EP2057864A1 - Heizelement - Google Patents
HeizelementInfo
- Publication number
- EP2057864A1 EP2057864A1 EP07801293A EP07801293A EP2057864A1 EP 2057864 A1 EP2057864 A1 EP 2057864A1 EP 07801293 A EP07801293 A EP 07801293A EP 07801293 A EP07801293 A EP 07801293A EP 2057864 A1 EP2057864 A1 EP 2057864A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating element
- electrodes
- ceramic body
- element according
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
Definitions
- Heating elements with ceramic PTC resistors are known for example from the publication US 4,899,032.
- the heating element has a ceramic body specified, which has PTC properties.
- PTC Positive Temperature Coefficient.
- the heating element has electrodes which are arranged on the ceramic body. Both the ceramic body and the electrodes are lead-free.
- the heating element can be used in automotive applications in 12/24/42 V operation preferably for heating the vehicle interior, especially in diesel vehicles (cars, trucks, commercial vehicles) and gasoline-powered vehicles.
- a plurality of identical heating elements are arranged on a common carrier, conductively connected to one another and thus combined to form a heating arrangement.
- the ceramic body is sintered. To produce the ceramic body ceramic raw materials are used without lead additives.
- the ceramic raw material preferably contains BaTiO 3 .
- the ceramic raw material contains in a variant (for example, next the barium titanate) a proportion of SrTiO 3 .
- the body may be free of SrTiO 3 .
- the following ceramic composition is considered: BaTiO 3 50 to 85%, CaTiO 3 3 to 15%, SrTiO 3 to 50%, SiO 2 1 to 2%.
- the electrodes or their sublayers are preferably produced in a metal deposition process. Examples are sputtering, vapor deposition, galvanic deposition, chemical deposition. However, the electrodes can also be produced by burning in a metal paste. Depending on the variant, the thickness of the electrodes can be between 2 ⁇ m and 25 ⁇ m.
- the electrodes may contain metallic Al as the base material.
- the base material of the electrodes may be enriched with glass flux.
- the proportion of glass flux is preferably about 5%.
- the thickness of an electrode comprising Al as a base material and a glass flux as an additive is preferably 20 ⁇ m.
- the glass flow can be dispensed with, so that the electrodes are free of glass additives.
- the thickness of an electrode made of Al without glass flow is preferably 4 ⁇ m.
- the electrodes may have a layer sequence comprising a plurality of partial layers.
- the layer sequence may in particular comprise a base layer, which functions as an inner contact layer, and a diffusion barrier layer.
- the inner contacting layer serves for ohmic contacting of the ceramic body.
- chromium or a zinc-containing layer suitable.
- As a diffusion barrier layer is a nickel layer suitable, which can be applied depending on the variant directly on the Keratnik stresses or on the Maisier Anlagen.
- the layer sequence preferably also comprises a conductive layer (outer contact layer) which has a good electrical conductivity which is higher than that of the underlying layers.
- a conductive layer for example, a silver layer or a silver-containing layer is suitable. Further layer sequences not mentioned here can also be considered for the electrodes of the specified heating element.
- the electrodes produced in a baking process are produced with stoving pastes which have a glass content.
- a metal paste is used with a glass additive that is lead-free.
- the metal paste also contains organic binders, which are preferably completely burned out when the electrodes are burned in.
- the heating element preferably has two major surfaces.
- a first electrode is arranged on the first main surface and a second electrode is arranged on the second main surface.
- the heating element may be formed as a surface mountable device.
- the specific resistance of the heating element may for example be set between 10 and 500 ohm cm.
- the resistance value is not limited to the specified range.
- the specified heating element will be explained with reference to schematic and not to scale figures. Show it:
- FIG. 1 in cross section a heating element
- FIG. 1 in cross section a heating element with multilayer electrodes.
- the heating element shown in FIG. 1 comprises a ceramic body 1, a first electrode 2 and a second electrode 3.
- the electrode 2 is arranged on the lower main surface and the electrode 3 is arranged on the upper main surface of the body 1. Both the body 1 and the electrodes 2, 3 are lead-free.
- FIG. 2 shows a variant of the heating element shown in FIG. 1, in which each electrode consists of several layers.
- the lower electrode has an inner contact layer 2a, a diffusion barrier layer 2b and an outer contact layer 2c.
- the upper electrode similarly has an inner contact layer 3a, a diffusion barrier layer 3b, and an outer contact layer 3c.
- the diffusion barrier layer 2b, 3b is disposed between the contact layers 2a, 3a and 2c, 3c.
- the inner contacting layer 2a, 3a is disposed between the body 1 and the diffusion barrier layer 2b, 3b.
- Each of the layers 2a, 2b, 2c, 3a, 3b, 3c is lead-free. Reference sign
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Resistance Heating (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102006041054A DE102006041054A1 (de) | 2006-09-01 | 2006-09-01 | Heizelement |
| PCT/DE2007/001556 WO2008025348A1 (de) | 2006-09-01 | 2007-08-31 | Heizelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2057864A1 true EP2057864A1 (de) | 2009-05-13 |
| EP2057864B1 EP2057864B1 (de) | 2017-08-09 |
| EP2057864B9 EP2057864B9 (de) | 2018-02-21 |
Family
ID=38787569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP07801293.7A Active EP2057864B9 (de) | 2006-09-01 | 2007-08-31 | Heizelement |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8373100B2 (de) |
| EP (1) | EP2057864B9 (de) |
| JP (1) | JP2010501988A (de) |
| KR (1) | KR101465809B1 (de) |
| CN (1) | CN101507350A (de) |
| DE (1) | DE102006041054A1 (de) |
| WO (1) | WO2008025348A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2015002197A1 (ja) | 2013-07-02 | 2017-02-23 | 日立金属株式会社 | Ptc素子および発熱モジュール |
| US20160264100A1 (en) * | 2013-10-22 | 2016-09-15 | Byd Company Limited | Positive temperature coefficient heating assembly and defroster for a vehicle |
| CN111111961B (zh) * | 2019-12-29 | 2021-07-16 | 苏州路之遥科技股份有限公司 | 一种马桶圈用ptc加热材料的喷涂装置及喷涂方法 |
| DE102024119177A1 (de) * | 2024-07-05 | 2026-01-08 | Mahle International Gmbh | PTC-Heizelement und Verfahren zur Herstellung |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1415406B1 (de) * | 1958-04-30 | 1970-08-20 | Siemens Ag | Keramischer Widerstand mit hohem positiven Temperaturkoeffizienten seines Gesamtwiderstandswertes |
| US3437789A (en) * | 1965-10-07 | 1969-04-08 | Roger Charbonnier | Thermally stabilized electronic assembly |
| US3748439A (en) * | 1971-12-27 | 1973-07-24 | Texas Instruments Inc | Heating apparatus |
| JPS5148815B2 (de) | 1973-03-09 | 1976-12-23 | ||
| DE3708056A1 (de) * | 1987-03-12 | 1988-09-22 | Siemens Ag | Heizelement zum erwaermen stroemender medien |
| US4899032A (en) * | 1987-03-12 | 1990-02-06 | Siemens Aktiengesellschaft | Electric heating element utilizing ceramic PTC resistors for heating flooring media |
| DE3900787A1 (de) * | 1989-01-12 | 1990-07-19 | Siemens Ag | Verfahren zur herstellung eines keramischen elektrischen bauelementes |
| JPH0621191U (ja) * | 1992-03-26 | 1994-03-18 | 積水化成品工業株式会社 | ヒーター |
| JPH08148262A (ja) * | 1994-11-18 | 1996-06-07 | Matsushita Electric Ind Co Ltd | 正特性サーミスタ発熱体 |
| US5663702A (en) * | 1995-06-07 | 1997-09-02 | Littelfuse, Inc. | PTC electrical device having fuse link in series and metallized ceramic electrodes |
| JPH10101413A (ja) * | 1996-09-27 | 1998-04-21 | Toyota Central Res & Dev Lab Inc | Ptcセラミック、その製造法およびヒータ |
| IL121449A0 (en) * | 1997-08-01 | 1998-02-08 | Body Heat Ltd | Adhesive composition for electrical PTC heating device |
| JPH11297504A (ja) * | 1998-04-10 | 1999-10-29 | Murata Mfg Co Ltd | 電子装置 |
| JPH11345704A (ja) * | 1998-06-02 | 1999-12-14 | Murata Mfg Co Ltd | セラミック電子部品素子及びそれを用いたセラミック電子部品 |
| US6380627B1 (en) * | 1998-06-26 | 2002-04-30 | The Regents Of The University Of California | Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication |
| JP2000095562A (ja) * | 1998-07-24 | 2000-04-04 | Murata Mfg Co Ltd | 正特性サ―ミスタ用原料組成物、正特性サ―ミスタ用磁器、および正特性サ―ミスタ用磁器の製造方法 |
| JP3424742B2 (ja) * | 1998-11-11 | 2003-07-07 | 株式会社村田製作所 | 正の抵抗温度特性を有する積層型半導体セラミック電子部品 |
| JP3855611B2 (ja) * | 2000-07-21 | 2006-12-13 | 株式会社村田製作所 | 半導体セラミック及び正特性サーミスタ |
| JP4252231B2 (ja) * | 2001-09-05 | 2009-04-08 | 日本碍子株式会社 | 半導体ウェハー支持部材接合体の製造方法および半導体ウェハー支持部材接合体 |
| JP4204773B2 (ja) * | 2001-09-17 | 2009-01-07 | 株式会社日立製作所 | 空燃比検出装置 |
| US20030056584A1 (en) * | 2001-09-27 | 2003-03-27 | Park Tae-Won | Mass flow sensor and measuring apparatus |
| WO2003073442A1 (en) * | 2002-02-28 | 2003-09-04 | Kojima Chemical Co., Ltd. | Resistor |
| JP3630144B2 (ja) * | 2002-02-28 | 2005-03-16 | 小島化学薬品株式会社 | 抵抗器 |
| DE10310722A1 (de) * | 2003-03-10 | 2004-09-23 | Tesa Ag | Elektrisch erwärmbare Haftklebemasse |
| CN100386829C (zh) * | 2004-07-28 | 2008-05-07 | 王克政 | Ptc厚膜电路可控电热元件 |
-
2006
- 2006-09-01 DE DE102006041054A patent/DE102006041054A1/de not_active Withdrawn
-
2007
- 2007-08-31 CN CNA2007800316500A patent/CN101507350A/zh active Pending
- 2007-08-31 EP EP07801293.7A patent/EP2057864B9/de active Active
- 2007-08-31 KR KR1020097005920A patent/KR101465809B1/ko active Active
- 2007-08-31 WO PCT/DE2007/001556 patent/WO2008025348A1/de not_active Ceased
- 2007-08-31 JP JP2009525920A patent/JP2010501988A/ja active Pending
-
2009
- 2009-02-26 US US12/393,793 patent/US8373100B2/en active Active
Non-Patent Citations (2)
| Title |
|---|
| None * |
| See also references of WO2008025348A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090212041A1 (en) | 2009-08-27 |
| DE102006041054A1 (de) | 2008-04-03 |
| WO2008025348A1 (de) | 2008-03-06 |
| KR101465809B1 (ko) | 2014-11-26 |
| KR20090043590A (ko) | 2009-05-06 |
| CN101507350A (zh) | 2009-08-12 |
| US8373100B2 (en) | 2013-02-12 |
| EP2057864B9 (de) | 2018-02-21 |
| JP2010501988A (ja) | 2010-01-21 |
| EP2057864B1 (de) | 2017-08-09 |
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