Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/0061—Electrical connection means
  • G01L19/0084—Electrical connection means to the outside of the housing
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
  • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • G01L19/14—Housings
  • G01L19/142—Multiple part housings
  • G01L19/143—Two part housings
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Definitions

• DE 100 54 013 B4 relates to a pressure sensor module.
• This comprises at least one module housing with a nozzle, in which an opening for a medium to be measured is arranged.
• the pressure sensor module furthermore comprises a pressure sensor which is arranged in a sensor housing provided with a sensor housing opening and formed separately from the module housing and is protected by a covering means applied to the pressure sensor in the sensor housing.
• the sensor housing is located in a recess of the module housing at least partially on the module housing and is held in the recess by a plastic extrusion or a potting compound. A part of the sensor housing which surrounds the sensor housing opening bears against the module housing, so that the sensor housing opening completely surrounds the opening of the connecting piece.
• the plastic encapsulation or potting compound surrounds the sensor housing in the recess except for the voltage applied to the motor housing part of the sensor housing and the sensor housing opening completely.
• the sensor module is, in particular, a pressure sensor module with a sensor housing, which has a housing part with electrical conductors partially embedded therein.
• a first interior in which a sensor arrangement is arranged is formed in the sensor housing, and a second interior sealed relative to the first interior is provided.
• a receiving part is arranged with a receptacle formed by a circumferential wall, in which the sensor arrangement is used and covered with a filled in the receptacle protective cover.
• connection elements are connected to connection sections of the electrical conductors. connected directly.
• the at least one capacitor arranged in the second internal space is connected via an electrically conductive material to at least one of the electrical conductors.
• capacitors are required in sensors for protecting the micromechanical silicon pressure measuring chips with evaluation circuit.
• the silicon pressure measuring chips are commonly referred to as Sl-chip.
• One possibility is to integrate these capacitors in the SI chip. On the one hand, this requires an additional expenditure of chip area and thus increases the manufacturing costs of the chip; on the other hand, the integrated EMC capacitors mostly do not fulfill the requirement with respect to electrostatic discharges (ESD requirement) or only insufficiently.
• capacitors externally, i. to equip separately from the Si chip.
• these capacitors are populated in the same pressurized space as the Si chip, for example on the circuit carrier (hybrid, printed circuit board) or the punched grid of the sensor.
• the latter possibility has its drawbacks, for example, the structure becomes more inflexible because the capacitors can not be placed anywhere. This in turn means that the distance between the Si chip and capacitors can not be arbitrarily reduced, which is necessary for optimizing the electromagnetic compatibility.
• a sensor module in particular a pressure sensor module with integrated capacitors is proposed in which the strength against electromagnetic interference is increased by using already existing Si chips and at the same time the structure of the entire sensor, in particular the pressure sensor, is simplified and kept more flexible. It is important to deviate as little as possible from existing manufacturing concepts, which are already manufactured in series and tested, in the construction of the pressure sensor module proposed according to the invention.
• the erf vor bornndungswash proposed construction of a pressure sensor module with integrated capacitors has over conventional variants the advantages that, for example, compared to the variant, the advantages that, for example, compared to the variant to integrate the capacitors on the Si chip, a smaller Chipfiambae and thus smaller chip - costs arise. Chip-integrated capacitors are only a compromise and do not meet the ESD requirements placed on them, inadequately or not at all. This results in lower item costs compared to the development of a new Si chip.
• the structure proposed according to the invention has over the variant in which the capacitors in a non-pressurized chamber (two-chamber structure) on the
• the mentioned capacitors are preassembled on the stamped grid of the pressure sensor module by means of a suitable method, such as soldering, by means of epoxy conductive adhesive or by soldering and bonding. This is followed by overmolding with the housing material of the module, which is not an extra step to be provided, but can take place within the framework of the production of the module housing.
• the EMC capacitors used can also be retrofitted in the backfill area.
• Backf ⁇ ll area is to be understood as a recess open to the rear of the module housing, in which the at least one EMC capacitor from the back of the module housing can be used.
• the currently used construction of a pressure sensor module is to adapt only minimal.
• the resulting structure of the pressure sensor module proposed according to the invention has a significantly increased EMC, is flexible and can be installed without further external sounding.
• any desired pressure sensors for the different applications can be constructed, all of which have the advantages described above over the previously used solutions, as will be explained below.
• FIG. 2 shows an embodiment of the pressure measuring module proposed according to the invention for detecting the relative pressure
• Figure 3 shows an embodiment of the present invention proposed pressure measuring module for detecting the absolute pressure, wherein at least one EMC capacitor is installed at the back of the housing forth, and
• FIG. 4 shows the top view of the pressure measuring module proposed according to the invention with two EMC capacitors, each electrically contacting two printed conductors of a stamped grid
• 5 shows a pressure measuring module in a sectional view with an encapsulated by a subdivision EMC capacitor.
• FIG. 1 shows a pressure measuring module 10 proposed according to the invention, which can be used to detect an absolute pressure.
• the illustration according to FIG. 1 shows that the pressure measuring module 10 has a housing 12 whose housing walls 16 delimit an interior space 14. On the bottom of the inner space 14 is a base 18, on the upper side of which a pressure measuring chip, in particular a silicon pressure measuring chip, is accommodated.
• the pressure measuring chip 20 has an upper planar surface 22 and a lower side 34.
• a stamped grid 30 or a number of printed conductors 50 (compare top view according to FIG. 4). Free ends of the stamped grid 30 and the number of interconnects 50 open into the interior 14 within the housing 12.
• About bonding wires 24 is the Planfikiee 22 of Druckmesschips 20 with the punched grid 30 or with the number of interconnects 50, depending on the embodiment, electrically connected.
• At least one EMC capacitor 28 is associated with the leadframe 30 according to this embodiment variant.
• the at least one EMC capacitor 28 is surrounded by a Passivitationsmedium 26 and connected by means of a cohesive connection or an epoxy adhesive bond in the context of a cohesive connection 32 with the lead frame 30.
• the inner space 14 of the pressure measuring module 10 is covered by a cover 60, however, allows pressurization of the Planfikiee 22 of the pressure measuring chip 20 and thus allows a measurement of an absolute pressure.
• the pressure measuring module 10 shown in the sectional view in FIG. 1 can be manufactured, for example, in such a way that a pre-assembly of at least one capacitor 28 on the lead frame 30 or at least one capacitor 56, which bridges two conductor tracks 50, is produced. ckend contacted (see Figure 4), takes place.
• the pre-assembly of the at least one capacitor 28 or 56 is preferably carried out by way of forming a cohesive connection, for example by soldering or by means of an epoxy conductive adhesive or by soldering and bonding. During bonding, an electrical contact is made by a thin bonding wire.
• the stamped grid 30 is encapsulated with the material from which the housing 12 is manufactured. This does not represent a separate process step, but the at least one capacitor 28 or 56 can be injected into the housing 12 by the encapsulation method subsequent to the pre-assembly.
• the pressure measuring module 10 shown in the representation according to FIG. 1 can also be carried out by retrofitting the at least one electronic component, for example an EMC capacitor 28, on the stamped grid 30 or on at least one printed conductor 50.
• the subsequent assembly is carried out in a finished housing, wherein the at least one electronic component 28 is joined by forming a material connection, such as by soldering or gluing by means of an epoxy conductive adhesive or by soldering and bonding, with the housing.
• the subsequently joined electronic component 28, such as at least one EMC capacitor passivated.
• the passivation takes place by introducing a passivation medium, for example by gelling or gluing a recess of the housing 12, within which the at least one electronic component 28 is located in the housing 12.
• passage channels 36, 38 are respectively provided in the base 18 and in the bottom region of the housing 12 below the cavity 14.
• the underside 34 of the pressure measuring chip is pressurized 20, the upper planar surface 22 is acted upon by the permeable cover 60.
• the housing 12 is provided with an interior space 14 within which the base 18 is located with the pressure measuring chip 20 received on its upper side.
• the lead frame 30 has at least one electronic component 28, such as an EMC capacitor, which is passivated within a passivation medium 26.
• the at least one electronic component in the form of at least one EMC capacitor 28 is connected by a cohesive connection, which is designed for example as a solder connection, or by using an epoxy conductive adhesive with the lead frame 30 or with at least one conductor 50.
• a bottom of the housing 12 is identified by reference number 42 and an outer wall of the housing 12 by reference number 44.
• the pressure measuring module 10 is produced, for example, by pre-assembly of the at least one electronic component 28 on the stamped grid or the at least one printed conductor 50.
• the pre-assembly is carried out by forming a material connection between the at least one electronic component 28, which is preferably an EMC capacitor, and the lead frame 30 or at least one conductor 50 by forming a material connection, such as a solder joint, or by forming a bond by means of an epoxy conductive adhesive or by soldering and bonding.
• the pressure measuring module 10 can be produced by subsequently mounting the at least one electronic component 28, which is preferably an EMC capacitor, on the stamped grid 30 or the at least one printed conductor 50 by a material-locking joining method.
• the soldering or the bonding by means of an epoxy conductive adhesive or the soldering and bonding have prevailed as cohesive joining methods.
• the assembly of the at least one electromagnetic component in the form of an EMC capacitor 28 takes place subsequently in the finished housing 12 of the pressure measuring module 10. Subsequent assembly is followed by a passivation step in which a passivation medium 26 surrounds the at least one electronic component 28.
• the passivation of the at least one electronic component 28 is preferably carried out by gelling or gluing.
• FIG. 3 shows an embodiment of the pressure measuring module proposed according to the invention for detecting an absolute pressure with at least one electronic component mounted from the rear side of the housing.
• the housing 12 of the pressure measuring module 10 has a cavity 46.
• the cavity 46 is accessible from the rear side 42 of the housing 12 and limited by wall slopes 48.
• the lead frame 30 and the at least one conductor 50 see, such as an EMC capacitor 28, are fitted. This is done from the back of the housing 12 ago.
• a cohesive connection between the at least one electronic component 28 and The lead frame 30 or the at least one conductor 50 can be made by soldering in combination with a conductive adhesive, only by soldering, by soldering and bonding or by using a conductive adhesive, such as an Epoxyleitklebers.
• a free end 40 of the stamped grid 30 or the at least one printed conductor 50 projects beyond an outer wall of the housing 12 of the pressure measuring module 10 proposed according to the invention.
• the pressure measuring chip 20 is electrically connected via bonding wires 24 to the stamped grid 30 or at least one printed conductor 50 (compare illustration according to FIG. 4).
• the underside 34 of the pressure measuring chip 20 is placed in the embodiment of the pressure measuring module 10 proposed according to the invention on the upper side of the base 18 in the embodiment shown in FIG.
• the interior space 14, in which the base 18 and the pressure measuring chip 20 are located inside the housing 12, is closed off by a cover 60, which is designed such that the pressure to be sensed by the pressure measuring chip 20 can be detected.
• FIG. 4 shows a plan view of the pressure measuring module proposed according to the invention.
• the housing 12 has a cutout which is identified by reference numeral 54.
• electronic components 56 in particular two interconnects 50 bridging EMC capacitors 56.
• two electronic components 56 which are preferably EMC capacitors, can also be number of electronic components 56 differing from the illustrated number.
• the upper planar side 22 of the pressure measuring chip 20 is connected to contacting pads 52 by a number of bonding wires 24.
• Thetechnischtechnikspads 52 are in turn connected to the in the plan view of Figure 4 only partially shown interconnects 50, which pass through the housing 12 of the erfmdungs proposed pressure measuring module 10.
• the seal 60 of the interior 14 of the pressure measuring module 10 shown in FIGS. 1, 2 and 3 is omitted in the plan view 58 according to FIG. 4 for illustrative reasons.
• the in The pressure measuring chip 20 shown in the plan view 58 is accommodated on the base 18, which is not reproduced in the plan view 58 according to FIG. 4, since it is covered by the surface dimensions of the pressure measuring chip 20.
• the construction of the pressure measuring module with integrated electronic components, such as at least one EMC capacitor 28, 56, explained with reference to FIGS. 1 to 4, has the striking advantage over capacitors integrated on the pressure measuring chip 20, that are integrated into the housing 12 electronic components 28, in particular in the housing 12 of integrated EMC capacitors, the surface of the pressure measuring chip 20 may be smaller and thus lower chip costs are generated.
• capacitors integrated into the pressure measuring chip generally
• the inventively proposed solution for the integration of electronic components 28, in particular at least one EMC capacitor 28, in the housing 12 has the advantage that lower manufacturing costs are achieved and in particular no new development of a Druckmesschips 20 is required.
• the solution of the pressure measuring module 10 proposed according to the invention has the advantage over a variant in which at least one EMC capacitor was accommodated in a non-pressurized chamber and adhered to the stamped grid, that an improvement in the electromagnetic compatibility can be realized by a much smaller distance between the at least one electronic component, in particular at least one EMC capacitor 28, 56, and the pressure measuring chip 20 is present.
• the at least one electronic component 28, which is designed in particular as an EMC capacitor 28, 56 is not externally accommodate, but can be integrated into the housing 12.
• a considerable simplification of the production of the pressure measuring module 10 can be realized, since, for example, setting, adhesive and curing processes can be dispensed with.
• the second chamber present in a two-chamber module can be used for integration of the electronic components 28, 56, which are preferably EMC capacitors, for example, to accommodate additional ESD EMC protection measures.
• the electronic components 28, 56 which are preferably EMC capacitors, for example, to accommodate additional ESD EMC protection measures.
• the capacitors chamber varistors and the like can be accommodated more.
• the pressure measuring module 10 proposed according to the invention can be produced by a number of production methods:
• the electronic components 28, 56 which are preferably present as EMC capacitors, can be preassembled on the stamped grid 30 or the at least one printed conductor 50.
• the pre-assembly is carried out by forming a cohesive connection, for example by soldering or gluing using an epoxy conductive adhesive.
• the preassembled subassembly thus obtained from stamped grid or printed conductors 50 and at least one electronic component 28, 56 is encapsulated with the housing material of the housing 12.
• the actual housing 12 is obtained. This encapsulation does not constitute a separate manufacturing step.
• the encapsulation of the preassembled subassembly seals it against external media.
• the housing 12 of the pressure measuring module 10 proposed according to the invention can be spray-injected. Subsequently, a mounting of the at least one electronic component 28 on the stamped grid 30 by means of a cohesive process. Soldering and bonding by means of an epoxy conductive adhesive, soldering and bonding with a thin bonding wire are particularly suitable for this purpose.
• the at least one electrical Ronic component in a Backf ⁇ ll area 46 ie be retrofitted in an accessible from the back of the housing 12 recess.
• FIG. 5 shows an embodiment variant of a pressure measuring module with an EMC capacitor encapsulated by a subdivision.
• FIG. 5 shows that the housing 12 made as a premold, which has in its interior 14 the pressure measuring chip 20 arranged on the base 18, is in turn embedded in a plastic tub 78.
• the plastic tub 78 is closed by a lid 62.
• the lid is injected into embedding 64 so that the housing 12 made as a premold is sealed against the environment.
• the arranged in the interior 14 of the manufactured as Premold housing 12 Druckmesschip 20 is exposed through a passage 38 which passes through the manufactured as Premold housing 12, and a passage 18 passing through the passage 36 and an opening formed in the plastic tub 78 opening to the ambient pressure.
• the stamped grid 30 is equipped with at least one electronic component, preferably an EMC capacitor 28.
• the at least one electronic component 28 is surrounded by a passivation 26 and connected via a solder connection or an epoxy adhesive bond 32 to an outlet of the stamped grid 30 or at least one printed conductor 50.
• a stamp-like configuration is provided Cover 68.
• the cover 68 is formed in the embodiment shown in Figure 5 as an extension of a designed, for example, as an intermediate wall 66 subdivision of the lid 62.
• the interior of the cover 62 is divided into two chambers by the subdivision 66 formed, in particular, as an intermediate wall. tert rushes.
• One of the chambers of the lid 62 the edges of which are received in embedding 64 in the plastic tub 78, covers the premolded housing 12, while another chamber 70 is free of installation.
• Within the chamber 70 of the cover 62 there is a connection point 74 between the stamped grid 30 leaving the housing 12 made as a premold or the at least one printed conductor 50 and a leadframe or conductor track extension, compare position 72 in FIG.
• An open end of the punched grid extension 72 protrudes into a connection region 76 on the plastic trough 78.
• FIG. 5 further shows that the pressure measuring chip 20 is exposed to the ambient pressure via an opening in the plastic housing 78, which is aligned with the through-channel 38 and the through-channel 36.
• the at least one electronic component 28, which is connected via the solder connection 32 or an epoxy adhesive bond 32 to the stamped grid 30 or the at least one printed conductor 50, is preferably an EMC capacitor or the like.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Measuring Fluid Pressure (AREA)

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• 2008
  • 2008-01-18 DE DE102008005153A patent/DE102008005153A1/de active Pending
  • 2008-11-26 JP JP2010542548A patent/JP5453310B2/ja not_active Expired - Fee Related
  • 2008-11-26 US US12/812,732 patent/US8272272B2/en active Active
  • 2008-11-26 CN CN200880124901.4A patent/CN101910815B/zh active Active
  • 2008-11-26 WO PCT/EP2008/066198 patent/WO2009089956A1/de active Application Filing
  • 2008-11-26 EP EP08870945A patent/EP2235492A1/de not_active Ceased
• 2012
  • 2012-11-30 JP JP2012262663A patent/JP5511936B2/ja active Active

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