EP1917667B1 - Resistance terminale hf presentant une structure de couches plane - Google Patents

Resistance terminale hf presentant une structure de couches plane Download PDF

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Publication number
EP1917667B1
EP1917667B1 EP06776894A EP06776894A EP1917667B1 EP 1917667 B1 EP1917667 B1 EP 1917667B1 EP 06776894 A EP06776894 A EP 06776894A EP 06776894 A EP06776894 A EP 06776894A EP 1917667 B1 EP1917667 B1 EP 1917667B1
Authority
EP
European Patent Office
Prior art keywords
conductor
layer
earthing
resistor
layer structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP06776894A
Other languages
German (de)
English (en)
Other versions
EP1917667A2 (fr
Inventor
Frank Weiss
Dietrich Zahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Publication of EP1917667A2 publication Critical patent/EP1917667A2/fr
Application granted granted Critical
Publication of EP1917667B1 publication Critical patent/EP1917667B1/fr
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C13/00—Resistors not provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/24—Terminating devices
    • H01P1/26—Dissipative terminations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/24—Terminating devices
    • H01P1/26—Dissipative terminations
    • H01P1/268—Strip line terminations

Definitions

  • the present invention relates to an RF termination resistor having a planar layer structure comprising on a substrate a resistance layer for converting RF energy to heat, an input line for supplying RF energy, and a grounding line for electrically connecting to a ground contact, the input line is electrically connected to a first end of the resistive layer and the grounding conductor is electrically connected to a first end opposite the second end of the resistive layer and at a ground contact end of the layered structure, the bulk starting conductor forms the uppermost layer of the layered structure, according to the preamble of claim 1.
  • the invention further relates to a method for producing a planar layer structure for an RF termination resistor, wherein on a substrate, a resistance layer for converting RF energy into heat, an input conductor for feeding n of RF energy and a grounding conductor for electrically connecting to a ground contact, wherein the input conductor is electrically connected to a first end of the resistive layer and the grounding conductor is electrically connected to a first end opposite the second end of the resistive layer, according to the preamble of Claim 6.
  • RF terminating resistors are used, for example, for adapting RF modules in the mobile and microwave radio range with very high transmission powers, for example for terminating a combiner or antenna output.
  • High power dissipation terminators have large resistor structures to distribute the injected RF power to this area. This works However, unfavorable to the reflection factor in broadband application, or the terminating resistor is used with the same reflection factors only in a narrower frequency band.
  • EP 1460710 shows an RF terminating resistor with a planar layer structure.
  • the invention has for its object to design a RF termination of the above type and a method of the type mentioned above such that the ground terminal of the resistor structure of the substrate to the ground contact, such as a housing wall, on the one hand very short, to the most accurate adaptation of the On the other hand, however, to obtain characteristic impedance that can still form a good solder joint for the ground contact between the ground strip conductor and ground contact.
  • the ground strip conductor track is at least partially disposed on the resistor layer.
  • the resistive layer is formed on the substrate and then the grounding conductor track is at least partially formed on the resistive layer.
  • the grounding conductor track is arranged on the substrate and has an extension extending in the direction of the first end of the resistance layer, which is arranged on the resistance layer.
  • a good and functionally reliable producible electrical contact between the ground strip conductor and the ground contact is achieved by an upper side facing away from the substrate of the bulk conductor track both in the region of the ground contact end of the layer structure, in which the ground strip conductor rests on the substrate, as well as in the Extension, in which the mass insertion conductor rests on the resistance layer extends in a plane.
  • the planar layer structure is arranged in a housing of electrically conductive material, wherein the ground contact is the housing.
  • the ground contact is arranged on a ground contact-side end face of the planar layer structure.
  • the apparent, preferred embodiment of an RF termination resistor comprises a resistance layer 10, an input conductor 12 and a grounding conductor 14.
  • the resistance layer 10, the input conductor 12 and the grounding conductor 14 are formed as respective layers on a substrate 16 and form a planar layer structure.
  • the input conductor 12 is electrically connected to a first end 18 of the resistive layer 10, and the grounding conductor 14 is electrically connected to a second end 20 of the resistive layer 10 opposite the first end 18.
  • the resistive layer 10 is for converting RF energy into heat
  • the input trace 12 is for supplying RF energy
  • the bulk launch trace 14 is for electrically connecting to a ground contact 22 (FIG. Fig. 2 ).
  • the resistive layer 10 and the grounding conductor 14 formed planar layer structure is made of Fig. 2 closer.
  • the ground contact 22 is arranged frontally on a ground contact-side end of the layer structure and is for example a part of a housing.
  • This housing is made of an electrically conductive material and thereby also has good Wänne effetseigenschaften so that the resultant in the resistive layer 10 heat energy is dissipated through the housing to a heat sink.
  • the grounding conductor 14 provides electrical contact between the resistive layer 10 and the housing 22.
  • the grounding conductor track 14 is arranged at least partially on the resistance layer 10.
  • the Masseeanschussleiterbahn 14 arranged on the substrate 16.
  • Extending in the direction of the first end 18 of the resistive layer 10 is an extension 24 of the bulk starting conductor 14, which is arranged on the resistive layer 10, ie, the resistive layer 10 is arranged in the region of the extension 24 between the substrate 16 and the grounding conductor layer 14.
  • a side facing away from the substrate 16 top 26 of the bulk slotted conductor 14 extends both in the region of the ground contact-side end of the layer structure in which the bulk slotted conductor 14 rests on the substrate 16, as well as in the region of the extension 24 in which the Masseneanschussleiter- web 14 on the resistance layer 10 rests in a plane.
  • This planar upper side 26 of the grounding conductor 14 serves to establish the electrical contact with the housing 22, wherein a solder connection is preferably produced.
  • a length 28 of the grounding conductor 14, i. an extension of the mass insertion conductor 14 in the propagation direction of the RF wave have a certain minimum length, since otherwise no sufficient Lotkehle can form.
  • a method of fabricating a planar laminar structure for an RF termination comprising forming on a substrate a resistive layer for converting RF energy to heat, an input line for supplying RF energy, and a bulk bus for electrically connecting to a ground contact Input conductor is electrically connected to a first end of the resistive layer and the Masseeingschussleiterbahn is electrically connected to a first end opposite the second end of the resistive layer, characterized in that first the resistive layer is formed on the substrate and thereafter the Masseeingschussleiterbahn at least partially formed on the resistive layer becomes.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Reversible Transmitting Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Details Of Resistors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Claims (6)

  1. Résistance terminale HF présentant une structure en couches planes qui comprend, sur un substrat (16), une couche résistive (10) pour convertir de l'énergie à haute fréquence en chaleur, une piste conductrice d'entrée (12) pour alimenter de l'énergie à haute fréquence, et une piste conductrice d'attaque de masse (14) pour la liaison électrique à un contact de masse (22), dans laquelle la piste conductrice d'entrée (12) est reliée électriquement à une première extrémité (18) de la couche résistive (10), et la piste conductrice d'attaque de masse (14) est reliée électriquement à une seconde extrémité (20) de la couche résistive (10) à l'opposé de la première extrémité (18) et, à une extrémité de la structure en couches du côté du contact de masse, la piste conductrice d'attaque de masse (14) constitue la couche la plus supérieure de la structure en couches,
    caractérisée en ce que la piste conductrice d'attaque de masse (14) est agencée au moins partiellement sur la couche résistive (10).
  2. Résistance terminale HF selon la revendication 1, caractérisée en ce que, à l'extrémité de la structure en couches du côté du contact de masse, la piste conductrice d'attaque de masse (14) est agencée sur le substrat (16) et présente un élargissement (24) qui s'étend en direction de la première extrémité (18) de la couche résistive et qui est agencé sur la couche résistive (10).
  3. Résistance terminale HF selon la revendication 2, caractérisée en ce qu'une face supérieure (26), détournée du substrat (16), de la piste conductrice d'attaque de masse (14) s'étend aussi bien dans la région de l'extrémité de la structure en couches du côté du contact de masse, région dans laquelle la piste conductrice d'attaque de masse (14) repose sur le substrat (16), que dans la région de l'élargissement (24), région dans laquelle la piste conductrice d'attaque de masse (14) repose sur la couche résistive (10), dans une surface.
  4. Résistance terminale HF selon l'une au moins des revendications précédentes, caractérisée en ce que la structure en couches planes est agencée dans un boîtier en matériau électriquement conducteur, et dans laquelle le contact de masse (22) est le boîtier.
  5. Résistance terminale HF selon l'une au moins des revendications précédentes, caractérisée en ce que le contact de masse (22) est agencée sur une surface frontale, du côté du contact de masse, de la structure en couches planes.
  6. Procédé pour réaliser une structure en couches planes pour une résistance terminale HF, dans lequel on réalise sur un substrat une couche résistive pour convertir de l'énergie HF en chaleur, une piste conductrice d'entrée pour alimenter de l'énergie HF, et une piste conductrice d'attaque de masse pour la liaison électrique avec un contact de masse, dans lequel la piste conductrice d'entrée est reliée électriquement à une première extrémité de la couche résistive et la piste conductrice d'attaque de masse est reliée électriquement à une seconde extrémité de la couche résistive à l'opposé de la première extrémité,
    caractérisé en ce que l'on réalise tout d'abord la couche résistive sur le substrat, et en ce que l'on réalise ensuite la piste conductrice d'attaque de masse au moins partiellement sur la couche résistive.
EP06776894A 2005-08-26 2006-08-16 Resistance terminale hf presentant une structure de couches plane Active EP1917667B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202005013515U DE202005013515U1 (de) 2005-08-26 2005-08-26 HF-Abschlusswiderstand mit einer planaren Schichtstruktur
PCT/EP2006/008089 WO2007022906A2 (fr) 2005-08-26 2006-08-16 Resistance terminale hf presentant une structure de couches plane

Publications (2)

Publication Number Publication Date
EP1917667A2 EP1917667A2 (fr) 2008-05-07
EP1917667B1 true EP1917667B1 (fr) 2010-01-06

Family

ID=35336570

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06776894A Active EP1917667B1 (fr) 2005-08-26 2006-08-16 Resistance terminale hf presentant une structure de couches plane

Country Status (10)

Country Link
US (1) US7834714B2 (fr)
EP (1) EP1917667B1 (fr)
JP (1) JP2009506525A (fr)
CN (1) CN101253583B (fr)
AT (1) ATE454703T1 (fr)
CA (1) CA2617505C (fr)
DE (2) DE202005013515U1 (fr)
HK (1) HK1121578A1 (fr)
NO (1) NO338161B1 (fr)
WO (1) WO2007022906A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202006018768U1 (de) 2006-12-12 2007-02-15 Rosenberger Hochfrequenztechnik Gmbh & Co.Kg HF-Abschlusswiderstand in Flanschbauweise
CN103633427B (zh) * 2012-12-28 2015-02-04 中国科学院电子学研究所 基于平面电阻技术的宽带天线
DE102018121918A1 (de) * 2018-09-07 2020-03-12 DESY Deutsches Elektronen-Synchrotron Leistungsverstärker für den Hochfrequenzbereich

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2096858B1 (fr) 1970-07-07 1973-11-16 Thomson Csf
US4310812A (en) * 1980-08-18 1982-01-12 The United States Of America As Represented By The Secretary Of The Army High power attenuator and termination having a plurality of cascaded tee sections
US5151676A (en) * 1989-02-02 1992-09-29 Fujitsu Limited Film resistance terminator
US4965538A (en) * 1989-02-22 1990-10-23 Solitron Devices, Inc. Microwave attenuator
JP3060916B2 (ja) * 1995-10-24 2000-07-10 株式会社村田製作所 高圧用可変抵抗器
US6300859B1 (en) * 1999-08-24 2001-10-09 Tyco Electronics Corporation Circuit protection devices
FR2852738A1 (fr) 2003-03-19 2004-09-24 Radiall Sa Dispositif hyperfrequence destine a la dissipation ou a l'attenuation de puissance.

Also Published As

Publication number Publication date
US7834714B2 (en) 2010-11-16
JP2009506525A (ja) 2009-02-12
EP1917667A2 (fr) 2008-05-07
WO2007022906A3 (fr) 2007-04-19
NO338161B1 (no) 2016-08-01
CA2617505C (fr) 2014-10-07
HK1121578A1 (en) 2009-04-24
WO2007022906A2 (fr) 2007-03-01
NO20081366L (no) 2008-03-14
US20090134959A1 (en) 2009-05-28
CN101253583A (zh) 2008-08-27
CA2617505A1 (fr) 2007-03-01
ATE454703T1 (de) 2010-01-15
DE502006005869D1 (de) 2010-02-25
DE202005013515U1 (de) 2005-11-03
CN101253583B (zh) 2012-03-21

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