DE102012207563A1 - Lamp device i.e. incandescent lamp retrofitlamp, for illuminating room, has plate-like lamp modules including semiconductor light sources, and curved printed circuit board accommodated between upper and lower layers of multi-layer retainer - Google Patents

Abstract

The device (101) has plate-like lamp modules (102a-102c) including edge-side radiating semiconductor light sources i.e. side reflector LEDs (12). A curved printed circuit board is accommodated between an upper layer (107) and a lower layer (108) of a multi-layer retainer. The upper layer and/or the lower layer projects in a light radiating direction by the sources. The board is equipped with the semiconductor light sources. The equipped board is covered by a light-permeable cover. An electrical plug contact is provided on the board.

Description

The invention relates to a lighting device, comprising at least one lighting module, wherein the semiconductor light sources. The invention is particularly advantageous for use in lights and lamps, especially retrofit lamps, especially incandescent retrofit lamps.

One of the challenges of lamps and luminaires based on light-emitting diodes (LEDs) is to use the typically directionally emitting light-emitting diodes to create a lamp or luminaire which radiates as uniformly as possible in all directions of the solid angle or omnidirectionally. This has hitherto been achieved by the fact that LEDs are mounted on a three-dimensionally shaped carrier, so that they radiate in different directions. Here you also have to work with diffusers. Also, a number of light-emitting diodes is practically limited by the size of the one carrier.

Another requirement in lighting design is often brilliant light, which has locally perceivable brightness peaks. With diffusers and distant phosphors ("remote phosphor"), however, only surfaces that illuminate over a large area and that emit diffused light can be produced. In addition, this results in high losses. For example, blue light emitting LEDs can irradiate a phosphor layer which partially converts to yellow light and in turn emits white or blue-yellow mixed light in different directions.

It is also known to distribute light emitted by the LEDs over mostly axisymmetric reflectors or lenses in space, which is structurally complex and expensive.

An additional problem is also the commonly used heatsinks made of die-cast aluminum. Due to the high weight and cost reasons, an attempt is made to reduce the amount of aluminum used.

It is the object of the present invention to at least partially overcome the disadvantages of the prior art.

This object is achieved according to the features of the independent claims. Preferred embodiments are in particular the dependent claims.

The object is achieved by a lighting device, comprising at least one plate-shaped light module, wherein the light module has edge emitting semiconductor light sources. Thus, a compact structure of the lighting device can be connected to a high luminance. By a, in particular curved, design of the edge, a solid angle of the emitted light beam can be fanned out widely in the main plane of the printed circuit board, which enables a highly omnidirectional light emission with simple means. The light-emitting edges or narrow sides of the light modules also enable a brilliant light impression. Due to the plate-shaped basic shape of the at least one lighting module, a large cooling surface is also provided, so that a heat sink connected thereto may be small.

A peripheral-emitting semiconductor light source can be understood in particular to be a semiconductor light source whose main emission direction or optical axis is aligned such that it is aligned at its edge at least substantially parallel to a main plane of the plate-shaped illumination module.

Preferably, the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, e.g. based on InGaN or AlInGaP, organic LEDs (OLEDs, for example polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may be e.g. have at least one diode laser.

It is an embodiment that at least one light-emitting module has at least one printed circuit board each equipped with at least one side-emitter semiconductor light source. Thus, the edge-side or narrow-side light emission can be made possible with a particularly low cost, in particular only by equipping a planar printed circuit board. The light emission pattern generated by a printed circuit board can be easily passed through a change in a number, position and / or orientation (angle of attack) of the side-emitter semiconductor light sources vary. A side-emitter semiconductor light source is understood in particular to mean a semiconductor light source whose main emission or symmetry axis of its light beam is not perpendicular or normal to the surface of the printed circuit board on which it rests, but in particular runs parallel thereto. The side-emitter semiconductor light source emits its light with respect to the surface of the printed circuit board equipped therewith not forward or upward, but laterally thereto.

It is an embodiment of at least one light module having a multi-layer receptacle with at least one upper layer and one lower layer, wherein at least one printed circuit board is accommodated between the upper layer and the lower layer, and the upper layer and / or the lower layer over the at least one semiconductor light source protrude in the light emission direction. Firstly, this enables a simple electrical contacting via the layers, secondly the layers allow effective cooling, so that a dedicated heat sink can be even smaller or even dispensed with, and thirdly a particularly robust and easy-to-handle light module is provided. In addition, the upper layer and the lower layer can act as a panel in a top-side or bottom-side direction. Consequently, a corresponding (lateral) glare can be achieved in a simple and inexpensive manner. Expensive and expensive optics and dedicated diaphragms can be dispensed with. A dazzling effect can be easily adjusted by a distance of the semiconductor light sources from the edge of the upper and / or the lower layer.

The at least one semiconductor light source thus radiates in particular out of a front side or narrow side of the multilayer receptacle bounded by the upper layer and the lower layer ("edge-directed light extraction"). A main extension direction of the edge side or front side is also referred to below as a longitudinal direction, to which the upper layer and the lower layer are arranged laterally.

It is a development of that the upper layer and the lower layer are spaced apart by means of an intermediate layer, which together form a composite element. As a result, a particularly stable light module is provided.

It is still a further development that the upper layer and the lower layer consist of electrically conductive material and the intermediate layer consists of electrically non-conductive material. The electrically conductive material allows a typically very good thermal conductivity. In addition, the printed circuit board can be electrically connected to the upper layer and the lower layer, so that these layers can serve as large-area and easily contactable electrical connections of the light module. For example, these layers may represent different electrical poles.

It is also a development that the at least one populated printed circuit board is received in a region of a return of the intermediate layer between the upper layer and the lower layer. The return can be achieved, for example, by a simple material removal, e.g. Milling, the liner can be achieved. This embodiment enables a structurally more integrated, easily produced possibility of receiving the printed circuit board in the multi-layer receptacle designed as a composite element.

The upper layer and the lower layer of the multi-layer receiver are preferably aligned parallel to one another. The layers are preferably plate-shaped. The multi-layer recording can therefore be present in particular as a composite panel ("blade"). The upper layer and the lower layer may in particular have the same shape and size as well as the same material, in particular be of the same design.

It is a further development that the populated printed circuit board can be pressed by means of a clamping device introduced into the region of the recess onto one of the layers, in particular the lower layer. As a result, a high long-term stability of the lighting module and a particularly low heat transfer resistance between one of the layers, in particular the lower layer, and the printed circuit board resting thereon are achieved.

The clamping device may have one or more clamping elements. The clamping device may be made of metal or plastic.

It is also an embodiment that the clamping device is a light-transmitting cover for the at least one semiconductor light source. This refinement additionally makes it possible in a simple way to protect the assembled printed circuit board from external influences and also makes it possible to beamform. This clamping device is preferably made of plastic.

It is also an embodiment that the clamping device has at least one, in particular the circuit board facing away from, flexible web. Due to the flexible and thus elastically deformable web can be a fixed, well-defined and lasting contact pressure of the circuit board to the associated location. In addition, tolerances of the return can be compensated.

It is still a development that the clamping device is glued (in particular together with the circuit board) in the multi-layer recording. Also, the clamping device may be bolted to the intermediate layer and / or the upper or lower layer. In addition, the clamping device may be engaged in the multi-layer recording, in particular clipped be.

However, the use of a cover is generally not tied to its function as a clamping device, and it is a general configuration that the assembled printed circuit board is covered by a translucent cover.

This refinement additionally makes it possible in a simple way to protect the assembled printed circuit board from external influences and also makes it possible to beamform. So the cover may also be a clamping device, but it does not necessarily have to be.

It is a preferred development for a high luminous efficacy that the translucent cover is transparent. It is a preferred development for a more homogeneous light emission that the translucent cover is diffusely scattering or translucent.

The translucent cover may have one or more, in particular integrated therein, optical elements, in particular transmitted light elements such as lenses, etc., for flexible beam shaping.

The multi-layer recording can also have more than the above-described two or three layers.

In general, the multi-layer receptacle may have a plurality of printed circuit boards, in particular a multi-layer receptacle equipped with an intermediate layer may have one or more recesses and a plurality of printed circuit boards populated with side-emitter semiconductor light sources. Consequently, in particular a multi-layer receptacle can also have a plurality of spaced-apart, light-emitting edge or end-side sections.

However, the light emitting module is not limited to use of a multi-layer recording, and may be e.g. have no position or only one location for mounting the circuit board. So the at least one circuit board may also be single.

So it may be sufficient for easy production of a well-cooled light module that the light module has only one layer, which serves as a support for the circuit board. In particular, this layer may consist of a larger plate, e.g. a sheet, be cut or punched out and cause increased mechanical stability and, if thermally well conductive, improved heat dissipation. In this case, a cover, if present, attached to the one layer, that the layer can serve as a holding element to allow sufficient contact pressure of the cover. For example, the cover may embrace the situation.

It is still a development that the assembled printed circuit board with its unattached underside rests flat on the (lower) layer. As a result, a low thermal resistance between the circuit board and the corresponding layer is created, which allows effective heat dissipation from the circuit board in particular to this position. In order to reduce a heat transfer resistance, a heat transfer material such as a thermal paste, a thermally conductive adhesive, a heat conducting film or the like may be arranged between the printed circuit board and this layer.

It is a further development that at least one layer, in particular the lower layer bearing the printed circuit board, in particular the upper layer and / or the lower layer, consists of a good thermally conductive material, in particular with a thermal conductivity λ of at least 15 W / (m · K ), in particular of at least 100 W / (m · K). The material may be, for example, plastic or metal, in particular aluminum. If present, the intermediate layer may in particular be made of plastic. The multi-layer recording can be present in particular as an aluminum composite plate, in particular Alucobond or the like.

It is still a further development of the multi-layer recording that the upper layer and the lower layer are spaced apart from each other by means of an interleaved inserted aperture element for the at least one side-emitter semiconductor light source. This has the advantage that a more complex structure is possible between the layers. By means of the diaphragm element, an even more varied beam shaping of the light emitted by the side radiator LEDs is made possible.

It is a development of the fact that the upper layer and the lower layer are locked directly or indirectly with each other. This allows a simple and stable assembly.

It is still a further development that the upper layer with the panel member can be locked and the panel element can be locked with the lower layer. This simplifies a complex yet stable structure.

It is also a development of the fact that the aperture element several reflector areas which serve as individual reflectors for respective side-emitter semiconductor light sources. This allows for increased light output and even more varied beam shaping of the light emitted by the side-emitter LEDs. The reflector regions can in particular act as shell reflectors for the side-emitter LED and, for example, have specular or diffusely reflecting inner walls for this purpose. The reflector regions can be arranged in particular in a row.

However, the diaphragm element may also have non-reflective diaphragm regions, which then serve (only) as individual diaphragms for respective side-emitter semiconductor light sources.

On the back, a plate-shaped region may adjoin the reflector regions, which has several ribs on the upper side. The ribs may in particular serve to support the reflector at one position and to press it in the direction of the other layer. The plate-shaped area may lie flat on the top side of the printed circuit board and thereby press it onto its carrier.

It is also a further development that between the layers a rearwardly projecting support member is arranged, which has a rearwardly projecting portion and the rearwardly projecting portion and a rearwardly projecting portion of one of the layers form at least one slot for receiving a heat sink. This allows a particularly simple heat dissipation of the semiconductor light sources. The heat sink may in particular be a plate-shaped heat sink.

It is a preferred development for a good thermal heat dissipation, that the support member consists of a thermally highly conductive material, in particular metal. It is also advantageous for this purpose that the circuit board can rest on the support member. In particular, the printed circuit board can be easily thermally linked to a heat sink connected to the rearwardly projecting region.

The support element may in particular be a sheet metal part. The sheet metal part may in particular be plate-shaped with a step, wherein the step, in particular, mentally subdivides the rearwardly projecting region from a front region provided between the layers. The front area may carry the circuit board, possibly via a TIM material.

It is also a development that the circuit board is equipped with at least one (vertical radiator) LED, which radiates through one of the layers. So a side lighting or effect lighting are provided. For this purpose, the layers may, for example, at least partially consist of a light-transmitting material and / or have at least one light passage opening.

It is furthermore a further development that the at least one semiconductor light source has a plurality of semiconductor light sources arranged in at least one row. As a result, light leakage of high brightness can be provided in a simple manner over an elongate portion of the edge or front side (in the longitudinal direction thereof).

The semiconductor light sources may in particular be arranged in a row or in a plurality, in particular arranged one behind the other, optionally offset in height, rows.

The rows may have an at least partially straight basic shape and / or an at least partially curved basic shape.

It is also a development that the at least one row of semiconductor light sources runs along a (narrow-side or front-side) edge of the multilayer recording (if present), in particular with an equal distance thereto. Thus, a uniform shading or aperture effect can be achieved along the edge.

It is still an embodiment that the (frontal) edge is at least partially a curved edge. Thus, in a simple manner, a light distribution in the longitudinal direction can be set even more selectively, in particular be widened or narrowed.

However, at least in sections, the (end-side edge) may also be a straight edge.

It is yet another embodiment that at least some of the semiconductor light sources are aligned obliquely to the course direction (longitudinal direction) of the edge or the front side and in particular not only perpendicular thereto. This embodiment allows a different direction of the light emission from a position of the edge of the multilayer recording. This makes it possible, in particular, to align the emitted light differently for a given position or orientation of the lighting module.

It is still a further development that the semiconductor light sources oriented obliquely to the course direction of the edge are all aligned in the same direction. Alternatively, these semiconductor light sources, in particular in a curved Edge, all have an equal angle to their nearest edge region.

It is also an embodiment that at least some adjacent semiconductor light sources are angled at least one row facing each other. In this way, in particular, a light emission pattern having a plurality of local brightness maxima (for example a "batwing" pattern) can be generated in a compact manner, which is uniform over the row of semiconductor light sources. The fact that adjacent semiconductor light sources are angled towards one another may in particular mean that their light emission surfaces or emitter surfaces face each other, although in particular not frontally. In other words, adjacent semiconductor light sources or their light emitting surfaces may include an angle of less than 180 ° to each other. In particular, adjacent semiconductor light sources or their light emitting surfaces can enclose an angle between 90 ° and 180 °, in particular an angle between 135 ° and 180 °, in particular between 160 ° and 180 °.

It is furthermore an embodiment that at least some of the semiconductor light sources are arranged in adjacent groups and the groups each have at least two mutually angled semiconductor light sources. As a result, a similar and multi-specifiable predeterminable light emission over a number of groups and thus semiconductor light sources is made possible.

It is further an embodiment that the at least one semiconductor light source has a plurality of semiconductor light sources, of which at least one semiconductor light source serves as a diaphragm for at least one other semiconductor light source. Thus, a diaphragm effect without further, dedicated diaphragm elements can also be effected in a longitudinal direction or arrangement direction of the semiconductor light sources which is not influenced by the upper layer or the lower layer in terms of lighting technology.

It is still an embodiment that is located on the circuit board, an electrical plug contact. As a result, the light module can be contacted electrically in a simple manner. The electrical plug contact may be a plug element arranged on the printed circuit board and / or may be a contact tag protruding laterally from the printed circuit board.

It is yet another embodiment that the lighting device comprises a plurality of upright, arranged around a common axis of symmetry angularly offset lighting modules. Thereby, in particular together with a non-linear, e.g. curved, array of semiconductor light sources, a space in the circumferential direction are illuminated with high uniformity. Under an upright arrangement can be understood in particular an arrangement in which the axis of symmetry or a longitudinal axis of the lighting device is parallel to a plate or plate plane, in particular komplanar (but alternatively also spaced thereto) is located.

However, the invention is not limited thereto, and the lighting modules, eg 142 . 162 . 172 , Can also be inclined to the plane of symmetry or the longitudinal axis of the lighting device. Such a device may arise, for example, from a mental rotation of the connecting element.

As a result, a particularly strongly overlapping light emission pattern can be provided.

It is also an embodiment that the lighting modules are attached to the rear of a base of the lighting device and the front side are connected to each other by means of a connecting element. This allows easy installation and fixation of the lighting device. The base is used for connection to a power grid or similar. and may for example be in the form of a conventional socket, e.g. in the form of an Edison socket, bayonet socket or bipin socket.

It is also an embodiment that the light modules have semiconductor light sources arranged on opposite outer edges and the light modules can be plugged into one another at an angle offset from one another. This allows mounting with a small number of lighting modules as well as a particularly stable structure.

It is also an embodiment that the lighting modules have (only) an outside edge arranged semiconductor light sources and the lighting modules spaced from each other, in particular equidistant, are arranged. This simplifies attachment of the individual lighting modules.

It is still an embodiment that the lighting device further comprises a arranged on the connecting element, equipped with semiconductor light sources printed circuit board, wherein a main emission of these semiconductor light sources is aligned parallel to the common axis of symmetry of the lighting modules. Thus, an increased luminous flux is provided, in particular, along and within a narrow opening angle with respect to the common axis of symmetry. As a result, in particular, a smaller number of semiconductor light sources emitting light along the common axis of symmetry due to the presence of the connecting element can be compensated, and omnidirectionality is improved.

In addition, the semiconductor light sources can then be arranged so that they radiate more laterally, thus further improving omnidirectionality.

It is a further embodiment that the lighting modules are connected to each other by means of at least one inclined to the common axis of symmetry printed circuit board. The printed circuit boards can thereby be self-supporting, and it may be possible to dispense with a dedicated connection element for their fixation. In addition, a particularly large-scale arrangement and alignment of the semiconductor light sources can be achieved.

The at least one obliquely oriented printed circuit board does not need to have edge emitting semiconductor light sources, in particular side emitter light sources (but it may), but may, for example, have only perpendicular to one or both sides of the circuit board arranged perpendicular radiator semiconductor light sources.

The lighting device may in particular be a retrofit lamp, in particular incandescent retrofit lamp. Here, the highly omnidirectional character of the light emission is particularly advantageous advantage.

The lighting device may also be a light. For example, the lamp may be a floor lamp, a table lamp or a strip light. The at least one lighting device may be used to set a direction of emission of the light emitted therefrom, e.g. be mounted rotatably and / or displaceable.

The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following schematic description of exemplary embodiments which will be described in detail in conjunction with the drawings. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

1 shows in a view obliquely from above a section of a equipped with a plurality of side emitter semiconductor light sources printed circuit board;

2 shows in a view obliquely from above a section of another equipped with a plurality of side emitter semiconductor light sources printed circuit board;

3 shows in a view obliquely from above a multi-layer recording of a light module for receiving a printed circuit board;

4 shows in a view obliquely from above a light module with the multi-layer recording with a pick-up printed circuit board received therein according to 2 ;

5 shows in a view obliquely from above an enlarged section of the lighting module;

6 shows in a view obliquely from above a section of a rear portion of a cover for a printed circuit board;

7 shows in a view obliquely from above a section of a front portion of the cover;

8th shows in a view obliquely from above a (further) light module similar to 4 with the cover according to 6 and 7 ;

9 shows in a view obliquely from above even a light module similar to 4 with differently arranged semiconductor light sources;

10 shows in a view obliquely from above even a light module similar to 4 with semiconductor light sources differently arranged in a different way;

11 shows in a view obliquely from above even a light module similar to 4 with semiconductor light sources differently arranged in a still further way;

12 shows in a view obliquely from above yet another light module;

13 shows in a view obliquely from above yet another light module and;

14 - 21 show yet another light module or components thereof;

22 - 26 show yet another light module or components thereof;

27 shows an oblique view of a first lighting device in the form of a filament retrofit lamp with a plurality of lighting modules;

28 shows an oblique view of a multi-layer recording of the lighting device 27 ;

29 shows an oblique view equipped with a side lamp LEDs PCB for use in the multi-layer recording 28 ;

30 shows an oblique view of the multi-layer recording

29 with a cover to be inserted therein for the circuit board 29 ;

31 shows in a view obliquely from above a section of the lighting device 27 in the area of the connecting element 31 ;

32 shows a sectional view in an oblique view of a front-side connecting element for the lighting modules;

33 shows the first lighting device 27 as an exploded view in side view;

34 shows an exploded view in side view of a socket of the lighting device 27 ,

35 shows the lighting device 27 in a first longitudinal section;

36 shows the lighting device 27 in a second, angularly offset longitudinal section;

37 shows an oblique view of a second lighting device in the form of a filament retrofit lamp with a plurality of lighting modules;

38 shows the second lighting device in another oblique view with removed front-side connecting element;

39 shows an oblique view of a third lighting device in the form of a filament retrofit lamp with a plurality of lighting modules;

40 shows an exploded view in a view obliquely from the front of a light module of the third lighting device;

41 shows the lighting module of the third lighting device as an exploded view in a view obliquely from behind;

42 shows the third lighting device as an exploded view in side view;

43 shows in a view obliquely from above the third lighting device with removed front-side connecting element and only one light emitting module;

44 shows a sectional side view of a front cutout of the third lighting device with only one light module;

45 shows an oblique view of a fourth lighting device in the form of a filament retrofit lamp with a plurality of lighting modules;

46 shows an exploded view in a view obliquely from the front of a light module of the fourth light emitting device;

47 shows the light module of the fourth light device as an exploded view in a view obliquely from behind;

48 shows an oblique view of a fifth lighting device with a plurality of lighting modules;

49 shows an illumination module of the fifth lighting device as an exploded view in a view obliquely from the front;

50 shows a sixth lighting device in an oblique view in an exploded view;

51 shows the sixth lighting device in an assembled state;

52 shows the lighting modules of the fifth lighting device in an assembled state;

53 shows an upper cover of the lighting modules of the sixth lighting device; and

54 shows a lower cover of the lighting modules of the sixth lighting device.

1 shows in a view obliquely from above a section of one with a plurality of side emitter semiconductor light sources in the form of side emitter LEDs 12 equipped printed circuit board 11 , The side reflector LEDs 12 have laterally aligned light emitting surfaces 13 on, so that their main radiation direction H parallel to one with the side reflector LEDs 12 stocked top 14 the circuit board 11 lies. The side reflector LEDs 12 or their light emitting surfaces 13 are parallel to a leading edge 15 aligned with the circuit board, so that the main radiation direction H perpendicular to the leading edge 15 is.

The circuit board 11 has an elongated shape with at a trailing edge 16 rounded corners 17 on to a security against rotation when using the circuit board 11 to enable and facilitate easier use. The side reflector LEDs 12 are along a longitudinal extent of the circuit board 11 equidistant in a straight row and equidistant from the leading edge 15 arranged. Because the light emitting surfaces 13 pointing in the same direction to the front and the side reflector LEDs 12 are not deeply offset to each other, is their Light emission pattern not by another side emitter LED 12 shadowed or blocked.

2 shows in a view obliquely from above a section of another with multiple side emitter LEDs 12 equipped printed circuit board 11 , In contrast to 1 are the side reflector LEDs 12 now twisted, so that their main emission direction H is no longer perpendicular to the leading edge 15 is, but for example, an angle of about 45 ° angled to it. As a result, the side reflector LEDs 12 still arranged in a straight row, but now in relation to each other in terms of their light emission surfaces 13 Low added. This arrangement makes it possible, the light emission also angularly offset to the leading edge 15 to align the circuit board. Since the angle of attack can be varied, the radiation angle is thus independent of the position of the printed circuit board 11 ,

3 shows in a view obliquely from above a multi-layer recording 18 for receiving the assembled printed circuit board 11 , eg from 1 or 2 , The multi-layer recording 18 lies in the form of a rectangular or cuboid composite panel with an upper layer 19 made of aluminum, a lower layer 20 made of aluminum and an intermediate layer 21 made of electrically non-conductive plastic. In a front edge 22 or front side of the multilayer holder 18 is one in the liner 21 introduced return 23 , eg a cutout of the intermediate layer 21 , which serves as a receptacle for the circuit board 11 serves. The shape of the return 23 is in plan view conform to the shape of the circuit board 11 , so that the assembled circuit board 11 fitting in the return 23 can insert, as in 4 shown. This will be a light module 24 provided.

The circuit board 11 So is in the return 23 between the upper layer 19 and the lower layer 20 picked up, leaving the leading edge 15 the circuit board at least approximately flush with an edge of the lower layer 20 is arranged. Consequently, the side-spot LEDs are 12 obliquely to the direction or longitudinal direction of the edge 22 aligned.

In particular, the upper layer 19 and the lower layer 20 via the side reflector LEDs 12 or their light emitting surfaces 13 in the Lichtabstrahlrichtung or Hauptabstrahlrichtung H out and thereby serve as (with respect to a longitudinal direction of the edge 22 ) side panels. About the distance of the side reflector LEDs 12 to the edge 22 can the lateral glare vary. The farther the side reflector LEDs 12 behind the upper layer 19 and the lower layer 20 are arranged, the smaller the beam angle.

The circuit board 11 lies flat with its unequipped back on the lower layer 20 here, via a thermal interface material (TIM) in the form of a thin, thermally conductive adhesive layer 25 , This can cause waste heat from the side reflector LEDs 12 over the circuit board 11 and the adhesive layer 25 on the lower layer 20 be discharged, the lower layer 20 can serve as a heat spreading element and heat sink.

The upper layer 19 and the lower layer 20 can with the circuit board 11 be electrically connected and serve as their connection contacts.

How closer in 5 are shown in a view on the front edge 22 obliquely to the main emission direction H, the light emitting surfaces 13 the side reflector LEDs 12 partly by arranged in front, adjacent side reflector LEDs 12 covered. This is the brightest center Z of the side reflector LEDs 12 , from which the most light is emitted, drawn separately. Consequently, the side lamp LEDs serve 12 even as apertures in one direction along the longitudinal axis of the edge 22 , In particular, the center Z of the respectively sitting in front side spotlight LED 12 be obscured in the longitudinal direction to a certain angle and thus be blinded. Consequently, there is a comparatively sharp transition from the area full of light intensity to a glare-free area, as is advantageous, for example, for desk standing lamps.

Should this longitudinal glare of the side reflector LEDs 12 between them, it is also possible, additional glare elements (o.Fig.) Between the side reflector LEDs 12 to bring in, for example in the form of slats.

6 shows in a view obliquely from above a section of a rear portion of a cover 26 for the circuit board 11 , 7 shows in a view obliquely from above a section of a front portion of the cover 26 , The cover 26 is designed in the form of a hollow, underside open plastic body and sits with a lower edge 27 on the circuit board 11 on. On the upper side, the cover has a plurality of elastically resilient or flexible webs 28 on. The back has the cover 26 at least one passage opening 29 for at least one electrical contact (o.Fig.) On. At least one frontal area 30 , which the light emitting surfaces 13 the side reflector LEDs 12 covered, is translucent (transparent or translucent) designed and can serve as an optical element for beam shaping or have such elements (lenses, etc.).

8th shows a light module 31 with such a cover 26 , where the upper layer 19 the multilayer recording 18 for better representation of the cover 26 is not shown. The cover 26 presses or presses the circuit board 11 from above by means of the bars 28 on the lower layer 20 and thus serves as one in the return 23 introduced clamping device for additional attachment of the circuit board 11 and for further reducing a heat transfer resistance between the circuit board 11 and the lower layer 20 , In addition, so manufacturing tolerances of the return 23 be compensated. The front side area 30 serves to protect the side reflector LEDs 12 and can also serve a beam shaping.

The cover 26 can in the multilayer recording 18 glued, screwed in, clamped and / or locked.

9 shows in a view obliquely from above still a light module 32 similar to the light module 24 , The side reflector LEDs 12 are arranged here in principle in a row, but in adjacent groups of two side-emitter LEDs 12 , The two side reflector LEDs 12 a group are angled towards each other and thus have different main emission directions. About the length of the edge 22 so change the main emission directions, so that the side-spot LEDs 12 over the length of the frontal edge 22 mainly in two directions, the main emission directions. The result is a so-called "batwing" light distribution, with which the light can be widely distributed in both directions.If, for example, a low lateral glare, this arrangement is particularly well suited for indirect Deckenanstrahlung by their wide distribution lateral glare is the "Batwing" eg good for suspended lights.

10 shows a light module 33 similar to the light module 32 , but now the groups of side reflector LEDs 12 three side reflector LEDs each 12 have, which are all angled towards each other and thus have three different main radiation directions.

11 shows a light module 34 similar to the light module 24 , where now in the return 23 two printed circuit boards 11 are introduced, namely a circuit board 11 on the lower layer 20 overlying and additionally a circuit board 11 on the upper layer 19 aural. The side reflector LEDs 12 point everyone in the same direction.

In this way, a higher power and light density can be achieved than with the provision of only one printed circuit board 11 in a return 23 , If the power supply through the upper layer 19 and the lower layer 20 takes place, one polarity should be considered. In particular, if the polarity on "jumpers" or other setting switches, etc. on the circuit boards 11 can be varied by assembly, the same PCB layout can be used on both sides.

12 shows in a view obliquely from above yet another light module 35 , With this light module 35 show the upper position 36 and the lower layer 37 no straight, but curved or curved edges, and thus a curved edge 38 ,

The edge 38 is rounded on the outside (convex) and allows a particularly wide light emission in the longitudinal direction. The side reflector LEDs 12 are arranged analogously in a convexly curved row. This can be an angle of incidence of the side lamp LEDs 12 to each other and / or in relation to the edge 38 at least for some of the side reflector LEDs 12 be different.

13 shows in a view obliquely from above yet another light module 39 , With this light module 39 show the upper position 40 and the lower layer 41 curved or curved edges, and thus a curved frontal edge 42 ,

The edge 42 is rounded inwards (concave) and allows a particularly narrow and dense light emission. The side reflector LEDs 12 are arranged analogously concave in a curved row here. This can be an angle of incidence of the side lamp LEDs 12 to each other and / or in relation to the edge 42 at least for some of the side reflector LEDs 12 be different.

The lighting modules shown allow a variety of lighting projects in compliance with the requirements of the lighting in a favorable structure. Due to the various possibilities of positioning and / or alignment of the side spot LEDs, the light can be directed directly in highly blended form in the desired direction. Complex and expensive optics can be dispensed with.

The side-spot LEDs can be placed very close to each other (especially in a version with angle of attack). For the viewer, a seemingly continuous strip of light results at the edge.

14 shows an oblique view still another light module 51 , The light module 51 is plate-shaped (with a significantly larger plane Extension as height) is formed. The light module 51 has front on a circuit board 52 arranged side reflector LEDs 12 on, as well as in 15 partial view in a view from diagonally forward.

The light module 51 is in cross section between two side reflector LEDs 12 in 16 and in cross section through a side-emitting LED 12 through in 17 shown. The light module 51 is as an exploded view in oblique view from above 18 shown.

The circuit board 52 is similar to the circuit board 11 formed, but has a toothed leading edge 53 with parallel to the next side reflector LED 12 extending teeth, as in 19 shown in a view from above. The side reflector LEDs 12 radiate from a front edge 54 of the light module 51 out.

At the edge 54 is a multi-layer recording 55 present, which is an upper layer 56 and a lower layer 57 having. The circuit board 52 is between the layers 56 . 57 recorded, with the layers 56 . 57 via the associated side reflector LEDs 12 stand out to the front. The upper layer 56 and the lower layer 57 are by means of an interleaved inserted aperture element in the form of a reflector 58 spaced apart, the reflector 58 in 20 in view from diagonally above is shown as an item.

The reflector 58 is designed as a raster reflector and has to several front side arranged in series reflector areas 59 on. The reflector areas 59 serve as individual reflectors for respective side-spot LEDs 12 , The reflector areas 59 are in the direction of radiation in front of a respective side spot LED 12 arranged. The reflector areas 59 especially as shell reflectors for the side reflector LED 12 act or serve and, for example, specular or diffusely reflecting interior walls 60 exhibit. The reflector 58 may in particular be made of plastic, for example in an injection molding process. The reflector 58 also serves as a grid aperture and can be too broad beam angle of the side lamp LEDs 12 prevent, eg for use as a ceiling light.

The back connects to the row of reflector areas 59 a plate-shaped area 61 on which upper side several ribs 62 having. Ribs 62 serve the reflector 58 at the upper location 56 support and towards the lower layer 57 to press. The plate-shaped area 61 points behind the reflector areas 59 one opening each 63 to carry out a respective side emitter LED 12 on. This allows the plate-shaped area 61 on the upper side flat on the circuit board 52 rest.

Between the layers 56 . 57 is also a rearwardly projecting support member 64 arranged. The support element 64 is here formed as a profile-like, sheet metal part made of metal, which is a step 65 has, as in 21 partial view in oblique view from the front. The stage 65 shares the support element 64 mentally in a front area 66 and in a rear area 67 , The front area 66 is as a support for the circuit board 52 provided while the rear area 67 is provided to the rear behind the layers 56 . 57 stand out or outrage.

In the assembled state, which in the 14 to 17 shown, extend rearward of the plate-shaped area 61 of the reflector 58 protruding latching noses 68 through suitable openings 69 in the stage 65 the support member 64 through and fix the reflector 58 against the support element 64 ,

The reflector 58 points to its front fixation on the lower layer 57 front and underside a rearward bent longitudinal collar 70 on, which in a matching front and top side arranged longitudinal collar 71 the lower layer 57 , which is bent over on the front, overlappingly engages. To its rear fixation on the lower layer 57 indicates the lower layer 57 a top-side, longitudinal collar-like wall 72 on, in which the locking lugs 68 of the reflector 58 can be used. The reflector 58 is characterized by the lower layer 57 latched. Between the reflector 58 and the lower layer 57 become thereby the printed circuit board 52 and the support member 64 held in a press fit. The reflector 58 In particular, presses a non-populated underside of the circuit board 52 flat on the metallic support member 64 , which causes a good heat transfer from the circuit board 52 on the support element 64 results. The support element 64 can thereby serve as a heat conducting element or as a heat spreading element.

The upper layer 56 is to its attachment to the reflector 58 latched, by subverted bent walls or longitudinal collars 74 and 75 , A rear longitudinal collar 74 it engages in the rear projecting locking lugs 76 the ribs 62 of the reflector 58 one. A front longitudinal collar 75 it engages in the rear projecting locking lugs 77 selected reflector areas 59 of the reflector 58 one.

The rear area 67 the support member 64 and a parallel to it backward area 78 the lower layer 57 form a receiving slot for receiving a heat sink 79 , The heat sink 79 is here as a plate-shaped alucobond body of an upper layer 19 made of aluminum, a lower layer 20 made of aluminum and an intermediate layer 21 made of electrically non-conductive plastic.

It is a design technically preferred embodiment that the upper layer 56 and the lower layer 57 made of the same material as the upper layer 19 and the lower layer 20 of the heat sink 79 consist, eg of aluminum. Especially in this case, the layers can 56 . 57 Made of aluminum. However, the invention is not limited thereto, and the layers 56 . 57 may eg also consist of another metal or plastic. Metallic layers 56 . 57 can be formed as extrusions, layers 56 . 57 made of plastic eg as injection molded parts.

22 shows in an oblique view from above an exploded view of a section of a lighting module 81 , The light module 81 is similar to the light module 71 designed, but now the circuit board 82 additionally top and bottom vertical spot LEDs 83 has its Hauptabstrahlrichtung or axis of symmetry of its light beam in a conventional manner at least substantially perpendicular or normal to the surface of the circuit board 52 stands, as well as in an oblique view on the top of the circuit board 82 in 23 and in an oblique view of the underside of the circuit board 82 in 24 shown. The vertical spotlight LEDs 83 Both the bottom side and the top side are each arranged in a row, wherein the number of vertical spotlight LEDs 83 each row is less than the number of side lamp LEDs 12 , here only one third of the number of LEDs 12 having.

To that of the vertical spotlight LEDs 83 let radiated light to the outside, for example, a side lighting or effect lighting of the light module 81 to cause are both in the front area 66 the support member 84 recesses 85 in an area of a respective lower side perpendicular radiator LED 83 introduced (as in 25 shown) as well as in the reflector 86 recesses 87 in an area of a respective top-side perpendicular radiator LED 83 introduced (as in 26 shown).

The upper layer 56 and the lower layer 57 For example, they may be made of a translucent (transparent or translucent) material, such as plastic, and need not have recesses.

27 shows an oblique view of a first lighting device 101 in the form of an incandescent retrofit lamp with three radiant light emitting modules 102 . 102b and 102c , The light modules 102 . 102b and 102c For example, a basic structure similar to the light module 35 exhibit. This is how the lighting modules point 102 . 102b and 102c two curved, opposite (outside) frontal edges 103a . 103b respectively. 103c on which the (not shown) side lamp LEDs 12 emit at the edge.

The light modules 102 . 102b and 102c with respect to a common axis of symmetry, which a longitudinal axis L of the first lighting device 101 corresponds, parallel and thus upright or vertical in space. Thus, the longitudinal axis L lies in a main plane of the plate-shaped lighting modules 102 . 102b and 102c , Adjacent lighting modules 102 . 102b and 102c are angularly offset by 60 ° with respect to the longitudinal axis L and also inserted into one another. The curved edges 103a . 103b respectively. 103c are therefore angularly offset by 60 ° to each other. This makes it possible to emit almost the entire solid angle highly uniformly. Deviations from a uniform light emission, such as in an "equatorial plane" perpendicular to the longitudinal axis L, in a region of a greatest width of the lighting modules 102 . 102b and 102c in which the side reflector LEDs 12 have the greatest distance from each other, can be, for example, by a corresponding adjustment of the angle of attack of the side lamp LEDs 12 at least partially offset. And yet remains a "brilliant" light impression due to the direct insight side lamps LEDs 12 consist.

The curved edges 103a . 103b respectively. 103c also extend in each case along the longitudinal axis L of a rearwardly arranged base 104 to a front-side connecting element 105 ,

28 shows in an oblique view by way of example a multi-layer recording 106a of the light module 102 , This has a similar basic structure as the multi-layer recording 18 with an upper layer 107 , a lower location 108 and a liner 109 on. The outside is the multi-layer recording 106a for receiving two curved circuit boards 110 with corresponding side reflector LEDs 12 designed, of which in 29 only one is shown. The circuit board 110 has an electrical connector in the region of its lower edge 111 for electrical contacting of its side reflector LEDs 12 on.

As in 30 shown is the circuit board 110 from an at least partially translucent cover 112 with a similar one Basic construction like the cover 26 covered, and on one side outside in a return 113 the multilayer recording 106a used. The cover 112 also has at its ends two locking lugs 114 . 115 for positioning and fixation in the multi-layer holder 106a on.

For front fixing of the light module 102 has the multi-layer recording 106a on the upper side, a locking receptacle 116 for latching receiving the connecting element 105 on, as well as in 31 shown in more detail.

For fixing the back of the lighting modules 102 . 102b . 102c points the pedestal 105 a front lid 117 which in the cut-out is enlarged into 32 is shown. The lid 117 has several insertion slots 118 for the introduction of back margins 119 the lighting modules 102 . 102b . 102c on. The lid 117 points to the inside of the insertion slots 118 locking lugs 120 on, which in corresponding locking recesses 121 the lighting modules 102 . 102b . 102c can intervene. The light modules 102 . 102b . 102c So you can by a simple insertion movement with the lid 117 locked or snapped. In particular, as well as in 33 clarifies, first the top slotted light module 102c on the lid 117 be placed latching, then the top and bottom slotted light module 102b in the light module 102c plugged in and in the lid 117 latched and following the light module slotted only on the underside 102 in the light module 102b plugged in and in the lid 117 be locked. Subsequently, the three lighting modules 102 . 102b . 102c on the front side by means of a latching insert of the connecting element 105 connected and fixed together.

As in 34 shown, sits below the lid 117 A carrier 122 on which connector 123 are arranged, below or within the slots 118 of the lid 117 , which coincides with the latching of the lighting modules 102 . 102b . 102c with their connectors 111 get connected.

The connectors 123 are with a driver 124 connected, which is adapted to a from a base element 125 , here in the form of an Edison socket, tapped electrical signal into one for operating the side lamp LEDs 12 to convert suitable electrical signal. The driver 124 is in a driver housing 126 housed, which front through the lid 117 is completed and the base element 125 has as its rear end.

35 and 36 show the first lighting device 101 as a longitudinal section along the longitudinal axis L at different angles, with 35 as a one-sided cut through a light module 102 ,

37 shows an oblique view of a second lighting device 131 in the form of a filament retrofit lamp with several lighting modules 102 c. The second lighting device 131 differs from the first lighting device 101 in that the lid 133 of the pedestal 132 is pulled up and the connecting element 134 is pulled down to the internal structure of the nested lighting modules 102 -C cover. The lid 133 and the connecting element 134 adjacent to each other flush and may be locked together or otherwise connected, which further increases stability. 38 shows the second lighting device 131 with removed connecting element 134 , wherein in the connecting element 134 slots 135 for receiving the light modules 102 -C are present.

39 shows an oblique view of a third lighting device 141 in the form of a filament retrofit lamp with several lighting modules 142 , The light modules 142 are similar to the light modules 102 -C built, but now only one-sided edge (on one edge 155 ) radiating. The light modules 142 are particularly similar to each other, which simplifies logistics, manufacture and assembly. In particular, can be so by the choice of the number of light modules 142 Create different performance classes of the lighting device with the same components.

40 shows an exploded view in a view obliquely from the front of a light module 142 , 41 shows the light module 142 as an exploded view in a view obliquely from behind. The light module 142 has a multi-layer recording 143 similar to a half of the multilayer recording 106a with an upper layer 144 , a lower location 145 and a liner 146 on. The outside is the multi-layer recording 142 for receiving a curved circuit board 147 with corresponding side reflector LEDs 12 in a return 148 designed.

The electrical contact of the light module 142 takes place in the front area of the circuit board 147 instead of. As in 42 and 43 shown is between the lid 149 of the pedestal 150 and the connecting element 151 a room for a board 152 with front-mounted electrical contact plugs or connectors 123 , The connectors 123 are below the slots 135 of the connecting element 151 , As in particular in 43 shown, can the light module 142 front side with its connector 111 in a connector 123 be plugged in. The cover 153 the circuit board 147 has a hook on the front 154 on which the connecting element 151 behind a slot 135 engages, as on average also in 44 shown.

The fixation on the underside of the lighting modules 142 takes place via an insertion into appropriate bulges in the lid 149 , as in the cut also in 44 shown.

The third lighting device 141 has, inter alia, the advantage that electronic components, such as driver components, the upper and lower halves of the lighting device 141 can be distributed, especially between the driver 124 and the board 152 , So can components for a low voltage side on the board 152 and components that have higher safety margins on the driver 124 be arranged.

45 shows an oblique view of a fourth lighting device 161 in the form of a filament retrofit lamp similar to the lighting device 141 , In contrast to the lighting device 141 are the lighting modules 162 now not provided with a multi-layer recording. Rather, the circuit board 163 , as in 46 and in 47 shown, which is similar to the circuit board 147 built and equipped, on a simple location 164 similar to the lower layer 143 , eg a simple aluminum sheet, put on. This allows a cheaper production. The location 164 has a larger area for effective cooling than the circuit board 163 ,

The cover 165 I like the location 163 engage around a sufficient contact pressure on the circuit board 163 to be able to exercise. The cover 165 like with the location 163 For example, by means of a "plastic riveting process" (a stamping by heating) are welded.

48 shows in oblique view a fifth lighting device 171 in the form of a filament retrofit lamp similar to the lighting device 161 , In contrast to the lighting device 161 are the lighting modules 172 , as in 49 shown, now not with more with any separate metallic layer or similar. Mistake. Rather, the circuit board likes 173 even large enough for effective cooling. The circuit board 173 May be coated with at least one metallic layer (o.Fig.). The cover 165 I like the circuit board now 173 engage in order to exert sufficient pressure on them. The cover 165 likes with the circuit board 173 for example, by means of a "plastic riveting process" (a stamping by heating) to be welded.

50 shows a sixth lighting device 181 in an oblique view as an exploded view. 51 shows the lighting device 181 in a composite state.

The lighting device 181 has six semi-annular, upright, about a common longitudinal axis L equiangularly offset printed circuit boards 182 on. The circuit boards 182 are on the outside with semiconductor light sources, eg side-spot LEDs 12 , equipped, so can also be regarded as lighting modules. On the inside, the circuit boards are centered 182 a perpendicular to the longitudinal axis L slot 183 on. In the slots 183 The PCB is from the inside a horizontally located annular circuit board 184 introduced, which at the edge also with semiconductor light sources, eg side-spot LEDs 12 , is equipped. Also the circuit board 184 can be considered as a light module.

The circuit boards 182 Thus, "longitudinal planes" can form a sphere while the circuit board 184 forms the "equatorial plane". Through the circuit board 184 In particular, the otherwise weaker illuminated equatorial plane may be better illuminated and an even more homogeneous distribution can be achieved. The composite circuit boards 182 . 184 are in 52 shown.

The circuit boards 182 . 184 are made by two compliant, half-space covers 185 and 186 of which a top covers 185 in 53 is shown and a lower covers 186 in 54 is shown. The covers are translucent and can be placed on each other, eg latched and / or glued. The covers 185 and 186 take one half each of the circuit boards 182 . 184 on and have, for example, to accommodate the circuit boards 182 corresponding internal open struts 187 on. The aspiration 187 are as guide rails for the printed circuit boards 182 educated. The transition between the covers 185 and 186 has a gearing 190 on, which can be achieved that the side reflector LEDs 12 not directly behind the transition between the two covers 185 and 186 or their snaps (not shown) are arranged.

Instead of an annular circuit board 184 For example, a circular circuit board can also be used.

Generally, to reduce the glare, individual semiconductor light sources on the boards (side-emitter LEDs and / or vertical spotlight LEDs) can also be directed onto or into the body of the lighting device (for indirect irradiation). In this way, the light is less dazzling to the human eye.

Although the invention in detail by the illustrated embodiments illustrated in more detail and The invention is not limited thereto and other variations can be deduced therefrom by the person skilled in the art without departing from the scope of the invention. In particular, features of the various embodiments can be combined or exchanged.

For example, the cover can be used with all the lighting devices shown.

Also, lighting devices having a curved front edge may have light emitting diodes present in similarly arranged groups therein, e.g. adjacent groups can be arranged as such angled against each other.

Since in one variant, both the multi-layer recording and the printed circuit board can be made of flexible material, a curved variant is also conceivable.

Also like frontal edges of the lighting devices 51 and 81 be bent with the appropriate elements such as circuit boards, etc., for example similar to the 12 and 13 ,

The heat sink, eg 79 For example, it does not need to be a composite element (eg, Alucobond), but it may also be a solid or hollow body of a single material, eg, aluminum and / or copper. The heat sink may eg be an extruded aluminum profile.

The support element, eg 64 may be firmly applied to the heat sink, eg glued, resulting in improved stabilization.

Also, instead of the reflector, a grid aperture may be used. This grid aperture may in particular have the same shape as the reflector, but have no dedicated reflector surfaces, eg by omitting reflective coatings. The reflector, eg 58 , may also be considered as a reflective grid aperture.

In general, the lighting device can in particular also be regarded as an at least two-layer, plate-shaped, (narrow-side or frontally) edge-emitting lighting device with at least one semiconductor light source arranged between two outer layers.

Also need the light modules, eg 142 . 162 . 172 not to be aligned parallel to the longitudinal axis L of the lighting device, but can also be inclined. Such a device may, for example, from a mental rotation of the connecting element, eg 105 . 134 . 151 to emerge about the longitudinal axis L. This allows a more overlapping Lichtabstrahlmuster be achieved.

LIST OF REFERENCE NUMBERS

11

circuit board

12

Side-emitting LED

13

light emission

14

front

15

leading edge

16

trailing edge

17

rounded corner

18

Multi-layer recording

19

upper layer

20

lower position

21

liner

22

frontal edge

23

return

24

lighting device

25

bonding layer

26

cover

27

lower edge

28

web

29

Duct opening

30

cover

31

lighting device

32

lighting device

33

lighting device

34

lighting device

35

lighting device

36

upper layer

37

lower position

38

frontal edge

39

lighting device

40

upper layer

41

lower position

42

frontal edge

51

lighting device

52

circuit board

53

serrated front edge

54

frontal edge

55

Multi-layer recording

56

upper layer

57

lower position

58

reflector

59

reflector region

60

inner wall

61

plate-shaped area

62

rib

63

Duct opening

64

supporting member

65

step

66

front area

67

rearward projecting area

68

locking lug

69

opening

70

rearward bent longitudinal collar

71

front-bent longitudinal collar

72

wall

74

along collar

75

along collar

76

locking lug

77

locking lug

78

rearward projecting area

79

heatsink

81

lighting device

82

circuit board

83

Vertical lighting LEDs

84

supporting member

85

recess

86

reflector

87

recess

101

lighting device

102a-c

 light module

103a-c

 curved edge

104

base

105

connecting element

106a

Multi-layer recording

107

upper layer

108

lower position

109

liner

110

circuit board

111

electrical connector

112

translucent cover

113

return

114

grid nose

115

grid nose

117

cover

118

insertion slot

119

back edge area

120

locking lug

121

engaging recess

122

carrier

123

electrical connector

124

driver

125

base element

126

drivers housing

131

lighting device

132

base

133

cover

134

connecting element

135

slot

141

lighting device

142

light module

143

Multi-layer recording

144

upper layer

145

lower position

146

liner

147

circuit board

148

return

149

cover

150

base

151

connecting element

152

circuit board

153

cover

154

hook

155

edge

161

lighting device

162

light module

163

circuit board

164

simple location

165

cover

171

lighting device

172

light module

173

circuit board

181

lighting device

182

circuit board

183

slot

184

circuit board

185

top cover

186

lower cover

187

pursuit

190

gearing

H

main radiation

L

longitudinal axis

Z

brightest center

Claims (12)

Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ), comprising at least one plate-shaped light module ( 102 c; 142 ; 162 ; 172 ; 182 . 184 ), wherein the at least one light module ( 102 c; 142 ; 162 ; 172 ; 182 . 184 ) edge-emitting semiconductor light sources ( 12 ) having. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to claim 1, wherein at least one luminous module has at least one each with at least one side-radiator semiconductor light source ( 12 ) equipped printed circuit board ( 11 ; 52 ; 82 ; 110 ; 147 ; 163 ; 173 ; 182 . 184 ) having. Lighting device ( 101 ; 131 ; 141 ) according to claim 2, wherein - at least one light module ( 102 c; 142 ; 162 ) a multilayer recording ( 18 ; 56 . 57 ; 106a ; 143 ) with an upper layer ( 19 ; 56 ; 107 ; 144 ) and a lower layer ( 20 ; 57 ; 108 ; 145 ), - the printed circuit board ( 11 ; 52 ; 82 ; 110 ; 147 ) between the upper layer ( 19 ; 56 ; 107 ; 144 ) and the lower layer ( 20 ; 57 ; 108 ; 145 ), and - the upper layer ( 19 ; 56 ; 107 ; 144 ) and / or the lower layer ( 20 ; 57 ; 108 ; 145 ) via the at least one side emitter semiconductor light source ( 12 ) in their Lichtabstrahlrichtung (H) stand out. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to one of the preceding claims, wherein the assembled printed circuit board ( 11 ; 52 ; 82 ; 110 ; 147 ) by means of a translucent cover ( 30 ; 112 ; 153 ; 165 ; 185 . 186 ) is covered. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to one of the preceding claims, wherein on the printed circuit board ( 110 ; 147 ) an electrical plug contact ( 111 ; 123 ) is located. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to one of the preceding claims, wherein the lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) a plurality of luminous modules arranged angularly offset about a common axis of symmetry (L) ( 102 c; 142 ; 162 ; 172 ; 182 ) having. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ) according to one of the preceding claims, wherein the lighting modules ( 102 c; 142 ; 162 ; 172 ) at the back on a pedestal ( 104 ; 132 ) of the lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ) are mounted and front side by means of a connecting element ( 105 ; 134 ; 151 ) are interconnected. Lighting device ( 101 ; 131 ) according to one of the preceding claims, wherein the lighting modules ( 102 C) on opposite outside edges ( 103a C) semiconductor light sources ( 12 ) and the lighting modules ( 102 -C) are angularly plugged into one another. Lighting device ( 141 ; 161 ; 171 ; 181 ) according to one of claims 1 to 7, wherein the lighting modules ( 142 ; 162 ; 172 ; 182 ) on an outside edge ( 155 ) arranged semiconductor light sources ( 12 ) and the lighting modules ( 142 ; 162 ; 172 ; 182 ) spaced from each other, in particular equidistant, are arranged. Lighting device ( 181 ) according to claim 6, wherein the lighting modules ( 182 ) by means of at least one to the common axis of symmetry (L) obliquely oriented circuit board ( 184 ) are interconnected. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to one of the preceding claims, wherein the lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) is a retrofit lamp, in particular incandescent retrofit lamp. Lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) according to one of claims 1 to 10, wherein the lighting device ( 101 ; 131 ; 141 ; 161 ; 171 ; 181 ) represents a part of a lamp or a lamp.

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