EP1754249A1 - Procede et dispositif pour enlever un composant colle sur un film souple - Google Patents

Procede et dispositif pour enlever un composant colle sur un film souple

Info

Publication number
EP1754249A1
EP1754249A1 EP04804931A EP04804931A EP1754249A1 EP 1754249 A1 EP1754249 A1 EP 1754249A1 EP 04804931 A EP04804931 A EP 04804931A EP 04804931 A EP04804931 A EP 04804931A EP 1754249 A1 EP1754249 A1 EP 1754249A1
Authority
EP
European Patent Office
Prior art keywords
film
support
component
plane
support plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04804931A
Other languages
German (de)
English (en)
Inventor
Joachim Trinks
Andreas Marte
Wolfgang Herbst
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulicke and Soffa Die Bonding GmbH
Original Assignee
Alphasem AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alphasem AG filed Critical Alphasem AG
Priority to EP10186245A priority Critical patent/EP2306496A3/fr
Publication of EP1754249A1 publication Critical patent/EP1754249A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/976—Temporary protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Definitions

  • the invention relates to a method for detaching a component glued to a flexible film according to the preamble of claim 1. Such methods are used in particular in the processing of semiconductor chips to remove a large number of chips from the wafer film in rapid succession and to place them on a base.
  • the semiconductor chips with the electronic circuits arranged thereon are previously separated from the silicon wafer referred to as a wafer by sawing.
  • the wafer is glued to the wafer film stretched in a frame, the adhesion obviously having to be sufficiently high to prevent breakouts or chip detachments during the sawing process.
  • the adhesion should be as small as possible in order to avoid excessive mechanical forces acting on the chip.
  • US 2003/0075271 describes a method and device for detaching semiconductor elements, in which a detaching tool has a plurality of circumferential, concentrically arranged contact elements which can be telescopically extended, the semiconductor element being raised and the film gradually detaching.
  • the detaching tool has a pyramid-like structured suction surface. This suction surface is surrounded by a flat contact surface.
  • JP 63-228638 describes a removal tool in which a plunger with a smaller area than the electronic component is pressed against the film from below.
  • the holding device for gripping the component is designed like a fork and grasps the component in the edge area that has already been detached from the film.
  • JP 3-76139 describes a detachment tool for a semiconductor element in which a detachment stamp is combined with a needle, the detachment stamp being raised first and then the needle being pushed through the film.
  • the surface section which can be shifted plane-parallel, results in very precise control of the film deformation under the influence of the negative pressure in order to reduce the adhesive surface.
  • the stroke of the plane-parallel feed or retraction movement can be set exactly. This enables the detachment process to be adapted to certain workpiece parameters, such as certain film qualities or component heights.
  • the speed of the detachment process can also be controlled.
  • the component is held in a clamping manner between the holding surface of the holding tool and the surface section or between the holding surface and the support element until it is finally lifted off in any sequence of detachment.
  • Support of this type on both sides and preferably across the board at any time is particularly important in the case of very thin chips.
  • the surface section is withdrawn from the support plane into a detachment position while the holding tool holds the component.
  • the surface section covers a defined stroke at an adjustable speed and moves away from the underside of the film. Under the action of vacuum, the film follows the control surface section and detaches from the underside of the component, which is only supported by the support element. The component can then be detached from the connection still held by the supporting element, for which only a small amount of force is required.
  • the surface section can first be pushed out of the support plane simultaneously with the holding tool beyond the support plane and then put back into the support plane. During this displacement movement, the component is supported over a large area and held securely and stably between the holding tool and the surface section. When the surface section is pushed forward, the release process of the film is started gently along the edge, depending on the configuration of the surface section. For this purpose, it is advantageous if the surface section or the sum of the surface sections has a somewhat smaller area than the component. When resetting, the surface section continues its movement until it has again reached the separation position mentioned at the beginning.
  • a plurality of surface sections spaced apart from one another can be moved simultaneously in such a way that a support element is arranged at least between two surface sections.
  • the movable surface sections are penetrated by the support element, so that as possible in each sequence well-distributed support of the component on the underside of the film is guaranteed.
  • the film is preferably supported on the support element in a punctiform and / or linear manner, depending on the size and configuration of the component.
  • the component is supported on at least 50% of its surface at least at the beginning of the detachment process by the surface section or by the surface sections.
  • Such a large-area support is particularly important when the component is first lifted out of the support plane, an edge detachment being intended.
  • the surface section is heated. In this way, heat can be transferred to the chip or to the wafer film.
  • the temperature control is process-dependent.
  • the invention also relates to a device according to the preamble of claim 10.
  • this device is intended to be able to carry out the aforementioned method in a simple manner.
  • the device should also, if possible, be installed in existing processing machines, in particular in existing die bonders. This object is achieved according to the invention with a device which has the features in claim 8.
  • the movably mounted control element with the plane section that can be moved plane-parallel can be particularly easily with couple to the same drive system as can already be found for conventional stripping needles.
  • the control element can be both retractable and advanced relative to the support plane. In the case of very small chips, it may be sufficient if the control surface has at least one flat surface section, next to which at least one support element is arranged in a suitable manner. However, it is advantageous to have a plurality of support elements which surround the surface section at a suitable distance from one another or from the surface section. The fact that the control surface has a plurality of flat surface sections spaced apart from one another ensures a large-area support on the underside of the film. If a support element is arranged at least between two surface sections, extensive support of the component is ensured even when the surface sections are retracted below the support plane.
  • control element can have several surface sections that are firmly connected to one another. It is particularly advantageous if the .. control element is made monolithic, so that all surface sections can be machined together and thus also lie exactly in the same plane.
  • control element can also have a plurality of surface sections which can be moved independently of one another and which can be moved laterally offset with respect to one another via a corresponding gear.
  • the support element can have support pyramids or support cones for the point-like support of the film or support strips for the linear support of the film.
  • the support element can have a plurality of support pyramids or support cones, which are also arranged in a matrix-like manner around the surface sections.
  • cross bars forming a cross could also be arranged between the four surface sections.
  • the control surface or the individual surface sections can be heated by means of a heating device in order to heat the wafer film or the individual chip.
  • the heating device can be an electrical resistance heater or another heating element.
  • the heating device can also have suitable control means for temperature control.
  • FIG. 1 shows a first example of a detachment process according to the invention in three sequences
  • FIG. 2 shows a second example of a detaching process according to the invention in four sequences
  • FIG. 3 shows a top view of the end face of a first release tool according to the invention
  • FIG. 4 shows a cross section through the plane A-A according to FIG. 3,
  • FIG. 5 shows a perspective illustration of the detaching tool according to FIGS. 3 and 4
  • FIG. 6 shows a top view of the end face of a second removal tool according to the invention
  • FIG. 7 shows a cross section through the plane B-B according to FIG. 6,
  • FIG. 8 shows a perspective illustration of the detaching tool according to FIGS. 6 and 7,
  • FIG. 9 shows a cross section through a further example of a detaching tool with a plurality of independently movable surface sections
  • FIG. 10 shows a detaching process with a detaching tool according to FIG. 9 in the sequences a to k.
  • a first embodiment of a detaching process is shown in three sequences in FIGS.
  • a plurality of chips 1 are glued onto a stretched wafer film 2, or the coherent wafer originally glued on was divided into individual chips by sawing. After sawing, the film is stretched in a known manner in order to facilitate the separation of the chips.
  • the detachment tool designated as a whole by 5, is only shown schematically here. It is arranged in a fixed position relative to the wafer film 2 in a work machine. The chip 1 is placed over the detachment tool 5 via an X-Y coordinate drive.
  • a holding tool 4 with a flat holding surface with a suction function can be placed on the surface 3 of the chip facing away from the film.
  • a vacuum is applied to this surface via a vacuum channel 20, so that the chip adheres to the holding tool 4.
  • the holding tool 4 can be lifted off while maintaining the negative pressure in the direction of the arrow a (FIG. 1c) and transports the chip to a substrate or to an intermediate station.
  • the detaching tool 5 has at least one support element 6, which lies in a support plane 11.
  • the wafer film 2 lies flat on this support plane at the beginning of the detachment process.
  • a plurality of surface sections 8a, 8b arranged at the end of a control element 10 also preferably run in the support plane 11 in the immediate vicinity of the support element 6.
  • the surface sections or control element 10 can be retracted in the direction of arrow b (FIG. 1b).
  • a vacuum is present in the area of the detachment tool 5 on the underside of the wafer film 2 (arrows v). This can attack via special vacuum channels 9 or simply through the play between the fixed and moving parts on the film.
  • depressions 7 can be formed, for example, by corresponding bevels, at which the detachment process can be initiated under the action of the negative pressure.
  • FIG. la Such a starting phase is shown in Figure la.
  • the depressions 7 run not only in the edge region of the surface sections 8a, 8b, but also in the edge region of the chip 1. Under the action of the vacuum, they cause a locally very limited deformation of the wafer film 2 and thus its detachment from the chip 1.
  • the surface sections 8a, 8b are withdrawn relative to the support plane 11 in the direction of the arrow b.
  • the wafer film 2 follows this movement continuously and remains only in the area of the support by the support element 6 in the support plane 11.
  • the detachment speed can be controlled precisely by means of the movement of the surface sections.
  • the holding tool 4 holds the chip 1 immovably in the starting position.
  • FIGS. 2a to 2d A somewhat modified detachment process is shown in FIGS. 2a to 2d.
  • Figure 2a partially corresponds to the initial situation according to Figure la. However, the film 2 is stretched flat over the depressions 7, so that the detachment process does not start at this point.
  • FIGS. 2c and 2d correspond to the situations according to FIGS. 1b and 1c in the final phase of the detachment process.
  • a further step according to FIG. 2b is interposed.
  • the surface sections 8a, 8b are simultaneously advanced with the holding tool 4 by a small distance in the direction of arrow a, so that the chip 1 to be detached initially projects above the support plane 11. This minimal offset gently starts the detaching process in the edge area of the chip 1.
  • the holding tool 4 is then again lowered synchronously with the surface sections 8a, 8b until the film 2 rests on the support 6 again.
  • the surface sections 8a, 8b continue their movement according to FIG. 2c in the direction of arrow b, whereupon the remaining detachment process takes place as in FIG. 1.
  • the chip 1 is first touched with the holding tool 4 before the surface sections 8a and 8b move up and down.
  • the chip is gripped between the holding surface of the holding tool and the surface sections 8a, 8b or the support element 6 before any tensile or bending forces act on the film 2 at all.
  • this clamping holder is retained.
  • FIGS. 3 to 5 show a detaching tool 5 as can be used for the previously described methods.
  • the tool consists of a pot-like housing 23 with a hollow cylindrical fastening collar 12 and with a support surface 13 on which the film comes to rest in the area surrounding the chip to be removed.
  • the entire inside of the fastening sleeve can be connected to a vacuum source.
  • a negative pressure of 200 mbar absolute can be achieved compared to atmospheric pressure.
  • a total of four suction bores 14 are arranged on the circular support surface 13 in a uniform angular division, via which the wafer film is fixed.
  • An approximately square depression 21 is arranged on the support surface 13. Within this lowering four approximately triangular tappet openings 17 are provided in a cloverleaf arrangement. A support bar cross 16 runs between these tappet openings and a support pyramid 15 is arranged at the crossing point. The support pyramid and support strip cross together form the support element 6, which runs in the support plane 11.
  • An approximately cylindrical control element 10 is held axially movably in the center and coaxially to the fastening collar 12.
  • four individual plungers 18 are arranged, the configuration of which in the support plane 11 corresponds to the configuration of the plunger openings 17.
  • the plungers 18 each have a surface section 8 at their ends and they penetrate the plunger openings 17 with play, so that the negative pressure can also act on the wafer film lying above the recess 21 along their side walls.
  • a suction bore 19 can also be arranged in the center of the control element 10.
  • plan area of the chip to be removed is slightly larger than that of the one-piece plunger arrangement.
  • Support is provided via the diagonals of the chip and in the center.
  • the fastening collar 12 is essentially similar to that in the previous exemplary embodiment.
  • the suction bores 14 in the support surface 13 are also arranged identically.
  • the configuration of the support surface itself and of the control element 10 is different.
  • a square depression 21 is provided.
  • the support element 6 is formed exclusively by support pyramids 15, which are arranged in a matrix-like manner in the corner area, in the middle of each side edge and in the center.
  • a total of four approximately square tappet openings 17 are arranged in the bottom of the depression 21. Additional bores 22 can be provided in the edge region for better distribution of the negative pressure.
  • control surface or the individual surface sections can be heated by means of a heating device 40, which is indicated here as an electrical heating cartridge.
  • the control element 10 also has four plungers 18, the configuration of which corresponds approximately to that of the plunger openings.
  • the wafer film is supported in the area of the glued-on chip exclusively in a punctiform manner. Otherwise, the function of the detachment tool is the same as in the exemplary embodiment described above.
  • FIG. 9 finally shows a modified embodiment of a detaching tool 25.
  • This has a housing 26, in which several individual plungers 28 may be axially displaceably mounted in a matrix-like manner.
  • the individual plungers are stored both in a control slide 30 and in a feed element 34.
  • the feed element is designed like a pot, similar to the housing 26, and has an end face 35, which is slightly recessed under a housing opening 27. Openings through which the individual plungers 28 penetrate are arranged in the end face 35.
  • the feed element 34 is biased under the action of a helical compression spring 36 against a support 37 on the housing 26.
  • the control slide 30 can be lowered further in the direction of arrow b.
  • the control slide 30 has a gradation 33 with different levels, wherein two or more individual tappets can be arranged on the same gradation level.
  • the individual plungers each have a stop 38 at the upper end, which limits the plunger movement upwards.
  • the individual plungers are each provided with a driver element 32, with all driver elements lying on the same plane in the neutral starting position shown.
  • the individual plungers are prestressed with a helical compression spring 31 between the stops 38 and the step 33.
  • the vacuum required for the detachment process can act on the wafer film 2 via vacuum channels 29. Additional channels, for example in the individual plungers 28, would, however, be conceivable.
  • control surface sections 8 of the individual tappets are all in the support plane 11.
  • the special feature of this exemplary embodiment is that the surface sections 8 simultaneously take on the function of a support. This means that there is no support which is rigid relative to the surface sections 8 in the support plane 11.
  • This guided retraction movement causes a continuous detachment of the film from the outside inwards in a guided and supported movement.
  • the detachment is completely symmetrical, so that the chip cannot be moved.
  • 10 shows in the individual representations a) to k) a detachment sequence using the detachment tool 25 according to FIG. 9, a) shows the neutral starting position after the wafer film has been placed over the detachment tool and before the holding tool 4 detects the chip 1.
  • the holding tool detects the chip and the underside of the wafer film 2 is placed under vacuum.
  • control slide 30 is then advanced according to c), the surface sections 8 being raised simultaneously with the holding tool 4. At the same time, the wafer film 2 is sucked somewhat under the support plane 11. The detachment process already begins along the outer edges of the chip 1.
  • control slide 30 is reset again, so that the chip 1 returns to the starting position. All individual tappets now initially have the function of a support for the wafer film. However, this remains in a detached position along the edges.
  • the control slide is pulled back further, the two outermost tappets being taken along and lowering.
  • the wafer film follows in a guided movement and detaches from the underside of the chip.
  • further retraction sequences of the tappets follow from the outside inwards, until finally only the two innermost tappets serve as supports.
  • the innermost plungers are also lowered below the support plane 11, so that the detachment process is ended without the holding tool 4 having to be moved.
  • the holding tool 4 Only now, according to k), is the holding tool 4 raised and the pressure equalized, so that the elastic wafer film 2 relaxes again.
  • the individual plungers can now be pushed back into the starting position according to a) and the wafer film can be positioned above the detaching tool in order to detach a new chip.
  • Modifications of the detaching tool according to FIG. 9 would of course be conceivable.
  • the plunger arrangement and the sequences of the retreat could each be adapted to the special circumstances.

Abstract

Selon l'invention, un film (2) pourvu d'un composant (1) amovible est placé, au niveau dudit composant, sur un outil de séparation (5) qui est pourvu d'au moins un élément de support (6) qui est destiné audit film et s'étend dans un plan de support (11). Le film est maintenu par aspiration contre l'élément de support (6) et partiellement en-dessous du plan de support, cela au moyen d'une dépression. Dans la zone de l'élément de support se trouve au moins une partie de surface (8) qui s'étend dans le plan de support lorsque le processus d'enlèvement commence et qui peut être déplacée lorsque le composant (1) est pris par un outil à aspiration (4), cela dans un plan parallèle au plan de support et avec maintien de la dépression. L'invention permet de commander le processus d'enlèvement du film selon un déplacement guidé, sans endommagement ou déplacement du composant.
EP04804931A 2004-05-19 2004-12-17 Procede et dispositif pour enlever un composant colle sur un film souple Withdrawn EP1754249A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP10186245A EP2306496A3 (fr) 2004-05-19 2004-12-17 Procédé et dispositif pour enlever un composant collé sur un film souple

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH00869/04A CH697213A5 (de) 2004-05-19 2004-05-19 Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils.
PCT/EP2004/053593 WO2005117072A1 (fr) 2004-05-19 2004-12-17 Procede et dispositif pour enlever un composant colle sur un film souple

Publications (1)

Publication Number Publication Date
EP1754249A1 true EP1754249A1 (fr) 2007-02-21

Family

ID=34959940

Family Applications (2)

Application Number Title Priority Date Filing Date
EP04804931A Withdrawn EP1754249A1 (fr) 2004-05-19 2004-12-17 Procede et dispositif pour enlever un composant colle sur un film souple
EP10186245A Withdrawn EP2306496A3 (fr) 2004-05-19 2004-12-17 Procédé et dispositif pour enlever un composant collé sur un film souple

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP10186245A Withdrawn EP2306496A3 (fr) 2004-05-19 2004-12-17 Procédé et dispositif pour enlever un composant collé sur un film souple

Country Status (7)

Country Link
US (1) US7981246B2 (fr)
EP (2) EP1754249A1 (fr)
KR (1) KR101097500B1 (fr)
CN (1) CN101019205B (fr)
CH (1) CH697213A5 (fr)
HK (1) HK1111263A1 (fr)
WO (1) WO2005117072A1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8221583B2 (en) * 2007-01-20 2012-07-17 Stats Chippac Ltd. System for peeling semiconductor chips from tape
CH699851A1 (de) * 2008-11-05 2010-05-14 Esec Ag Chip-Auswerfer und Verfahren zum Ablösen und Entnehmen eines Halbleiterchips von einer Folie.
MY150953A (en) 2008-11-05 2014-03-31 Esec Ag Die-ejector
US8715457B2 (en) * 2008-11-12 2014-05-06 Esec Ag Method for detaching and removing a semiconductor chip from a foil
KR101026040B1 (ko) 2008-11-13 2011-03-30 삼성전기주식회사 박막소자 제조방법
KR101046064B1 (ko) 2008-12-11 2011-07-01 삼성전기주식회사 박막소자 제조방법
IT1393913B1 (it) * 2009-05-05 2012-05-17 Rent Srl Gruppo e procedimento di alimentazione di bobine di materiale in foglio, in particolare ma non esclusivamente film plastico stampato con riferimenti di posizione per confezionatrici automatiche
ATE552610T1 (de) 2009-08-11 2012-04-15 Kulicke & Soffa Die Bonding Gmbh Verfahren und vorrichtung zur prüfung eines chips vor dem bonden
JP5107408B2 (ja) * 2010-08-31 2012-12-26 東京エレクトロン株式会社 ピックアップ方法及びピックアップ装置
DE102011087388A1 (de) * 2011-02-17 2012-08-23 Semikron Elektronik Gmbh & Co. Kg Ip-Department Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie
CH706280B1 (de) * 2012-03-30 2016-03-15 Esec Ag Verfahren zum Ablösen eines Halbleiterchips von einer Folie.
JP6021904B2 (ja) * 2012-05-17 2016-11-09 富士機械製造株式会社 ダイ剥離装置
KR20140107982A (ko) * 2013-02-28 2014-09-05 삼성전자주식회사 다이 이젝터 및 다이 분리 방법
US9111984B2 (en) * 2013-10-28 2015-08-18 Freescale Semiconductor Inc. Devices and methods of operation for separating semiconductor die from adhesive tape
CN103659813A (zh) * 2013-12-25 2014-03-26 大连佳峰电子有限公司 一种用于半导体晶片吸取的机构运动控制方法
JP2017005222A (ja) * 2015-06-16 2017-01-05 パイオニア株式会社 ピックアップ装置
EP3234992B1 (fr) * 2016-01-29 2018-09-26 JENOPTIK Optical Systems GmbH Méthode et appareil pour détacher une micro-puce d'une plaquette et placement de la micro-puce sur un substrat
TWI567011B (zh) * 2016-06-15 2017-01-21 All Ring Tech Co Ltd Method and device for conveying the components of the bonding process
CN107160822B (zh) * 2017-04-26 2018-11-27 湖州蓝澳无纬布有限公司 一种节能型无纬布生产前期加工处理设备
JP6519761B2 (ja) * 2017-08-25 2019-05-29 上野精機株式会社 電子部品受渡し装置
CN114188264B (zh) * 2022-02-15 2022-05-03 合肥矽迈微电子科技有限公司 一种芯片剥离机构、剥离机及剥离方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4778326A (en) 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4556362A (en) * 1983-12-21 1985-12-03 At&T Technologies, Inc. Methods of and apparatus for handling semiconductor devices
JPS63228638A (ja) * 1987-03-17 1988-09-22 Sony Corp チツプ取出し装置
JPH0376139A (ja) * 1989-08-18 1991-04-02 Nec Corp 半導体素子突上げ方法
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
US6352073B1 (en) * 1998-11-12 2002-03-05 Kabushiki Kaisha Toshiba Semiconductor manufacturing equipment
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP3209736B2 (ja) 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP2001196443A (ja) * 2000-01-14 2001-07-19 Sharp Corp 半導体チップのピックアップ装置およびピックアップ方法
JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
US7306695B2 (en) * 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
US7757742B2 (en) * 2007-07-31 2010-07-20 Asm Assembly Automation Ltd Vibration-induced die detachment system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2005117072A1 *

Also Published As

Publication number Publication date
EP2306496A2 (fr) 2011-04-06
KR20070085112A (ko) 2007-08-27
WO2005117072A1 (fr) 2005-12-08
KR101097500B1 (ko) 2011-12-22
EP2306496A3 (fr) 2012-10-10
US7981246B2 (en) 2011-07-19
HK1111263A1 (en) 2008-08-01
US20070277929A1 (en) 2007-12-06
CN101019205A (zh) 2007-08-15
CH697213A5 (de) 2008-06-25
CN101019205B (zh) 2010-06-16

Similar Documents

Publication Publication Date Title
EP1754249A1 (fr) Procede et dispositif pour enlever un composant colle sur un film souple
DE2944810C2 (de) Montagekopf zum Montieren von elektronischen Bauteilen
DE69836398T2 (de) Verfahren und Vorrichtung zum Zerteilen eines Wafers und zum Trennen von Bauelementen
DE19520053B4 (de) Bestückungsvorrichtung für Halbleiterelemente
DE102013103100B4 (de) Verfahren zum Ablösen eines Halbleiterchips von einer Folie
CH673000A5 (fr)
DE102016108788A1 (de) Verfahren zur Handhabung ausgerichteter Waferpaare
DE3330874A1 (de) Werkstuecktraeger und verfahren zum aufspannen eines werkstueckes
EP2184765A1 (fr) Ejecteur de puce
DE112011101129B4 (de) Ultraschall-Bondsysteme und Verfahren zu ihrer Verwendung
DE10227823B4 (de) Verfahren und Vorrichtung zum Herstellen eines LCD
EP3509786A1 (fr) Table de machine réglable
EP1587138B1 (fr) Dispositif pour la montage de de puces semiconductrices et procédé de séparer de puces semiconductries d'une feuille
DE1765591B1 (de) Verfahren und vorrichtung zum instellungbringen und verbinden eines bauelementes
EP2490253B1 (fr) Dispositif et procédé destinés à extraire au moins un composant semi-conducteur sous forme de puce à partir d'une feuille
DE60207466T2 (de) Mehrachsige Stanzvorrichtung
EP3443587B1 (fr) Appareil, système et méthode pour aligner des composants électroniques
EP2359398B1 (fr) Procédé pour détacher et prélever une puce de semi-conducteur sur un film
EP3362201B1 (fr) Procédé de fonctionnement d'une presseur plieuse et presse plieuse
DE102005041505B3 (de) Verfahren und Vorrichtung zum Abformen von Strukturen
DE102009035099B4 (de) Vorrichtung und Verfahren zum Abheben von Bauteilen von einem Träger
DE102005041464A1 (de) Thermodeneinrichtung mit Heizplatte
EP2996864B1 (fr) Procédé et dispositif pour appliquer des bandes décoratives sur une garniture de siège
DE10009386A1 (de) Magazin, Montagevorrichtung für Mikrobauteile und Verfahren zum Montieren von Mikrobauteilen
DE102022118873B4 (de) Verfahren und Vorrichtung zum Entnehmen von Chips von einem Waferfilmframe, Bestücksystem und Computerprogramm

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20061205

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20080108

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ALPHASEM GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: KULICKE & SOFFA DIE BONDING GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ALPHASEM HOLDING GMBH

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: KULICKE & SOFFA DIE BONDING GMBH

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20120103