EP2057864A1 - Heating element - Google Patents
Heating elementInfo
- Publication number
- EP2057864A1 EP2057864A1 EP07801293A EP07801293A EP2057864A1 EP 2057864 A1 EP2057864 A1 EP 2057864A1 EP 07801293 A EP07801293 A EP 07801293A EP 07801293 A EP07801293 A EP 07801293A EP 2057864 A1 EP2057864 A1 EP 2057864A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heating element
- electrodes
- ceramic body
- element according
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 33
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000011521 glass Substances 0.000 claims description 10
- 230000004888 barrier function Effects 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 8
- 229910002367 SrTiO Inorganic materials 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 3
- 238000005234 chemical deposition Methods 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 238000007740 vapor deposition Methods 0.000 claims description 2
- 238000004070 electrodeposition Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/02—Heaters using heating elements having a positive temperature coefficient
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
Definitions
- Heating elements with ceramic PTC resistors are known for example from the publication US 4,899,032.
- the heating element has a ceramic body specified, which has PTC properties.
- PTC Positive Temperature Coefficient.
- the heating element has electrodes which are arranged on the ceramic body. Both the ceramic body and the electrodes are lead-free.
- the heating element can be used in automotive applications in 12/24/42 V operation preferably for heating the vehicle interior, especially in diesel vehicles (cars, trucks, commercial vehicles) and gasoline-powered vehicles.
- a plurality of identical heating elements are arranged on a common carrier, conductively connected to one another and thus combined to form a heating arrangement.
- the ceramic body is sintered. To produce the ceramic body ceramic raw materials are used without lead additives.
- the ceramic raw material preferably contains BaTiO 3 .
- the ceramic raw material contains in a variant (for example, next the barium titanate) a proportion of SrTiO 3 .
- the body may be free of SrTiO 3 .
- the following ceramic composition is considered: BaTiO 3 50 to 85%, CaTiO 3 3 to 15%, SrTiO 3 to 50%, SiO 2 1 to 2%.
- the electrodes or their sublayers are preferably produced in a metal deposition process. Examples are sputtering, vapor deposition, galvanic deposition, chemical deposition. However, the electrodes can also be produced by burning in a metal paste. Depending on the variant, the thickness of the electrodes can be between 2 ⁇ m and 25 ⁇ m.
- the electrodes may contain metallic Al as the base material.
- the base material of the electrodes may be enriched with glass flux.
- the proportion of glass flux is preferably about 5%.
- the thickness of an electrode comprising Al as a base material and a glass flux as an additive is preferably 20 ⁇ m.
- the glass flow can be dispensed with, so that the electrodes are free of glass additives.
- the thickness of an electrode made of Al without glass flow is preferably 4 ⁇ m.
- the electrodes may have a layer sequence comprising a plurality of partial layers.
- the layer sequence may in particular comprise a base layer, which functions as an inner contact layer, and a diffusion barrier layer.
- the inner contacting layer serves for ohmic contacting of the ceramic body.
- chromium or a zinc-containing layer suitable.
- As a diffusion barrier layer is a nickel layer suitable, which can be applied depending on the variant directly on the Keratnik stresses or on the Maisier Anlagen.
- the layer sequence preferably also comprises a conductive layer (outer contact layer) which has a good electrical conductivity which is higher than that of the underlying layers.
- a conductive layer for example, a silver layer or a silver-containing layer is suitable. Further layer sequences not mentioned here can also be considered for the electrodes of the specified heating element.
- the electrodes produced in a baking process are produced with stoving pastes which have a glass content.
- a metal paste is used with a glass additive that is lead-free.
- the metal paste also contains organic binders, which are preferably completely burned out when the electrodes are burned in.
- the heating element preferably has two major surfaces.
- a first electrode is arranged on the first main surface and a second electrode is arranged on the second main surface.
- the heating element may be formed as a surface mountable device.
- the specific resistance of the heating element may for example be set between 10 and 500 ohm cm.
- the resistance value is not limited to the specified range.
- the specified heating element will be explained with reference to schematic and not to scale figures. Show it:
- FIG. 1 in cross section a heating element
- FIG. 1 in cross section a heating element with multilayer electrodes.
- the heating element shown in FIG. 1 comprises a ceramic body 1, a first electrode 2 and a second electrode 3.
- the electrode 2 is arranged on the lower main surface and the electrode 3 is arranged on the upper main surface of the body 1. Both the body 1 and the electrodes 2, 3 are lead-free.
- FIG. 2 shows a variant of the heating element shown in FIG. 1, in which each electrode consists of several layers.
- the lower electrode has an inner contact layer 2a, a diffusion barrier layer 2b and an outer contact layer 2c.
- the upper electrode similarly has an inner contact layer 3a, a diffusion barrier layer 3b, and an outer contact layer 3c.
- the diffusion barrier layer 2b, 3b is disposed between the contact layers 2a, 3a and 2c, 3c.
- the inner contacting layer 2a, 3a is disposed between the body 1 and the diffusion barrier layer 2b, 3b.
- Each of the layers 2a, 2b, 2c, 3a, 3b, 3c is lead-free. Reference sign
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006041054A DE102006041054A1 (en) | 2006-09-01 | 2006-09-01 | heating element |
PCT/DE2007/001556 WO2008025348A1 (en) | 2006-09-01 | 2007-08-31 | Heating element |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2057864A1 true EP2057864A1 (en) | 2009-05-13 |
EP2057864B1 EP2057864B1 (en) | 2017-08-09 |
EP2057864B9 EP2057864B9 (en) | 2018-02-21 |
Family
ID=38787569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07801293.7A Active EP2057864B9 (en) | 2006-09-01 | 2007-08-31 | Heating element |
Country Status (7)
Country | Link |
---|---|
US (1) | US8373100B2 (en) |
EP (1) | EP2057864B9 (en) |
JP (1) | JP2010501988A (en) |
KR (1) | KR101465809B1 (en) |
CN (1) | CN101507350A (en) |
DE (1) | DE102006041054A1 (en) |
WO (1) | WO2008025348A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2015002197A1 (en) | 2013-07-02 | 2017-02-23 | 日立金属株式会社 | PTC element and heating module |
WO2015058692A1 (en) * | 2013-10-22 | 2015-04-30 | Byd Company Limited | Positive temperature coefficient heating assembly and defroster for a vehicle |
CN111111961B (en) * | 2019-12-29 | 2021-07-16 | 苏州路之遥科技股份有限公司 | Spraying device and spraying method for PTC heating material for toilet seat |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1415406B1 (en) * | 1958-04-30 | 1970-08-20 | Siemens Ag | Ceramic resistor with a high positive temperature coefficient of its total resistance value |
US3437789A (en) * | 1965-10-07 | 1969-04-08 | Roger Charbonnier | Thermally stabilized electronic assembly |
US3748439A (en) * | 1971-12-27 | 1973-07-24 | Texas Instruments Inc | Heating apparatus |
JPS5148815B2 (en) * | 1973-03-09 | 1976-12-23 | ||
DE3708056A1 (en) * | 1987-03-12 | 1988-09-22 | Siemens Ag | Heating element for heating flowing media |
US4899032A (en) * | 1987-03-12 | 1990-02-06 | Siemens Aktiengesellschaft | Electric heating element utilizing ceramic PTC resistors for heating flooring media |
DE3900787A1 (en) * | 1989-01-12 | 1990-07-19 | Siemens Ag | Method for producing a ceramic electrical component |
JPH0621191U (en) * | 1992-03-26 | 1994-03-18 | 積水化成品工業株式会社 | heater |
JPH08148262A (en) * | 1994-11-18 | 1996-06-07 | Matsushita Electric Ind Co Ltd | Positive characteristic thermistor heating element |
US5663702A (en) * | 1995-06-07 | 1997-09-02 | Littelfuse, Inc. | PTC electrical device having fuse link in series and metallized ceramic electrodes |
JPH10101413A (en) * | 1996-09-27 | 1998-04-21 | Toyota Central Res & Dev Lab Inc | Ptc ceramic, its production and heater |
IL121449A0 (en) * | 1997-08-01 | 1998-02-08 | Body Heat Ltd | Adhesive composition for electrical PTC heating device |
JPH11297504A (en) * | 1998-04-10 | 1999-10-29 | Murata Mfg Co Ltd | Electronic device |
JPH11345704A (en) * | 1998-06-02 | 1999-12-14 | Murata Mfg Co Ltd | Ceramic electronic parts element and ceramic electronic parts using the element |
US6380627B1 (en) * | 1998-06-26 | 2002-04-30 | The Regents Of The University Of California | Low resistance barrier layer for isolating, adhering, and passivating copper metal in semiconductor fabrication |
JP2000095562A (en) * | 1998-07-24 | 2000-04-04 | Murata Mfg Co Ltd | Raw material composition for positive temperature coefficient thermistor, porcelain for positive temperature coefficient thermistor, and production of its porcelain |
JP3424742B2 (en) * | 1998-11-11 | 2003-07-07 | 株式会社村田製作所 | Multilayer semiconductor ceramic electronic components with positive resistance temperature characteristics |
JP3855611B2 (en) * | 2000-07-21 | 2006-12-13 | 株式会社村田製作所 | Semiconductor ceramic and positive temperature coefficient thermistor |
JP4252231B2 (en) * | 2001-09-05 | 2009-04-08 | 日本碍子株式会社 | Manufacturing method of semiconductor wafer support member assembly and semiconductor wafer support member assembly |
JP4204773B2 (en) * | 2001-09-17 | 2009-01-07 | 株式会社日立製作所 | Air-fuel ratio detection device |
US20030056584A1 (en) * | 2001-09-27 | 2003-03-27 | Park Tae-Won | Mass flow sensor and measuring apparatus |
AU2003211482A1 (en) | 2002-02-28 | 2003-09-09 | Kojima Chemical Co., Ltd. | Resistor |
JP3630144B2 (en) * | 2002-02-28 | 2005-03-16 | 小島化学薬品株式会社 | Resistor |
DE10310722A1 (en) * | 2003-03-10 | 2004-09-23 | Tesa Ag | Electrically heatable adhesive composition, useful for adhesive tape in automotive applications such as electrically heated mirrors, comprises an adhesive component and an electrically conductive filler |
CN100386829C (en) * | 2004-07-28 | 2008-05-07 | 王克政 | PTC thick film curc uit controllable electric heating element |
-
2006
- 2006-09-01 DE DE102006041054A patent/DE102006041054A1/en active Pending
-
2007
- 2007-08-31 KR KR1020097005920A patent/KR101465809B1/en active IP Right Grant
- 2007-08-31 WO PCT/DE2007/001556 patent/WO2008025348A1/en active Application Filing
- 2007-08-31 CN CNA2007800316500A patent/CN101507350A/en active Pending
- 2007-08-31 JP JP2009525920A patent/JP2010501988A/en active Pending
- 2007-08-31 EP EP07801293.7A patent/EP2057864B9/en active Active
-
2009
- 2009-02-26 US US12/393,793 patent/US8373100B2/en active Active
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO2008025348A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN101507350A (en) | 2009-08-12 |
US20090212041A1 (en) | 2009-08-27 |
JP2010501988A (en) | 2010-01-21 |
KR20090043590A (en) | 2009-05-06 |
WO2008025348A1 (en) | 2008-03-06 |
US8373100B2 (en) | 2013-02-12 |
KR101465809B1 (en) | 2014-11-26 |
EP2057864B1 (en) | 2017-08-09 |
DE102006041054A1 (en) | 2008-04-03 |
EP2057864B9 (en) | 2018-02-21 |
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