EP1743053B1 - Procede de production d'un revetement - Google Patents
Procede de production d'un revetement Download PDFInfo
- Publication number
- EP1743053B1 EP1743053B1 EP05747427A EP05747427A EP1743053B1 EP 1743053 B1 EP1743053 B1 EP 1743053B1 EP 05747427 A EP05747427 A EP 05747427A EP 05747427 A EP05747427 A EP 05747427A EP 1743053 B1 EP1743053 B1 EP 1743053B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- stage
- substrate
- coating time
- deposition process
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Definitions
- the invention relates to a method for producing a corrosion-resistant and / or oxidation-resistant coating according to the preamble of patent claim 1,
- components In particular components of gas turbines, at high temperatures, their free surfaces are exposed to highly corrosive and oxidizing conditions.
- such components may consist of a nickel base or cobalt base superalloy.
- the components are provided with coatings. Preference is given to PtA1 coatings, with which a particularly good corrosion protection and / or oxidation protection can be realized.
- the EP 0 784 104 Bl discloses a PtA1 coating for gas turbine components and a method of making such a coating. According to the method described there, a PtA1 coating is produced on a substrate by depositing a platinum layer on a substrate surface, wherein after the deposition of the platinum layer, diffusion of platinum from the platinum layer into the substrate surface is carried out. After deposition of the platinum layer and the diffusion of the platinum, the thus coated substrate is a-lit, ie coated with aluminum, wherein the aluminum is preferably diffused into the substrate surface.
- the deposition of platinum on the substrate surface before Alitieren the substrate is preferably carried out by electroplating.
- the present invention relates to details of a method of making a corrosion resistant and / or oxidation resistant coating on a substrate, which involves electrodepositing a platinum group metal, particularly platinum and / or palladium, or an alloy based on at least one platinum group metal. So it is essential for the quality of the corrosion-resistant and / or oxidation-resistant coating that a uniformly defined Deposition of particular platinum is realized by galvanic way, so as to realize a uniform thickness of the platinum coating. For example, a minimum value of the coating thickness of approximately 1 ⁇ m may not be undershot, since this would result in insufficient hot gas resistance and locally rapid failure of the coating.
- the present invention is based on the problem to provide a novel method for producing a corrosion-resistant and / or oxidation-resistant coating, which is a platinum group metal-A1 coating.
- the galvanic deposition of the or each platinum group metal or alloy is carried out in a two-stage deposition process, wherein in a first stage of the deposition process in a coating time T1, a current applied for electroplating is increased continuously or stepwise from a start value to a maximum value , and in a second stage of the deposition process in a coating time T2, the current applied for plating is kept constant at the maximum value.
- the present invention relates in particular to those details which relate to the electrodeposition of at least one platinum group metal, in particular platinum and / or palladium, or an alloy based on at least one platinum group metal on a substrate to be examined.
- platinum group metal in particular platinum and / or palladium
- an alloy based on at least one platinum group metal on a substrate to be examined At this point it should be noted that after the galvanic deposition of platinum and / or palladium or a related alloy on the substrate and before Alitieren the so galvanically coated substrate diffusing the platinum and / or palladium or the corresponding alloy into the substrate can.
- a surface pretreatment of the substrate takes place.
- the surface pretreatment of the substrate comprises at least the following three steps: In a first step of the surface pretreatment, the surface of the substrate to be coated is blasted. The blasting takes place with Al 2 O 3 particles which have a particle diameter of 100 to 200 ⁇ m and are directed at a pressure of 1.5 to 3.5 bar onto the substrate surface to be irradiated. When blasting, a coverage of 200 to 1500% is used, which means that each surface section is blasted between two and fifteen times or detected by a corresponding number of particle beams. After blasting, there is a metallically bright and oxide-free substrate surface. Following blasting, the blasted surface is electrochemically cleaned or degreased, in a NaOH-containing solution. Following degreasing or cleaning of the substrate surface, the same is activated in a 40 to 60% strength by volume HCl solution.
- the galvanic deposition of the or each metal of the platinum group or of the corresponding alloy takes place by means of a deposition process.
- the electrodeposition takes place in a two-stage deposition process, wherein in a first stage of the deposition process, a current applied for electroplating is increased continuously or stepwise from a initial value to a maximum value, and wherein in a second stage of the deposition process the current applied for electroplating is kept constant at the maximum value.
- the electrodeposition is carried out over a total coating time T, wherein the first stage of the cutting process, in which the current applied for plating is continuously or stepwise increased to the maximum value from the initial value, takes place in a coating time T 1 , and wherein the second stage the deposition process, in which the current applied to the plating is kept constant at the maximum value, in a coating time T 2 is performed.
- the coating time T 1 of the first stage of the deposition process amounts to approximately 50% of the total coating time
- the current intensity I is continuously increased to the maximum value starting from an initial value which corresponds approximately to 10% of the maximum value I MAX of the current applied for electroplating within the coating time T 1 .
- the current intensity I in the coating time T 1 can be increased stepwise from the initial value to the maximum value I MAX .
- the current applied to the plating current I is maintained at this maximum value I MAX .
- the current applied to the electrodeposition electrode I preferably has one of the following conditions, wherein the condition (1) corresponds to the continuous increase of the current I in the first phase of the deposition process, and the condition (2) of the stepwise increase of the current I corresponds during the first phase of the deposition process.
- I ⁇ 0 . 1 * I MAX + 0 . 9 * I MAX 0 . 5 * T * t For 0 ⁇ t ⁇ 0 . 5 * T I MAX For 0 .
- the maximum current I MAX applied for the galvanic deposition corresponds, depending on the type of galvanic bath used, to a magnitude of 0.2 to 3.5 A / dm 2 , preferably with maximum currents of 1.5 A. / dm 2 or 2 A / dm 2 worked.
- an initial value of the current I is used, which is about 10% of the maximum current I MAX , it is also possible to work with an initial value of the current I which is approximately 15% or even 20% of the maximum current I MAX is.
- the substrate to be coated during the entire Abscheideprczesses ie during the entire first stage and the entire second stage of the deposition process, connected cathodically and thus negatively.
- the substrate to be coated can be anodically or positively treated prior to the actual deposition process and thus introduced into the galvanic bath. Alternatively, it is also possible to switch the substrate to be coated directly cathodically.
- preferably several substrates are coated simultaneously in a galvanic bath with the or each metal of the platinum group or a corresponding alloy.
- egg is a rational production of relatively large quantities in batch mode possible.
- a uniform deposition of platinum and / or palladium or a corresponding alloy on substrates having a complex, three-dimensional geometry is possible.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Prevention Of Electric Corrosion (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
Claims (8)
- Procédé de production d'un revêtement résistant à la corrosion et/ou à l'oxydation, au moins un métal du groupe du platine, en particulier le platine et/ou le palladium, ou un alliage à base d'au moins un métal du groupe du platine, étant déposé par galvanisation sur une surface d'un substrat, et, par la suite, une aluminisation du substrat ainsi galvanisé étant réalisée, caractérisé en ce que le dépôt galvanique du ou de chaque métal du groupe du platine et/ou de l'alliage correspondant est réalisé par un procédé de dépôt en deux étapes, au cours d'une première étape du procédé de dépôt, pendant une durée de revêtement T1, une puissance de courant appliquée pour la galvanisation étant augmentée de manière continue ou par étapes à partir d'une valeur de départ jusqu'à une valeur maximale d'un ordre de grandeur de 0,2 à 3,5 A/dm2, et, dans une deuxième étape du procédé de dépôt, la puissance du courant appliquée pour la galvanisation étant maintenue à la valeur maximale de manière constante pendant une durée de revêtement T2, et
en ce que le procédé de dépôt est réalisé pendant une durée totale de revêtement T, la durée de revêtement T1 de la première étape valant d'environ 50 % de la durée totale de revêtement et la durée de revêtement T2 de la deuxième étape valant d'environ 50 % de la durée totale de revêtement T, et où T = T1 + T2. - Procédé selon la revendication 1, caractérisé en ce que la valeur de départ de la puissance du courant appliquée lors de la première étape correspond à environ 10 à 20 % de la valeur maximale.
- Procédé selon la revendication 1 ou 2, caractérisé en ce que, partir de la valeur de départ de la puissance du courant, la puissance du courant est augmentée de manière continue jusqu'à la valeur maximale pendant la durée de revêtement T1 de la première étape.
- Procédé selon la revendication 1 ou 2, caractérisé en ce que, à partir de la valeur de départ de la puissance du courant, la puissance du courant est augmentée par étapes jusqu'à la valeur maximale pendant la durée de revêtement T1 de la première étape.
- Procédé selon l'une des revendications 1 à 4, caractérisé en ce que le substrat à revêtir est monté sur la cathode ou le pôle négatif pendant la durée totale du dépôt.
- Procédé selon l'une des revendications 1 à 5, caractérisé en ce que, avant le procédé de dépôt, le substrat à revêtir est monté sur l'anode et/ou le pôle positif et est ainsi plongé dans un bain galvanique.
- Procédé selon l'une des revendications 1 à 6, caractérisé en ce que, avant le procédé de dépôt et le cas échéant avant le montage sur l'anode et/ou le pôle positif, le substrat à revêtir est soumis à un prétraitement de surface dans lequela) la surface du substrat à revêtir est irradiée ;b) ensuite, la surface irradiée est nettoyée ou bien dégraissée électrochimiquement ;c) ensuite, la surface nettoyée ou dégraissée est activée.
- Procédé selon la revendication 7, caractérisé en ce que, lors du prétraitement de surfacea) la surface du substrat à revêtir est irradiée à une pression de 1, à à 3, 5 bar avec des particules de Al2O3 qui présentent un diamètre de particules de 100 à 200 µm ;b) ensuite, la surface irradiée est nettoyée ou dégraissée électrochimiquement dans une solution de NaOH ;c) ensuite, la surface nettoyée ou bien dégraissée est de préférence activée dans une solution de HCl de 40 à 60 % en volume.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004021926A DE102004021926A1 (de) | 2004-05-04 | 2004-05-04 | Verfahren zur Herstellung einer Beschichtung sowie Anode zur Verwendung in einem solchen Verfahren |
PCT/DE2005/000811 WO2005108651A2 (fr) | 2004-05-04 | 2005-05-02 | Procede de production d'un revetement et anode utilisee dans un procede de ce type |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1743053A2 EP1743053A2 (fr) | 2007-01-17 |
EP1743053B1 true EP1743053B1 (fr) | 2012-08-29 |
Family
ID=34968980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05747427A Active EP1743053B1 (fr) | 2004-05-04 | 2005-05-02 | Procede de production d'un revetement |
Country Status (4)
Country | Link |
---|---|
US (1) | US7771578B2 (fr) |
EP (1) | EP1743053B1 (fr) |
DE (1) | DE102004021926A1 (fr) |
WO (1) | WO2005108651A2 (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10361888B3 (de) * | 2003-12-23 | 2005-09-22 | Airbus Deutschland Gmbh | Anodisierverfahren für Aluminiumwerkstoffe |
FR2954780B1 (fr) * | 2009-12-29 | 2012-02-03 | Snecma | Procede de depot par voie electrolytique d'un revetement composite a matrice metallique contenant des particules, pour la reparation d'une aube metallique |
US8828214B2 (en) * | 2010-12-30 | 2014-09-09 | Rolls-Royce Corporation | System, method, and apparatus for leaching cast components |
JP6226231B2 (ja) | 2013-09-18 | 2017-11-08 | 株式会社Ihi | 熱遮蔽コーティングしたNi合金部品及びその製造方法 |
US10392948B2 (en) * | 2016-04-26 | 2019-08-27 | Honeywell International Inc. | Methods and articles relating to ionic liquid bath plating of aluminum-containing layers utilizing shaped consumable aluminum anodes |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3666638A (en) | 1970-04-21 | 1972-05-30 | Sidney Levine | Process for anodizing aluminum materials |
US4085012A (en) | 1974-02-07 | 1978-04-18 | The Boeing Company | Method for providing environmentally stable aluminum surfaces for adhesive bonding and product produced |
GB1555940A (en) | 1977-01-21 | 1979-11-14 | Boeing Co | Aluminium or aluminium alloy adherends and to a method oxide coating on an aluminium or aluminium alloy article |
IT1094825B (it) * | 1978-05-11 | 1985-08-10 | Panclor Chemicals Ltd | Procedimento ed apparecchiatura per l'alogenazione dell'acqua |
US4894127A (en) | 1989-05-24 | 1990-01-16 | The Boeing Company | Method for anodizing aluminum |
DE4211881C2 (de) * | 1992-04-09 | 1994-07-28 | Wmv Ag | Verfahren zum elektrochemischen Aufbringen einer strukturierten Oberflächenbeschichtung |
EP0567755B1 (fr) | 1992-04-29 | 1996-09-04 | WALBAR INC. (a Delaware Corporation) | Procédé amélioré pour le revêtement par diffusion et produits |
US5486283A (en) | 1993-08-02 | 1996-01-23 | Rohr, Inc. | Method for anodizing aluminum and product produced |
DE69509202T2 (de) | 1994-12-24 | 1999-09-09 | Rolls Royce Plc | Wärmedämmschicht sowie Methode zu deren Auftragung auf einen Superlegierungskörper |
US6066405A (en) | 1995-12-22 | 2000-05-23 | General Electric Company | Nickel-base superalloy having an optimized platinum-aluminide coating |
DE19902527B4 (de) * | 1999-01-22 | 2009-06-04 | Hydro Aluminium Deutschland Gmbh | Druckplattenträger und Verfahren zur Herstellung eines Druckplattenträgers oder einer Offsetdruckplatte |
US6254756B1 (en) | 1999-08-11 | 2001-07-03 | General Electric Company | Preparation of components having a partial platinum coating thereon |
DE60010405T2 (de) | 1999-10-23 | 2004-09-09 | Rolls-Royce Plc | Korrosionsschutzschicht für metallisches Werkstück und Verfahren zur Herstellung einer korrosionsschützenden Beschichtung auf ein metallisches Werkstück |
US6432821B1 (en) * | 2000-12-18 | 2002-08-13 | Intel Corporation | Method of copper electroplating |
ITTO20010149A1 (it) | 2001-02-20 | 2002-08-20 | Finmeccanica S P A Alenia Aero | Procedimento di anodizzazione a basso impatto ecologico di un pezzo di alluminio o leghe di alluminio. |
CN1685086B (zh) | 2002-04-12 | 2010-10-13 | Acm研究公司 | 电抛光和电镀方法 |
US6974531B2 (en) * | 2002-10-15 | 2005-12-13 | International Business Machines Corporation | Method for electroplating on resistive substrates |
DE10350882A1 (de) | 2003-10-31 | 2005-06-02 | Mtu Aero Engines Gmbh | Bauteil, Oxidationsschutzbeschichtung für ein solches Bauteil und Herstellverfahren |
DE10361888B3 (de) | 2003-12-23 | 2005-09-22 | Airbus Deutschland Gmbh | Anodisierverfahren für Aluminiumwerkstoffe |
-
2004
- 2004-05-04 DE DE102004021926A patent/DE102004021926A1/de not_active Withdrawn
-
2005
- 2005-05-02 WO PCT/DE2005/000811 patent/WO2005108651A2/fr active Application Filing
- 2005-05-02 EP EP05747427A patent/EP1743053B1/fr active Active
- 2005-05-02 US US11/579,721 patent/US7771578B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2005108651A3 (fr) | 2007-03-22 |
EP1743053A2 (fr) | 2007-01-17 |
US7771578B2 (en) | 2010-08-10 |
DE102004021926A1 (de) | 2005-12-01 |
WO2005108651A2 (fr) | 2005-11-17 |
US20080035486A1 (en) | 2008-02-14 |
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