EP1844486A1 - Verfahren zur herstellung eines kontaktstückes, sowie kontaktstück für eine vakuumschaltkammer selbst - Google Patents
Verfahren zur herstellung eines kontaktstückes, sowie kontaktstück für eine vakuumschaltkammer selbstInfo
- Publication number
- EP1844486A1 EP1844486A1 EP06701154A EP06701154A EP1844486A1 EP 1844486 A1 EP1844486 A1 EP 1844486A1 EP 06701154 A EP06701154 A EP 06701154A EP 06701154 A EP06701154 A EP 06701154A EP 1844486 A1 EP1844486 A1 EP 1844486A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact piece
- layers
- layer
- erosion
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 10
- 238000005476 soldering Methods 0.000 claims description 17
- 230000003628 erosive effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004663 powder metallurgy Methods 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 238000010309 melting process Methods 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005496 tempering Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
- H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
- H01H33/66—Vacuum switches
- H01H33/664—Contacts; Arc-extinguishing means, e.g. arcing rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/0203—Contacts characterised by the material thereof specially adapted for vacuum switches
- H01H1/0206—Contacts characterised by the material thereof specially adapted for vacuum switches containing as major components Cu and Cr
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
- H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
- H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49105—Switch making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49206—Contact or terminal manufacturing by powder metallurgy
Definitions
- the invention relates to a method for producing a contact piece, in particular for use in a low-voltage medium-voltage and high-voltage vacuum switching chamber according to the preamble of claim 1, and a contact piece for a vacuum interrupter itself, according to the preamble of claim 12.
- Switching chambers in particular vacuum switching chambers used in low-voltage, medium-voltage, high-voltage and generator switching devices, are provided within the chamber housing with contact pieces which make the electrical contact in the closed state of the arrangement and at which a plasma arc is formed when switched off, especially under short circuit conditions (an arc that burns in a vacuum atmosphere).
- contact pieces which make the electrical contact in the closed state of the arrangement and at which a plasma arc is formed when switched off, especially under short circuit conditions (an arc that burns in a vacuum atmosphere).
- radial magnetic field contact systems are often used.
- the radial magnetic field is generated by means of coil sickle segments, the sickle elements being formed by slots introduced into the contact piece plates.
- the radial magnetic field contact pieces used in this case are formed in a cylindrical disk shape with rounded outer edges. This serves to improve the dielectric properties. It is state of the art to use contact systems with contact pieces of multilayer systems. Multilayer contact pieces, in which the cross-section is outwardly double conical are also known. Thus, a per se advantageous arrangement such as, for example, from DE 3840192 A1 is known, constructed of a multilayer system in which the erosion resistant
- Contact layer of a standard contact material, for example, CuCr 25 and the second layer is preferably made of pure copper.
- the pure copper ensures a high electrical and thermal conductivity, while the CuCr layer ensures the erosion resistance in the contact piece area itself.
- the described double conical design results in a disk-like shape, which is particularly easy to produce for contact pieces with a large outer diameter, and is preferably used in high-current or generator switch assemblies.
- the center of gravity of the individual contact piece sickles of the radial magnetic field contact piece can be further displaced in the direction of the center of the axis, as a result of which the force occurring in a mechanical switching operation causes a smaller moment at the transition point to the contact piece.
- the resulting mechanical stresses are reduced by this measure on the one hand advantageous and on the other hand, a longer life is achieved with frequent mechanical switching operations.
- multi-layer contact pieces are manufactured in a process in which these e.g. in an inert crucible (ceramic) after the sintered melting process are brought together.
- the core of the invention is in this case that, in order to achieve greater wall thicknesses or layer thicknesses of the layers to be brought together of the contact pieces, placed between the layers to be joined a solder foil and the entire assembly is heated in a soldering oven to soldering temperature and on the other hand, the desired two-layered ( or multiple layers,> 2) can be achieved by stacking several layers of powder. This can be exemplified by a two-layered
- Contact piece can be achieved by a stacking of copper powder and in the second layer of a mixture of KupferChrompulver. In the latter case, the stacking of powder, this is pressed in a mold to a pressing (the green compact) and then sintered to the finished blank in the oven to the finished MLC blank.
- the resulting two-layer MLC contact piece consists of a erosion-resistant contact layer of CuCr and an underlying particularly thick-walled copper layer as a second layer with a very high conductivity. This results in an extremely low current path resistance and also a good power supply to the contact outer region on the burns in the case of a short-circuit current of the arc to the subsequent zero current of the current when switching off.
- the transition thus produced which is formed by the inserted between the plates solder foil and the subsequent tempering in the soldering oven, not only results in a surface-bonded solder joint as such, but that through the entire heat treatment in the soldering furnace, the solder also over a corresponding microscopic penetration into the boundary surfaces of the
- the Fermi energies and the valence bands in the interface region are similar to each other in terms of solid state and potential, so that metal - metal oxide impurities do not occur there, which occurs significantly more frequently in a sintering / melting process.
- the upper layer with the underlying at least one further layer e.g. a copper layer is soldered in the manner according to the invention or prepared by a powder coating.
- the solid state physical property set forth above holds true that in this type of soldering process of the MLC contact blank, the current path resistance is kept low by a potential discontinuity free transition zone.
- the layers connected to one another are designed in such a way that, in the finished state of the contact piece, they produce a double conical disk-like shape.
- the at least one further layer following the erosion-resistant layer is smaller in diameter or, in the case of a plurality, successively smaller.
- the individual layers are powder metallurgically present as pressed green bodies and are sintered simultaneously in the soldering process.
- the contact piece according to claim 1ff. provides a contact piece for a medium-voltage system, in particular for a vacuum switching chamber in the low, Medium voltage and high voltage range according to the method shown above.
- Figure 1 Overall view of a vacuum chamber.
- FIG. 1 shows an overall representation of a vacuum interrupter chamber and subsequently shown and described in detail in FIG. Figure 1 shows a vacuum interrupter chamber, consisting of the movable supply line 1, the vacuum interrupter chamber cover 2, the vacuum-tight connection between the
- Insulator (ceramic) 6 and the metallic bellows 3 produces.
- the center screen 4 controls the electric field inside and outside the vacuum interrupter chamber and protects the insulator 6 from metal vapor.
- the contact pieces 5 ' and 5 " are arranged, which are advantageously designed as MLC contact piece according to FIG. 2.
- Feed line 8 is arranged on the fixed contact side, the screen 7 takes over the electric field control.
- FIG. 2 shows the novel combination of two layers, namely a burn-off-resistant first contact piece layer 5 ' , which may consist, for example, of CuCr or the above-mentioned burn-up-resistant materials or material alloys, and a further contact piece layer 5 " , made of pure copper, for example
- the layer 10 shows the soldering zone, in the case of the powder stacking on the boundary zone between the two (or more layers), which makes it possible to produce a contact piece with optimized properties
- Both the erosion resistance is particularly sufficient, but on the other hand also a low current path resistance and a high conductivity ge tellrleitstet.
- the contact piece is formed by stacking two layers with the interposition of a solder foil 10, which is then soldered to the assembly in a soldering oven. For example, by soldering a support plate made of steel, the mechanical strength can be further increased and additionally a B-FeId shielding function can be achieved.
Landscapes
- Contacts (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Switches (AREA)
- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200510003812 DE102005003812A1 (de) | 2005-01-27 | 2005-01-27 | Verfahren zur Herstellung eines Kontaktstückes, sowie Kontaktstück für eine Vakuumschaltkammer selbst |
| PCT/EP2006/000578 WO2006079495A1 (de) | 2005-01-27 | 2006-01-24 | Verfahren zur herstellung eines kontaktstückes, sowie kontaktstück für eine vakuumschaltkammer selbst |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP1844486A1 true EP1844486A1 (de) | 2007-10-17 |
| EP1844486B1 EP1844486B1 (de) | 2015-03-04 |
Family
ID=35840566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP06701154.4A Expired - Lifetime EP1844486B1 (de) | 2005-01-27 | 2006-01-24 | Verfahren zur herstellung eines kontaktstückes, sowie kontaktstück für eine vakuumschaltkammer selbst |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8302303B2 (de) |
| EP (1) | EP1844486B1 (de) |
| CN (1) | CN101111914B (de) |
| DE (1) | DE102005003812A1 (de) |
| WO (1) | WO2006079495A1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023209347A1 (de) | 2023-09-25 | 2025-03-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer Kontaktschicht |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005003812A1 (de) * | 2005-01-27 | 2006-10-05 | Abb Technology Ag | Verfahren zur Herstellung eines Kontaktstückes, sowie Kontaktstück für eine Vakuumschaltkammer selbst |
| JP4979604B2 (ja) * | 2008-01-21 | 2012-07-18 | 株式会社日立製作所 | 真空バルブ用電気接点 |
| DE102009033982B4 (de) * | 2009-07-16 | 2011-06-01 | Siemens Aktiengesellschaft | Vakuumschaltröhre |
| CN102136376B (zh) * | 2011-03-18 | 2013-05-08 | 孔琦琪 | 一种新式低压电器功能触头 |
| CN103143847A (zh) * | 2013-02-07 | 2013-06-12 | 宁波保税区升乐电工合金材料有限公司 | 一种焊接银层触点的模腔工装 |
| US10573472B2 (en) | 2013-06-20 | 2020-02-25 | Siemens Aktiengesellschaft | Method and device for producing contact elements for electrical switching contacts |
| CN105206435A (zh) * | 2015-07-31 | 2015-12-30 | 陕西斯瑞工业有限责任公司 | 一种梯度复合铜铬触头材料及其制备方法 |
| DE102015217647B4 (de) * | 2015-09-15 | 2025-01-30 | Siemens Aktiengesellschaft | Schaltkontakt für eine Vakuumschaltröhre sowie Vakuumschaltröhre |
| DE102020212377A1 (de) * | 2020-09-30 | 2022-03-31 | Siemens Aktiengesellschaft | Kompakte Vakuumschaltröhre |
| EP4205154A1 (de) * | 2020-09-30 | 2023-07-05 | Siemens Aktiengesellschaft | Ein kontakt für eine vakuumschaltröhre und ein herstellungsverfahren für einen solchen |
| CN113593992B (zh) * | 2021-07-09 | 2023-09-15 | 陕西斯瑞新材料股份有限公司 | 一种超低铬含量CuW-CuCr整体电触头及其制备方法 |
| EP4254451A1 (de) * | 2022-03-30 | 2023-10-04 | Abb Schweiz Ag | Vakuumschaltröhre |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1111631B (de) | 1958-04-22 | 1961-07-27 | Henkel & Cie Gmbh | Verfahren zur Steigerung der Loeslichkeit von organischen N-Chlor-verbindungen |
| DE1220212B (de) | 1959-04-18 | 1966-06-30 | Bendix Corp | Reibkoerper mit gesintertem, metallkeramischem Reibmaterial und Verfahren zur Herstellung des Reibkoerpers |
| CH519775A (de) * | 1970-03-26 | 1972-02-29 | Siemens Ag | Verfahren zum Herstellen eines heterogenen Durchdringungs-Verbundmetalls als Kontaktwerkstoff für Vakuumschalter |
| DE2032939B2 (de) * | 1970-07-03 | 1975-05-07 | Robert Bosch Gmbh, 7000 Stuttgart | Verfahren zum Auflöten eines Halbleiterkörpers auf einen Träger |
| CH529435A (de) * | 1972-03-17 | 1972-10-15 | Sprecher & Schuh Ag | Verfahren zur Herstellung eines Vakuumschalterkontaktes |
| DE3242446C2 (de) | 1982-11-16 | 1985-02-07 | Trilochan Singh 8910 Landsberg Sidhu | Biologisches Mittel zur Regenerierung von Haut und Haaren |
| JPS6054124A (ja) * | 1983-09-02 | 1985-03-28 | 株式会社日立製作所 | 真空しや断器 |
| US4717797A (en) * | 1984-12-18 | 1988-01-05 | Siemens Aktiengesellschaft | Contact arrangement for a vacuum switching tube |
| DE3840192A1 (de) * | 1987-12-02 | 1989-06-15 | Calor Emag Elektrizitaets Ag | Schaltkontaktanordnung |
| DE3931774A1 (de) * | 1989-09-23 | 1991-04-04 | Calor Emag Elektrizitaets Ag | Verfahren zur herstellung einer vakuumschaltkammer |
| DE4002933A1 (de) * | 1990-02-01 | 1991-08-08 | Sachsenwerk Ag | Vakuumschaltkammer |
| JP3159827B2 (ja) * | 1993-03-11 | 2001-04-23 | 株式会社日立製作所 | 真空遮断器、真空遮断器用電極およびその製作方法 |
| AT400692B (de) * | 1994-04-13 | 1996-02-26 | Plansee Ag | Hartlot |
| US6072141A (en) * | 1994-09-22 | 2000-06-06 | Slamecka; Ernst | Vacuum switch contact arrangement |
| US5691522A (en) * | 1995-06-07 | 1997-11-25 | Eaton Corporation | Vacuum interrupter with a single internal assembly for generating an axial magnetic field |
| EP0790629B1 (de) * | 1995-09-04 | 2005-12-21 | Kabushiki Kaisha Toshiba | Vakuumschalter |
| US5929411A (en) * | 1997-10-22 | 1999-07-27 | Eaton Corporation | Vapor shield for vacuum interrupters |
| DE19753031C1 (de) * | 1997-11-18 | 1999-04-22 | Siemens Ag | Kreisringförmige Lotfolie und Verfahren zur Herstellung von Vakuumschaltröhren mit schneidgelöteten Metall-Keramik-Verbindungen |
| DE19902500B4 (de) * | 1999-01-22 | 2004-07-22 | Moeller Gmbh | Verfahren zum Herstellen einer Kontaktanordnung für eine Vakuumschaltröhre |
| DE19903619C1 (de) * | 1999-01-29 | 2000-06-08 | Louis Renner Gmbh | Pulvermetallurgisch hergestellter Verbundwerkstoff und Verfahren zu dessen Herstellung sowie dessen Verwendung |
| GB2338111B (en) * | 1999-02-02 | 2001-03-21 | Alstom Uk Ltd | Improvements relating to vacuum switching devices |
| DE19907276C2 (de) * | 1999-02-20 | 2001-12-06 | Bosch Gmbh Robert | Verfahren zur Herstellung einer Lötverbindung zwischen einem elektrischen Bauelement und einem Trägersubstrat |
| DE19960876A1 (de) * | 1999-12-17 | 2001-06-21 | Abb Patent Gmbh | Verfahren zur Herstellung eines Kontaktstückrohlings und eines Kontaktstückes sowie ein Kontaktstückrohling, ein Kontaktstück und eine Kontaktstückanordnung für Axialmagnetfeldanwendungen in einer Vakuumkammer |
| DE10065091A1 (de) * | 2000-12-21 | 2002-06-27 | Siemens Ag | Kontaktanordnung für eine Vakuumschaltröhre |
| CN1145997C (zh) * | 2001-02-28 | 2004-04-14 | 京东方科技集团股份有限公司 | 集成化电力开关触头 |
| CN100442413C (zh) * | 2001-09-12 | 2008-12-10 | 株式会社明电舍 | 用于真空断路器的触点以及包括该触点的真空断路器 |
| JP3840934B2 (ja) * | 2001-09-12 | 2006-11-01 | 株式会社明電舎 | 真空インタラプタ用接触子及び真空インタラプタ |
| US6747233B1 (en) * | 2001-12-28 | 2004-06-08 | Abb Technology Ag | Non-linear magnetic field distribution in vacuum interrupter contacts |
| US6965089B2 (en) * | 2003-02-21 | 2005-11-15 | Mcgraw-Edison Company | Axial magnetic field vacuum fault interrupter |
| US6867385B2 (en) * | 2003-02-21 | 2005-03-15 | Mcgraw-Edison Company | Self-fixturing system for a vacuum interrupter |
| DE10343655B4 (de) * | 2003-09-20 | 2005-09-29 | Elringklinger Ag | Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit |
| DE10343652B4 (de) * | 2003-09-20 | 2005-09-29 | Elringklinger Ag | Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit |
| DE102005003812A1 (de) * | 2005-01-27 | 2006-10-05 | Abb Technology Ag | Verfahren zur Herstellung eines Kontaktstückes, sowie Kontaktstück für eine Vakuumschaltkammer selbst |
| US7781694B2 (en) * | 2007-06-05 | 2010-08-24 | Cooper Technologies Company | Vacuum fault interrupter |
| ATE497246T1 (de) * | 2008-09-01 | 2011-02-15 | Abb Technology Ag | Niederspannungs-, mittelspannungs- oder hochspannungsanordnung |
-
2005
- 2005-01-27 DE DE200510003812 patent/DE102005003812A1/de not_active Withdrawn
-
2006
- 2006-01-24 CN CN200680003429.XA patent/CN101111914B/zh not_active Expired - Fee Related
- 2006-01-24 US US11/883,055 patent/US8302303B2/en not_active Expired - Fee Related
- 2006-01-24 WO PCT/EP2006/000578 patent/WO2006079495A1/de not_active Ceased
- 2006-01-24 EP EP06701154.4A patent/EP1844486B1/de not_active Expired - Lifetime
-
2012
- 2012-08-20 US US13/589,474 patent/US8869393B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
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| See references of WO2006079495A1 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023209347A1 (de) | 2023-09-25 | 2025-03-27 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer Kontaktschicht |
| WO2025067736A1 (de) | 2023-09-25 | 2025-04-03 | Siemens Aktiengesellschaft | Verfahren zur herstellung einer kontaktschicht |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102005003812A1 (de) | 2006-10-05 |
| CN101111914A (zh) | 2008-01-23 |
| US20080163476A1 (en) | 2008-07-10 |
| US8302303B2 (en) | 2012-11-06 |
| WO2006079495A1 (de) | 2006-08-03 |
| US8869393B2 (en) | 2014-10-28 |
| EP1844486B1 (de) | 2015-03-04 |
| CN101111914B (zh) | 2014-02-19 |
| US20120312785A1 (en) | 2012-12-13 |
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