelled piece.
- the primary diffuser element 10 is preferably at a homogeneous or inhomogeneous distance of at least 1mm, more preferably at least 2mm, again preferably with the formation of an air gap (a gap filled with gaseous medium), spaced from the respective nearest LED chip 20, 21.
- the wall thickness of the primary diffuser element 10 and / or of the upper part 8 acting as a secondary diffuser can each be homogeneous or inhomogeneous.
- the homogeneous or inhomogeneous wall thickness can be between 0.1 mm and 5 mm, preferably between 1 mm and 3 mm.
- the region 50 of the primary diffuser element 10 located above the LED chips 20, 21 may have a reduced wall thickness compared to the region 60 of the hood-type primary diffuser element 10.
- the primary diffuser element 10 can be mounted on a support, for example on the circuit board 30 of the LED module 7 mechanically (by clips, locking, gluing, etc.).
- the primary diffuser element 11 may also be formed dome-shaped.
- Fig. 3 an embodiment is shown in which the primary diffuser element 12 is arranged directly on the circuit board 30 of the LED module 7, and the LED chips 20, 21 carries.
- the first and / or second diffuser element may have color conversion means ("remote color conversion") which may be used as an alternative or in addition to a color conversion layer immediately, i. without an air gap, over one or more of the LED chips.
- remote color conversion may be used as an alternative or in addition to a color conversion layer immediately, i. without an air gap, over one or more of the LED chips.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Die Erfindung behandelt eine Retrofit LED-Lampe, die als Ersatz von Halogenlampen oder Glühlampen ausgestaltet sind.The invention relates to a retrofit LED lamp, which are designed as a replacement of halogen lamps or incandescent lamps.
Zur Beleuchtung werden immer häufiger LED-Lampen eingesetzt. Diese zeichnen sich durch ihre hohe Lichteffizienz und ihre Langlebigkeit aus. Des Weiteren können sie auf Grund ihrer äußerst geringen Abmessungen sehr flexibel eingesetzt werden. LEDs werden zumeist als LED-Module hergestellt. Dabei ist an LED-Module, bestehend aus mindestens einer blauen LED zu denken, das durch auf der LED angeordnetes Wellenlängenkonvertierungsmittel weißes Licht erzeugt. Mittels RGB-LED-Module lassen sich beliebige Farben erzeugen, wobei eine Einstellung und eine Dimmung über eine PWM-Ansteuerung der einzelnen Farbkanäle realisierbar ist.For lighting LED lamps are used more often. These are characterized by their high light efficiency and longevity. Furthermore, they can be used very flexibly due to their extremely small dimensions. LEDs are usually manufactured as LED modules. It is to think of LED modules, consisting of at least one blue LED, which generates white light arranged by arranged on the LED wavelength conversion means. By means of RGB LED modules, any desired color can be generated, wherein a setting and a dimming via a PWM control of the individual color channels can be realized.
LED-Lampen können in Form von sogenannten Retrofit LED-Lampen eingesetzt werden. Hierbei weist die LED-Lampe die Form und Funktion bspw. einer konventionellen Glühbirne auf, wobei sie jedoch als Leuchtmittel eine oder mehrere LEDs bzw. ein oder mehrere LED-Module umfasst. Zur Anpassung des Versorgungsstroms weist die Retrofit LED-Lampe zudem eine eigene Treiberschaltung auf, die ausgehend bspw. von einer über den Sockel zugeführten Netzspannung den Versorgungsstrom an die Betriebsbedingungen der LEDs anpasst. Somit können die LED-Retrofit-Glühbirnen wie konventionelle Glühbirnen in gewöhnliche Lampenfassungen eingeschraubt werden und mittels des zugeführten Netzstroms betrieben werden.LED lamps can be used in the form of so-called retrofit LED lamps. In this case, the LED lamp has the form and function, for example, of a conventional light bulb, but it comprises one or more LEDs or one or more LED modules as the light source. In order to adapt the supply current, the retrofit LED lamp also has its own driver circuit, which, starting from, for example, adapts the supply current to the operating conditions of the LEDs from a mains voltage supplied via the base. Thus, the LED retrofit bulbs like conventional bulbs can be screwed into ordinary lamp sockets and operated by means of the supplied mains current.
Verschiedene LED-Lichtquellen sind aus den Druckschriften
Bei LED-Modulen, die LED-Chips auf einem gemeinsamen Träger integrieren, stellt sich indessen das Problem, dass das emittierte Licht von den mindestens zwei (oder mehrere) LED-Chips mit unterschiedlichen Emissionsspektren möglichst homogen gemischt werden muß, um weißes Licht mit einstellbarer Farbtemperatur zu erzeugen.
Die bekannten optischen Elemente, die zur Lichtmischung dienen, sind Diffusoren, Linsen, Reflektoren usw. und ihre Kombinationen.
Die Anwendung von einem Diffusor z.B. als Oberteil einer LED-Lampe mit der vorgeschlagenen Lösung ergibt indessen das Problem, dass sich in einem Randbereich des als Diffusor ausgebildeten Oberteils negative Abschattungseffekte ergeben können. Mit anderen Worten, wenn dieser Randbereich des als Diffusor ausgebildeten Oberteils mit menschlichem Auge betrachtet wird, kann nachteilig der Fall eintreten, dass nicht das Mischspektrum der mindestens zwei LED-Chips, sondern als eine Art hinterleuchteter Lampenschirm örtlich getrennte Spektren bzw. Farben erblickt werden können.In the case of LED modules which integrate LED chips on a common carrier, however, the problem arises that the emitted light from the at least two (or more) LED chips with different emission spectra must be mixed as homogeneously as possible in order to produce white light with adjustable brightness To produce color temperature.
The known optical elements used for light mixing are diffusers, lenses, reflectors, etc., and their combinations.
However, the use of a diffuser, for example, as the upper part of an LED lamp with the proposed solution results in the problem that negative shading effects can result in an edge region of the upper part designed as a diffuser. In other words, if this edge region of the diffuser-shaped upper part is viewed with the human eye, it may disadvantageously be the case that spatially separated spectra or colors can not be seen as the mixed spectrum of the at least two LED chips but as a type of backlit lampshade ,
Um diesem Problem Abhilfe zu schaffen, schlägt die Erfindung allgemein vor, ein wenigstens zweischalig aufgebautes Diffusorelement mit einem Primärdiffusorelement und einem als Sekundärdiffusor wirkenden Oberteil vorzusehen.In order to remedy this problem, the invention generally proposes to provide an at least two-shell diffuser element with a primary diffuser element and a shell acting as a secondary diffuser.
Wenn die Erfindung im Rahmen der vorliegenden Beschreibung bezugnehmend auf ein beispielsweise kerzenförmig ausgebildetes Retrofit LED-Lampenelement beschrieben wird, ist noch ersichtlich, dass die Erfindung auch allgemein auf LED-Module angewendet werden kann, insbesondere auf solche, bei denen wenigstens zwei LED-Chips mit unterschiedlichem Emissionsspektrum auf der gleichen Ebene angeordnet sind. Die Lösung kann bei LED-Leuchten bspw. bei Deckenleuchten, Spots und Tischleuchten integriert werden.
Der Erfindung liegt also die Aufgabe zugrunde, eine Retrofit LED-Lampe mit LED-Modul mit verbesserter Farbhomogenität der Abstrahlcharakteristik vorzuschlagen.
Die Aufgabe wird erfindungsgemäß durch die Merkmale der unabhängigen Ansprüche gelöst. Die abhängigen Ansprüche stellen vorteilhafte Weiterbildungen der Erfindung dar. Ein Aspekt der Erfindung sieht vor ein LED-Modul, das aufweist:
- wenigstens einen auf einem Träger angebrachten LED-Chip,
- ein erstes ("primäres") Diffusorelement, das Licht von dem wenigstens einem LED-Chip diffus streut, und
- ein zweites ("sekundäres") Diffusorelement, das in Lichtabstrahlrichtung gesehen ausserhalb des ersten Diffusorelements und von diesem, vorzugsweise unter Bildung eines Luftspalts, getrennt ist.
The invention is therefore based on the object to propose a retrofit LED lamp with LED module with improved color homogeneity of the emission characteristics.
The object is achieved by the features of the independent claims. The dependent claims represent advantageous developments of the invention. An aspect of the invention provides an LED module comprising
- at least one LED chip mounted on a carrier,
- a first ("primary") diffuser element which diffuses light diffusely from the at least one LED chip, and
- a second ("secondary") diffuser element which, viewed in the light emission direction, is separated outside the first diffuser element and from the latter, preferably forming an air gap.
Das LED-Modul kann wenigstens zwei LED-Chips mit unterschiedlichen Emissionsspektren aufweisen.The LED module can have at least two LED chips with different emission spectra.
Wenigstens ein LED-Chip kann unter Leuchtstoffkonversion weißes, grünlich weißes oder grünes Licht erzeugen.At least one LED chip can produce white, greenish white or green light under phosphor conversion.
Wenigstens ein LED-Chip monochromatisches Licht, bspw. im roten Spektrum, erzeugt.At least one LED chip produces monochromatic light, for example in the red spectrum.
Eines oder beide Diffusorelemente kann/können aus einem Kunstoffmaterial und/oder aus Glas gefertigt sein.One or both diffuser elements can be made of a plastic material and / or of glass.
Das erste Diffusorelement kann haubenförmig ausgebildet sein.The first diffuser element may be hood-shaped.
Das erste Diffusorelement kann derartig ausgebildet sein, daß der Randbereich der Haube wenigstens seitlich vollständig den bzw. die die LED-Chips umgibt.The first diffuser element can be designed such that the edge region of the hood at least laterally completely surrounds the LED chip (s).
Die Wandstärke des ersten Diffusorelements kann in einem Bereich oberhalb des wenigstens einen LED-Chips geringer sein als in dem Randbereich des haubenartigen Diffusorelements, der seitlich abgestrahltes Licht des wenigstens einen LED-Chips diffus streut.The wall thickness of the first diffuser element may be smaller in a region above the at least one LED chip than in the edge region of the hood-like diffuser element which diffuses diffusely laterally emitted light of the at least one LED chip.
Das erste Diffusorelement kann auf dem LED-Träger oder auf einem unterhalb des LED-Trägers angeordneten Elements angebracht sein, das vorzugsweise wärmeabführend ausgebildet ist.The first diffuser element can be mounted on the LED carrier or on an element arranged below the LED carrier, which is preferably heat-dissipating.
Das erste Diffusorelement kann mechanisch, bspw. durch Einrasten montiert sein.The first diffuser element can be mounted mechanically, for example by latching.
Das erste Diffusorelement kann von dem LED-Chip mindestens 1mm, vorzugsweise mindestens 2mm, beabstandet sein.The first diffuser element may be spaced from the LED chip by at least 1 mm, preferably at least 2 mm.
Eines oder beide Diffusorelemente kann/können eine homogene oder eine inhomogene Wandstärke zwischen 0,1mm und 5mm, vorzugsweise zwischen 1mm und 3mm, aufweisen.One or both diffuser elements may have a homogeneous or an inhomogeneous wall thickness between 0.1 mm and 5 mm, preferably between 1 mm and 3 mm.
Das erste Diffusorelement kann mit den Seitenflächen des Trägers für den wenigstens einen LED-Chip überlappen.The first diffuser element may overlap with the side surfaces of the carrier for the at least one LED chip.
Das erste und/oder zweite Diffusorelement kann/können Farbkonversionsmittel aufweisen ("remote color conversion"), die alternativ oder zusätzlich zu einer Farbkonversionsschicht unmittelbar über einem oder mehreren der LED-Chips vorliegen. Die Erfindung bezieht sich auf eine Retrofit LED-Lampe, aufweisend ein LED-Modul der oben genannter Art.
Die Erfindung bezieht sich dabei insbesondere auf eine Retrofit LED-Lampe, aufweisend eine Fassung für Halogen- oder Glühlampen sowie ein LED-Modul der oben genannten Art.
Weitere Vorteile, Eigenschaften und Merkmale der Erfindung sollen nunmehr bezugnehmend auf die Figuren der begleitenden Zeichnungen erläutert werden.
Es zeigen:
-
Fig. 1a eine erfindungsgemäße Ausführungsform einer Retrofit LED-Lampe in einer Explosionsansicht, -
Fig. 1b die Ausführungsform vonFig.1a in zusammengebauter Weise, und -
Fig. 2 und 3 weitere Ausführungsbeispiele eines Primärdiffusors gemäss der vorliegenden Erfindung.
The invention relates in particular to a retrofit LED lamp, comprising a socket for halogen or incandescent lamps and an LED module of the type mentioned above.
Further advantages, characteristics and features of the invention will now be explained with reference to the figures of the accompanying drawings.
Show it:
-
Fig. 1a an embodiment of a retrofit LED lamp according to the invention in an exploded view, -
Fig. 1b the embodiment of1a in an assembled way, and -
FIGS. 2 and 3 Further embodiments of a primary diffuser according to the present invention.
Dabei handelt es sich um eine Retrofit LED-Lampe 1 zum Einsatz in einer konventionellen Lampenfassung. Hierfür weist die Birne 1 einen konventionellen Sockel 2, beispielsweise mit einem E14, E17 oder E27 Schraubgewinde auf. Alternativ ist auch ein Sockel denkbar, der für einen Niedervoltanschluss ausgelegt ist, wie ein G4, G5 oder G6 Stiftsockel. Auch denkbar ist ein BA9 oder BA15 Bajonettsockel.It is a retrofit LED lamp 1 for use in a conventional lamp socket. For this purpose, the bulb 1 has a
Wenn die Retrofit LED-Lampe 1 durch eine entsprechende Lampenfassung mit Netzwechselspannung oder mit Niedervoltspannung versorgt wird, wird zum korrekten Betrieb des LED-Moduls 7 eine Stromanpassung benötigt. Hierfür weist die Birne eine Treiberschaltung 5 auf. Diese kann jeden für diesen Einsatz denkbaren Ansteuerschaltkreis aufweisen, wie er aus dem Stand der Technik bekannt ist. So ist beispielsweise an einen AC-DC-Wandler zur Gleichrichtung einer Netzwechselspannung zu denken. Vorteilhafterweise kann diesem ein DC-DC-Wandler oder anderer Konverter nachgeschaltet sein, der die Spannung oder den Strom oder die Leistung reduziert. Dabei kann ein Schalter eingesetzt werden, der mittels Pulsbreitenmodulation (PWM) geschaltet wird. auch ist an eine nachgeschaltete Strombegrenzungsschaltung, beispielsweise mittels einer Transistorschaltung, zu denken.If the retrofit LED lamp 1 is powered by a corresponding lamp socket with mains AC voltage or low voltage, a current adjustment is required for correct operation of the
Das LED-Modul 7 kann eine oder mehrere LEDs und/oder OLEDs aufweisen. Dabei sind insbesondere leuchtstoffkonvertierte blaue LEDs einsetzbar, RGB-LED-Module oder ihre denkbaren Kombinationen. Bei den leuchtstoffkonvertierten LEDs handelt es sich insbesondere um mindestens eine blaue LED, bei denen durch Farbkonvertierungsmittel wie Leuchtstoff ein Teil des ausgestrahlten blauen Lichts in gelbes, grünlich gelbes Licht umgewandelt wird. Die Anwendung von leuchtstoffkonvertierten grünen und/oder grünlich weißen LEDs ist auch denkbar. Vorzugsweise werden noch zusätzlich eine oder mehrere rote LEDs (oder andere monochromatischen LEDs) eingesetzt, die zu einem höheren Farbwiedergabewert führen und für ein wärmeres Licht sorgen. Die roten LEDs können dabei separat zu den Leuchtstoffstoffkonvertierten blauen LEDs angeordnet sein, oder sie können sich neben diesen befinden, sodass ebenfalls ein Teil ihres ausgestrahlten roten Licht leuchtstoffkonvertiert wird.The
Das LED-Modul kann als ein COB ("Chip-on-Board")-Modul realisiert werden.
Die LED-Chips 20, 21 können mit einer Vergußmasse, die kalottenförmig (z.B. als Globe-Top) ausgebildet ist, bedeckt sein.The LED module can be realized as a COB ("chip-on-board") module.
The LED chips 20, 21 may be covered with a potting compound, which is formed dome-shaped (eg as a globe top).
Erfindungsgemäß sitzt das LED-Modul 7 nun auf einer inneren Schicht einer Kühlkörperanordnung. Somit sind das LED-Modul und die innere Schicht 6 flächig verbunden. Dabei ist die innere Schicht in dem Bereich, in dem das LED-Modul anliegt, möglichst eben, womit die innere Schicht und das LED-Modul eine möglichst hohe Kontaktfläche aufweisen, d.h. dass sie vollflächig verbunden sind. Die innere Schicht kann dabei aus einem Oberteil 6 und einem Unterteil 4 bestehen. Somit kann die innere Schicht die Treiberschaltung 5 zumindest teilweise einschließen. Das Unterteil 4 weist vorteilhafter Weise eine Öffnung auf der Unterseite auf, wodurch die Treiberschaltung hervorstehen kann oder durch welche ein Leiter hindurch ragen kann, der einen elektrischen Kontakt mit Stromversorgung herstellt. Das Oberteil 6 weist außerdem eine nach außen ausgewölbte Form auf, sodass sich auf ihrer Innenseite ausreichend Platz für die Treiberschaltung ergibt. Auf ihrer Außenseite, vorzugsweise in der Mitte der Auswölbung weist sie einen eben Bereich auf, auf dem das LED-Modul 7 angebracht ist. Das Oberteil 6 kann also eine in etwa halbkugelförmige Form aufweisen, die auf ihrer Oberseite abgeflacht ist.According to the invention, the
Das Ober- und Unterteil 6 und 4 sind möglichst flächig verbunden und weisen so eine Wärmeübertragung zwischen den Teilen sowie eine starke mechanische Fixierung auf. Hierfür kann als Verbindung ein Bajonettverschluss, ein Schraubgewinde oder eine lineare, konische oder abgestufte Verbindung verwendet werden. Auch ist denkbar, dass ein Teil in das andere clipartig eingefügt wird. Durch die zweiteilige Ausführung der inneren Schicht ist außerdem die Anbringung des LED-Moduls 7 auf der inneren Schicht leichter durchzuführen, da hierfür die Oberseite separat von der Unterseite verwendet werden kann, auch kann die Treiberschaltung leichter eingefügt werden. Die Oberseite 6 kann zusätzlich im Bereich des LED-Moduls optische Mittel aufweisen wie eine Kavität, in der das LED-Modul angebracht wird. Dabei ist es jedoch vorteilhaft, wenn das erzeugte Licht in einem großen Winkel austreten kann.The upper and
Die innere Schicht besteht aus einem stromleitenden Material wie Metall, bspw. Aluminium oder Kunststoff.The inner layer consists of an electrically conductive material such as metal, for example. Aluminum or plastic.
Somit weist sie ebenfalls eine hohe Wärmeleitfähigkeit auf.Thus, it also has a high thermal conductivity.
Die Kühlkörperanordnung weist weiterhin eine äußere Schicht auf, die die innere Schicht umgibt, wobei die äußere Schicht eine möglichst hohe Oberfläche aufweist. Auch diese Schicht besteht aus einem Oberteil 8 und einem Unterteil 3. Diese sind vorzugseiwese über ein Gewinde verbindbar, wobei somit eine hohe mechanische Fixierung sowie eine hohe Wärmeübertragung durch eine große gemeinsame Oberfläche zwischen den Teilen gewährleistet ist. Die äußere Sicht besteht vorzugsweise aus einem nichtleitenden Material wie Kunststoff, bzw. zumindest aus einem wenig leitendem Material, das eine isolierende Eigenschaft aufweist. Darüber hinaus weist sie eine geringere Wärmeleitfähigkeit, auf als die innere Schicht.The heat sink assembly further includes an outer layer surrounding the inner layer, the outer layer having as high a surface area as possible. This layer also consists of an
Hieraus ergibt sich der vorteilhafte Effekt, dass Wärme von der Wärmequelle, d.h. vom LED-Modul und auch von der Treiberschaltung mittels der inneren Schicht schnell abtransportiert wird und dann von der äußeren Schicht aufgenommen wird. Für diesen Zweck liegen die innere- und die äußere Schicht zumindest teilweise bündig aneinander an. Dies ist im Ausführungsbeispiel von
Zwischen den Oberteilen 6 und 8 der inneren und äußeren Schicht besteht ein Raum, indem sich das LED-Modul 7 befindet. Dieser Raum kann optische Mittel wie eine Linse aufweisen. Weiterhin ist es möglich, dass dieser Raum zumindest Teilweise gefüllt ist, beispielsweise mit einem transparenten Material, sodass ebenfalls eine Wärmeabgabe zwischen den beiden Oberteilen erfolgen kann.Between the
Das Unterteil der äußeren Schicht ist so mit dem Lampensockel 2 verbunden, dass beide Teile eine große gemeinsame Oberfläche aufweisen. Somit wird eine hohe Wärmeübertragung zwischen der äußeren Schicht und dem Lampensockel sichergestellt.The lower part of the outer layer is connected to the
Die äußere Schicht ist außerdem zumindest teilweise, insbesondere im Bereich des Oberteils 8, transluzent oder transparent, sodass das vom LED-Modul 7 erzeugte Licht hindurch scheint. Das Oberteil 8 kann zudem optische Eigenschaften wie eine Linse, Diffusorpartikel oder sonstiges aufweisen.The outer layer is also at least partially, in particular in the region of the
Das Unterteil 3 weist eine Dicke von mindestens 100µm, vorzugsweise von mindestens 200µm und noch bevorzugter von mindestens 500µm, am bevorzugten jedoch von mindestens 1000µm auf.The lower part 3 has a thickness of at least 100 .mu.m, preferably of at least 200 .mu.m, and more preferably of at least 500μm, but more preferably at least 1000μm.
Zwischen der inneren Schicht und der Treiberschaltung kann ein Spalt bestehen. Dieser kann mit Luft gefüllt sein. Auch ist denkbar, dass er mit einer Vergussmasse gefüllt sein. Dabei kann die Vergussmasse auch eine Verbindung aller Teile der Kühlanordnung, des Lampensockels 2, sowie der Treiberschaltung darstellen. Somit wird eine mechanische Fixierung sowie eine Wärmeübertragung zwischen den Teilen begünstigt.There may be a gap between the inner layer and the driver circuit. This can be filled with air. It is also conceivable that he be filled with a potting compound. In this case, the potting compound can also represent a connection of all parts of the cooling arrangement, the
Ein Kontakt zwischen der inneren und der äußeren Schicht kann auch darüber hergestellt werden, dass die innere Schicht ein Metall-Einsatz in einer durch Moulding-Verfahren hergestellten äußeren Schicht darstellt. Eine mechanische Fixierung kann dabei über Standardverfahren hergestellt werden wie Rippen oder Kavitäten im Metall-Einsatz. Die äußere Schicht und der Metalleinsatz, d.h. die innere Schicht können auch mittels eine Verbindungsmittels verbunden werden, wie Klebstoff, Schmierfett, Zement oder ein Elastomer. Die Verwendung von Kunststoffeinsätzen ist auch denkbar.Contact between the inner and outer layers can also be made by making the inner layer a metal insert in an outer layer made by molding. A mechanical fixation can be made via standard methods such as ribs or cavities in metal use. The outer layer and the metal insert, i. the inner layer may also be joined by means of a bonding agent such as adhesive, grease, cement or an elastomer. The use of plastic inserts is also conceivable.
Die innere Schicht kann auf ihrer Innenoberfläche zumindest teilweise eine zusätzliche, dritte Schicht aufweisen. Diese weist isolierende Eigenschaften auf. Somit kann die Treiberschaltung vor Kurzschlüssen weiter geschützt werden. Dabei ist denkbar, dass diese isolierende Schicht im Bereich unterhalb des LED-Moduls eine Aussparung aufweist, sodass über die innere, leitende Schicht eine elektrische Verbindung zwischen Treiberschaltung und LED-Modul hergestellt werden kann. Denkbar ist jedoch auch, dass die dritte Schicht durchgehend ausgebildet ist und innere Schicht sowie die dritte Schicht im Bereich des LED-Moduls zu dessen Kontaktierung von Leitern durchbohrt werden.The inner layer may have at least partially an additional, third layer on its inner surface. This has insulating properties. Thus, the driver circuit can be further protected against short circuits. It is conceivable that this insulating layer in the area below the LED module has a recess, so that via the inner, conductive layer, an electrical connection between the driver circuit and the LED module can be made. However, it is also conceivable that the third layer is formed continuously and inner layer and the third layer in the region of the LED module are pierced to make contact with conductors.
Wie in
Aufgrund der Anordnung der LED-Chips 20, 21 auf der gemeinsamen Platine 30 oder allgemein auf dem gleichen Niveau, ergibt sich indessen das Problem, dass sich in einem Randbereich des als Diffusor ausgebildeten Oberteils 8 negative Abschattungseffekte ergeben können. Mit anderen Worten, wenn dieser Randbereich 40 des als Diffusor ausgebildeten Oberteils 8 mit menschlichem Auge betrachtet wird, kann nachteilig der Fall eintreten, dass nicht das Mischspektrum der beiden LED-Chips 20, 21, sondern als eine Art hinterleuchteter Lampenschirm örtlich getrennte Spektren bzw. Farben erblickt werden können.Due to the arrangement of the LED chips 20, 21 on the
Um diesem Problem Abhilfe zu schaffen, schlägt die Erfindung allgemein vor, ein wenigstens zweischalig aufgebautes Diffusorelement mit einem Primär-Diffusorelement 10 und dem als Sekundärdiffusor wirkenden Oberteil 8 vorzusehen. Wenn die Erfindung im Rahmen der vorliegenden Beschreibung bezugnehmend auf ein beispielsweise kerzenförmig ausgebildetes Retrofit LED-Lampenelement beschrieben wird, ist noch ersichtlich, dass die Erfindung auch allgemein auf LED-Module angewendet werden kann, insbesondere auf solche, bei denen wenigstens zwei LED-Chips mit unterschiedlichem Emissionsspektrum auf der gleichen Ebene angeordnet sind.In order to remedy this problem, the invention generally proposes to provide a diffuser element with at least two-shell structure with a
Wie in
Wie in
Sowohl das Oberteil 8 wie auch das Primär-Diffusorelement 10 können aus einem Kunststoffmaterial, beispielsweise Polykarbonat, Polystyrene, Polyester, Polymethyl methacrylate (PMMA) oder ihre Kopolymere enthält, gefertigt sein. Die Diffusorelemente können Kunststoffpartikel enthalten, wobei die Brechungsindizes von Partikelkern und Partikelschale vorzugsweise nicht übereinstimmen. Die Kunststoffpartikel können in einer Polymermatrix verteilt sein.Both the
Die beiden Diffusorelemente können auch aus Glas oder Glas-Kunststoff Mischungen gefertigt sein.The two diffuser elements can also be made of glass or glass-plastic mixtures.
Das Sekundärdiffusorelement (Oberteil) 8 ist vorzugsweise unter Bildung eines Luftspalts mit einem durchschnittlichen Minimalabstand von beispielsweise mindestens 1mm, vorzugsweise mindestens 3mm von dem Primärdiffusorelement 10 beabstandet.The secondary diffuser element (upper part) 8 is preferably spaced apart from the
Das primäre Diffusorelement und das sekundäre Diffusorelement können als ein integrales doppelschalig aussehendes Stück gefertigt werden.The primary diffuser element and the secondary diffuser element may be fabricated as an integral double-shelled piece.
Wiederum das Primärdiffusorelement 10 ist vorzugsweise in einem homogenen oder inhomogenen Abstand von mindestens 1mm, mehr bevorzugt von mindestens 2mm, wiederum vorzugsweise unter Bildung eines Luftspalts (ein Zwischenraum ausgefüllt mit gasförmigem Medium), von dem jeweils nächstliegenden LED-Chips 20, 21 beabstandet.
Die Wandstärke des Primärdiffusorelements 10 und/oder des als Sekundärdiffusor wirkenden Oberteils 8 kann jeweils homogen oder inhomogen sein. Die homogene oder inhomogene Wandstärke kann zwischen 0,1mm und 5mm, vorzugsweise zwischen 1mm und 3mm, liegen.
Hinsichtlich des Primärdiffusorelements 10 kann beispielsweise der oberhalb der LED-Chips 20, 21 liegende Bereich 50 des Primärdiffusorelements 10 eine verringerte Wandstärke im Vergleich zum Bereich 60 des haubenartigen Primärdiffusorelements 10 aufweisen.Again, the
The wall thickness of the
With regard to the
Das Primärdiffusorelement 10 kann auf einem Träger, beispielsweise auch auf der Platine 30 des LED-Moduls 7 mechanisch (durch Klips, Verrasten, Verkleben, usw.) angebracht sein.The
Wie in
In
Licht von den LED-Chips 20, 21 wird also durch das Primärdiffusorelement 7, 11, 12 diffus gestreut. Da das menschliche Auge bei montierten LED-Lampen nicht direkt auf das Primärdiffusorelement 10, 11, 12 blicken kann, sondern nur auf das außerhalb befindliche Sekundärdiffusorelement in Form des Oberteils 8, kann vorteilhafterweise keine Farbtrennung mehr wahrgenommen werden. Somit wird das menschliche Auge auch bei direkter Betrachtung des Randbereichs 40 des Sekundär-Diffusorelements 8 ein Mischspektrum der LED-Chips 20, 21 erblicken, aber keine räumlich getrennten Farbwirkungen.Light from the LED chips 20, 21 is thus diffused by the
Das erste und/oder zweite Diffusorelement kann/können Farbkonversionsmittel aufweisen ("remote color conversion"), die alternativ oder zusätzlich zu einer Farbkonversionsschicht unmittelbar, d.h. ohne Luftspalt, über einem oder mehreren der LED-Chips vorliegen.The first and / or second diffuser element may have color conversion means ("remote color conversion") which may be used as an alternative or in addition to a color conversion layer immediately, i. without an air gap, over one or more of the LED chips.
Claims (14)
- A retrofit LED lamp, which has an LED module (7) and a cooling element arrangement,- wherein the LED module (7) has:- at least one LED chip (20, 21) mounted on a substrate,- a first diffuser element, which scatters the light from the at least one LED chip (20, 21) diffusely, and- a second diffuser element, which when viewed in the light emission direction is outside the first diffuser element and is separated therefrom, preferably forming an air gap, wherein the first diffuser element forming an air gap is spaced apart from the at least one LED chip (20, 21), wherein the at least one LED chip (20, 21) is covered with a color-conversion means,- wherein the cooling element arrangement has:- an inner layer (4, 6), and- an outer layer (3, 8), wherein the second diffuser element corresponds to an upper part (8) of the outer layer (3, 8);- wherein the LED module (7) rests on the inner layer (4, 6) of the cooling element arrangement and is flatly connected with the latter;- wherein the inner layer (4, 6) and the outer layer (3, 8) at least partially abut flush against one another.
- A retrofit LED lamp according to Claim 1,
which has at least two LED chips (20, 21) with different emission spectra. - A retrofit LED lamp according to Claim 1 or 2,
in which at least one LED chip (20, 21) generates white, greenish-white and green light under luminescent material conversion. - A retrofit LED lamp according to any one of the preceding claims,
in which at least one LED chip (20, 21) generates monochromatic light, for example, in the red spectrum. - A retrofit LED lamp according to any one of the preceding claims,
in which one or both diffuser elements are made from a plastic material and/or from glass. - A retrofit LED lamp according to any one of the preceding claims,
in which the first diffuser element is designed to be hood-shaped. - A retrofit LED lamp according to Claim 6,
in which the first diffuser element is designed in such a manner that the edge region of the formed hood at least laterally completely surrounds the LED chip(s) (20, 21). - A retrofit LED lamp according to any one of Claim 6 or 7,
in which the wall thickness of the first diffuser element is less in a region above the at least one LED chip (20, 21) than in the edge region of the hood-like diffuser element, which scatters laterally emitted light of the at least one LED chip (20, 21) diffusely. - A retrofit LED lamp according to any one of the preceding claims,
in which the first diffuser element is attached to the LED substrate or to an element arranged beneath the LED substrate, which is designed preferably so as to dissipate heat. - A retrofit LED lamp according to any one of the preceding claims,
in which the first diffuser element is mounted mechanically, for example, by snap-fastening. - A retrofit LED lamp according to any one of the preceding claims,
in which the first diffuser element is spaced at least 1 mm, preferably at least 2 mm apart from the LED chip (20, 21). - A retrofit LED lamp according to any one of the preceding claims,
in which one or both diffuser elements have a homogeneous or an inhomogeneous wall thickness between 0.1 mm and 5 mm, preferably between 1 mm and 3 mm. - A retrofit LED lamp according to any one of the preceding claims,
in which the first diffuser element overlaps with the side surfaces of the substrate for the at least one LED chip (20, 21). - A retrofit LED lamp according to any one of the preceding claims,
wherein the first and/or second diffuser element has color conversion means ("remote color conversion"), which alternatively or additionally to a color conversion layer are present directly above one or more of the LED chips (20, 21).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010003800 | 2010-04-09 | ||
DE201010029593 DE102010029593A1 (en) | 2010-04-09 | 2010-06-01 | LED module with double diffuser |
PCT/EP2011/055251 WO2011124565A1 (en) | 2010-04-09 | 2011-04-05 | Led module having a double diffuser |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2556286A1 EP2556286A1 (en) | 2013-02-13 |
EP2556286B1 true EP2556286B1 (en) | 2018-10-17 |
Family
ID=44658238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11712252.3A Active EP2556286B1 (en) | 2010-04-09 | 2011-04-05 | Led module having a double diffuser |
Country Status (6)
Country | Link |
---|---|
US (1) | US9057497B2 (en) |
EP (1) | EP2556286B1 (en) |
CN (1) | CN102893073B (en) |
DE (1) | DE102010029593A1 (en) |
TW (1) | TWI464347B (en) |
WO (1) | WO2011124565A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413748B (en) * | 2011-06-15 | 2013-11-01 | Lextar Electronics Corp | Led lighting device |
US8827523B1 (en) * | 2013-04-02 | 2014-09-09 | National Central University | Candle-like lighting device |
DE102014101403A1 (en) * | 2013-05-15 | 2014-11-20 | Seidel GmbH & Co. KG | lighting device |
US9657916B2 (en) * | 2015-05-28 | 2017-05-23 | Technical Consumer Products, Inc. | Lighting device including multiple diffusers for blending light |
CN105444008B (en) * | 2015-11-30 | 2018-10-19 | 小米科技有限责任公司 | A kind of intelligent lamp |
CN105402613B (en) * | 2015-11-30 | 2018-10-19 | 小米科技有限责任公司 | A kind of lamp mixed |
CN106931341A (en) * | 2015-12-31 | 2017-07-07 | 赛尔富电子有限公司 | A kind of area source LED bar graph lamp |
RU168264U1 (en) * | 2016-09-09 | 2017-01-25 | Общество с ограниченной ответственностью "Руслед" | LED LAMP |
CN212390136U (en) * | 2020-05-25 | 2021-01-22 | 漳州立达信光电子科技有限公司 | Lamp set |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1418630A1 (en) * | 2002-11-07 | 2004-05-12 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
US20090086492A1 (en) * | 2007-09-27 | 2009-04-02 | Osram Sylvania Inc | LED lamp with heat sink optic |
WO2010141617A1 (en) * | 2009-06-02 | 2010-12-09 | Bridgelux, Inc. | Light source having a refractive element |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361192B1 (en) * | 1999-10-25 | 2002-03-26 | Global Research & Development Corp | Lens system for enhancing LED light output |
US20080198604A1 (en) | 2007-02-20 | 2008-08-21 | Sekonix Co., Ltd. | Lighting apparatus using filter and condenser for led illumination |
EP2607169B1 (en) * | 2007-05-21 | 2021-07-07 | Signify Holding B.V. | An improved LED device for wide beam generation and method of making the same |
TWM326990U (en) * | 2007-06-25 | 2008-02-11 | Hong Kuan Technology Co Ltd | Anti-dazzling LED lighting module |
RU2525834C2 (en) * | 2008-01-22 | 2014-08-20 | Конинклейке Филипс Электроникс Н.В. | Lighting device with led and transmitting base comprising luminescent material |
JP4557037B2 (en) * | 2008-04-08 | 2010-10-06 | ウシオ電機株式会社 | LED light emitting device |
CN101430079B (en) * | 2008-12-11 | 2011-10-12 | 英飞特电子(杭州)有限公司 | Detachable led lamp |
CN201425257Y (en) * | 2009-05-14 | 2010-03-17 | 上海广电光电子有限公司 | Led light source device |
-
2010
- 2010-06-01 DE DE201010029593 patent/DE102010029593A1/en active Pending
-
2011
- 2011-04-05 CN CN201180024257.5A patent/CN102893073B/en not_active Expired - Fee Related
- 2011-04-05 WO PCT/EP2011/055251 patent/WO2011124565A1/en active Application Filing
- 2011-04-05 EP EP11712252.3A patent/EP2556286B1/en active Active
- 2011-04-05 US US13/639,941 patent/US9057497B2/en not_active Expired - Fee Related
- 2011-04-08 TW TW100112309A patent/TWI464347B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1418630A1 (en) * | 2002-11-07 | 2004-05-12 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
US20090086492A1 (en) * | 2007-09-27 | 2009-04-02 | Osram Sylvania Inc | LED lamp with heat sink optic |
WO2010141617A1 (en) * | 2009-06-02 | 2010-12-09 | Bridgelux, Inc. | Light source having a refractive element |
Also Published As
Publication number | Publication date |
---|---|
EP2556286A1 (en) | 2013-02-13 |
DE102010029593A1 (en) | 2011-10-13 |
TWI464347B (en) | 2014-12-11 |
TW201207318A (en) | 2012-02-16 |
CN102893073A (en) | 2013-01-23 |
CN102893073B (en) | 2018-02-13 |
US9057497B2 (en) | 2015-06-16 |
US20130039060A1 (en) | 2013-02-14 |
WO2011124565A1 (en) | 2011-10-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2556286B1 (en) | Led module having a double diffuser | |
EP2049835B1 (en) | Lamp | |
DE102009056115B4 (en) | Retrofit LED lamp with double-layer heat sink | |
DE102010043918B4 (en) | Semiconductor lamp | |
EP2753863B1 (en) | Lighting device | |
DE102015100631A1 (en) | Light-emitting device, light source for illumination and illumination device | |
DE202008006327U1 (en) | Lamp with heat build-up and associated lamp cover | |
DE102010001047A1 (en) | lighting device | |
DE202007008258U1 (en) | LED bulbs | |
EP2780956B1 (en) | Led module | |
DE102016115757A1 (en) | LED module and luminaire with the same | |
DE112011103188B4 (en) | Device for heat insulation for an LED lamp, LED lamp with it and manufacturing process for it as well as Modular LED lamp | |
DE102005059198A1 (en) | Fluorescent light | |
DE102014110087A1 (en) | Light emitting module, lighting device and lighting equipment | |
DE112015004420T5 (en) | LED BULB | |
DE102009023055A1 (en) | Line bulb-retrofit lamp has semiconductor lighting element having light emitting diode, radiator box and band-shaped semiconductor lighting module, which has semiconductor shining element and which is fastened on radiator box | |
EP2947372A1 (en) | Led module for spotlights | |
EP2627942A2 (en) | Led spotlight having a reflector | |
AT12552U1 (en) | LED RADIATOR WITH REFLECTOR | |
DE102007056270B4 (en) | Lighting unit with an LED light source | |
DE202009016460U1 (en) | LED lighting device | |
WO2012041734A2 (en) | Module for a lighting device and lighting device | |
DE202010013172U1 (en) | LED light with heat sink | |
EP3121512A1 (en) | Light, in particular downlight and/or spotlight comprising a light source | |
DE102016102047A1 (en) | lighting device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20121008 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20160121 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21K 9/232 20160101ALI20161031BHEP Ipc: F21V 5/00 20150101AFI20161031BHEP Ipc: F21Y 101/00 20160101ALI20161031BHEP Ipc: F21V 3/00 20150101ALI20161031BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Ref document number: 502011014869 Country of ref document: DE Free format text: PREVIOUS MAIN CLASS: F21K0099000000 Ipc: F21Y0115100000 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: F21K 9/232 20160101ALI20170720BHEP Ipc: F21V 3/00 20150101ALI20170720BHEP Ipc: F21Y 115/10 20160101AFI20170720BHEP Ipc: F21V 5/00 20150101ALI20170720BHEP |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: GRANT OF PATENT IS INTENDED |
|
INTG | Intention to grant announced |
Effective date: 20180703 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE PATENT HAS BEEN GRANTED |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D Free format text: NOT ENGLISH |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D Free format text: LANGUAGE OF EP DOCUMENT: GERMAN |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R096 Ref document number: 502011014869 Country of ref document: DE Ref country code: AT Ref legal event code: REF Ref document number: 1054484 Country of ref document: AT Kind code of ref document: T Effective date: 20181115 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R084 Ref document number: 502011014869 Country of ref document: DE |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: MP Effective date: 20181017 |
|
REG | Reference to a national code |
Ref country code: LT Ref legal event code: MG4D |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190217 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190117 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190117 Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: AL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190118 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20190217 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 502011014869 Country of ref document: DE |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
26N | No opposition filed |
Effective date: 20190718 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
REG | Reference to a national code |
Ref country code: BE Ref legal event code: MM Effective date: 20190430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190405 Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190430 Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190430 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190405 |
|
REG | Reference to a national code |
Ref country code: AT Ref legal event code: MM01 Ref document number: 1054484 Country of ref document: AT Kind code of ref document: T Effective date: 20190405 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: AT Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20190405 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20110405 Ref country code: MT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R081 Ref document number: 502011014869 Country of ref document: DE Owner name: TRIDONIC GMBH & CO KG, AT Free format text: FORMER OWNER: TRIDONIC JENNERSDORF GMBH, JENNERSDORF, AT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: MK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20181017 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20220419 Year of fee payment: 12 Ref country code: FR Payment date: 20220427 Year of fee payment: 12 |
|
P01 | Opt-out of the competence of the unified patent court (upc) registered |
Effective date: 20230530 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20230405 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230405 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230405 Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20230430 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20240429 Year of fee payment: 14 |