CN101019205A - 用于将粘接在柔软薄膜上的部件分开的方法和装置 - Google Patents
用于将粘接在柔软薄膜上的部件分开的方法和装置 Download PDFInfo
- Publication number
- CN101019205A CN101019205A CNA2004800430659A CN200480043065A CN101019205A CN 101019205 A CN101019205 A CN 101019205A CN A2004800430659 A CNA2004800430659 A CN A2004800430659A CN 200480043065 A CN200480043065 A CN 200480043065A CN 101019205 A CN101019205 A CN 101019205A
- Authority
- CN
- China
- Prior art keywords
- film
- plane
- surface portion
- support
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1126—Using direct fluid current against work during delaminating
- Y10T156/1132—Using vacuum directly against work during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1928—Differential fluid pressure delaminating means
- Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH869/04 | 2004-05-19 | ||
CH00869/04A CH697213A5 (de) | 2004-05-19 | 2004-05-19 | Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils. |
PCT/EP2004/053593 WO2005117072A1 (de) | 2004-05-19 | 2004-12-17 | Verfahren und vorrichung zum ablösen eines auf eine flexible folie geklebten bauteils |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101019205A true CN101019205A (zh) | 2007-08-15 |
CN101019205B CN101019205B (zh) | 2010-06-16 |
Family
ID=34959940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2004800430659A Active CN101019205B (zh) | 2004-05-19 | 2004-12-17 | 用于将粘接在柔软薄膜上的部件分开的方法和装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7981246B2 (zh) |
EP (2) | EP2306496A3 (zh) |
KR (1) | KR101097500B1 (zh) |
CN (1) | CN101019205B (zh) |
CH (1) | CH697213A5 (zh) |
HK (1) | HK1111263A1 (zh) |
WO (1) | WO2005117072A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103659813A (zh) * | 2013-12-25 | 2014-03-26 | 大连佳峰电子有限公司 | 一种用于半导体晶片吸取的机构运动控制方法 |
CN107160822A (zh) * | 2017-04-26 | 2017-09-15 | 湖州蓝澳无纬布有限公司 | 一种节能型无纬布生产前期加工处理设备 |
CN107517582A (zh) * | 2016-06-15 | 2017-12-26 | 万润科技股份有限公司 | 贴合制程的元件搬送、提取、贴合方法及装置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8221583B2 (en) * | 2007-01-20 | 2012-07-17 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
MY150953A (en) | 2008-11-05 | 2014-03-31 | Esec Ag | Die-ejector |
CH699851A1 (de) * | 2008-11-05 | 2010-05-14 | Esec Ag | Chip-Auswerfer und Verfahren zum Ablösen und Entnehmen eines Halbleiterchips von einer Folie. |
EP2359398B1 (de) | 2008-11-12 | 2017-05-10 | Besi Switzerland AG | Verfahren zum ablösen und entnehmen eines halbleiterchips von einer folie |
KR101026040B1 (ko) | 2008-11-13 | 2011-03-30 | 삼성전기주식회사 | 박막소자 제조방법 |
KR101046064B1 (ko) | 2008-12-11 | 2011-07-01 | 삼성전기주식회사 | 박막소자 제조방법 |
IT1393913B1 (it) * | 2009-05-05 | 2012-05-17 | Rent Srl | Gruppo e procedimento di alimentazione di bobine di materiale in foglio, in particolare ma non esclusivamente film plastico stampato con riferimenti di posizione per confezionatrici automatiche |
ATE552610T1 (de) | 2009-08-11 | 2012-04-15 | Kulicke & Soffa Die Bonding Gmbh | Verfahren und vorrichtung zur prüfung eines chips vor dem bonden |
JP5107408B2 (ja) * | 2010-08-31 | 2012-12-26 | 東京エレクトロン株式会社 | ピックアップ方法及びピックアップ装置 |
DE102011087388A1 (de) * | 2011-02-17 | 2012-08-23 | Semikron Elektronik Gmbh & Co. Kg Ip-Department | Vorrichtung und Verfahren zur Abnahme mindestens eines chipförmigen Halbleiterbauelements von einer Folie |
CH706280B1 (de) * | 2012-03-30 | 2016-03-15 | Esec Ag | Verfahren zum Ablösen eines Halbleiterchips von einer Folie. |
JP6021904B2 (ja) * | 2012-05-17 | 2016-11-09 | 富士機械製造株式会社 | ダイ剥離装置 |
KR20140107982A (ko) * | 2013-02-28 | 2014-09-05 | 삼성전자주식회사 | 다이 이젝터 및 다이 분리 방법 |
US9111984B2 (en) * | 2013-10-28 | 2015-08-18 | Freescale Semiconductor Inc. | Devices and methods of operation for separating semiconductor die from adhesive tape |
JP2017005222A (ja) * | 2015-06-16 | 2017-01-05 | パイオニア株式会社 | ピックアップ装置 |
JP6301565B1 (ja) * | 2016-01-29 | 2018-03-28 | イエーノプティーク オプティカル システムズ ゲーエムベーハー | マイクロチップをウェーハーから切り離して該マイクロチップを基板上に装着する方法および装置 |
JP6519761B2 (ja) * | 2017-08-25 | 2019-05-29 | 上野精機株式会社 | 電子部品受渡し装置 |
CH715447B1 (de) | 2018-10-15 | 2022-01-14 | Besi Switzerland Ag | Chip-Auswerfer. |
CN114188264B (zh) * | 2022-02-15 | 2022-05-03 | 合肥矽迈微电子科技有限公司 | 一种芯片剥离机构、剥离机及剥离方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778326A (en) | 1983-05-24 | 1988-10-18 | Vichem Corporation | Method and means for handling semiconductor and similar electronic devices |
US4556362A (en) * | 1983-12-21 | 1985-12-03 | At&T Technologies, Inc. | Methods of and apparatus for handling semiconductor devices |
JPS63228638A (ja) * | 1987-03-17 | 1988-09-22 | Sony Corp | チツプ取出し装置 |
JPH0376139A (ja) * | 1989-08-18 | 1991-04-02 | Nec Corp | 半導体素子突上げ方法 |
US6202292B1 (en) * | 1998-08-26 | 2001-03-20 | Micron Technology, Inc. | Apparatus for removing carrier film from a semiconductor die |
US6352073B1 (en) * | 1998-11-12 | 2002-03-05 | Kabushiki Kaisha Toshiba | Semiconductor manufacturing equipment |
JP2000353710A (ja) * | 1999-06-14 | 2000-12-19 | Toshiba Corp | ペレットピックアップ装置および半導体装置の製造方法 |
JP3209736B2 (ja) | 1999-11-09 | 2001-09-17 | エヌイーシーマシナリー株式会社 | ペレットピックアップ装置 |
JP2001196443A (ja) * | 2000-01-14 | 2001-07-19 | Sharp Corp | 半導体チップのピックアップ装置およびピックアップ方法 |
JP3976541B2 (ja) * | 2001-10-23 | 2007-09-19 | 富士通株式会社 | 半導体チップの剥離方法及び装置 |
US7306695B2 (en) * | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
US7757742B2 (en) * | 2007-07-31 | 2010-07-20 | Asm Assembly Automation Ltd | Vibration-induced die detachment system |
-
2004
- 2004-05-19 CH CH00869/04A patent/CH697213A5/de not_active IP Right Cessation
- 2004-12-17 EP EP10186245A patent/EP2306496A3/de not_active Withdrawn
- 2004-12-17 US US11/596,645 patent/US7981246B2/en active Active
- 2004-12-17 CN CN2004800430659A patent/CN101019205B/zh active Active
- 2004-12-17 KR KR1020067025586A patent/KR101097500B1/ko active IP Right Grant
- 2004-12-17 EP EP04804931A patent/EP1754249A1/de not_active Withdrawn
- 2004-12-17 WO PCT/EP2004/053593 patent/WO2005117072A1/de active Application Filing
-
2008
- 2008-02-05 HK HK08101408.6A patent/HK1111263A1/xx unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103659813A (zh) * | 2013-12-25 | 2014-03-26 | 大连佳峰电子有限公司 | 一种用于半导体晶片吸取的机构运动控制方法 |
CN107517582A (zh) * | 2016-06-15 | 2017-12-26 | 万润科技股份有限公司 | 贴合制程的元件搬送、提取、贴合方法及装置 |
CN107517582B (zh) * | 2016-06-15 | 2020-11-24 | 万润科技股份有限公司 | 贴合制程的元件搬送方法及装置 |
CN107160822A (zh) * | 2017-04-26 | 2017-09-15 | 湖州蓝澳无纬布有限公司 | 一种节能型无纬布生产前期加工处理设备 |
Also Published As
Publication number | Publication date |
---|---|
EP2306496A2 (de) | 2011-04-06 |
EP2306496A3 (de) | 2012-10-10 |
CN101019205B (zh) | 2010-06-16 |
KR20070085112A (ko) | 2007-08-27 |
WO2005117072A1 (de) | 2005-12-08 |
US20070277929A1 (en) | 2007-12-06 |
CH697213A5 (de) | 2008-06-25 |
HK1111263A1 (en) | 2008-08-01 |
KR101097500B1 (ko) | 2011-12-22 |
EP1754249A1 (de) | 2007-02-21 |
US7981246B2 (en) | 2011-07-19 |
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Address after: Swiss Berg Patentee after: Kulicke and Soffa Die Bonding GmbH Address before: Swiss Berg Patentee before: Alphasem AG |