EP2062301B1 - Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans le boîtier - Google Patents

Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans le boîtier Download PDF

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Publication number
EP2062301B1
EP2062301B1 EP08706734.4A EP08706734A EP2062301B1 EP 2062301 B1 EP2062301 B1 EP 2062301B1 EP 08706734 A EP08706734 A EP 08706734A EP 2062301 B1 EP2062301 B1 EP 2062301B1
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EP
European Patent Office
Prior art keywords
housing
recess
carrier element
optoelectronic component
plastic housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP08706734.4A
Other languages
German (de)
English (en)
Other versions
EP2062301A2 (fr
Inventor
Georg Bogner
Stefan Gruber
Thomas Zeiler
Markus Kirsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP2062301A2 publication Critical patent/EP2062301A2/fr
Application granted granted Critical
Publication of EP2062301B1 publication Critical patent/EP2062301B1/fr
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present invention relates to a housing for an optoelectronic component, which can be used in particular as a lens component for light-emitting diodes.
  • a variety of different housing is used.
  • Semiconductor chips are often mounted on structured metallic carriers, so-called lead frames, and injected into a potting compound.
  • a flat quadratic Duroplast body is used as the housing, which is opaque to light.
  • a translucent housing made of a thermoplastic material may be used.
  • a conversion element which is provided for a modification of the radiated light, is mounted directly on the chip of the optoelectronic component when using such housings, for example for light emitting diodes (LED).
  • LED light emitting diodes
  • the publication DE 103 40 069 A1 describes a surface-mountable electronic device having a body with a cavity in which two LEDs are arranged.
  • This document describes in one example the arrangement of two LED chips on a planar metallic leadframe, the back of which forms contact surfaces for an external electrical connection.
  • JP 2006-216887 A describes an optoelectronic component with a substrate, on which a photodiode and an IC are arranged on electrically conductive structures.
  • a reflector with a Aperture is applied, in which the photodiode is arranged, wherein the IC is embedded in the synthetic resin material of the reflector, which is optionally black.
  • the object of the present invention is to provide a housing for optoelectronic components, which can be combined better than previous housings with optical components.
  • a light-emitting diode mounted in the housing should have a low thermal resistance and a high thermal resistance Have stability and can be provided in a convenient way with a conversion element.
  • the housing has a carrier element, on which a plastic housing is arranged, which in particular can be a duroplastic and opaque to light.
  • the plastic housing is provided with a recess which is provided for receiving an optoelectronic component and on the side remote from the carrier element has an opening to the outside.
  • An optoelectronic component is arranged with an area provided for light emission or light reception to the opening aligned within the recess.
  • the recess can be filled in particular after the assembly of the optoelectronic component with a transparent filling material.
  • a transparent cover of the recess can be arranged in the region of the opening, in particular at a distance from an optoelectronic component arranged in the recess.
  • the cover may be, for example, a transparent lid made of glass or plastic, but may also comprise a lens or an array of different optical components.
  • a conversion element for modifying the light can be arranged, in particular in applications for light-emitting diodes.
  • the housing shape makes it possible to arrange the conversion element at a suitable distance from the light-emitting top side of the component.
  • the conversion element can be designed to change the color of the light. It is preferably as thin as possible, preferably spans the entire solid angle range determined by the opening of the recess and is preferably not arranged in direct contact with the optoelectronic component. This ensures that the light emitted in different directions covers approximately the same path length when passing through the conversion element and consequently has a similar color temperature independently of the emission direction.
  • Separately provided structures or mounting apertures may be provided on the plastic housing which define the location of a cover or optical components relative to the plastic housing, thus allowing for easy mounting of a cover or optical components and their precise alignment relative to the plastic housing.
  • the optoelectronic component in particular a light emitting diode (LED), a chip island or the like can be provided on the carrier element on the side facing the recess.
  • additional structural elements can be provided on the support element.
  • An electrical connection of the optoelectronic component is provided by using a carrier element made of metal and a suitable structuring of the carrier element.
  • the carrier element is a structured metal layer, namely a per se known leadframe, which is divided into separate parts, which are electrically isolated from each other.
  • a support element may, for. B. made of copper.
  • the optoelectronic component is then z. B. via a backside contact on the Chip island of the support element contacted.
  • a bonding wire may be provided, which electrically conductively connects a corresponding terminal contact of the optoelectronic component with a further portion of the carrier element.
  • the different proportions of the structured carrier element of metal thus form the external electrical connection to the housing.
  • the housing does not need to be provided with strip-shaped connection conductors ("connection legs") guided to the outside (no leads).
  • connection legs strip-shaped connection conductors
  • the rear contact surfaces of the carrier element can be soldered for an external electrical connection, for example on
  • the material of the plastic housing is adapted to the material of the carrier element with regard to the thermal expansion coefficient and the adhesion properties.
  • a plastic housing of suitable material By bonding with a plastic housing of suitable material, it is possible to use as a carrier element a flat metallic leadframe, which is merely stamped or etched and in combination with the plastic housing nevertheless has a high mechanical stability.
  • Within the plastic housing i. injected into the plastic material of the plastic housing, at least one further electronic component is arranged as an ESD protection or as a drive component.
  • This housing shape makes it possible to realize an arrangement of optoelectronic components in a housing which is mechanically and thermally stable and can also be provided with different further optical and / or electrical components.
  • the FIG. 1 shows a plan view of an example of the housing.
  • a plastic housing 2 is attached, which has recesses, through which in the in the FIG. 1 reproduced viewing direction shares of the support element 1 are visible from above. These recesses can, as far as they are not provided for receiving an optoelectronic component, but only mounting aids to be omitted; they also do not have to reach down to the top of the support element 1 down.
  • the plastic housing 2 can be opaque, z. B. black, and in particular be a thermoset, as z. B. is used in conventional QFN packages.
  • the plastic housing 2 has a recess 3, which is preferably axially symmetrical, in the illustrated embodiment, at least approximately cylindrical, but in principle may have any geometric shape. On the side facing away from the support member 1 side, the recess has an opening 9 to the outside, can pass through the light.
  • an optoelectronic component 12 is arranged above the carrier element 1.
  • the optoelectronic component 12 may, for example, be arranged directly on a chip island of the carrier element 1.
  • a first electrical connection is preferably effected via a rear-side contact of the optoelectronic component 12 with the carrier element 1.
  • Another electrical connection is in the in the FIG. 1 represented by a bonding wire 13, which connects a terminal contact of the optoelectronic component 12 with a connection surface of a further portion of the carrier element.
  • the portions of the support member 1 are separated in the illustrated example by a non-existent web 7 and electrically isolated from each other, said web 7 may be formed by a portion of the plastic housing 2.
  • a structure 5 of the plastic housing 2 may be provided so that on the recess 3, a cover or an optical component, for example, a conversion element, can be precisely aligned relative to the plastic housing 2 or so that better adhesion of a transparent potting compound is achieved.
  • a cover or an optical component for example, a conversion element
  • mounting openings 6 or grooves can be mounted in the plastic housing 2 also in the z.
  • pins or the like extensions which are attached to the relevant optical component, are fitted.
  • the optoelectronic component 12 may, for. B. be a light emitting diode (LED) or another light emitting device. It is also possible to arrange a photodetector in the housing.
  • FIG. 2 shows the housing of the example of FIG. 1 in a rear view.
  • the carrier element 1 has two separate and electrically isolated portions.
  • the Indian FIG. 2 shown below major portion has the chip island on which the optoelectronic device is disposed within the recess.
  • the Indian FIG. 2 Above drawn portion of the support member 1 acts as a further electrical connection and is in the described embodiment, as shown in the FIG. 1 is shown connected within the recess 3 with the bonding wire 13.
  • FIG. 3 shows the in the FIG. 1 marked cross-section III through the housing and the optoelectronic component arranged therein, which, however, is shown only schematically.
  • the carrier element 1 in this example comprises two separate portions.
  • the recess 3 can be filled with a transparent filler as needed.
  • a transparent potting compound such.
  • silicone an epoxy resin or a hybrid material (silicone epoxy) in Question.
  • the provided in the plastic housing 2 structure 5 is in this example a kind of lateral groove in the inner wall of the recess 3, which serves for better adhesion of the potting compound.
  • FIG. 3 a structural element 11 is indicated, which may be attached to the carrier element 1 and is provided for more accurate positioning of the optoelectronic component 12.
  • the bonding wire 13 present in this example is attached at one end to a contact surface on the upper side of the optoelectronic component 12 and fastened at the other end on the connection surface 8 of the second portion of the carrier element 1. From the illustrated arrangement it follows that for mounting in this housing preferably a surface emitting device is suitable. In a suitably modified assembly, for. B. in particular at right angles to the surface of the carrier element 1, but also an edge emitting device can be used in conjunction with this housing.
  • a cover 4 of the opening 9 is present on the side facing away from the carrier element 1 side of the recess 3.
  • the cover 4 is in this example a transparent layer of a mechanically stable material, for. B. made of transparent plastic or glass, and laterally mounted on the plastic housing 2, for example, glued.
  • any desired optical component or even an arrangement of several optical components can be provided as cover 4.
  • the Cover 4 may thus comprise any optics known per se, for example for reflection or diffraction, also in combination with one another, which can be fastened to the plastic housing 2 in a simple manner. This is a particular advantage of this housing design. If a cover 4 is provided, in particular, a filling material in the recess 3 can be dispensed with.
  • a cover 4 such as a transparent lid, a lens or other optical components
  • a material that will withstand the high temperatures required for a subsequent soldering process to produce external electrical connections of the housing without damage In the cover 4 used optical components should therefore in such applications of the housing therefore in particular reflow solderable material, eg. As silicone or glass, his.
  • FIG. 5 shows the other in the FIG. 1 marked cross section V for an embodiment in which the opening 9 of the recess 3 is covered with a lens 14.
  • the recess 3 is preferably filled with a suitable filling material, but the filling material may also be omitted in this embodiment.
  • the lens may also be formed as a proportion of the filling material. Instead, the lens can be poured orregistrmoldet.
  • the lens may also be made of glass or a transparent plastic.
  • the Indian FIG. 5 shown peripheral portion 15 of the lens 14, which rests on the plastic housing 2 is preferably provided with nubs or pins in the in the FIG. 1 engage shown mounting holes 6, so that the lens 14 is arranged automatically during assembly in the exactly adjusted position.
  • the z. B. is encapsulated with the plastic material of the plastic housing 2.
  • An electrical connection of the other electronic component 10 is z. Example, via a suitably structured portion of a support member 1 made of metal and / or via bonding wires, which may be led out of the plastic housing 2, if necessary, possible.
  • outputs and / or inputs of the further electronic component can be connected to terminals provided for this purpose of the optoelectronic component.
  • the further electronic component 10 may, for. B. a circuit protection against electrostatic damage (ESD, electrostatic damage) included.
  • the optoelectronic component 12 is not influenced or even impaired by an arrangement of one or more further electronic components within the plastic housing 2 in its mode of operation. In particular, no absorption or deflection of the radiation is caused by the presence of an electronic component within the plastic housing 2, and an axially symmetric configuration of the recess 3 and a resulting axisymmetric light emission are possible without any problems.
  • FIG. 6 is one of the FIG. 5 corresponding cross section of a further embodiment shown in which in the recess 3, a conversion element 16 is arranged.
  • the structure 5 of the plastic housing may be formed as a step, so that the conversion element 16 can be precisely aligned with the plastic housing 2 and mounted at the intended distance to the optoelectronic component 12.
  • the conversion element 16 is preferably as thin as possible and preferably covers the entire recess 3. It preferably has no direct connection to the surface of the optoelectronic component 12, that is, it is not mounted directly on its surface. It can thereby be achieved that a light propagation to or from the optoelectronic component 12 takes place with a practically direction-independent change by the conversion element 16.
  • the housing is provided for an LED, it can be ensured with such an arrangement of the conversion element 16 that the light emitted in different directions traverses the conversion element 16 at at least approximately the same angle and travels a comparable path length, so that the out of the housing As a result, the emergent light has a similar color temperature over the entire detected solid angle range.
  • the distance of the conversion element 16 can be optimized by the optoelectronic component 12, so that in particular the intended light bundling or the size of the solid angle range detected by the radiated light, optionally also regardless of the size of the opening 9 of the recess 3, set in the desired manner can be.
  • the housing design thus allows the arrangement of optoelectronic component 12 and conversion element 16 according to the respective requirements optimize.
  • the fixation of the conversion element 16 at the intended distance to the optoelectronic component 12 can be accomplished, for example, in such a way when using a filling material with which the recess 3 is filled, that the filler is first introduced into the recess 3 up to a certain height in that the conversion element 16 is arranged on this portion of the filling material and finally the remaining filling material is introduced and the conversion element 16 is enclosed therein.
  • FIG. 7 shows a further embodiment of the housing in a plan view according to the FIG. 1 ,
  • the carrier element 1 is subdivided into a plurality of components, so that a plurality of optoelectronic components 12 can be arranged thereon and electrically connected.
  • Each optoelectronic component 12 is arranged on a separate portion of the carrier element 1 and connected via a respective bonding wire 13 to a separate pad 8.
  • the shape of the opening 9 is adapted to the arrangement of a plurality of optoelectronic components 12.
  • the number of mounted optoelectronic components 12 is limited by the size of the components and the size of the recess 3, but otherwise arbitrary.
  • FIG. 8 shows the embodiment according to the FIG. 7 in one of the FIG. 2 corresponding rear view, in which the subdivision of the support element 1 is recognizable in the separate shares.
  • the various electronic and optical components used in conjunction with the housing can be easily mounted.
  • the use of solder-resistant optics allows a high-quality connection with the plastic housing before the housing is mounted, for example on a circuit board or the like, and solder contacts are produced. Since the housing can be dimensioned very small, the optics can also be made small and reduce manufacturing costs.
  • the housing is almost arbitrarily dimensioned, so that in particular its height can be adapted to the size of the optoelectronic component.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Claims (11)

  1. Boîtier pour un composant optoélectronique, avec
    un élément porteur (1) avec une face supérieure, qui est une couche métallique structurée sous la forme d'une grille de connexion métallique plane, qui est uniquement estampée ou corrodée, avec au moins deux parts séparées l'une de l'autre et isolées électriquement,
    un boîtier en plastique (2) qui est disposé sur l'élément porteur (1), et
    un évidement (3) dans le boîtier en plastique (2),
    sachant que,
    l'évidement (3) présente des dimensions, qui permettent le logement du composant optoélectronique sur la face supérieure de l'élément porteur (1),
    l'évidement (3) possède une ouverture (9) sur la face détournée de l'élément porteur (1), et s'étend de l'ouverture (9) jusqu'à l'élément porteur (1),
    le boîtier en plastique (2) comporte un autre composant électronique (10) disposé dans son intérieur et extrudé avec une matière en plastique du boîtier en plastique (2), qui contient un circuit protecteur contre les détériorations issues d'une charge électrostatique et/ou un circuit de commande pour le composant optoélectronique (12),
    le boîtier en plastique (2) est en un plastique thermodurcissable noir et adapté aux coefficients d'extension thermiques de l'élément porteur (1),
    les au moins deux parts de l'élément porteur (1) sont séparées l'une de l'autre par une traverse (7) et isolées électriquement, la traverse (7) étant constituée par une part du boîtier en plastique (2) et faisant saillie au-dessus du côté supérieur de l'élément porteur (1), et
    l'élément porteur (1) présente sur le côté détourné du boîtier en plastique (2) des surfaces de contact à l'arrière pour un branchement électrique externe et aucune patte de connexion guidée vers l'extérieur et que le boîtier en plastique (2) est adjacent aux surfaces de contact dans toutes les directions se produisant le long des surfaces de contact arrière, de sorte que le boîtier est une construction no-leads.
  2. Boîtier selon la revendication 1,
    pour lequel un recouvrement transparent (4) de l'ouverture (9) de l'évidement (3) est présent.
  3. Boîtier selon la revendication 2,
    pour lequel le recouvrement transparent présente une lentille (14) .
  4. Boîtier selon une quelconque des revendications 1 à 3, pour lequel une matière de charge transparente est présente dans l'évidement (3).
  5. Boîtier selon la revendication 4, pour lequel
    le boîtier en plastique (2) est doté d'une structure (5), qui est une rainure dans la paroi interne de l'évidement (3) et sert à l'adhérence de la matière de charge.
  6. Boîtier selon une quelconque des revendications 1 à 5, pour lequel
    le boîtier en plastique (2) est doté d'une structure (5), qui est un gradin dans la paroi interne de l'évidement (3) ou d'une ouverture de montage (6), qui définit la disposition d'un recouvrement (4) ou d'un composant optique par rapport au boîtier en plastique (2).
  7. Boîtier selon une quelconque des revendications 1 à 6, pour lequel
    l'élément porteur (1) présente un îlot de puce électronique ou un élément de structure (11) qui est prévu pour le logement du composant optoélectronique (12) à l'intérieur de l'évidement (3) .
  8. Disposition d'un composant optoélectronique dans un boîtier selon une quelconque des revendications 1 à 7, avec un composant optoélectronique (12), notamment une diode luminescente, qui est disposée à l'intérieur de l'évidement (3) avec une zone orientée vers l'ouverture (9) et prévue pour l'émission de lumière ou la réception de lumière.
  9. Disposition selon la revendication 8, pour laquelle un élément de conversion (16) est disposé entre l'ouverture (9) de l'évidement (3) et le composant optoélectronique (12).
  10. Disposition selon la revendication 9, pour laquelle l'élément de conversion (16) recouvre l'ensemble de la zone d'angle solide définie par l'ouverture (9) de l'évidement (3), de sorte que l'élément de conversion (16) entraîne une modification de la diffusion de lumière indépendante de la direction, vers ou à partir du composant optoélectronique (12) disposé dans l'évidement (3).
  11. Disposition selon une quelconque des revendications 8 à 10, pour laquelle
    au moins un autre composant optoélectronique (12), notamment une diode luminescente, est présente, qui est disposée à l'intérieur de l'évidement (3) avec une zone orientée vers l'ouverture (9) et prévue pour l'émission de lumière ou la réception de lumière.
EP08706734.4A 2007-01-11 2008-01-09 Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans le boîtier Active EP2062301B1 (fr)

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PCT/DE2008/000029 WO2008083672A2 (fr) 2007-01-11 2008-01-09 Boîtier pour composant optoélectronique et disposition d'un composant optoélectronique dans un boîtier

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US20110002587A1 (en) 2011-01-06
US9054279B2 (en) 2015-06-09
EP2062301A2 (fr) 2009-05-27
DE102007001706A1 (de) 2008-07-17
JP2010516050A (ja) 2010-05-13
WO2008083672A3 (fr) 2008-12-18
TW200841496A (en) 2008-10-16
KR20090104020A (ko) 2009-10-05
CN101569023A (zh) 2009-10-28
WO2008083672A2 (fr) 2008-07-17
TWI475715B (zh) 2015-03-01
KR101410569B1 (ko) 2014-06-23

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