Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/18—Pretreatment of the material to be coated
  • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
  • C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
  • C23C18/1886—Multistep pretreatment
  • C23C18/1889—Multistep pretreatment with use of metal first
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
  • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
  • C23C18/31—Coating with metals
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31678—Of metal
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/31504—Composite [nonstructural laminate]
  • Y10T428/31678—Of metal
  • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Definitions

• the invention relates to substrates with spatially selective metal coating, to processes for their production, wherein the locations of the metal coating on the substrate can be influenced. Furthermore, the invention relates to the use of such substrates for catalysts, solid-state electrolyte sensors or optically transparent conductive layers.
• Catalysts are substances which reduce the activation energy to the end of a particular reaction, thereby increasing the reaction rate without being consumed in the reaction.
• colloidal metals are known, which are prepared by reduction of metal salts or metal complexes.
• the size, the type and distribution of the metallically active clusters have an essential influence on the activity of noble metal catalysts, but on the other hand their accessibility within the support structures.
• the support consists of at least one layer of identical protein-containing molecules, which are arranged in the form of a crystal lattice with a lattice constant of 1 to 50 nm.
• WO 97/48837 describes metallic nanostructures based on self-assembled, geometrically highly ordered proteins and a process for their preparation.
• the assembled proteins are activated with a metal salt or metal complex and can then be electrolessly metallized in a metallization under conditions compatible with proteins.
• AT 410 805 B describes a method for depositing S-layer proteins, in which the S-layer proteins have a net electrical charge, and establishing an electrical potential difference between the solution and the carrier surface by adjusting the electrical potential of the carrier surface under which effect the S-layer proteins from the solution accumulate on the carrier surface.
• publications are known which relate to applications in the field of microelectronics.
• DE 692 31 893 T2 describes a process for electroless metallization in which a selective deposition of metals takes place by pretreating the substrate with chemical groups.
• DE 199 52 018 C1 describes a process in which substrates decorated in the nanometer range are produced.
• the method is based on the positioning of polymeric core-shell systems in wells of a photoresist layer structured by lithographic techniques.
• DE 199 30 893 B4 discloses the use of highly ordered proteins which are occupied by clustered clusters of a catalytically active metal as carrier-fixed catalyst for chemical hydrogenations, in which the clusters occupied proteins remain unchanged.
• the highly ordered proteins serve as carriers on which metallic clusters are deposited in more or less regular form, that is, a structuring of the clusters is achieved in the best case by the regular structure of the self-assembled proteins.
• Use of the proteins for the selective deposition of the metallic clusters on the underlying substrate by incomplete coverage and thus the prevention of metal deposition in the undesired locations is not disclosed.
• DE 102 28 056 A1 includes a method for creating nucleation centers for the selective heterogeneous growth of metal clusters on DNA molecules.
• the DNA molecules are metallized in an aqueous solution in the presence of metal salts and reducing agents.
• the nucleation centers act as a particularly good template, so that with a suitable process control the homogeneous nucleation of metal clusters in the solution can be prevented.
• Support materials in the solution which may also come as nucleation in question.
• the DNA molecules are not deposited on carrier surfaces prior to metallization. The selectivity of the deposition thus relates to the suppression of homogeneous nucleation as well as the possibility of partial metallization of the DNA molecules by influencing the base sequences of the DNA.
• the object of the invention is therefore to provide substrates with a spatially selective metal coating and method for their production in which the locations of the metal coating on the substrate can be influenced.
• the object is achieved by a substrate with spatially selective metal coating, the surface of which partially has biological template with a metallic coating and which is obtainable in that the metallic coating takes place only after deposition of the biological template on the substrate.
• the biological template surface layer proteins (S-layer).
• the metallic coating may consist of metal clusters and / or at least one metal layer.
• Metal clusters and metal layers can be made of different materials Consist of metals.
• metals are preferably noble metals, such as. Ex. Pt, Pd used.
• the substrate preferably consists of Al 2 O 3 , silicon, carbon, or a solid state electrolyte.
• the metal coating is not carried out directly on the substrates, but on biological templates with which the substrates are previously coated. Due to their selectable size and chemical or physical properties, the biological templates allow control of the deposition site. According to one embodiment of the invention, the biological template can be activated prior to deposition on the substrate surface in metal salt solution. As a result, the effectiveness of the nucleation centers of the biotemplate is increased even before the substrate is coated, and the metallization process on the substrate can be accelerated. The activation is achieved by mixing a suspension of Biotemplate with a Metallaltzates over several hours.
• Precious metals are preferably deposited as metals.
• electroless metallization is preferred. This metal complexes are bound to a surface and reduced by a subsequent process to metals and formed metal cluster.
• the biological template on the substrate for.
• the biological templates then act as nuclei for preferential deposition of noble metal clusters on their surface, since the deposition of metal on the template is energetically favored over direct deposition on the substrate.
• Selective deposition of the membrane at the sites preferred for catalysis can thus lead, with suitable process control, to an exclusive deposition of catalytically active noble metal clusters in the optimum form for the desired catalytic reaction on the substrate.
• metal complexes are already bound to the membrane-like structures in a metal salt solution. After controlled deposition to the desired locations on the substrate, the metal complexes are reduced by suitable processes to metallic clusters.
• biological templates are used to cover the surface.
• other techniques can be used for selective deposition:
• biomolecules have a defined structure and are therefore present in an equally defined size.
• size of the biomolecules can be controlled by the formation of aggregates. In this case, it is possible to control the number of biomolecules involved, in order in turn to produce a defined size.
• the invention also includes the use of the substrates according to the invention for catalysts, solid-state electrolyte sensors or optically transparent, electrically conductive layers.
• the coating according to the invention makes it possible to provide substrate surfaces with a high proportion of three-phase boundary surfaces (metal coating / substrate gas phase / liquid phase)). Such substrates are suitable for solid-state electrolyte sensors.
• the substrates according to the invention are also suitable for optically transparent, electrically conductive layers, for. Eg displays.
• optically transparent conductive substrates to biological templates are deposited, which are then metallized.
• layers are required that can dissipate electrical charges.
• these layers must at the same time have a high optical transparency in order not to impair their optical function.
• the preparation of the S-layer is based on the publication by Engelhard H .; Saxton, W .; Baumeister, W., "Three-dimensional structure of tetragonal surface layer of Sporosarcina urea, J. Bacteriol. 168 (1), 309, 1986.
• the standard buffer for storage at 4 ° C of the isolated and purified S-layer consists of a 50 mM TRIS / HCl solution, with the addition of 3 mM NaN 3 and ImM MgCl 2 .
• the S-layer solution for all further experimental work has a standard concentration of 10 mg / ml.
• a 3 mM K 2 PtCl 4 solution prepared at least 24 h beforehand is mixed with 13 ⁇ l of the protein solution in accordance with the calculations for occupying the protein with metal clusters.
• the interaction between S-layer solution and metal complex solution takes place in a time of 24 h and with light termination. After this incubation period, the number of metal complexes required for clustering is already attached to the template.
• the substrate material is removed from the solution and subjected to several washing steps.
• the subsequent addition of hydrazine as a reducing agent to the coated substrate reduces the bound metal salt complexes to noble metal clusters.
• Fig. 1 shows an electron micrograph of a sample thus prepared.
• the existing clusters can be converted into closed metallic layers.
• a surface produced in this way then has the property of electrical conductivity with a simultaneously high proportion of three-phase boundary surfaces (metal coating-substrate-gas phase or metal coating-substrate-liquid phase).
• Substrates prepared in this way can be used as a solid-state electrolyte sensor with particularly high sensitivity.
• the freshly prepared monomer solution is recrystallized directly on a Si substrate with the addition of MgCl 2 (final concentration 1 mM).
• MgCl 2 final concentration 1 mM
• the protein monomers recrystallise within 24 h on the Si substrate in a monolayer.
• the Si substrate thus functionalized is brought into contact with a metal complex solution in order subsequently to be coated with metallic clusters as in Working Example 1.
• the advantage of recrystallization of protein monomers directly on the Si substrate over the deposition of S-layer patches is the formation of a monolayer of protein and the associated lower use of biological material.
• the proportion of the surface covered with biotemplates can be influenced by external parameters (eg temperature, pH value of the solution.)
• the substrate produced in this way is suitable as in Example 1 as a three-phase interface of a solid electrolyte sensor.
• the S-Layer solution for all further experimental work has a standard concentration of 10 mg / l.
• Alumina particles (100 mg each) are mixed with 825 ⁇ l of the activated S-layer solution and allowed to interact for 24 hours. Thereafter, twice with dest. H 2 O rinsed.

Landscapes

• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Catalysts (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=37683694

Family Applications (1)

Country Status (9)

Families Citing this family (3)

Family Cites Families (9)

• 2006
  • 2006-07-29 CN CN2006800356306A patent/CN101273156B/zh not_active Expired - Fee Related
  • 2006-07-29 DE DE200611002640 patent/DE112006002640A5/de not_active Withdrawn
  • 2006-07-29 KR KR1020087005188A patent/KR20080041673A/ko not_active Application Discontinuation
  • 2006-07-29 EP EP06775802A patent/EP1920082A2/de not_active Withdrawn
  • 2006-07-29 CA CA 2620514 patent/CA2620514A1/en not_active Abandoned
  • 2006-07-29 BR BRPI0614239-7A patent/BRPI0614239A2/pt not_active IP Right Cessation
  • 2006-07-29 JP JP2008523124A patent/JP2009502456A/ja active Pending
  • 2006-07-29 US US11/997,163 patent/US20090124488A1/en not_active Abandoned
  • 2006-07-29 WO PCT/DE2006/001363 patent/WO2007012333A2/de active Application Filing

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events